STMicroelectronics M25P16-VMP6

表面安装

YES

Contact plating

gold-plated

Number of pins

80

终端数量

8

Rohs Code

无

Part Life Cycle Code

Transferred

Ihs Manufacturer

STMICROELECTRONICS

Part Package Code

DFP

Package Description

SON, SOLCC8,.25

Clock Frequency-Max (fCLK)

50 MHz

Number of Words

2097152 words

Number of Words Code

2000000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

SON

Package Equivalence Code

SOLCC8,.25

Package Shape

RECTANGULAR

Package Style

小概要

Supply Voltage-Nom (Vsup)

3 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

2x40

Row pitch

2.54mm

Gross weight

7.65 g

Operating temperature

-40...163°C

JESD-609代码

e0

ECCN 代码

EAR99

类型

NOR型号

端子表面处理

锡铅

HTS代码

8542.32.00.51

端子位置

DUAL

终端形式

无铅

功能数量

1

端子间距

1.27 mm

Reach合规守则

not_compliant

Current rating

1.5A

引脚数量

8

JESD-30代码

R-PDSO-N8

资历状况

不合格

电源电压-最大值(Vsup)

3.6 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2.7 V

操作模式

SYNCHRONOUS

电源电流-最大值

0.015 mA

组织结构

2MX8

座位高度-最大

1 mm

内存宽度

8

待机电流-最大值

0.00001 A

记忆密度

16777216 bit

并行/串行

SERIAL

内存IC类型

FLASH

编程电压

2.7 V

串行总线类型

SPI

耐力

100000 Write/Erase Cycles

数据保持时间

20

写入保护

HARDWARE/SOFTWARE

Rated voltage

60V

个人资料

beryllium copper

长度

6 mm

宽度

5 mm

Plating thickness

0.75µm

Flammability rating

UL94V-0