类别是'category.电信接口IC' (8324)

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对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

Contact plating

表面安装

Number of pins

材料

终端数量

Air permeability

Application area

Capacitance tolerance

Capacitors series

Case - inch

Case - mm

Colour

Connector pinout layout

Contacts pitch

Date Of Intro

Electrical mounting

Gross weight

Heatsink shape

Inner diameter

Installation height

Kind of capacitor

Kind of connector

Material finishing

Metal thickness

Mounting hole size

Plate thickness

Purpose

Spatial orientation

Thread pitch

Transport package size/quantity

Transport packaging size/quantity

Type of capacitor

Type of connector

Type of heatsink

Type of terminal

Operating temperature

容差

JESD-609代码

无铅代码

ECCN 代码

类型

电阻

端子表面处理

颜色

HTS代码

电容量

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

Reach合规守则

Current rating

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

资历状况

电介质

温度等级

操作模式

电源电流-最大值

数据率

座位高度-最大

Operating temperature range

筛选水平

通信IC类型

收发器数量

Rated voltage

第二个连接器加载的位置数

Outer diameter

个人资料

过滤器

压缩法

饱和电流

负电源电压

Operating voltage

增益公差-最大

线性编码

高度

长度

宽度

Plating thickness

Flammability rating

TLE6263G
TLE6263G
Infineon Technologies AG 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

28

Obsolete

INFINEON TECHNOLOGIES AG

SOIC

PLASTIC, SO-28

PLASTIC/EPOXY

SOP

SOP28,.4

RECTANGULAR

小概要

13.5 V

8542.39.00.01

DUAL

鸥翼

235

1

1.27 mm

unknown

28

R-PDSO-G28

不合格

125 Mbps

2.65 mm

电路接口

1

3

18.1 mm

7.6 mm

DP83865DVH
DP83865DVH
National Semiconductor Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

128

Transferred

NATIONAL SEMICONDUCTOR CORP

QFP-128

70 °C

PLASTIC/EPOXY

FQFP

QFP128,.67X.93,20

RECTANGULAR

FLATPACK, FINE PITCH

1.8 V

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

QUAD

鸥翼

245

1

0.5 mm

not_compliant

30

R-PQFP-G128

不合格

COMMERCIAL

1000000 Mbps

3.15 mm

以太网收发器

1

3

20 mm

14 mm

CX20493-31
CX20493-31
Conexant Systems Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

28

KGM

1210

3225

SMD

0.026 g

MLCC

Transferred

康讯系统

QFN

HVQCCN, LCC28,.2SQ,20

70 °C

UNSPECIFIED

HVQCCN

LCC28,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.3 V

ceramic

-55...125°C

±5%

e3

哑光锡

8542.39.00.01

150pF

QUAD

无铅

260

1

0.5 mm

compliant

30

28

S-XQCC-N28

不合格

C0G (NP0)

COMMERCIAL

56 Mbps

1 mm

MODEM-SUPPORT CIRCUIT

1

2kV

5 mm

5 mm

MC33111P
MC33111P
Freescale Semiconductor 数据表

N/A

-

最小起订量: 1

最小包装量: 1

gold-plated

NO

26

16

socket

1x26

2.54mm

THT

3.64 g

Obsolete

female

FREESCALE SEMICONDUCTOR INC

DIP

DIP,

85 °C

-40 °C

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

3.6 V

straight

pin strips

-40...163°C

EAR99

8542.39.00.01

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

3A

16

R-PDIP-T16

INDUSTRIAL

4.44 mm

电信电路

150V

beryllium copper

19.175 mm

7.62 mm

0.75µm

UL94V-0

WM8750BLGEFL
WM8750BLGEFL
Cirrus Logic 数据表

N/A

-

最小起订量: 1

最小包装量: 1

tinned

YES

32

M4

screw terminal,

1.838 g

Obsolete

CIRRUS LOGIC INC

HVQCCN,

85 °C

-25 °C

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.5 V

straight

screw terminal

8542.39.00.01

QUAD

无铅

1

0.5 mm

compliant

S-PQCC-N32

OTHER

SYNCHRONOUS

1 mm

PCM 编解码器

copper

YES

5 mm

5 mm

SA636DK
SA636DK
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

20

KGM

1210

3225

SMD

0.01 g

MLCC

Obsolete

NXP SEMICONDUCTORS

SSOP

4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20

85 °C

-40 °C

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

3 V

ceramic

-55...125°C

±5%

8542.39.00.01

4.7nF

DUAL

鸥翼

260

1

0.65 mm

compliant

40

20

R-PDSO-G20

不合格

C0G (NP0)

