12 In Stock

• 1: ¥712.024515
• 10: ¥671.721244
• 100: ¥633.699282
• 500: ¥597.829517
查看所有的价格

-

Production (Last Updated: 1 month ago)

484-BGA

YES

484-FPBGA (23x23)

484

FBGA-484

5.81

3

PLASTIC/EPOXY

BGA

BGA484,22X22,40

微芯片技术

SQUARE

网格排列

1.26 V

1.2 V

30

1.2000 V

Non-Compliant

233

Tray

M2S010

活跃

-

166 MHz

12084 LE

SMD/SMT

-

64 kB

1.14 V

M2S010T-FG484I

无

活跃

MICROSEMI CORP

-40 to 100 °C

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

233

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

现场可编程门阵列

STD

FPGA - 10K Logic Modules

12084

1 Core

256KB

23 mm

23 mm

N/A

-

表面贴装

YES

400

400

M2GL025S-1VFG400I

有

活跃

MICROSEMI CORP

5.82

3

PLASTIC/EPOXY

FBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

1.2 V

207

Compliant

100 °C

-40 °C

BOTTOM

BALL

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

138 kB

207

现场可编程门阵列

27696

27696

N/A

-

YES

1152

未说明

1.14 V

M2S100T-1FC1152I

无

活跃

MICROSEMI CORP

35 X 35 MM, 1 MM PITCH, FBGA-1152

5.86

PLASTIC/EPOXY

BGA

BGA1152,34X34,40

SQUARE

网格排列

1.26 V

1.2 V

e0

锡铅

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

574

2.9 mm

现场可编程门阵列

99512

35 mm

35 mm

N/A

-

YES

1152

M2GL100T-FCG1152

有

Obsolete

MICROSEMI CORP

5.82

PLASTIC

BGA

BGA1152,34X34,40

SQUARE

网格排列

1.2 V

8542.39.00.01

BOTTOM

BALL

1 mm

unknown

S-PBGA-B1152

574

不合格

1.2 V

574

现场可编程门阵列

99512

N/A

-

YES

1152

1.26 V

1.2 V

未说明

1.14 V

M2S100-1FCG1152I

有

活跃

MICROSEMI CORP

BGA, BGA1152,34X34,40

5.8

4

PLASTIC/EPOXY

BGA

BGA1152,34X34,40

SQUARE

网格排列

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

574

2.9 mm

现场可编程门阵列

99512

35 mm

35 mm

N/A

-

YES

1152

M2GL100-FCG1152

有

Obsolete

MICROSEMI CORP

BGA, BGA1152,34X34,40

5.82

PLASTIC

BGA

BGA1152,34X34,40

SQUARE

网格排列

1.2 V

BOTTOM

BALL

1 mm

unknown

S-PBGA-B1152

574

不合格

1.2 V

574

现场可编程门阵列

99512

N/A

-

YES

1152

M2GL150S-1FCG1152I

有

活跃

MICROSEMI CORP

BGA, BGA1152,34X34,40

5.82

4

PLASTIC/EPOXY

BGA

BGA1152,34X34,40

SQUARE

网格排列

1.2 V

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

574

现场可编程门阵列

146124

N/A

-

表面贴装

YES

484

M2GL050S-1FGG484I

有

活跃

MICROSEMI CORP

5.82

3

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

网格排列

1.2 V

267

Compliant

100 °C

-40 °C

BOTTOM

BALL

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

228.3 kB

267

现场可编程门阵列

56340

56340

2183 In Stock

• 1: ¥789.073859
• 10: ¥744.409304
• 100: ¥702.272922
• 500: ¥662.521630
查看所有的价格

-

484-BGA

YES

484-FPBGA (23x23)

484

BGA, BGA484,26X26,40

1.39

80 MHz

3

100 °C

-40 °C

微芯片技术

PLASTIC/EPOXY

BGA

BGA484,26X26,40

SQUARE

网格排列

1.575 V

1.5 V

30

1.5000 V

1.425 V

200000

1.575 V

MCU - 41, FPGA - 94

Tray

A2F200

活跃

1.425 V

A2F200M3F-FGG484I

有

活跃

MICROSEMI CORP

-40 to 100 °C

SmartFusion®

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

94

不合格

1.5,1.8,2.5,3.3 V

INDUSTRIAL

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

94

4608 CLBS, 200000 GATES

2.44 mm

现场可编程门阵列

STD

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

200000

256KB

23 mm

23 mm

N/A

-

288-TFBGA, CSPBGA

YES

288-CSP (11x11)

