类别是'category.电信接口IC' (8324)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 材料 | 终端数量 | Air permeability | Application area | Capacitance tolerance | Capacitors series | Case - inch | Case - mm | Colour | Date Of Intro | Gross weight | Heatsink shape | Inner diameter | Installation height | Kind of capacitor | Material finishing | Metal thickness | Mounting hole size | Plate thickness | Purpose | Thread pitch | Transport package size/quantity | Transport packaging size/quantity | Type of capacitor | Type of heatsink | Operating temperature | 容差 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 电阻 | 端子表面处理 | 颜色 | HTS代码 | 电容量 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电介质 | 温度等级 | 操作模式 | 电源电流-最大值 | 数据率 | 座位高度-最大 | Operating temperature range | 筛选水平 | 通信IC类型 | 收发器数量 | 第二个连接器加载的位置数 | Outer diameter | 过滤器 | 压缩法 | 饱和电流 | 负电源电压 | Operating voltage | 增益公差-最大 | 线性编码 | 高度 | 长度 | 宽度 | |||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | TP3040N | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | 无 | Obsolete | NATIONAL SEMICONDUCTOR CORP | DIP, | 70 °C | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 5 V | e0 | 锡铅 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T16 | 不合格 | COMMERCIAL | 6.4 mA | 5.08 mm | 电信电路 | -5 V | 21.755 mm | 7.62 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RF6535 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | 有 | Transferred | RF MICRO DEVICES INC | QFN | HVQCCN, LCC20,.14SQ,20 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | LCC20,.14SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3.3 V | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | unknown | 20 | S-XQCC-N20 | 不合格 | INDUSTRIAL | 0.26 mA | 0.5 mm | 电信电路 | 3.5 mm | 3.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ZL70123MNG7 | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 29 | 活跃 | MICROCHIP TECHNOLOGY INC | LGA, | 55 °C | UNSPECIFIED | LGA | RECTANGULAR | 网格排列 | 3.3 V | 8542.39.00.01 | BOTTOM | 无铅 | 1 | compliant | R-XBGA-N29 | COMMERCIAL | 2.95 mm | 射频和基带电路 | 18 mm | 12 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ZL70123MNG7 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 29 | Transferred | MICROSEMI CORP | LGA, | 55 °C | UNSPECIFIED | LGA | RECTANGULAR | 网格排列 | 3.3 V | 8542.39.00.01 | BOTTOM | BUTT | 1 | compliant | R-XBGA-B29 | COMMERCIAL | 2.95 mm | 射频和基带电路 | 18 mm | 12 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TJA1052IT/5 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | aluminium | 16 | black | 700 g | grilled | for back plate | anodized | Transferred | NXP SEMICONDUCTORS | 7.50 MM, PLASTIC, SOT162-1, MS-013, SOP-16 | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | 小概要 | 5 V | 1.8mm | extruded | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | compliant | R-PDSO-G16 | 不合格 | AUTOMOTIVE | 0.07 mA | 1000 Mbps | 2.65 mm | AEC-Q100 | 电路接口 | 1 | universal | 14mm | 10.3 mm | 7.