类别是'category.电信接口IC' (8324)

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对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

表面安装

材料

终端数量

Air permeability

Application area

Capacitance tolerance

Capacitors series

Case - inch

Case - mm

Colour

Date Of Intro

Gross weight

Heatsink shape

Inner diameter

Installation height

Kind of capacitor

Material finishing

Metal thickness

Mounting hole size

Plate thickness

Purpose

Thread pitch

Transport package size/quantity

Transport packaging size/quantity

Type of capacitor

Type of heatsink

Operating temperature

容差

JESD-609代码

无铅代码

ECCN 代码

类型

电阻

端子表面处理

颜色

HTS代码

电容量

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

资历状况

电介质

温度等级

操作模式

电源电流-最大值

数据率

座位高度-最大

Operating temperature range

筛选水平

通信IC类型

收发器数量

第二个连接器加载的位置数

Outer diameter

过滤器

压缩法

饱和电流

负电源电压

Operating voltage

增益公差-最大

线性编码

高度

长度

宽度

TP3040N
TP3040N
National Semiconductor Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

16

Obsolete

NATIONAL SEMICONDUCTOR CORP

DIP,

70 °C

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

5 V

e0

锡铅

8542.39.00.01

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

R-PDIP-T16

不合格

COMMERCIAL

6.4 mA

5.08 mm

电信电路

-5 V

21.755 mm

7.62 mm

RF6535
RF6535
RF Micro Devices Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

20

Transferred

RF MICRO DEVICES INC

QFN

HVQCCN, LCC20,.14SQ,20

85 °C

-40 °C

UNSPECIFIED

HVQCCN

LCC20,.14SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.3 V

8542.39.00.01

QUAD

无铅

1

0.5 mm

unknown

20

S-XQCC-N20

不合格

INDUSTRIAL

0.26 mA

0.5 mm

电信电路

3.5 mm

3.5 mm

ZL70123MNG7
ZL70123MNG7
Microchip Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

29

活跃

MICROCHIP TECHNOLOGY INC

LGA,

55 °C

UNSPECIFIED

LGA

RECTANGULAR

网格排列

3.3 V

8542.39.00.01

BOTTOM

无铅

1

compliant

R-XBGA-N29

COMMERCIAL

2.95 mm

射频和基带电路

18 mm

12 mm

ZL70123MNG7
ZL70123MNG7
Microsemi Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

29

Transferred

MICROSEMI CORP

LGA,

55 °C

UNSPECIFIED

LGA

RECTANGULAR

网格排列

3.3 V

8542.39.00.01

BOTTOM

BUTT

1

compliant

R-XBGA-B29

COMMERCIAL

2.95 mm

射频和基带电路

18 mm

12 mm

TJA1052IT/5
TJA1052IT/5
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

aluminium

16

black

700 g

grilled

for back plate

anodized

Transferred

NXP SEMICONDUCTORS

7.50 MM, PLASTIC, SOT162-1, MS-013, SOP-16

125 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

小概要

5 V

1.8mm

extruded

8542.39.00.01

DUAL

鸥翼

1

1.27 mm

compliant

R-PDSO-G16

不合格

AUTOMOTIVE

0.07 mA

1000 Mbps

2.65 mm

AEC-Q100

电路接口

1

universal

14mm

10.3 mm

7.5 mm

TP3067N
TP3067N
National Semiconductor Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

20

Transferred

NATIONAL SEMICONDUCTOR CORP

PLASTIC, DIP-20

70 °C

PLASTIC/EPOXY

DIP

DIP20,.3

RECTANGULAR

IN-LINE

5 V

e0

EAR99

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

260

1

2.54 mm

not_compliant

40

R-PDIP-T20

不合格

COMMERCIAL

SYNCHRONOUS/ASYNCHRONOUS

10 mA

5.08 mm

PCM 编解码器

YES

A-LAW

1

-5 V

0.15 dB

不提供

26.075 mm

7.62 mm

SA636DK
SA636DK
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

20

KGM

1210

3225

0.01 g

SMD

MLCC

Obsolete

NXP SEMICONDUCTORS

SSOP

4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20

85 °C

-40 °C

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

3 V

ceramic

-55...125°C

±5%

8542.39.00.01

4.7nF

DUAL

鸥翼

260

1

0.65 mm

compliant

40

20

R-PDSO-G20

不合格

C0G (NP0)

