类别是'category.RF二极管' (10000)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 二极管元件材料 | 终端数量 | 厂商 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 应用 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | Reach合规守则 | 引脚数量 | 参考标准 | JESD-30代码 | 资历状况 | 配置 | 速度 | 二极管类型 | 反向泄漏电流@ Vr | 不同 If 时电压 - 正向 (Vf) | 箱体转运 | 工作温度 - 结点 | 输出电流-最大值 | 电压 - 直流逆向(Vr)(最大值) | 平均整流电流(Io) | 最大反向电压(DC) | 平均整流电流 | 产品类别 | 相位的数量 | Rep Pk反向电压-最大值 | JEDEC-95代码 | 电容@Vr, F | 最大非代表Pk前进电流 | 二极管配置 | 反向电流-最大值 | 击穿电压-最小值 | 重复峰值反向电压 | 反向测试电压 | 频带 | 二极管电容-标称 | 二极管电容-最大值 | 二极管电阻测试电流 | 二极管正向电阻-最大值 | 产品类别 | 辐射硬化 | |||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
JAN1N5822 | Semtech | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | DO-201AD, Axial | NO | DO-201AD | SILICON | 2 | Semtech Corporation | JAN1N5822 | 未说明 | Bulk | Discontinued at Digi-Key | 无 | 活跃 | MICROSEMI CORP | HERMETIC SEALED PACKAGE-2 | 1.49 | 1 | UNSPECIFIED | ROUND | 长式 | - | e0 | 无 | Tin/Lead (Sn/Pb) | GENERAL PURPOSE | 冶金结合 | 8541.10.00.80 | AXIAL | WIRE | 未说明 | compliant | 2 | MIL-19500/620E | O-XALF-W2 | Qualified | SINGLE | Fast Recovery =< 500ns, > 200mA (Io) | 接收电极 | 500 µA @ 40 V | 525 mV @ 3 A | ISOLATED | -65°C ~ 125°C | 3 A | 40 V | 3A | 1 | - | 80 A | |||||||||||||||||||||||||||||||||||
GB01SHT06-CAU | GeneSiC Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 碳化硅 | 1 | 1 | 250 °C | -55 °C | UNSPECIFIED | SQUARE | UNCASED CHIP | 24 W | GB01SHT06-CAU | 有 | 接触制造商 | GENESIC SEMICONDUCTOR INC | S-XUUC-N1 | 5.71 | EAR99 | EFFICIENCY | PD-CASE | 8541.10.00.40 | UPPER | 无铅 | compliant | S-XUUC-N1 | SINGLE | 接收电极 | 2.5 A | 1 | 650 V | 10 A | 5 µA | ||||||||||||||||||||||||||||||||||||||||||||||||||||
GB20SHT06-CAL | GeneSiC Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 碳化硅 | 1 | 1 | 250 °C | -55 °C | UNSPECIFIED | SQUARE | UNCASED CHIP | 208 W | GB20SHT06-CAL | 有 | 接触制造商 | GENESIC SEMICONDUCTOR INC | S-XUUC-N1 | 5.67 | EAR99 | EFFICIENCY | PD-CASE | 8541.10.00.40 | UPPER | 无铅 | compliant | S-XUUC-N1 | SINGLE | 接收电极 | 30 A | 1 | 650 V | 140 A | 5 µA | ||||||||||||||||||||||||||||||||||||||||||||||||||||
LSM535J/TR13 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | DO-214AB, SMC | DO-214AB | 微芯片技术 | LSM535 | 活跃 | 3000 | 微芯片技术 | N | LSM535J/TR13 | 无 | 活跃 | MICROSEMI CORP | 5.8 | 未说明 | Tape & Reel (TR) | Reel | - | 无 | Diodes & Rectifiers | Schottky | 未说明 | compliant | Fast Recovery =< 500ns, > 200mA (Io) | 接收电极 | 2 mA @ 35 V | 520 mV @ 5 A | -55°C ~ 150°C | 35 V | 5A | Schottky Diodes & Rectifiers | - | Schottky Diodes & Rectifiers | ||||||||||||||||||||||||||||||||||||||||||||||||||