288

PLASTIC/EPOXY

微芯片技术

TFBGA

BGA288,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.575 V

1.5 V

20

MCU - 31, FPGA - 78

Tray

A2F200

活跃

1.425 V

A2F200M3F-CS288I

无

活跃

MICROSEMI CORP

TFBGA, BGA288,21X21,20

5.24

80 MHz

100 °C

-40 °C

-40°C ~ 100°C (TJ)

SmartFusion®

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

BOTTOM

BALL

235

0.5 mm

compliant

S-PBGA-B288

78

不合格

1.5,1.8,2.5,3.3 V

INDUSTRIAL

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

78

4608 CLBS, 200000 GATES

1.05 mm

现场可编程门阵列

STD

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

200000

256KB

11 mm

11 mm

2996 In Stock

• 1: ¥1,607.856514
• 10: ¥1,516.845768
• 100: ¥1,430.986576
• 500: ¥1,349.987336
查看所有的价格

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

-40 °C

微芯片技术

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

网格排列

1.575 V

1.5 V

30

165

Tray

AGLE600

活跃

1.425 V

AGLE600V5-FG256I

无

活跃

MICROSEMI CORP

BGA, BGA256,16X16,40

5.3

250 MHz

3

85 °C

-40°C ~ 85°C (TA)

IGLOOe

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B256

165

不合格

1.5 V

INDUSTRIAL

165

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

13824

600000

17 mm

17 mm

N/A

-

表面贴装

表面贴装

144-LBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

85 °C

-40 °C

微芯片技术

PLASTIC/EPOXY

LBGA

BGA144,12X12,40

SQUARE

GRID ARRAY, LOW PROFILE

3.6 V

3.3 V

40

3.3, 5 V

2.97, 4.5 V

3.63, 5.5 V

111

Compliant

Tray

A54SX08

活跃

3 V

A54SX08-1FGG144I

有

活跃

MICROSEMI CORP

1 MM PITCH, ROHS COMPLIANT, FBGA-144

5.24

280 MHz

3

-40 to 85 °C

SX

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

260

1 mm

compliant

280 MHz

S-PBGA-B144

111

不合格

5 V

3.3,5 V

INDUSTRIAL

5.5 V

4.5 V

800 ps

800 ps

111

768 CLBS, 8000 GATES

1.55 mm

现场可编程门阵列

768

12000

280 MHz

768

768

1

256

0.8 ns

768

768

8000

1.05 mm

13 mm

13 mm

无

N/A

-

YES

484

PLASTIC/EPOXY

BGA

BGA484,26X26,40

SQUARE

网格排列

2.75 V

2.5 V

30

2.25 V

A54SX32A-2FG484I

无

Obsolete

MICROSEMI CORP

1 MM PITCH, FBGA-484

5.3

313 MHz

3

85 °C

-40 °C

e0

Tin/Lead (Sn/Pb)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

249

不合格

2.5,2.5/5 V

INDUSTRIAL

249

2880 CLBS, 48000 GATES

2.44 mm

现场可编程门阵列

0.9 ns

2880

2880

48000

27 mm

27 mm

2707 In Stock

• 1: ¥2,511.272017
• 10: ¥2,369.124547
• 100: ¥2,235.023152
• 500: ¥2,108.512409
查看所有的价格

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

125 °C

-40 °C

微芯片技术

PLASTIC/EPOXY

LBGA

BGA144,12X12,40

SQUARE

GRID ARRAY, LOW PROFILE

1.575 V

1.5 V

30

97

Tray

A3P1000

活跃

1.425 V

Automotive grade

A3P1000-1FGG144T

有

活跃

MICROSEMI CORP

LBGA, BGA144,12X12,40

5.23

350 MHz

3

-40°C ~ 125°C (TA)

