Samsung Semiconductor MJD45H11

表面安装

YES

材料

aluminium

外壳材料

1

Transport packaging size / quantity

48*31.5*27/2000

Maximum current

10 A

Noal voltage

30 Vmin

Body diameter

8.4 mm

Mounting hole size

6 mm

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Operating Temperature-Max

140 °C

Transition Frequency-Nom (fT)

40 MHz

Type of heatsink

extruded

Heatsink shape

grilled

Colour

black

Material finishing

anodized

Mounting

for back plate

Heatsinks features

hollow fin geometry

Plate thickness

20mm

Gross weight

700 g

JESD-609代码

e0

ECCN 代码

EAR99

Connector type

socket (F) Ф2 mm, isolator color - yellow

端子表面处理

Tin/Lead (Sn/Pb)

深度

23 mm

Reach合规守则

unknown

配置

SINGLE

极性/通道类型

PNP

最大耗散功率(Abs)

20 W

集电极电流-最大值(IC)

8 A

最小直流增益（hFE）

40

第二个连接器加载的位置数

for fan motors

长度

0.5m

宽度

70mm

高度

23mm