IDH10S60C | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 碳化硅 | 2 | TO-220AC | R-PSFM-T2 | 5.79 | 1.7 V | 1 | 175 °C | -55 °C | PLASTIC/EPOXY | RECTANGULAR | FLANGE MOUNT | 未说明 | IDH10S60C | 有 | Obsolete | INFINEON TECHNOLOGIES AG | 有 | EAR99 | GENERAL PURPOSE | 8541.10.00.80 | SINGLE | THROUGH-HOLE | 未说明 | compliant | 3 | R-PSFM-T2 | 不合格 | SINGLE | 接收电极 | CATHODE | 10 A | 1 | 600 V | TO-220AC | 84 A | ||||||||||||||||||||||||||||||||||||||||||||||
HSMP-4890-TR1G | AVAGO TECHNOLOGIES INC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | SILICON | 3 | R-PDSO-G3 | AVAGO TECHNOLOGIES INC | Obsolete | HSMP-4890-TR1G | 有 | 6.78 | 未说明 | PLASTIC/EPOXY | RECTANGULAR | 小概要 | 150 °C | 1 | 1 | e4 | 有 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | SWITCHING | 8541.10.00.80 | DUAL | 鸥翼 | 260 | compliant | 3 | R-PDSO-G3 | 不合格 | SINGLE | 针形二极管 | 100 V | 5 V | 超高频转S波段 | 0.33 pF | 0.375 pF | 5 mA | 2.5 Ω | |||||||||||||||||||||||||||||||||||||||||||||
HSM830GE3/TR13 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | DO-215AB, SMC Gull Wing | YES | DO-215AB | SILICON | 2 | MICROSEMI CORP | 5.75 | 0.62 V | 微芯片技术 | 1 | 175 °C | -55 °C | PLASTIC/EPOXY | RECTANGULAR | 小概要 | 未说明 | Tape & Reel (TR) | HSM830 | 活跃 | 3000 | 微芯片技术 | Details | HSM830GE3/TR13 | 有 | 活跃 | Reel | - | 有 | GENERAL PURPOSE | Diodes & Rectifiers | DUAL | 鸥翼 | 未说明 | compliant | R-PDSO-G2 | SINGLE | Fast Recovery =< 500ns, > 200mA (Io) | 接收电极 | 250 µA @ 30 V | 620 mV @ 8 A | -55°C ~ 175°C | 8 A | 30 V | 8A | Schottky Diodes & Rectifiers | 1 | 30 V | DO-215AB | - | 350 A | 250 µA | 30 V | Schottky Diodes & Rectifiers | |||||||||||||||||||||||||||||
IDH15S120 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | IDH15S120 | 有 | Obsolete | INFINEON TECHNOLOGIES AG | TO-220AC | R-PSFM-T2 | 8.6 | 有 | EAR99 | 8541.10.00.80 | not_compliant | 3 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
HSM160GE3/TR13 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | DO-215AA, SMB Gull Wing | YES | DO-215AA | SILICON | 2 | DO-215AA | ROHS COMPLIANT, SMBG, 2 PIN | 微芯片技术 | 5.42 | 1 | PLASTIC/EPOXY | RECTANGULAR | 小概要 | 40 | Tape & Reel (TR) | HSM160 | 活跃 | 3000 | 微芯片技术 | Details | HSM160GE3/TR13 | 有 | 活跃 | MICROSEMI CORP | Reel | - | e3 | 有 | EAR99 | 哑光锡 | 8541.10.00.80 | Diodes & Rectifiers | DUAL | 鸥翼 | 260 | compliant | 2 | R-PDSO-G2 | 不合格 | SINGLE | Fast Recovery =< 500ns, > 200mA (Io) | 接收电极 | 100 µA @ 60 V | 690 mV @ 1 A | -55°C ~ 175°C | 1 A | 60 V | 1A | Schottky Diodes & Rectifiers | 60 V | DO-215AA | - | Schottky Diodes & Rectifiers | |||||||||||||||||||||||||||||
