N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484

484-FPBGA (23x23)

484

微芯片技术

30

267

Compliant

Tray

M2GL090

活跃

86184 LE

+ 85 C

0 C

SMD/SMT

1.14 V

M2GL090T-1FGG484

有

活跃

MICROSEMI CORP

BGA, BGA484,22X22,40

5.3

3

85 °C

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

网格排列

1.26 V

1.2 V

0°C ~ 85°C (TJ)

IGLOO2

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

OTHER

323.3 kB

267

2.44 mm

现场可编程门阵列

86316

2648064

1

4 Transceiver

86316

23 mm

23 mm

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

574

Tray

M2GL150

活跃

1.14 V

146124 LE

+ 100 C

- 40 C

SMD/SMT

M2GL150-FCG1152I

有

活跃

MICROSEMI CORP

35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152

5.27

4

PLASTIC/EPOXY

BGA

BGA1152,34X34,40

SQUARE

网格排列

1.26 V

1.2 V

30

-40°C ~ 100°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

1.2 V

667 Mb/s

574

2.9 mm

现场可编程门阵列

146124

5120000

STD

16 Transceiver

146124

35 mm

35 mm

N/A

-

256-LBGA

YES

256-FPBGA (17x17)

256

GRID ARRAY, LOW PROFILE, FINE PITCH

微芯片技术

1.26 V

1.2 V

40

1.2000 V

138

Tray

M2S010

活跃

1.14 V

-

166 MHz

12084 LE

SMD/SMT

-

64 kB

M2S010T-1VFG256I

有

活跃

MICROSEMI CORP

LFBGA, BGA256,16X16,32

5.77

3

PLASTIC/EPOXY

LFBGA

BGA256,16X16,32

SQUARE

-40 to 100 °C

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B256

138

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

1

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm

N/A

-

表面贴装

484-BFBGA

YES

484-BGA

484

微芯片技术

1.14 V

M2GL150-FCVG484

有

活跃

MICROSEMI CORP

19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-484

5.27

4

85 °C

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

1.26 V

1.2 V

30

248

Tray

M2GL150

活跃

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B484

OTHER

3.15 mm

现场可编程门阵列

146124

5120000

STD

19 mm

19 mm

N/A

-

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

BGA

BGA1152,34X34,40

SQUARE

微芯片技术

网格排列

1.26 V

1.2 V

40

1.2000 V

1.14 V

1.26 V

574

Tray

M2S150

活跃

-

166 MHz

146124 LE

-

64 kB

1.14 V

M2S150T-FCG1152

有

活跃

MICROSEMI CORP

BGA, BGA1152,34X34,40

5.77

4

85 °C

PLASTIC/EPOXY

0 to 85 °C

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

1152

S-PBGA-B1152

574

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

574

2.9 mm

现场可编程门阵列

STD

FPGA - 150K Logic Modules

146124

1 Core

512KB

35 mm

35 mm

N/A

-

表面贴装

VFBGA-256

YES

256-FPBGA (14x14)

256

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

微芯片技术

1.26 V

1.2 V

30

有

6060 LE

161 I/O

+ 85 C

0 C

119

SMD/SMT

Microchip Technology / Atmel

IGLOO2

Details

Tray

M2GL005

活跃

1.14 V

M2GL005-1VFG256

有

活跃

MICROSEMI CORP

LFBGA,

5.28

3

85 °C

PLASTIC/EPOXY

LFBGA

0°C ~ 85°C (TJ)

Tray

M2GL005

可编程逻辑集成电路

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

1.2 V

OTHER

-

1.56 mm

现场可编程门阵列

6060

FPGA - Field Programmable Gate Array

719872

-

FPGA - Field Programmable Gate Array

14 mm

14 mm

N/A

-

表面贴装

400-LFBGA

YES

400-VFBGA (17x17)

400

GRID ARRAY, LOW PROFILE, FINE PITCH

1.26 V

微芯片技术

1.2 V

30

207

Tray

M2GL060

活跃

有

56520 LE

+ 100 C

0.299386 oz

- 40 C

90

SMD/SMT

Microchip Technology / Atmel

IGLOO2

Details

1.14 V

M2GL060-VFG400I

有

活跃

MICROSEMI CORP

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

5.25

3

PLASTIC/EPOXY

LFBGA

SQUARE

-40°C ~ 100°C (TJ)

Tray

IGLOO2

8542.39.00.01

可编程逻辑集成电路

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

1.2 V

667 Mb/s

1.51 mm

现场可编程门阵列

56520

FPGA - Field Programmable Gate Array

1869824

STD

4 Transceiver

FPGA - Field Programmable Gate Array

17 mm

17 mm

N/A

-

表面贴装

VFBGA-256

YES

256-FPBGA (14x14)