Automotive, AEC-Q100, ProASIC3

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.5/3.3 V

AUTOMOTIVE

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

AEC-Q100

24576

24576

1000000

13 mm

13 mm

2547 In Stock

• 1: ¥1,572.390848
• 10: ¥1,483.387592
• 100: ¥1,399.422253
• 500: ¥1,320.209673
查看所有的价格

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

85 °C

3

微芯片技术

108 MHz

1.44

BGA,

MICROSEMI CORP

活跃

有

AGL1000V5-FGG484

1.5000 V

1.425 V

1.575 V

300

Tray

AGL1000

活跃

40

1.5 V

1.425 V

1.575 V

网格排列

SQUARE

BGA

PLASTIC/EPOXY

0 to 70 °C

IGLOO

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

不合格

OTHER

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

1152-BGA

YES

1152

1152-FPBGA (35x35)

400.011771 mg

1152

微芯片技术

BGA

BGA1152,34X34,40

SQUARE

网格排列

1.575 V

1.5 V

40

684

Tray

AX2000

活跃

Compliant

1.425 V

Military grade

AX2000-1FGG1152M

有

活跃

MICROSEMI CORP

BGA, BGA1152,34X34,40

5.29

763 MHz

3

125 °C

-55 °C

PLASTIC/EPOXY

-55°C ~ 125°C (TA)

Axcelerator

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

125 °C

-55 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

245

1 mm

compliant

S-PBGA-B1152

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

MILITARY

1.575 V

1.425 V

36 kB

850 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

294912

2000000

763 MHz

32256

MIL-STD-883 Class B

1

21504

0.84 ns

21504

32256

2000000

1.73 mm

35 mm

35 mm

无

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.575 V

1.5 V

30

300

Tray

AGL1000

活跃

1.425 V

AGL1000V5-FG484I

无

活跃

MICROSEMI CORP

BGA,

1.61

108 MHz

3

100 °C

-40 °C

-40°C ~ 85°C (TA)

IGLOO

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B484

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

23 mm

23 mm

N/A

-

YES

144

PLASTIC/EPOXY

LBGA

BGA144,12X12,40

SQUARE

GRID ARRAY, LOW PROFILE

2.75 V

2.5 V

30

2.25 V

A54SX08A-1FG144I

无

Obsolete

MICROSEMI CORP

LBGA, BGA144,12X12,40

5.28

278 MHz

3

85 °C

-40 °C

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

111

不合格

2.5,3.3/5 V

INDUSTRIAL

111

768 CLBS, 12000 GATES

1.55 mm

现场可编程门阵列

1.1 ns

768

768

12000

13 mm

13 mm

N/A

-

表面贴装

289-TFBGA, CSBGA

YES

289-CSP (14x14)

289

微芯片技术

TFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.575 V

1.5 V

未说明

212

Tray

AGLP125

Obsolete

1.425 V

AGLP125V5-CS289I

无

活跃

MICROSEMI CORP

TFBGA, BGA289,17X17,32

1.64

250 MHz

85 °C

-40 °C

PLASTIC/EPOXY

-40°C ~ 100°C (TJ)

IGLOO PLUS

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.8 mm

unknown

S-PBGA-B289

212

不合格

1.5 V

INDUSTRIAL

212

3120 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3120

36864

125000

STD

3120

3120

125000

14 mm

14 mm

N/A

-

YES

256

2.75 V

网格排列

SQUARE

BGA256,16X16,40

BGA

PLASTIC/EPOXY

-40 °C

85 °C

2.25 V

3

294 MHz

5.32

BGA, BGA256,16X16,40

MICROSEMI CORP

Obsolete

无

A54SX16A-2FG256I

30

2.5 V

TIN LEAD/TIN LEAD SILVER

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

180

不合格

2.5,3.3/5 V

INDUSTRIAL

180

1452 CLBS, 24000 GATES

1.97 mm

现场可编程门阵列

1 ns

1452

1452

24000

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

1152-BGA

YES

1152

1152-FPBGA (35x35)

400.011771 mg

1152

微芯片技术

-55 °C

PLASTIC/EPOXY

BGA

BGA1152,34X34,40

SQUARE

网格排列

1.575 V

1.5 V

20

684

Tray

AX2000

活跃

Compliant

1.425 V

Military grade

AX2000-1FG1152M

无

活跃

MICROSEMI CORP

BGA, BGA1152,34X34,40

5.29

ic

763 MHz

3

125 °C

-55°C ~ 125°C (TA)