HSM8100GE3/TR13 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | DO-215AB, SMC Gull Wing | YES | DO-215AB | SILICON | 2 | 活跃 | MICROSEMI CORP | R-PDSO-G2 | 5.48 | 微芯片技术 | 0.78 V | 1 | 175 °C | -55 °C | PLASTIC/EPOXY | RECTANGULAR | 小概要 | 未说明 | Tape & Reel (TR) | HSM8100 | 活跃 | 3000 | 微芯片技术 | Details | HSM8100GE3/TR13 | 有 | Reel | - | e3 | 有 | Matte Tin (Sn) | EFFICIENCY | FREE WHEELING DIODE, LOW LEAKAGE CURRENT, LOW POWER LOSS | Diodes & Rectifiers | DUAL | 鸥翼 | 未说明 | compliant | R-PDSO-G2 | SINGLE | Fast Recovery =< 500ns, > 200mA (Io) | 接收电极 | 500 µA @ 100 V | 780 mV @ 8 A | -55°C ~ 175°C | 8 A | 100 V | 8A | Schottky Diodes & Rectifiers | 1 | 100 V | DO-215AB | - | 300 A | 500 µA | 100 V | Schottky Diodes & Rectifiers | |||||||||||||||||||||||||
HSM3100JE3/TR13 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | DO-214AB, SMC | YES | DO-214AB | SILICON | 2 | 活跃 | MICROSEMI CORP | DO-214AB | R-PDSO-J2 | 微芯片技术 | 5.59 | 0.81 V | 1 | 175 °C | -55 °C | PLASTIC/EPOXY | RECTANGULAR | 小概要 | Tape & Reel (TR) | HSM3100 | 活跃 | 3000 | 微芯片技术 | Details | HSM3100JE3/TR13 | 有 | Reel | - | EAR99 | GENERAL PURPOSE | 8541.10.00.80 | Diodes & Rectifiers | DUAL | J BEND | compliant | 2 | R-PDSO-J2 | 不合格 | SINGLE | Fast Recovery =< 500ns, > 200mA (Io) | 接收电极 | 100 µA @ 100 V | 810 mV @ 3 A | -55°C ~ 175°C | 3 A | 100 V | 3A | Schottky Diodes & Rectifiers | 1 | 100 V | DO-214AB | - | 125 A | Single | 100 µA | 100 | 100 V | Schottky Diodes & Rectifiers | ||||||||||||||||||||||||
HSM3100GE3/TR13 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | DO-215AB, SMC Gull Wing | YES | DO-215AB | SILICON | 2 | 175 °C | 微芯片技术 | 1 | 0.81 V | 5.75 | SMCG, 2 PIN | MICROSEMI CORP | 活跃 | 有 | HSM3100GE3/TR13 | Tape & Reel (TR) | HSM3100 | 活跃 | PLASTIC/EPOXY | RECTANGULAR | 小概要 | 未说明 | -55 °C | - | 有 | GENERAL PURPOSE | DUAL | 鸥翼 | 未说明 | compliant | R-PDSO-G2 | SINGLE | Fast Recovery =< 500ns, > 200mA (Io) | 接收电极 | 100 µA @ 100 V | 810 mV @ 3 A | -55°C ~ 175°C | 3 A | 100 V | 3A | 1 | 100 V | DO-215AB | - | 125 A | 100 µA | 100 V | |||||||||||||||||||||||||||||||||||
DSB1A100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | DO-204AL, DO-41, Axial | NO | DO-204AL (DO-41) | SILICON | 2 | HERMETIC SEALED PACKAGE-2 | 微芯片技术 | 5.35 | 1 | 125 °C | -55 °C | UNSPECIFIED | ROUND | 长式 | 未说明 | 活跃 | DSB1A100 | Bulk | DSB1A100 | 无 | 活跃 | MICROSEMI CORP | DO-41 | - | e0 | 无 | EAR99 | 锡铅 | 冶金结合 | 8541.10.00.80 | AXIAL | WIRE | 未说明 | unknown | 2 | O-XALF-W2 | 不合格 | SINGLE | Fast Recovery =< 500ns, > 200mA (Io) | 接收电极 | 100 µA @ 100 V | 690 mV @ 1 A | ISOLATED | - | 1 A | 100 V | 1A | 100 V | DO-41 | - | ||||||||||||||||||||||||||||||||