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TP3067N | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 20 | 无 | Transferred | NATIONAL SEMICONDUCTOR CORP | PLASTIC, DIP-20 | 70 °C | PLASTIC/EPOXY | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 260 | 1 | 2.54 mm | not_compliant | 40 | R-PDIP-T20 | 不合格 | COMMERCIAL | SYNCHRONOUS/ASYNCHRONOUS | 10 mA | 5.08 mm | PCM 编解码器 | YES | A-LAW | 1 | -5 V | 0.15 dB | 不提供 | 26.075 mm | 7.62 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SA636DK | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | KGM | 1210 | 3225 | 0.01 g | SMD | MLCC | 有 | Obsolete | NXP SEMICONDUCTORS | SSOP | 4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20 | 85 °C | -40 °C | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | 3 V | ceramic | -55...125°C | ±5% | 8542.39.00.01 | 4.7nF | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 40 | 20 | R-PDSO-G20 | 不合格 | C0G (NP0) | INDUSTRIAL | 1.5 mm | 电信电路 | 50V | 6.5 mm | 4.4 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | KSZ8695PX | Micrel Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 289 | 有 | Transferred | MICREL INC | 19 X 19 MM, LEAD FREE, PLASTIC, MO-151, BGA-289 | 70 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.8 V | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 250 | 1 | 1 mm | compliant | 40 | S-PBGA-B289 | 不合格 | COMMERCIAL | 2.26 mm | 电信电路 | 3 | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MGA-43040-TR1G | Avago Technologies | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | Obsolete | AVAGO TECHNOLOGIES INC | HVBCC, | UNSPECIFIED | HVBCC | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | 8542.39.00.01 | BOTTOM | BUTT | 1 | 0.5 mm | unknown | S-XBCC-B28 | 0.91 mm | 电信电路 | 5 mm | 5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BCM20715A1KUBXG | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | Galvanized steel | 42 | 0.42 | M3 | d1 = 4.20 mm | t = 0.98 mm | 1.0 mm | 4.22 +0.08 mm | 活跃 | INFINEON TECHNOLOGIES AG | WLBGA-42 | 85 °C | -30 °C | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 1.22 V | 0.5 | 28.5*21*19/2000 | BOTTOM | BALL | 1 | 0.4 mm | compliant | R-PBGA-B42 | OTHER | 0.6 mm | 电信电路 | d = 6.35 ±0.25 mm | L = 1.5 ±0.25 mm | 3.019 mm | 2.509 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ESP32-WROVER-E | Espressif Inc | 数据表 | 2 In Stock |
- | 最小起订量: 1 最小包装量: 1 | YES | housing - stainless steel; gasket - silicone rubber | 38 | at least 1 L/min at 70 mbar pressure | electric, lighting, photoelectric, security, automotive and other equipment | KGM | 0805 | 2012 | 2.80 | SMD | MLCC | IP67 | 有 | Ф5.2 mm | 接触制造商 | ESPRESSIF SYSTEMS (SHANGHAI) PTE LTD | PACKAGE-38 | 85 °C | -40 °C | UNSPECIFIED | DMA | RECTANGULAR | 微电子组件 | 3.3 V | for pressure equalization in sealed enclosures and protection against condensation formation | 35*30*21/150 | ceramic | -55...125°C | ±1% | 5A992.C | M5X0.8 pressure equalization valve, metal | to hydrostatic pressure - at least 100 mbar for 30 min | 8542.39.00.01 | 2.2nF | DUAL | 无铅 | 250 | 1 | 1.27 mm | compliant | R-XDMA-N38 | C0G (NP0) | INDUSTRIAL | 150000 Mbps | 3.45 mm | -40…+125 °C | 电信电路 | 3 | 50V | 31.4 mm | 18 mm | |||||||||||||||||||||||||||||||||||||
