Silicon Motion SM662QXCACSP1212

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

HTS

8542.32.00.71

Automotive

有

PPAP

Unknown

Cell Type

MLC NAND

Chip Density (bit)

512G

Programmability

有

Timing Type

Synchronous

Interface Type

Serial e-MMC

Minimum Operating Temperature (°C)

-25

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Commercial

Command Compatible

有

ECC Support

有

Support of Page Mode

无

Mounting

表面贴装

Package Height

1.2

Package Width

12

Package Length

16

PCB changed

169

Standard Package Name

BGA

Supplier Package

BGA

Lead Shape

Ball

零件状态

Unconfirmed

引脚数量

169

引导模块

无