Axcelerator

e0

3A001.A.2.C

TIN LEAD/TIN LEAD SILVER

125 °C

-55 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B1152

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

MILITARY

1.575 V

1.425 V

36 kB

850 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

294912

2000000

763 MHz

32256

MIL-STD-883 Class B

1

21504

0.84 ns

21504

32256

2000000

1.73 mm

35 mm

35 mm

无

20 In Stock

• 1: ¥503.760972
• 10: ¥475.246198
• 100: ¥448.345469
• 500: ¥422.967425
查看所有的价格

-

表面贴装

196-TFBGA, CSBGA

YES

196-CSP (8x8)

196

5.25

微芯片技术

TFBGA,

MICROSEMI CORP

活跃

有

AGL400V5-CSG196

1.5000 V

1.425 V

1.575 V

143

Tray

AGL400

活跃

1.425 V

1.575 V

1.5 V

未说明

GRID ARRAY, THIN PROFILE, FINE PITCH

SQUARE

TFBGA

PLASTIC/EPOXY

85 °C

3

0 to 70 °C

IGLOO

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B196

不合格

OTHER

9216 CLBS, 400000 GATES

1.2 mm

现场可编程门阵列

9216

55296

400000

STD

9216

400000

8 mm

8 mm

N/A

-

表面贴装

1152-BGA

YES

1152-FPBGA (35x35)

1152

微芯片技术

180 MHz

5.26

BGA, BGA1152,34X34,40

MICROSEMI CORP

活跃

有

APA1000-FGG1152

712

Tray

APA1000

活跃

2.3 V

40

2.5 V

2.7 V

网格排列

SQUARE

BGA1152,34X34,40

BGA

PLASTIC/EPOXY

70 °C

3

0°C ~ 70°C (TA)

ProASICPLUS

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

2.3V ~ 2.7V

BOTTOM

BALL

245

1 mm

compliant

S-PBGA-B1152

712

不合格

2.5,2.5/3.3 V

COMMERCIAL

712

1000000 GATES

2.44 mm

现场可编程门阵列

202752

1000000

56320

1000000

35 mm

35 mm

N/A

-

表面贴装

表面贴装

144-LBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

40

微芯片技术

A54SX08-1FGG144

有

活跃

MICROSEMI CORP

1 MM PITCH, ROHS COMPLIANT, FBGA-144

5.24

280 MHz

3.3, 5 V

2.97, 4.75 V

3.63, 5.25 V

111

Tray

A54SX08

活跃

Compliant

3 V

3

70 °C

PLASTIC/EPOXY

LBGA

BGA144,12X12,40

SQUARE

GRID ARRAY, LOW PROFILE

3.6 V

3.3 V

0 to 70 °C

SX

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

260

1 mm

compliant

280 MHz

S-PBGA-B144

111

不合格

5 V

3.3,5 V

COMMERCIAL

5.25 V

4.75 V

800 ps

800 ps

111

768 CLBS, 8000 GATES

1.55 mm

现场可编程门阵列

768

12000

280 MHz

768

768

1

256

0.8 ns

768

768

8000

1.05 mm

13 mm

13 mm

无

2552 In Stock

• 1: ¥2,133.463277
• 10: ¥2,012.701202
• 100: ¥1,898.774719
• 500: ¥1,791.296909
查看所有的价格

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

1.425 V

1.5 V

微芯片技术

30

A3P1000-FGG144T

有

活跃

MICROSEMI CORP

LBGA, BGA144,12X12,40

5.23

350 MHz

3

97

Tray

A3P1000

活跃

Automotive grade

125 °C

-40 °C

PLASTIC/EPOXY

LBGA

BGA144,12X12,40

SQUARE

GRID ARRAY, LOW PROFILE

1.575 V

-40°C ~ 125°C (TA)

Automotive, AEC-Q100, ProASIC3

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.5/3.3 V

AUTOMOTIVE

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

AEC-Q100

STD

24576

24576

1000000

13 mm

13 mm