INDUSTRIAL

1.5 mm

电信电路

50V

6.5 mm

4.4 mm

KSZ8695PX
KSZ8695PX
Micrel Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

289

Transferred

MICREL INC

19 X 19 MM, LEAD FREE, PLASTIC, MO-151, BGA-289

70 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.8 V

e1

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

BALL

250

1

1 mm

compliant

40

S-PBGA-B289

不合格

COMMERCIAL

2.26 mm

电信电路

3

19 mm

19 mm

MGA-43040-TR1G
MGA-43040-TR1G
Avago Technologies 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

28

Obsolete

AVAGO TECHNOLOGIES INC

HVBCC,

UNSPECIFIED

HVBCC

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5 V

8542.39.00.01

BOTTOM

BUTT

1

0.5 mm

unknown

S-XBCC-B28

0.91 mm

电信电路

5 mm

5 mm

BCM20715A1KUBXG
BCM20715A1KUBXG
Infineon Technologies AG 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

Galvanized steel

42

M3

0.42

4.22 +0.08 mm

d1 = 4.20 mm

t = 0.98 mm

1.0 mm

活跃

INFINEON TECHNOLOGIES AG

WLBGA-42

85 °C

-30 °C

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.22 V

0.5

28.5*21*19/2000

BOTTOM

BALL

1

0.4 mm

compliant

R-PBGA-B42

OTHER

0.6 mm

电信电路

d = 6.35 ±0.25 mm

L = 1.5 ±0.25 mm

3.019 mm

2.509 mm

ESP32-WROVER-E
ESP32-WROVER-E
Espressif Inc 数据表

2 In Stock

-

最小起订量: 1

最小包装量: 1

YES

housing - stainless steel; gasket - silicone rubber

38

at least 1 L/min at 70 mbar pressure

electric, lighting, photoelectric, security, automotive and other equipment

KGM

0805

2012

2.80

IP67

MLCC

接触制造商

Ф5.2 mm

ESPRESSIF SYSTEMS (SHANGHAI) PTE LTD

PACKAGE-38

85 °C

-40 °C

UNSPECIFIED

DMA

RECTANGULAR

微电子组件

3.3 V

for pressure equalization in sealed enclosures and protection against condensation formation

SMD

35*30*21/150

ceramic

-55...125°C

±1%

5A992.C

M5X0.8 pressure equalization valve, metal

to hydrostatic pressure - at least 100 mbar for 30 min

8542.39.00.01

2.2nF

DUAL

无铅

250

1

1.27 mm

compliant

R-XDMA-N38

C0G (NP0)

INDUSTRIAL

150000 Mbps

3.45 mm

-40…+125 °C

电信电路

3

50V

31.4 mm

18 mm

MT9041BP
MT9041BP
Microsemi Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

28

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

5 V

Obsolete

MICROSEMI CORP

LCC

PLASTIC, MS-018AB, LCC-28

e0

锡铅

8542.39.00.01

QUAD

J BEND

1

1.27 mm

unknown

28

S-PQCC-J28

不合格

INDUSTRIAL

4.57 mm

电信电路

11.505 mm

11.505 mm

CMX867D2
CMX867D2
Mx Com Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

24

MX COM INC

SOIC

,

PLASTIC/EPOXY

RECTANGULAR

小概要

Obsolete

8542.39.00.01

DUAL

鸥翼

unknown

24

R-PDSO-G24

不合格

MODEM

CMX867D2
CMX867D2
CML Microcircuits Plc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

24

14.28

Obsolete

CML MICROCIRCUITS LTD

SOIC

SOP, SOP24,.4

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP24,.4

RECTANGULAR

小概要

3 V

62*27.5*28/500

e3

Matte Tin (Sn)

8542.39.00.01

DUAL

鸥翼

260

1

1.27 mm

compliant

40

24

R-PDSO-G24

不合格

INDUSTRIAL

0.011 mA

1 Mbps

2.67 mm

MODEM

15.365 mm

7.425 mm

KSZ8081MNXCA
KSZ8081MNXCA
Micrel Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

Plastic / metal

32

5.50

Transferred

MICREL INC

QFN-32

70 °C

UNSPECIFIED

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.3 V

46.5*28.8*27.6/500

e4

镍钯金

Orange

QUAD

无铅

260

1

0.5 mm

compliant

40

S-XQCC-N32

不合格

COMMERCIAL

100000 Mbps

1 mm

以太网收发器

1

2

19.7 mm

5 mm

5 mm

RFSA3043TR7
RFSA3043TR7
RF Micro Devices Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

16

±0.1pF

KGM

0201

0603

0.01 g

RF MICRO DEVICES INC

MLCC

HVQCCN,

105 °C

-40 °C

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5 V

SMD

Transferred

ceramic

-55...125°C

8542.39.00.01

4.7pF

QUAD

无铅

1

0.5 mm

unknown

S-XQCC-N16

C0G (NP0)