![]() | MT9041BP | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | 5 V | 无 | Obsolete | MICROSEMI CORP | LCC | PLASTIC, MS-018AB, LCC-28 | e0 | 无 | 锡铅 | 8542.39.00.01 | QUAD | J BEND | 1 | 1.27 mm | unknown | 28 | S-PQCC-J28 | 不合格 | INDUSTRIAL | 4.57 mm | 电信电路 | 11.505 mm | 11.505 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CMX867D2 | Mx Com Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 24 | Obsolete | MX COM INC | SOIC | , | PLASTIC/EPOXY | RECTANGULAR | 小概要 | 8542.39.00.01 | DUAL | 鸥翼 | unknown | 24 | R-PDSO-G24 | 不合格 | MODEM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CMX867D2 | CML Microcircuits Plc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 24 | 14.28 | 有 | Obsolete | CML MICROCIRCUITS LTD | SOIC | SOP, SOP24,.4 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP24,.4 | RECTANGULAR | 小概要 | 3 V | 62*27.5*28/500 | e3 | 有 | Matte Tin (Sn) | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 40 | 24 | R-PDSO-G24 | 不合格 | INDUSTRIAL | 0.011 mA | 1 Mbps | 2.67 mm | MODEM | 15.365 mm | 7.425 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | KSZ8081MNXCA | Micrel Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | Plastic / metal | 32 | 5.50 | 有 | Transferred | MICREL INC | QFN-32 | 70 °C | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3.3 V | 46.5*28.8*27.6/500 | e4 | 镍钯金 | Orange | QUAD | 无铅 | 260 | 1 | 0.5 mm | compliant | 40 | S-XQCC-N32 | 不合格 | COMMERCIAL | 100000 Mbps | 1 mm | 以太网收发器 | 1 | 2 | 19.7 mm | 5 mm | 5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RFSA3043TR7 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | ±0.1pF | KGM | 0201 | 0603 | 0.01 g | Transferred | MLCC | RF MICRO DEVICES INC | HVQCCN, | 105 °C | -40 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | SMD | ceramic | -55...125°C | 8542.39.00.01 | 4.7pF | QUAD | 无铅 | 1 | 0.5 mm | unknown | S-XQCC-N16 | C0G (NP0) | INDUSTRIAL | 0.9 mm | 电信电路 | 25V | 3 mm | 3 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ZL50114GAG2 | AMD Xilinx | 数据表 | 682 In Stock | - | 最小起订量: 1 最小包装量: 1 | YES | 552 | ±0.05pF | GCQ | 0201 | 0603 | 0.03 g | MLCC | 活跃 | XILINX INC | BGA | , | PLASTIC/EPOXY | SQUARE | 网格排列 | SMD | 有 | ceramic | -55...125°C | e2 | 铜镀锡银 | 8.4pF | BOTTOM | BALL | 未说明 | compliant | 未说明 | 552 | S-PBGA-B552 | 不合格 | C0G (NP0) | 电信电路 | 50V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | KSZ8995X | Micrel Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 128 | ±0.05pF | GCM | 0402 | 1005 | 0.03 g | 有 | MLCC | Transferred | MICREL INC | LEAD FREE, PLASTIC, QFP-128 | 70 °C | PLASTIC/EPOXY | FQFP | QFP128,.68X.91,20 | RECTANGULAR | FLATPACK, FINE PITCH | 1.8 V | SMD | ceramic | -55...125°C | e3 | Matte Tin (Sn) | 0.75pF | QUAD | 鸥翼 | 260 | 1 | 0.5 mm | compliant | 40 | R-PQFP-G128 | 不合格 | C0G (NP0) | COMMERCIAL | 375 mA | 3.4 mm | ETHERNET SWITCH | 3 | 100V | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Y08UZ-230B | Sankosha USA Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 2 | GCQ | 0201 | 0603 | 0.03 g | MLCC | 接触制造商 | SANKOSHA CORP | , | UNSPECIFIED | ROUND | 特殊形状 | SMD | ceramic | -55...125°C | ±2% | 10pF | UNSPECIFIED | WIRE | 1 | unknown | O-XXSS-W2 | C0G (NP0) | 浪涌保护电路 | 50V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | FX929BD5 | CML Microcircuits Plc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 24 | ±0.1pF | GCQ | 0201 | 0603 | 0.03 g | SMD | MLCC | Obsolete | CML MICROCIRCUITS LTD | SSOP, SOP24,.4 | 85 °C | -40 °C | PLASTIC/EPOXY | SSOP | SOP24,.4 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | ceramic | -55...125°C | 8542.39.00.01 | 1.3pF | DUAL | 鸥翼 | 1 | 0.65 mm | compliant | R-PDSO-G24 | 不合格 | C0G (NP0) | INDUSTRIAL | 0.01 mA | 