D180SC6M-4000 | Shindengen | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | SILICON | 5 | MODULE-3 | UNSPECIFIED | RECTANGULAR | FLANGE MOUNT | 5.75 | 0.67 V | 3 | 125 °C | 25 | Shindengen | Details | D180SC6M-4000 | 活跃 | SHINDENGEN ELECTRIC MANUFACTURING CO LTD | MODULE | Bulk | EAR99 | GENERAL PURPOSE | 8541.10.00.80 | Diodes & Rectifiers | UPPER | SOLDER LUG | unknown | 3 | R-XUFM-D5 | 不合格 | COMMON CATHODE, 3 ELEMENTS | 接收电极 | CATHODE | 60 A | Schottky Diodes & Rectifiers | 1 | 60 V | 800 A | 40000 µA | Schottky Diodes & Rectifiers | ||||||||||||||||||||||||||||||||||||||||||||
DF30JC6-7072 | Shindengen | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | DF30JC6-7072 | 活跃 | SHINDENGEN ELECTRIC MANUFACTURING CO LTD | 5.76 | 1000 | Shindengen | Details | Reel | EAR99 | Diodes & Rectifiers | Si | unknown | Schottky Diodes & Rectifiers | Schottky Diodes & Rectifiers | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
JANTX1N5711UBD | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 3-SMD, No Lead | YES | UB | SILICON | 3 | 5.56 | 微芯片技术 | 2 | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | 小概要 | 未说明 | Bulk | 1N5711 | 活跃 | 1 | Microchip / Microsemi | N | JANTX1N5711UBD | 无 | 活跃 | MICROSEMI CORP | R-CDSO-N3 | Waffle | Military, MIL-PRF-19500/444 | e0 | 无 | EAR99 | Tin/Lead (Sn/Pb) | 8541.10.00.70 | Diodes & Rectifiers | DUAL | 无铅 | 未说明 | compliant | 3 | MIL-19500/444 | R-CDSO-N3 | Qualified | SERIES CONNECTED, CENTER TAP, 2 ELEMENTS | Small Signal =< 200mA (Io), Any Speed | 接收电极 | 200 nA @ 50 V | 1 V @ 15 mA | -65°C ~ 150°C | 0.033 A | 50 V | 33mA | Schottky Diodes & Rectifiers | 2pF @ 0V, 1MHz | Schottky Diodes & Rectifiers | |||||||||||||||||||||||||||||||
JANTX1N6660DT1 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | SILICON | 3 | MICROSEMI CORP | TO-254AA | TO-254, 3 PIN | 5.47 | 2 | 150 °C | -65 °C | UNSPECIFIED | SQUARE | FLANGE MOUNT | Non-Compliant | 1 | Microchip / Microsemi | JANTX1N6660DT1 | 无 | Obsolete | Tray | EAR99 | POWER | 8541.10.00.80 | Diodes & Rectifiers | SINGLE | PIN/PEG | compliant | 3 | MIL-19500/608 | S-XSFM-P3 | Qualified | SERIES CONNECTED, CENTER TAP, 2 ELEMENTS | 接收电极 | ISOLATED | 15 A | Schottky Diodes & Rectifiers | 1 | 45 V | TO-254AA | 300 A | Schottky Diodes & Rectifiers | ||||||||||||||||||||||||||||||||||||||||||
