STMicroelectronics HCC4071BD

表面安装

NO

终端数量

14

Package Code

DIP

Package Equivalence Code

DIP14,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Package Body Material

CERAMIC

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Risk Rank

5.92

Ihs Manufacturer

STMICROELECTRONICS

Part Life Cycle Code

Obsolete

Rohs Code

无

Manufacturer Part Number

HCC4071BD

Usage Level

Aerospace class

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

not_compliant

JESD-30代码

R-XDIP-T14

资历状况

不合格

电源

5/15 V

温度等级

MILITARY

逻辑IC类型

OR GATE

筛选水平

ESCC9000

施密特触发器

NO

总剂量

100k Rad(Si) V