Xilinx XQZU5EV-1FFRB900M

表面安装

YES

终端数量

900

Manufacturer Part Number

XQZU5EV-1FFRB900M

Part Life Cycle Code

活跃

Ihs Manufacturer

XILINX INC

Package Description

FCBGA-900

Risk Rank

5.63

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Shape

SQUARE

Package Style

网格排列

Supply Voltage-Max

0.892 V

Supply Voltage-Nom

0.85 V

Supply Voltage-Min

0.808 V

Usage Level

Military grade

端子位置

BOTTOM

终端形式

BALL

Reach合规守则

compliant

JESD-30代码

S-PBGA-B900

温度等级

MILITARY

uPs/uCs/外围ICs类型

微处理器电路

筛选水平

MIL-PRF-38535