D2S4M-4060 | Shindengen | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | SILICON | 2 | 活跃 | D2S4M-4060 | 长式 | ROUND | GLASS | 125 °C | 1 | 0.55 V | 5.65 | SHINDENGEN ELECTRIC MANUFACTURING CO LTD | EAR99 | GENERAL PURPOSE | 8541.10.00.80 | AXIAL | WIRE | unknown | O-LALF-W2 | 不合格 | SINGLE | 接收电极 | ISOLATED | 1.5 A | 1 | 40 V | 60 A | 2000 µA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
FM1100L-W | Rectron | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FM1100L-W | 有 | 活跃 | RECTRON LTD | ROHS COMPLIANT, PLASTIC, SMAL, 2 PIN | 有 | compliant | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
HSM550GE3/TR13 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | DO-215AB, SMC Gull Wing | YES | DO-215AB | SILICON | 2 | 微芯片技术 | PLASTIC/EPOXY | RECTANGULAR | 小概要 | Tape & Reel (TR) | HSM550 | 活跃 | HSM550GE3/TR13 | 活跃 | MICROSEMI CORP | 5.75 | 0.65 V | 1 | 175 °C | -55 °C | - | 有 | GENERAL PURPOSE | DUAL | 鸥翼 | compliant | R-PDSO-G2 | SINGLE | Fast Recovery =< 500ns, > 200mA (Io) | 接收电极 | 250 µA @ 50 V | 650 mV @ 5 A | -55°C ~ 175°C | 5 A | 50 V | 5A | 1 | 50 V | DO-215AB | - | 250 A | 250 µA | 5 V | |||||||||||||||||||||||||||||||||||||||
HSM350GE3/TR13 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | DO-215AB, SMC Gull Wing | YES | DO-215AB | SILICON | 2 | MICROSEMI CORP | SMCG, 2 PIN | 5.75 | 微芯片技术 | 0.62 V | 1 | 175 °C | -55 °C | PLASTIC/EPOXY | RECTANGULAR | 小概要 | 未说明 | Tape & Reel (TR) | HSM350 | 活跃 | 3000 | 微芯片技术 | Details | HSM350GE3/TR13 | 有 | 活跃 | Reel | - | 有 | GENERAL PURPOSE | Diodes & Rectifiers | DUAL | 鸥翼 | 未说明 | compliant | R-PDSO-G2 | SINGLE | Fast Recovery =< 500ns, > 200mA (Io) | 接收电极 | 100 µA @ 50 V | 620 mV @ 3 A | -55°C ~ 175°C | 3 A | 50 V | 3A | 50 V | 3 A | Schottky Diodes & Rectifiers | 1 | 50 V | DO-215AB | - | 150 A | 100 µA | 50 V | Schottky Diodes & Rectifiers | 无 | ||||||||||||||||||||||||
HSM840GE3/TR13 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | DO-215AB, SMC Gull Wing | YES | DO-215AB | SILICON | 2 | MICROSEMI CORP | 5.75 | 0.62 V | 微芯片技术 | 1 | 175 °C | -55 °C | PLASTIC/EPOXY | RECTANGULAR | 小概要 | 未说明 | Tape & Reel (TR) | HSM840 | 活跃 | 3000 | 微芯片技术 | Details | HSM840GE3/TR13 | 有 | 活跃 | Reel | - | 有 | GENERAL PURPOSE | Diodes & Rectifiers | DUAL | 鸥翼 | 未说明 | compliant | R-PDSO-G2 | SINGLE | Fast Recovery =< 500ns, > 200mA (Io) | 接收电极 | 250 µA @ 40 V | 620 mV @ 8 A | -55°C ~ 175°C | 8 A | 40 V | 8A | Schottky Diodes & Rectifiers | 1 | 40 V | DO-215AB | - | 350 A | 250 µA | 40 V | Schottky Diodes & Rectifiers | |||||||||||||||||||||||||||||