256

GRID ARRAY, LOW PROFILE, FINE PITCH

1.26 V

微芯片技术

1.2 V

20

有

6060 LE

161 I/O

+ 100 C

0.321234 oz

- 40 C

119

SMD/SMT

Microchip Technology / Atmel

IGLOO2

N

Tray

M2GL005

活跃

1.14 V

M2GL005-VF256I

无

活跃

MICROSEMI CORP

LFBGA,

5.27

IC FPGA 161 I/O 256VFBGA

PLASTIC/EPOXY

LFBGA

SQUARE

-40°C ~ 100°C (TJ)

Tray

M2GL005

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

可编程逻辑集成电路

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.2 V

-

1.56 mm

现场可编程门阵列

6060

FPGA - Field Programmable Gate Array

719872

STD

-

FPGA - Field Programmable Gate Array

14 mm

14 mm

N/A

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

微芯片技术

5.24

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

MICROSEMI CORP

活跃

无

M1A3P1000L-FG256I

1.2000 V

1.14 V

1.26 V

177

Tray

M1A3P1000

活跃

30

1.2 V

1.14 V

1.575 V

网格排列

SQUARE

BGA256,16X16,40

BGA

PLASTIC/EPOXY

-40 °C

85 °C

3

350 MHz

-40 to 85 °C

ProASIC3L

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

177

不合格

1.5/3.3 V

INDUSTRIAL

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

STD

24576

24576

1000000

17 mm

17 mm

N/A

-

BGA-676

YES

676-FBGA (27x27)

676

3

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

网格排列

微芯片技术

1.26 V

1.2 V

30

有

-

166 MHz

86316 LE

1.071118 oz

40

SMD/SMT

7193 LAB

Microchip Technology / Atmel

N

-

64 kB

425

Tray

M2S090

活跃

1.14 V

M2S090TS-1FG676I

无

活跃

MICROSEMI CORP

FBGA-676

5.29

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B676

425

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

425

2.44 mm

现场可编程门阵列

SoC FPGA

FPGA - 90K Logic Modules

86316

1 Core

512KB

SoC FPGA

27 mm

27 mm

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

1.14 V

M2GL090TS-FCS325

无

活跃

MICROSEMI CORP

BGA, BGA325,21X21,20

5.27

85 °C

PLASTIC/EPOXY

BGA

BGA325,21X21,20

SQUARE

网格排列

1.26 V

1.2 V

20

180

Tray

M2GL090

活跃

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

OTHER

180

现场可编程门阵列

86184

2648064

86316

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

256-LBGA

YES

256

256-FPBGA (17x17)

256

微芯片技术

活跃

1.425 V

M1AFS600-FG256K

无

活跃

MICROSEMI CORP

LBGA,

5.3

3

100 °C

-55 °C

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

1.575 V

1.5 V

20

119

Non-Compliant

Tray

M1AFS600

-55°C ~ 100°C (TJ)

Fusion®

e0

Tin/Lead (Sn/Pb)

100 °C

-55 °C

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

OTHER

13.5 kB

600000 GATES

1.7 mm

现场可编程门阵列

110592

600000

600000

17 mm

17 mm

N/A

-

325-TFBGA, FCBGA

YES

325-FCBGA (11x13.5)

325

微芯片技术

30

180

Tray

M2S090

活跃

-

166 MHz

86316 LE

SMD/SMT

-

64 kB

1.14 V

M2S090-1FCS325I

无

活跃

MICROSEMI CORP

FBGA-325

5.77

PLASTIC/EPOXY

TFBGA

BGA325,21X21,20

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

1.26 V

1.2 V

-40°C ~ 100°C (TJ)

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

BOTTOM

BALL

240

0.5 mm

not_compliant

R-PBGA-B325

180

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.16 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

13.5 mm

11 mm

N/A

-

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

微芯片技术

30

1.2000 V

293

Tray

M2S150

活跃

-

166 MHz

146124 LE

-

64 kB

1.14 V

M2S150-1FCS536I

无

活跃

MICROSEMI CORP

BGA, BGA536,30X30,20

5.81

PLASTIC/EPOXY

BGA

BGA536,30X30,20

SQUARE

网格排列

1.26 V

1.2 V

-40 to 100 °C

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

not_compliant

S-PBGA-B536

293

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

293

现场可编程门阵列

1

FPGA - 150K Logic Modules

146124

1 Core

512KB

N/A

-

Production (Last Updated: 2 months ago)

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

网格排列

1.26 V

1.2 V

30

Non-Compliant

267

Tray

M2S060

活跃

-

166 MHz

56520 LE

-

64 kB

1.14 V

M2S060TS-1FG484

无

活跃

MICROSEMI CORP

FBGA-484

5.84

3

85 °C

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

0°C ~ 85°C (TJ)

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

23 mm

23 mm

N/A

-

表面贴装

676-BGA

YES

676-FBGA (27x27)