INDUSTRIAL

1.5 mm

电信电路

50V

6.5 mm

4.4 mm

KSZ8695PX
KSZ8695PX
Micrel Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

289

Transferred

MICREL INC

19 X 19 MM, LEAD FREE, PLASTIC, MO-151, BGA-289

70 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.8 V

e1

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

BALL

250

1

1 mm

compliant

40

S-PBGA-B289

不合格

COMMERCIAL

2.26 mm

电信电路

3

19 mm

19 mm

MGA-43040-TR1G
MGA-43040-TR1G
Avago Technologies 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

28

Obsolete

AVAGO TECHNOLOGIES INC

HVBCC,

UNSPECIFIED

HVBCC

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5 V

8542.39.00.01

BOTTOM

BUTT

1

0.5 mm

unknown

S-XBCC-B28

0.91 mm

电信电路

5 mm

5 mm

BCM20715A1KUBXG
BCM20715A1KUBXG
Infineon Technologies AG 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

Galvanized steel

42

0.42

M3

d1 = 4.20 mm

t = 0.98 mm

1.0 mm

4.22 +0.08 mm

活跃

INFINEON TECHNOLOGIES AG

WLBGA-42

85 °C

-30 °C

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.22 V

0.5

28.5*21*19/2000

BOTTOM

BALL

1

0.4 mm

compliant

R-PBGA-B42

OTHER

0.6 mm

电信电路

d = 6.35 ±0.25 mm

L = 1.5 ±0.25 mm

3.019 mm

2.509 mm

ESP32-WROVER-E
ESP32-WROVER-E
Espressif Inc 数据表

2 In Stock

-

最小起订量: 1

最小包装量: 1

YES

housing - stainless steel; gasket - silicone rubber

38

at least 1 L/min at 70 mbar pressure

electric, lighting, photoelectric, security, automotive and other equipment

KGM

0805

2012

2.80

SMD

MLCC

IP67

Ф5.2 mm

接触制造商

ESPRESSIF SYSTEMS (SHANGHAI) PTE LTD

PACKAGE-38

85 °C

-40 °C

UNSPECIFIED

DMA

RECTANGULAR

微电子组件

3.3 V

for pressure equalization in sealed enclosures and protection against condensation formation

35*30*21/150

ceramic

-55...125°C

±1%

5A992.C

M5X0.8 pressure equalization valve, metal

to hydrostatic pressure - at least 100 mbar for 30 min

8542.39.00.01

2.2nF

DUAL

无铅

250

1

1.27 mm

compliant

R-XDMA-N38

C0G (NP0)

INDUSTRIAL

150000 Mbps

3.45 mm

-40…+125 °C

电信电路

3

50V

31.4 mm

18 mm

MT9041BP
MT9041BP
Microsemi Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

28

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

5 V

Obsolete

MICROSEMI CORP

LCC

PLASTIC, MS-018AB, LCC-28

e0

锡铅

8542.39.00.01

QUAD

J BEND

1

1.27 mm

unknown

28

S-PQCC-J28

不合格

INDUSTRIAL

4.57 mm

电信电路

11.505 mm

11.505 mm

CMX867D2
CMX867D2
Mx Com Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

24

Obsolete

MX COM INC

SOIC

,

PLASTIC/EPOXY

RECTANGULAR

小概要

8542.39.00.01

DUAL

鸥翼

unknown

24

R-PDSO-G24

不合格

MODEM

CMX867D2
CMX867D2
CML Microcircuits Plc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

24

14.28

Obsolete

CML MICROCIRCUITS LTD

SOIC

SOP, SOP24,.4

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP24,.4

RECTANGULAR

小概要

3 V

62*27.5*28/500

e3

Matte Tin (Sn)

8542.39.00.01

DUAL

鸥翼

260

1

1.27 mm

compliant

40

24

R-PDSO-G24

不合格

INDUSTRIAL

0.011 mA

1 Mbps

2.67 mm

MODEM

15.365 mm

7.425 mm

KSZ8081MNXCA
KSZ8081MNXCA
Micrel Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

Plastic / metal

32

5.50

Transferred

MICREL INC

QFN-32

70 °C

UNSPECIFIED

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.3 V

46.5*28.8*27.6/500

e4

镍钯金

Orange

QUAD

无铅

260

1

0.5 mm

compliant

40

S-XQCC-N32

不合格

COMMERCIAL

100000 Mbps

1 mm

以太网收发器

1

2

19.7 mm

5 mm

5 mm

RFSA3043TR7
RFSA3043TR7
RF Micro Devices Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

16

±0.1pF

KGM

0201

0603

0.01 g

Transferred

MLCC

RF MICRO DEVICES INC

HVQCCN,

105 °C

-40 °C

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5 V

SMD

ceramic

-55...125°C

8542.39.00.01

4.7pF

QUAD

无铅

1

0.5 mm

unknown

S-XQCC-N16

C0G (NP0)

