类别是'category.FPGA 评估板' (3808)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 内存大小 | 速度 | 内存大小 | 操作模式 | 核心处理器 | 周边设备 | 程序内存大小 | 传播延迟 | 连接方式 | 数据率 | 建筑学 | 输入数量 | 组织结构 | 座位高度-最大 | 内存宽度 | 可编程逻辑类型 | 逻辑元件/单元数 | 产品类别 | 记忆密度 | 总 RAM 位数 | 最高频率 | 并行/串行 | 逻辑块数(LABs) | 内存IC类型 | 速度等级 | 输出功能 | 收发器数量 | 宏细胞数 | 主要属性 | CLB-Max的组合延时 | 逻辑块数量 | JTAG BST | 逻辑单元数 | 专用输入数量 | 核数量 | 等效门数 | 系统内可编程 | 闪光大小 | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | M2S010T-VF256I | Microchip | 数据表 | 11 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | 256-LFBGA | YES | 256-FPBGA (14x14) | 256 | 微芯片技术 | M2S010 | 活跃 | - | 166 MHz | 12084 LE | SMD/SMT | - | 64 kB | 1.14 V | M2S010T-VF256I | 无 | 活跃 | MICROSEMI CORP | LFBGA, BGA256,16X16,32 | 5.81 | PLASTIC/EPOXY | LFBGA | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.26 V | 1.2 V | 30 | Non-Compliant | 138 | Tray | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 138 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025T-1VF400 | Microchip | 数据表 | 2400 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | 微芯片技术 | MICROSEMI CORP | LFBGA, BGA400,20X20,32 | 5.3 | 1.2000 V | 1.14 V | 1.26 V | 207 | Tray | M2S025 | 活跃 | - | 166 MHz | 27696 LE | SMD/SMT | - | 64 kB | 85 °C | PLASTIC/EPOXY | LFBGA | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.26 V | 1.14 V | 1.2 V | 30 | M2S025T-1VF400 | 无 | 活跃 | 0 to 85 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 160 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | 现场可编程门阵列 | 1 | FPGA - 25K Logic Modules | 23988 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL050T-FG896 | Microchip | 数据表 | 2502 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 896-BGA | YES | 896-FBGA (31x31) | 896 | 微芯片技术 | 377 | Non-Compliant | Tray | M2GL050 | 活跃 | 1.14 V | M2GL050T-FG896 | 无 | 活跃 | MICROSEMI CORP | BGA, BGA896,30X30,40 | 5.3 | 3 | 85 °C | PLASTIC/EPOXY | BGA | BGA896,30X30,40 | SQUARE | 网格排列 | 1.26 V | 1.2 V | 20 | 1.2000 V | 1.14 V | 1.26 V | 0 to 85 °C | IGLOO2 | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B896 | 377 | 不合格 | 1.2 V | OTHER | 228.3 kB | 377 | 2.44 mm | 现场可编程门阵列 | 56340 | 1869824 | STD | 56340 | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL025-FG484 | Microchip | 数据表 | 2400 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 484 | 微芯片技术 | 5.3 | BGA, BGA484,22X22,40 | 267 | Tray | M2GL025 | 活跃 | 有 | This product may require additional documentation to export from the United States. | 27696 LE | + 85 C | 0 C | 60 | SMD/SMT | Microchip Technology / Atmel | IGLOO2 | N | 1.14 V | M2GL025-FG484 | 无 | 活跃 | MICROSEMI CORP | 20 | 1.2 V | 1.26 V | 网格排列 | SQUARE | BGA484,22X22,40 | BGA | PLASTIC/EPOXY | 85 °C | 3 | 0°C ~ 85°C (TJ) | Tray | IGLOO2 | 3A991.D | 85 °C | 0 °C | 8542.31.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 1.2 V | OTHER | 256 kB | 138 kB | 667 Mb/s | 267 | 2.44 mm | 现场可编程门阵列 | 27696 | FPGA - Field Programmable Gate Array | 1130496 | 400 MHz | 34 | 4 Transceiver | 27696 | FPGA - Field Programmable Gate Array | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCR3064XL-6VQG100I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 2.7 V | XCR3064XL-6VQG100I | 有 | 活跃 | XILINX INC | QFP | TFQFP, | 5.15 | 167 MHz | 3 | 64 | 85 °C | -40 °C | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 3.6 V | 3.3 V | 30 | e3 | 有 | 哑光锡 | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | 100 | S-PQFP-G100 | 不合格 | INDUSTRIAL | 6 ns | 64 I/O | 1.2 mm | EE PLD | MACROCELL | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4085XL-3BGG560I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 560 | XC4085XL-3BGG560I | 有 | Obsolete | XILINX INC | BGA | LBGA, | 5.82 | 166 MHz | 3 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 3.6 V | 3.3 V | 40 | 3 V | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | MAX USABLE 85000 LOGIC GATES | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 560 | S-PBGA-B560 | 不合格 | 3136 CLBS, 55000 GATES | 1.7 mm | 现场可编程门阵列 | 1.6 ns | 3136 | 55000 | 42.5 mm | 42.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV600E-8BGG432C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 432 | XCV600E-8BGG432C | 有 | Obsolete | XILINX INC | BGA | BGA-432 | 5.8 | 416 MHz | 3 | 85 °C | PLASTIC/EPOXY | LBGA | BGA432,31X31,50 | SQUARE | GRID ARRAY, LOW PROFILE | 1.89 V | 1.8 V | 30 | 1.71 V | e1 | 有 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | unknown | 432 | S-PBGA-B432 | 316 | 不合格 | 1.2/3.6,1.8 V | OTHER | 316 | 3456 CLBS, 186624 GATES | 1.7 mm | 现场可编程门阵列 | 0.4 ns | 3456 | 15552 | 186624 | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV400E-6BGG432I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 432 | 有 | XCV400E-6BGG432I | Obsolete | XILINX INC | BGA | BGA-432 | 5.79 | 357 MHz | 3 | PLASTIC/EPOXY | LBGA | BGA432,31X31,50 | SQUARE | GRID ARRAY, LOW PROFILE | 1.89 V | 1.8 V | 30 | 1.71 V | e1 | 有 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | unknown | 432 | S-PBGA-B432 | 316 | 不合格 | 1.2/3.6,1.8 V | 316 | 2400 CLBS, 129600 GATES | 1.7 mm | 现场可编程门阵列 | 0.47 ns | 2400 | 10800 | 129600 | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCS30XL-3PQG240C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 240 | XCS30XL-3PQG240C | 有 | Obsolete | XILINX INC | QFP | FQFP, | 5.81 | 3 | 85 °C | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 3.6 V | 3.3 V | 30 | 3 V | e3 | 有 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | 240 | S-PQFP-G240 | 不合格 | OTHER | 576 CLBS, 10000 GATES | 4.1 mm | 现场可编程门阵列 | 576 | 10000 | 32 mm | 32 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCF04SVOG20C0936 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | XCF04SVOG20C0936 | 有 | Obsolete | XILINX INC | TSSOP | TSSOP, | 5.48 | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3.3 V | 30 | e3 | 有 | 3A991.B.1 | 哑光锡 | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 20 | R-PDSO-G20 | 不合格 | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | 4MX1 | 1.19 mm | 1 | 4194304 bit | SERIAL | 配置存储器 | 6.5024 mm | 4.4 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV600E-6FGG900C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 900 | XCV600E-6FGG900C | 有 | Obsolete | XILINX INC | BGA | BGA, BGA900,30X30,40 | 5.81 | 357 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | 1.71 V | e1 | 有 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | 900 | S-PBGA-B900 | 512 | 不合格 | 1.2/3.6,1.8 V | OTHER | 512 | 3456 CLBS, 186624 GATES | 2.6 mm | 现场可编程门阵列 | 0.47 ns | 3456 | 15552 | 186624 | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC6VLX240T-3FF1759I | Xilinx | 数据表 | 152 In Stock | - | 最小起订量: 1 最小包装量: 1 | 无 | 活跃 | XILINX INC | , | 5.8 | 未说明 | XC6VLX240T-3FF1759I | e0 | 锡铅 | 未说明 | compliant | 