1.99 mm | MODEM-SUPPORT CIRCUIT | 50V | 8.2 mm | 5.29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TM1062TX3DUA | PulseR Ruggedized Solutions | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | ±0.1pF | GCM | 0402 | 1005 | 0.03 g | 无 | MLCC | Transferred | PULSER LLC | , | 125 °C | -55 °C | PLASTIC/EPOXY | RECTANGULAR | 微电子组件 | 3.3 V | SMD | ceramic | -55...125°C | 8542.39.00.01 | 0.47pF | DUAL | 鸥翼 | 225 | 1 | compliant | 30 | R-PDMA-G28 | 不合格 | C0G (NP0) | MILITARY | 电信电路 | 100V | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MCP2542FDT-E/MFVAO | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 活跃 | MICROCHIP TECHNOLOGY INC | HVSON, | 125 °C | -40 °C | PLASTIC/EPOXY | HVSON | SOLCC8,.12,25 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | e3 | EAR99 | 哑光锡 | 8542.32.00.51 | DUAL | 无铅 | 1 | 0.65 mm | compliant | S-PDSO-N8 | AUTOMOTIVE | 140 mA | 8000 Mbps | 1 mm | AEC-Q100 | CAN FD TRANSCEIVER | 1 | 3 mm | 3 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TJA1044VT | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NXP SEMICONDUCTORS | 活跃 | 8542.39.00.01 | unknown | 电路接口 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TGA2586-FL | TriQuint Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 10 | 有 | Transferred | TRIQUINT SEMICONDUCTOR INC | DFP, | PLASTIC/EPOXY | DFP | RECTANGULAR | FLATPACK | 有 | DUAL | FLAT | 未说明 | 1 | compliant | 未说明 | R-PDFP-F10 | 4.2418 mm | 射频和基带电路 | 24.003 mm | 15.78 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SKY58081-11 | Skyworks Solutions Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | 2020-07-27 | 活跃 | SKYWORKS SOLUTIONS INC | 110 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | LCC56,.23X.3,17 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3.4 V | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.44 mm | unknown | R-PQCC-N56 | 3200 mA | 0.7 mm | 射频和基带电路 | 7.6 mm | 6 mm |
TP3040N
National Semiconductor Corporation
分类:Interface - Telecom
RF6535
RF Micro Devices Inc
分类:Interface - Telecom
ZL70123MNG7
Microchip Technology Inc
分类:Interface - Telecom
ZL70123MNG7
Microsemi Corporation
分类:Interface - Telecom
TJA1052IT/5
NXP Semiconductors
分类:Interface - Telecom
TP3067N
National Semiconductor Corporation
分类:Interface - Telecom
SA636DK
NXP Semiconductors
分类:Interface - Telecom
KSZ8695PX
Micrel Inc
分类:Interface - Telecom
MGA-43040-TR1G
Avago Technologies
分类:Interface - Telecom
BCM20715A1KUBXG
Infineon Technologies AG
分类:Interface - Telecom
ESP32-WROVER-E
Espressif Inc
分类:Interface - Telecom
27.917602
MT9041BP
Microsemi Corporation
分类:Interface - Telecom
CMX867D2
Mx Com Inc
分类:Interface - Telecom
CMX867D2
CML Microcircuits Plc
分类:Interface - Telecom
KSZ8081MNXCA
Micrel Inc
分类:Interface - Telecom
RFSA3043TR7
RF Micro Devices Inc
分类:Interface - Telecom
ZL50114GAG2
AMD Xilinx
分类:Interface - Telecom
KSZ8995X
Micrel Inc
分类:Interface - Telecom
Y08UZ-230B
Sankosha USA Inc
分类:Interface - Telecom
FX929BD5
CML Microcircuits Plc
分类:Interface - Telecom
TM1062TX3DUA
PulseR Ruggedized Solutions
分类:Interface - Telecom
MCP2542FDT-E/MFVAO
Microchip Technology Inc
分类:Interface - Telecom
TJA1044VT
NXP Semiconductors
分类:Interface - Telecom
TGA2586-FL
TriQuint Semiconductor
分类:Interface - Telecom
SKY58081-11
Skyworks Solutions Inc
分类:Interface - Telecom