INDUSTRIAL

0.9 mm

电信电路

25V

3 mm

3 mm

MCP2542FDT-E/MFVAO
MCP2542FDT-E/MFVAO
Microchip Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

8

活跃

MICROCHIP TECHNOLOGY INC

HVSON,

125 °C

-40 °C

PLASTIC/EPOXY

HVSON

SOLCC8,.12,25

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

5 V

e3

EAR99

哑光锡

8542.32.00.51

DUAL

无铅

1

0.65 mm

compliant

S-PDSO-N8

AUTOMOTIVE

140 mA

8000 Mbps

1 mm

AEC-Q100

CAN FD TRANSCEIVER

1

3 mm

3 mm

TJA1044VT
TJA1044VT
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NXP SEMICONDUCTORS

活跃

8542.39.00.01

unknown

电路接口

TGA2586-FL
TGA2586-FL
TriQuint Semiconductor 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

10

Transferred

TRIQUINT SEMICONDUCTOR INC

DFP,

PLASTIC/EPOXY

DFP

RECTANGULAR

FLATPACK

DUAL

FLAT

未说明

1

compliant

未说明

R-PDFP-F10

4.2418 mm

射频和基带电路

24.003 mm

15.78 mm

SKY58081-11
SKY58081-11
Skyworks Solutions Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

56

活跃

2020-07-27

SKYWORKS SOLUTIONS INC

110 °C

-40 °C

PLASTIC/EPOXY

HVQCCN

LCC56,.23X.3,17

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.4 V

8542.39.00.01

QUAD

无铅

1

0.44 mm

unknown

R-PQCC-N56

3200 mA

0.7 mm

射频和基带电路

7.6 mm

6 mm

TJA1042TK/3
TJA1042TK/3
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

8

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SQUARE

SOLCC8,.12,25

HVSON

PLASTIC/EPOXY

-40 °C

150 °C

HVSON, SOLCC8,.12,25

SON

NXP SEMICONDUCTORS

活跃

e4

镍钯金银

8542.39.00.01

DUAL

无铅

260

1

0.65 mm

compliant

30

8

S-PDSO-N8

不合格

AUTOMOTIVE

70 mA

5000000 Mbps

1 mm

AEC-Q100

CAN FD TRANSCEIVER

1

1

3 mm

3 mm

TJA1048TK
TJA1048TK
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

14

不推荐

NXP SEMICONDUCTORS

SON

VSON-14

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

5 V

8542.39.00.01

DUAL

无铅

260

1

0.65 mm

compliant

30

14

R-PDSO-N14

不合格

1 mm

电路接口

1

4.5 mm

3 mm

TJA1028TK/3V3/10
TJA1028TK/3V3/10
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

8

活跃

NXP SEMICONDUCTORS

SON

HVSON,

PLASTIC/EPOXY

HVSON

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

3.3 V

8542.39.00.01

DUAL

无铅

1

0.65 mm

unknown

8

S-PDSO-N8

1 mm

MIL-STD-1553 DATA BUS TRANSCEIVER

3 mm

3 mm

TJA1028TK/5V0/20
TJA1028TK/5V0/20
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

8

活跃

NXP SEMICONDUCTORS

SON

HVSON,

PLASTIC/EPOXY

HVSON

SQUARE

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

5 V

8542.39.00.01

DUAL

无铅

260

1

0.65 mm

unknown

30

8

S-PDSO-N8

1 mm

MIL-STD-1553 DATA BUS TRANSCEIVER

1

3 mm

3 mm

TJA1052IT/5
TJA1052IT/5
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

aluminium

16

black

for back plate

700 g

grilled

Transferred

anodized

NXP SEMICONDUCTORS

7.50 MM, PLASTIC, SOT162-1, MS-013, SOP-16

125 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP16,.4

RECTANGULAR

小概要

5 V

1.8mm

extruded

8542.39.00.01

DUAL

鸥翼

1

1.27 mm

compliant

R-PDSO-G16

不合格

AUTOMOTIVE

0.07 mA

1000 Mbps

2.65 mm

AEC-Q100

电路接口

1

universal

14mm

10.3 mm

7.5 mm

TP3067N
TP3067N
National Semiconductor Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

20

Transferred

NATIONAL SEMICONDUCTOR CORP

PLASTIC, DIP-20

70 °C

PLASTIC/EPOXY

DIP

DIP20,.3

RECTANGULAR

IN-LINE

5 V

e0

EAR99

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

260

1

2.54 mm

not_compliant

40

R-PDIP-T20

不合格

COMMERCIAL

SYNCHRONOUS/ASYNCHRONOUS

10 mA

5.08 mm

PCM 编解码器

YES

A-LAW

1

-5 V

0.15 dB

不提供

26.075 mm

7.62 mm