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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	安装类型	包装/外壳	表面安装	引脚数	供应商器件包装	房屋材料	终端数量	触点材料 - 配套	触点材料 - 柱子	板材																			厂商																																												操作温度	包装	系列	JESD-609代码	零件状态	湿度敏感性等级(MSL)	终端	端子表面处理	组成	附加功能	HTS代码	子类别	技术	端子位置	终端形式	屏蔽/屏蔽	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	额定电流	间距 - 配套	引脚数量	输出的数量	资历状况	触点表面处理 - 柱子	输出类型	电源	温度等级	速度	内存大小	核心处理器	周边设备	程序内存大小
A2F060M3E-1TQG144	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	144	MICROSEMI CORP	1.575 V	5.81											LFQFP,	FLATPACK, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	1.5 V	1.425 V	85 °C	有	A2F060M3E-1TQG144	LFQFP	SQUARE	Microsemi Corporation	Obsolete											8542.39.00.01		CMOS	QUAD	鸥翼			0.5 mm	compliant				S-PQFP-G144							OTHER									1536 CLBS, 60000 GATES	1.6 mm	现场可编程门阵列									1536			60000								20 mm	20 mm
M2S050-FGG484I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	微芯片技术	-	166 MHz	56340 LE	0.489749 oz	60	SMD/SMT	4695 LAB	Microchip	Microchip Technology / Atmel	Details	-	64 kB	267	Tray	M2S050	活跃										SMARTFUSION2	100C	Industrial	FPBGA	-40C to 100C	267	56340	65nm	1.26(V)	1.2(V)	无	1.14(V)	-40C	有	56340	表面贴装	有	This product may require additional documentation to export from the United States.	-40°C ~ 100°C (TJ)	Tray	SmartFusion2									SOC - Systems on a Chip										484									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						SoC FPGA	STD					FPGA - 50K Logic Modules		1 Core	256KB			SoC FPGA
A2F060M3E-TQG144	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	144	QFP144,.87SQ,20	8.63	1.575 V	MICROSEMI CORP	Obsolete	Microsemi Corporation	SQUARE	LFQFP	80 MHz	A2F060M3E-TQG144	有	85 °C	1.425 V	30		1.5 V										LFQFP, QFP144,.87SQ,20	FLATPACK, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY				e3				PURE MATTE TIN (394)			8542.39.00.01	现场可编程门阵列	CMOS	QUAD	鸥翼		250	0.5 mm	compliant				S-PQFP-G144	33	不合格				1.5,1.8,2.5,3.3 V	OTHER								33	1536 CLBS, 60000 GATES	1.6 mm	现场可编程门阵列									1536	1536		60000								20 mm	20 mm
XCZU65DR-1FSVE1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	EDAC Inc.					Bulk	活跃										*
XCZU17EG-2FFVE1924E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1924-BBGA, FCBGA	1924-FCBGA (45x45)	AMD				ACH580-BCR-088A-2+B058+F267+K452	ABB	0.8500 V	668	Tray	XCZU17	活跃							0 to 100 °C		Zynq® UltraScale+™ MPSoC EG																			1924									533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							2					Zynq®UltraScale+™ FPGA, 926K+ Logic Cells					-
XCZU2EG-L1SBVA484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA, FCBGA	484-FCBGA (19x19)	AMD	ABB	82	Tray	XCZU2	活跃										ACH580-BCR-088A-2+B058+J429+K454	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																												500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA												Zynq®UltraScale+™ FPGA, 103K+ Logic Cells					-
XCZU7CG-2FFVC1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD								PDG52P1200D3WN	CE, CSA, UL	Cutler Hammer, Div of Eaton Corp	Panel	360	Tray	XCZU7	活跃			-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																	1,200 A											533MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA												Zynq®UltraScale+™ FPGA, 504K+ Logic Cells					-
XCZU3CG-L1SBVA484I	AMD	数据表	815 In Stock	-	最小起订量: 1 最小包装量: 1	484-BFBGA, FCBGA	484-FCBGA (19x19)	AMD										Miscellaneous	82	Tray	XCZU3	活跃	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																												500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA												Zynq®UltraScale+™ FPGA, 154K+ Logic Cells					-
