Samsung Semiconductor KLMAG2GEND-B0310

表面安装

YES

终端数量

153

Manufacturer Part Number

KLMAG2GEND-B0310

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Description

VFBGA,

Risk Rank

5.82

Operating Temperature-Max

85 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Supply Voltage-Max

1.95 V

Supply Voltage-Nom

1.8 V

Supply Voltage-Min

1.7 V

附加功能

ALSO REQURIED 3V SUPPLY

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

R-PBGA-B153

温度等级

OTHER

uPs/uCs/外围ICs类型

SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE

座位高度-最大

0.8 mm

外部数据总线宽度

8

最大数据传输率

50 MBps

主机数据传输速率-最大

400 MBps

长度

13 mm

宽度

11.5 mm