STMicroelectronics NAND02GR3B2DZA6E

Contact plating

tinned

表面安装

YES

Number of pins

54

终端数量

63

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

2x27

Row pitch

2.54mm

Gross weight

3.79 g

Rohs Code

有

Part Life Cycle Code

Transferred

Ihs Manufacturer

STMICROELECTRONICS

Package Description

FBGA, BGA63,10X12,32

Access Time-Max

20 ns

Number of Words

268435456 words

Number of Words Code

256000000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA63,10X12,32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, FINE PITCH

Supply Voltage-Nom (Vsup)

1.8 V

Operating temperature

-40...200°C

ECCN 代码

EAR99

HTS代码

8542.32.00.51

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

unknown

Current rating

3A

JESD-30代码

R-PBGA-B63

资历状况

不合格

温度等级

INDUSTRIAL

电源电流-最大值

0.02 mA

组织结构

256MX8

内存宽度

8

待机电流-最大值

0.00005 A

记忆密度

2147483648 bit

并行/串行

PARALLEL

内存IC类型

FLASH

Rated voltage

125V

数据轮询

NO

拨动位

NO

命令用户界面

YES

扇区/尺寸数

2K

行业规模

128K

页面尺寸

2K words

准备就绪/忙碌

YES

个人资料

bronze

Plating thickness

4µm

Flammability rating

UL94V-0