M2S050T-1VFG400I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	400-VFBGA (17x17)	微芯片技术						02466	Greenlee	1.2000 V	207	Tray	M2S050	活跃	-	166 MHz	56340 LE	SMD/SMT	-	64 kB					-40 to 100 °C		SmartFusion®2																												166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							1					FPGA - 50K Logic Modules			1 Core		256KB
XCZU2CG-L1SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD				DH227NRKV	Cutler Hammer, Div of Eaton Corp	0.8500 V	252	Tray	XCZU2	活跃							-40 to 100 °C		Zynq® UltraScale+™ MPSoC CG																												500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							1L					Zynq®UltraScale+™ FPGA, 103K+ Logic Cells					-
XCZU11EG-1FFVF1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD				139394	Schneider	0.8500 V	464	Tray	XCZU11	活跃							-40 to 100 °C		Zynq® UltraScale+™ MPSoC EG																												500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							1					Zynq®UltraScale+™ FPGA, 653K+ Logic Cells					-	Inverted Flare
XAZU2EG-1SFVA625I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	625-BFBGA, FCBGA	625-FCBGA (21x21)	AMD	Greenlee	128	Tray	XAZU2	活跃										31004	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																												500MHz, 1.2GHz	1.2MB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, I²C, SPI, UART/USART, USB	MPU, FPGA												Zynq®UltraScale+™ FPGA, 103K+ Logic Cells					-
XAZU3EG-1SFVA625I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	625-BFBGA, FCBGA	625-FCBGA (21x21)	AMD	0.808 V	0.892 V	128	Tray	XAZU3	活跃										E57LBL30A2SP	10 mm	Cutler Hammer, Div of Eaton Co	0.8500 V	-40 to 100 °C		Zynq® UltraScale+™ MPSoC EG													Shielded						625						NC			500MHz, 1.2GHz	1.8MB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, I²C, SPI, UART/USART, USB	MPU, FPGA							1					Zynq®UltraScale+™ FPGA, 154K+ Logic Cells					-	3 Pin Micro Pigtail				AC	30 mm
XCZU11EG-3FFVB1517E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD				TCHI-24	CE, cURus	ILME	488	Tray	XCZU11	活跃							0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG						Non-Metallic																	None (Housing Only)					600MHz, 667MHz, 1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					104mm x 27mm							Zynq®UltraScale+™ FPGA, 653K+ Logic Cells					-				-40-90 °C
XCZU4EV-1SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD	XCZU4	活跃										31008805000	Pfannenberg	0.892 V	0.808 V	0.8500 V	252	Tray	-40 to 100 °C		Zynq® UltraScale+™ MPSoC EV																												500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							1					Zynq®UltraScale+™ FPGA, 192K+ Logic Cells					-
XCZU17EG-2FFVE1924I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1924-BBGA, FCBGA	1924-FCBGA (45x45)	AMD	XCZU17	活跃										313902	PILZ	0.85 V	0.808 V	0.892 V	668	Tray	-40 to 100 °C		Zynq® UltraScale+™ MPSoC EG																			1924									533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							2					Zynq®UltraScale+™ FPGA, 926K+ Logic Cells					-
XCZU5CG-2FBVB900E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD								PDG53K0800E2NM	CE, CSA, UL	Cutler Hammer, Div of Eaton Corp	Panel	204	Tray	XCZU5	活跃			0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																	800 A											533MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA												Zynq®UltraScale+™ FPGA, 256K+ Logic Cells					-
M2S025-VF400	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	YES	400-VFBGA (17x17)	400	微芯片技术	活跃	MICROSEMI CORP	1.26 V	5.87								1.2000 V	1.14 V	1.26 V	207	Tray	M2S025	活跃	-	166 MHz	27696 LE	-	64 kB	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	85 °C	无	M2S025-VF400	LFBGA	SQUARE	Microsemi Corporation	0 to 85 °C		SmartFusion®2	e0				Tin/Lead (Sn/Pb)			8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL		240	0.8 mm	not_compliant				S-PBGA-B400	160	不合格				1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	160		1.51 mm	现场可编程门阵列			STD					FPGA - 25K Logic Modules		23988	1 Core		256KB					17 mm	17 mm