现场可编程门阵列 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4013XLA-08PQG240I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 240 | XC4013XLA-08PQG240I | 有 | Obsolete | XILINX INC | QFP | FQFP, | 5.3 | 263 MHz | 3 | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 3.6 V | 3.3 V | 40 | 3 V | e3 | Matte Tin (Sn) | CAN ALSO USE 30000 GATES | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | 240 | S-PQFP-G240 | 不合格 | 576 CLBS, 10000 GATES | 4.1 mm | 现场可编程门阵列 | 1 ns | 576 | 10000 | 32 mm | 32 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC6VSX475T-3FF1759C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | XC6VSX475T-3FF1759C | 无 | 活跃 | XILINX INC | 5.32 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4085XLA-08HQG304I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 304 | QFP | HFQFP, | 5.82 | 263 MHz | PLASTIC/EPOXY | HFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | 3.6 V | 3.3 V | 3 V | XC4085XLA-08HQG304I | 有 | Obsolete | XILINX INC | CAN ALSO USE 180000 GATES | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | 304 | S-PQFP-G304 | 不合格 | 3136 CLBS, 55000 GATES | 4.5 mm | 现场可编程门阵列 | 1 ns | 3136 | 55000 | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4044XLA-09HQG208C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | XC4044XLA-09HQG208C | 有 | Obsolete | XILINX INC | QFP | HFQFP, | 5.79 | 227 MHz | 3 | 85 °C | PLASTIC/EPOXY | HFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | 3.6 V | 3.3 V | 3 V | e3 | Matte Tin (Sn) | CAN ALSO USE 80000 GATES | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | 208 | S-PQFP-G208 | 不合格 | OTHER | 1600 CLBS, 27000 GATES | 4.1 mm | 现场可编程门阵列 | 1.1 ns | 1600 | 27000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7272A-20PC84C | Xilinx | 数据表 | 2 In Stock | - | 最小起订量: 1 最小包装量: 1 | YES | 84 | XC7272A-20PC84C | 无 | Obsolete | XILINX INC | LCC | PLASTIC, MO-047AF, LCC-84 | 5.88 | 50 MHz | 3 | 42 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | 5.25 V | 5 V | 4.75 V | e0 | EAR99 | Tin/Lead (Sn85Pb15) | PAL BLOCKS INTERCONNECTED BY PIA; 72 MACROCELLS | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | unknown | 84 | S-PQCC-J84 | 不合格 | 5 V | COMMERCIAL | 32 ns | 12 DEDICATED INPUTS, 42 I/O | 5.08 mm | OT PLD | MACROCELL | 72 | NO | 12 | NO | 29.3116 mm | 29.3116 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC3030-70PG84M | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 84 | XC3030-70PG84M | 有 | Obsolete | XILINX INC | PGA | PGA, PGA84M,11X11 | 5.8 | 70 MHz | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | PGA | PGA84M,11X11 | SQUARE | 网格排列 | 5 V | 未说明 | 3A001.A.2.C | 360 FLIP-FLOPS; TYP. GATES = 1500-2000; POWER-DOWN SUPPLY CURRENT = 80UA | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 未说明 | 2.54 mm | unknown | 84 | S-CPGA-P84 | 74 | 不合格 | 5 V | MILITARY | 74 | 100 CLBS, 1500 GATES | 4.318 mm | 现场可编程门阵列 | 9 ns | 100 | 100 | 1500 | 27.94 mm | 27.94 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC3120-4PQ100C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | QFP100,.7X.9 | RECTANGULAR | FLATPACK | 5.25 V | 5 V | QFP | PLASTIC/EPOXY | 70 °C | 3 | 227 MHz | 5.83 | QFP, QFP100,.7X.9 | QFP | XILINX INC | Obsolete | 无 | XC3120-4PQ100C | 4.75 V | e0 | Tin/Lead (Sn85Pb15) | TYP. GATES = 1000-1500 | QUAD | 鸥翼 | 0.65 mm | not_compliant | 100 | R-PQFP-G100 | 64 | 不合格 | 5 