676

微芯片技术

活跃

M2GL060

56520 LE

+ 100 C

- 40 C

SMD/SMT

1.14 V

M2GL060T-FG676I

无

活跃

MICROSEMI CORP

BGA,

5.26

3

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.26 V

1.2 V

20

387

Tray

-40°C ~ 100°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

1.2 V

2.44 mm

现场可编程门阵列

56520

1869824

4 Transceiver

27 mm

27 mm

N/A

-

表面贴装

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

M2GL060

活跃

56520 LE

+ 85 C

0 C

SMD/SMT

1.14 V

M2GL060TS-VF400

无

活跃

MICROSEMI CORP

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

5.26

85 °C

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.26 V

1.2 V

20

207

Tray

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

1.2 V

OTHER

1.51 mm

现场可编程门阵列

56520

1869824

4 Transceiver

17 mm

17 mm

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

1.14 V

1.26 V

574

Tray

M2GL150

活跃

1.14 V

M2GL150-FC1152I

无

活跃

MICROSEMI CORP

BGA, BGA1152,34X34,40

5.27

FPGA - Field Programmable Gate Array IGLOO 2

PLASTIC/EPOXY

BGA

BGA1152,34X34,40

SQUARE

网格排列

1.26 V

1.2 V

20

1.2000 V

-40 to 100 °C

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

574

2.9 mm

现场可编程门阵列

146124

5120000

STD

146124

35 mm

35 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

YES

400

400-VFBGA (17x17)

400

微芯片技术

Non-Compliant

Tray

M2GL025

活跃

27696 LE

+ 85 C

0 C

SMD/SMT

1.14 V

20

1.2 V

1.26 V

GRID ARRAY, LOW PROFILE, FINE PITCH

SQUARE

BGA400,20X20,32

LFBGA

PLASTIC/EPOXY

85 °C

5.3

LFBGA, BGA400,20X20,32

MICROSEMI CORP

活跃

无

M2GL025T-VF400

207

0°C ~ 85°C (TJ)

IGLOO2

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

1.2 V

OTHER

138 kB

207

1.51 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

17 mm

17 mm

N/A

-

484-BGA

YES

484-FPBGA (23x23)

484

BGA484,22X22,40

SQUARE

网格排列

微芯片技术

1.26 V

1.2 V

30

1.2000 V

1.14 V

1.26 V

209

Tray

M2S005

活跃

-

166 MHz

6060 LE

SMD/SMT

-

64 kB

1.14 V

M2S005-1FG484I

无

活跃

MICROSEMI CORP

FBGA-484

5.86

3

PLASTIC/EPOXY

BGA

-40 to 100 °C

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

217

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

217

2.44 mm

现场可编程门阵列

1

FPGA - 5K Logic Modules

4956

1 Core

128KB

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

YES

400

400-VFBGA (17x17)

400

微芯片技术

Non-Compliant

Tray

M2GL010

活跃

12084 LE

+ 85 C

0 C

SMD/SMT

1.14 V

M2GL010-1VF400

无

活跃

MICROSEMI CORP

LFBGA, BGA400,20X20,32

5.3

85 °C

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.26 V

1.2 V

20

195

0°C ~ 85°C (TJ)

IGLOO2

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

1.2 V

OTHER

114 kB

195

1.51 mm

现场可编程门阵列

12084

933888

1

12084

17 mm

17 mm

N/A

-

表面贴装

676-BGA

YES

676-FBGA (27x27)

676

微芯片技术

387

Tray

M2GL060

活跃

56520 LE

+ 100 C

- 40 C

SMD/SMT

1.14 V

M2GL060-FG676I

无

活跃

MICROSEMI CORP

BGA,

5.26

FPGA - Field Programmable Gate Array IGLOO 2

3

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.26 V

1.2 V

20

-40°C ~ 100°C (TJ)

IGLOO2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

1.2 V

2.44 mm

现场可编程门阵列

56520

1869824

27 mm

27 mm

N/A

-

Production (Last Updated: 1 month ago)

484-BGA

YES

484-FPBGA (23x23)

484

网格排列

微芯片技术

1.26 V

1.2 V

30

1.2000 V

Non-Compliant

233

Tray

M2S010

活跃

-

166 MHz

12084 LE

SMD/SMT

-

64 kB

1.14 V

M2S010T-FG484I

无

活跃

MICROSEMI CORP

FBGA-484

5.81

3

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

-40 to 100 °C

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

233

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

现场可编程门阵列

STD

FPGA - 10K Logic Modules

12084

1 Core

256KB

23 mm

23 mm

N/A

-

表面贴装

YES

400

400

3

PLASTIC/EPOXY

FBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

1.2 V

207

Compliant

M2GL025S-1VFG400I

有

活跃

MICROSEMI CORP

5.82

100 °C

-40 °C

BOTTOM

BALL

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

138 kB

207

现场可编程门阵列

27696

27696

N/A

-

YES

1152

M2S100T-1FC1152I

无

活跃

MICROSEMI CORP

35 X 35 MM, 1 MM PITCH, FBGA-1152

5.86

PLASTIC/EPOXY

BGA

BGA1152,34X34,40

SQUARE

网格排列

1.26 V

1.2 V

未说明

1.14 V

e0

锡铅

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

574

2.9 mm

现场可编程门阵列

99512

35 mm

35 mm