INDUSTRIAL

0.9 mm

电信电路

25V

3 mm

3 mm

ZL50114GAG2
ZL50114GAG2
AMD Xilinx 数据表

682 In Stock

-

最小起订量: 1

最小包装量: 1

YES

552

±0.05pF

GCQ

0201

0603

0.03 g

MLCC

活跃

XILINX INC

BGA

,

PLASTIC/EPOXY

SQUARE

网格排列

SMD

ceramic

-55...125°C

e2

铜镀锡银

8.4pF

BOTTOM

BALL

未说明

compliant

未说明

552

S-PBGA-B552

不合格

C0G (NP0)

电信电路

50V

KSZ8995X
KSZ8995X
Micrel Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

128

±0.05pF

GCM

0402

1005

0.03 g

MLCC

Transferred

MICREL INC

LEAD FREE, PLASTIC, QFP-128

70 °C

PLASTIC/EPOXY

FQFP

QFP128,.68X.91,20

RECTANGULAR

FLATPACK, FINE PITCH

1.8 V

SMD

ceramic

-55...125°C

e3

Matte Tin (Sn)

0.75pF

QUAD

鸥翼

260

1

0.5 mm

compliant

40

R-PQFP-G128

不合格

C0G (NP0)

COMMERCIAL

375 mA

3.4 mm

ETHERNET SWITCH

3

100V

20 mm

14 mm

Y08UZ-230B
Y08UZ-230B
Sankosha USA Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

2

GCQ

0201

0603

0.03 g

MLCC

接触制造商

SANKOSHA CORP

,

UNSPECIFIED

ROUND

特殊形状

SMD

ceramic

-55...125°C

±2%

10pF

UNSPECIFIED

WIRE

1

unknown

O-XXSS-W2

C0G (NP0)

浪涌保护电路

50V

FX929BD5
FX929BD5
CML Microcircuits Plc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

24

±0.1pF

GCQ

0201

0603

0.03 g

SMD

MLCC

Obsolete

CML MICROCIRCUITS LTD

SSOP, SOP24,.4

85 °C

-40 °C

PLASTIC/EPOXY

SSOP

SOP24,.4

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

ceramic

-55...125°C

8542.39.00.01

1.3pF

DUAL

鸥翼

1

0.65 mm

compliant

R-PDSO-G24

不合格

C0G (NP0)

INDUSTRIAL

0.01 mA

1.99 mm

MODEM-SUPPORT CIRCUIT

50V

8.2 mm

5.29 mm

TM1062TX3DUA
TM1062TX3DUA
PulseR Ruggedized Solutions 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

28

±0.1pF

GCM

0402

1005

0.03 g

MLCC

Transferred

PULSER LLC

,

125 °C

-55 °C

PLASTIC/EPOXY

RECTANGULAR

微电子组件

3.3 V

SMD

ceramic

-55...125°C

8542.39.00.01

0.47pF

DUAL

鸥翼

225

1

compliant

30

R-PDMA-G28

不合格

C0G (NP0)

MILITARY

电信电路

100V

MCP2542FDT-E/MFVAO
MCP2542FDT-E/MFVAO
Microchip Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

8

活跃

MICROCHIP TECHNOLOGY INC

HVSON,

125 °C

-40 °C

PLASTIC/EPOXY

HVSON

SOLCC8,.12,25

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

5 V

e3

EAR99

哑光锡

8542.32.00.51

DUAL

无铅

1

0.65 mm

compliant

S-PDSO-N8

AUTOMOTIVE

140 mA

8000 Mbps

1 mm

AEC-Q100

CAN FD TRANSCEIVER

1

3 mm

3 mm

TJA1044VT
TJA1044VT
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NXP SEMICONDUCTORS

活跃

8542.39.00.01

unknown

电路接口

TGA2586-FL
TGA2586-FL
TriQuint Semiconductor 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

10

Transferred

TRIQUINT SEMICONDUCTOR INC

DFP,

PLASTIC/EPOXY

DFP

RECTANGULAR

FLATPACK

DUAL

FLAT

未说明

1

compliant

未说明

R-PDFP-F10

4.2418 mm

射频和基带电路

24.003 mm

15.78 mm

SKY58081-11
SKY58081-11
Skyworks Solutions Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

56

2020-07-27

活跃

SKYWORKS SOLUTIONS INC

110 °C

-40 °C

PLASTIC/EPOXY

HVQCCN

LCC56,.23X.3,17

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.4 V

8542.39.00.01

QUAD

无铅

1

0.44 mm

unknown

R-PQCC-N56

3200 mA

0.7 mm

射频和基带电路

7.6 mm

6 mm