M2S060TS-1FCSG325	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	325-FCBGA (11x11)	微芯片技术			1.2 V	1.14 V	1.26 V	Compliant	200	Tray	M2S060	活跃	-	166 MHz	56520 LE	-	64 kB							0 to 85 °C		SmartFusion®2																												166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							1					FPGA - 60K Logic Modules			1 Core		256KB
XCVE1752-1LLIVSVA1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA	1596-BGA (37.5x37.5)	AMD	Tray	活跃										500	-40°C ~ 100°C (TJ)		Versal™ AI Core																												400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA												Versal™ AI Core FPGA, 1M Logic Cells					-
AGFB019R25A2E2V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	Tray	活跃										480	0°C ~ 100°C (TJ)		Agilex F																												1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA												FPGA - 1.9M Logic Elements					-
10AS027E4F29E3LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-780	YES	780	-	BGA, BGA780,28X28,40	网格排列	PLASTIC/EPOXY	BGA780,28X28,40	0.9 V	未说明	0.87 V	100 °C	有	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.43									PDG21M0150TFFJ	CE, CSA, UL	Cutler Hammer, Div of Eaton Corp	Panel	360	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	270000 LE	1	SMD/SMT	33750 LAB	964940	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB		0°C ~ 100°C (TJ)	Tray	Arria 10 SX		活跃						8542.39.00.01	SOC - Systems on a Chip	CMOS	BOTTOM	BALL		未说明	1 mm	compliant	150 A			S-PBGA-B780	360	不合格				0.9 V	OTHER	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	360		3.35 mm	现场可编程门阵列		SoC FPGA						FPGA - 270K Logic Elements	270000	2 Core	--			SoC FPGA				29 mm	29 mm
M2S010TS-FG484	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	484-BGA	YES	484-FPBGA (23x23)	484	微芯片技术	5.86							Non-Compliant	233	Tray	M2S010	活跃	-	166 MHz	12084 LE	-	64 kB	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	85 °C	无	M2S010TS-FG484	BGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	0°C ~ 85°C (TJ)		*	e0	活跃			Tin/Lead (Sn/Pb)			8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL		240	1 mm	not_compliant				S-PBGA-B484	233	不合格				1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	233		2.44 mm	现场可编程门阵列								FPGA - 10K Logic Modules		12084	1 Core		256KB					23 mm	23 mm
M2S090-FCSG325I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	通孔	325-TFBGA, FCBGA	YES	20	325-FCBGA (11x13.5)	--	325	--	Brass	FR4 Epoxy Glass	微芯片技术	--	180	Tray	M2S090	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	5.74	1.26 V	MICROSEMI CORP	活跃	Microsemi Corporation	RECTANGULAR	TFBGA	M2S090-FCSG325I	有	-	166 MHz	86316 LE	SMD/SMT	-	64 kB		--	--		Correct-A-Chip® 352000	e1	活跃	--	Solder	Tin/Silver/Copper (Sn/Ag/Cu)		LG-MIN, WD-MIN	8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL		250	0.5 mm	compliant	1A	0.050 (1.27mm)		R-PBGA-B325	180	不合格		Tin-Lead		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180		1.16 mm	现场可编程门阵列				0.125 (3.18mm)	0.100 (2.54mm)	PLCC	DIP, 0.3 (7.62mm) Row Spacing	FPGA - 90K Logic Modules		86316	1 Core		512KB	--				13.5 mm	11 mm	--	--	--
XCZU2CG-2SFVA625E	AMD	数据表	802 In Stock	-	最小起订量: 1 最小包装量: 1	Panel Mount, Bulkhead	625-BFBGA, FCBGA	625-FCBGA (21x21)	AMD	Tray	XCZU2	活跃									180	0°C ~ 100°C (TJ)		USBF电视		活跃																										533MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							2			USB - A, Receptacle	USB - A, Receptacle	Zynq®UltraScale+™ FPGA, 103K+ Logic Cells					-