HSM390G/TR13 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | DO-215AB, SMC Gull Wing | YES | DO-215AB | SILICON | 2 | 5.8 | 微芯片技术 | 0.81 V | 1 | 175 °C | -55 °C | PLASTIC/EPOXY | RECTANGULAR | 小概要 | 未说明 | Tape & Reel (TR) | HSM390 | 活跃 | HSM390G/TR13 | 无 | 活跃 | MICROSEMI CORP | R-PDSO-G2 | - | 无 | GENERAL PURPOSE | DUAL | 鸥翼 | 未说明 | compliant | R-PDSO-G2 | SINGLE | Fast Recovery =< 500ns, > 200mA (Io) | 接收电极 | 100 µA @ 90 V | 810 mV @ 3 A | -55°C ~ 175°C | 3 A | 90 V | 3A | 1 | 90 V | DO-215AB | - | 125 A | 100 µA | 90 V | |||||||||||||||||||||||||||||||||||
LSM845J/TR13 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | DO-214AB, SMC | DO-214AB | 微芯片技术 | LSM845 | 活跃 | 3000 | 微芯片技术 | N | LSM845J/TR13 | 无 | 活跃 | MICROSEMI CORP | 5.79 | 未说明 | Tape & Reel (TR) | Reel | - | 无 | Diodes & Rectifiers | Schottky | 未说明 | unknown | Fast Recovery =< 500ns, > 200mA (Io) | 接收电极 | 2 mA @ 45 V | 520 mV @ 8 A | -55°C ~ 150°C | 45 V | 8A | Schottky Diodes & Rectifiers | - | Schottky Diodes & Rectifiers | ||||||||||||||||||||||||||||||||||||||||||||||||||
LL5817 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | SILICON | 2 | ROHS COMPLIANT, PLASTIC, MELF-2 | 1.64 | 0.75 V | 1 | 1 | 150 °C | -65 °C | PLASTIC/EPOXY | ROUND | 长式 | 未说明 | LL5817 | 有 | 活跃 | TAIWAN SEMICONDUCTOR CO LTD | EAR99 | 8541.10 | END | 环绕 | 260 | compliant | O-PELF-R2 | SINGLE | 接收电极 | ISOLATED | 1 A | 20 V | 25 A |
JAN1N5822
Semtech
分类:Diodes - RF
GB01SHT06-CAU
GeneSiC Semiconductor
分类:Diodes - RF
GB20SHT06-CAL
GeneSiC Semiconductor
分类:Diodes - RF
LSM535J/TR13
Microchip
分类:Diodes - RF
IDH10S60C
Infineon Technologies
分类:Diodes - RF
HSMP-4890-TR1G
AVAGO TECHNOLOGIES INC
分类:Diodes - RF
HSM830GE3/TR13
Microchip
分类:Diodes - RF
IDH15S120
Infineon Technologies
分类:Diodes - RF
HSM160GE3/TR13
Microchip
分类:Diodes - RF
HSM8100GE3/TR13
Microchip
分类:Diodes - RF
HSM3100JE3/TR13
Microchip
分类:Diodes - RF
HSM3100GE3/TR13
Microchip
分类:Diodes - RF
DSB1A100
Microchip
分类:Diodes - RF
D180SC6M-4000
Shindengen
分类:Diodes - RF
DF30JC6-7072
Shindengen
分类:Diodes - RF
JANTX1N5711UBD
Microchip
分类:Diodes - RF
JANTX1N6660DT1
Microchip
分类:Diodes - RF
D2S4M-4060
Shindengen
分类:Diodes - RF
FM1100L-W
Rectron
分类:Diodes - RF
HSM550GE3/TR13
Microchip
分类:Diodes - RF
HSM350GE3/TR13
Microchip
分类:Diodes - RF
HSM840GE3/TR13
Microchip
分类:Diodes - RF
HSM390G/TR13
Microchip
分类:Diodes - RF
LSM845J/TR13
Microchip
分类:Diodes - RF
LL5817
Microchip
分类:Diodes - RF