V | COMMERCIAL | 64 | 64 CLBS, 1000 GATES | 3.4 mm | 现场可编程门阵列 | 3.3 ns | 64 | 64 | 1000 | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4036XLA-09BGG432C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 432 | 有 | Obsolete | XILINX INC | BGA | LBGA, | 5.79 | 227 MHz | 3 | 85 °C | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 3.6 V | 3.3 V | XC4036XLA-09BGG432C | 30 | 3 V | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | CAN ALSO USE 65000 GATES | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 432 | S-PBGA-B432 | 不合格 | OTHER | 1296 CLBS, 22000 GATES | 1.7 mm | 现场可编程门阵列 | 1.1 ns | 1296 | 22000 | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC3130A-4PC44C | Xilinx | 数据表 | 100 In Stock | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | 85 °C | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | 5.25 V | 5 V | 4.75 V | XC3130A-4PC44C | 接触制造商 | ROCHESTER ELECTRONICS LLC | QCCJ, | 5.78 | 227 MHz | MAX USABLE 2000 LOGIC GATES | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | unknown | S-PQCC-J44 | OTHER | 100 CLBS, 1500 GATES | 4.572 mm | 现场可编程门阵列 | 3.3 ns | 100 | 1500 | 16.5862 mm | 16.5862 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4085XLA-08HQG208C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | XC4085XLA-08HQG208C | 有 | Obsolete | XILINX INC | QFP | HFQFP, | 5.82 | 263 MHz | 3 | 85 °C | PLASTIC/EPOXY | HFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | 3.6 V | 3.3 V | 20 | 3 V | e3 | Matte Tin (Sn) | CAN ALSO USE 180000 GATES | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | 208 | S-PQFP-G208 | 不合格 | OTHER | 3136 CLBS, 55000 GATES | 4.1 mm | 现场可编程门阵列 | 1 ns | 3136 | 55000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCS30XL-3TQ144C | Xilinx | 数据表 | 40 In Stock | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | XCS30XL-3TQ144C | 无 | Obsolete | XILINX INC | QFP | PLASTIC, TQFP-144 | 5.85 | 3 | 85 °C | PLASTIC/EPOXY | LFQFP | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 3.6 V | 3.3 V | 30 | 3 V | e0 | 无 | Tin/Lead (Sn85Pb15) | 30000 EQUIVALENT GATES AVAILABLE | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.5 mm | not_compliant | 144 | S-PQFP-G144 | 196 | 不合格 | 3.3 V | OTHER | 196 | 576 CLBS, 10000 GATES | 1.6 mm | 现场可编程门阵列 | 576 | 576 | 10000 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7K420T-3FFG901C | Xilinx | 数据表 | 1745 In Stock | - | 最小起订量: 1 最小包装量: 1 | YES | 900 | XC7K420T-3FFG901C | 有 | 活跃 | XILINX INC | BGA | LEAD FREE, FBGA-900 | 5.77 | 4 | PLASTIC/EPOXY | 网格排列 | 30 | e1 | 3A001.A.7.B | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 245 | compliant | 900 | 不合格 | 现场可编程门阵列 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4020XLA-08PQG208I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | XC4020XLA-08PQG208I | 有 | Obsolete | XILINX INC | QFP | FQFP, | 5.79 | 263 MHz | 3 | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 3.6 V | 3.3 V | 30 | 3 V | e3 | Matte Tin (Sn) | CAN ALSO USE 40000 GATES | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | 208 | S-PQFP-G208 | 不合格 | 784 CLBS, 13000 GATES | 4.1 mm | 现场可编程门阵列 | 1 ns | 784 | 13000 | 28 mm | 28 mm |
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分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
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分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
