类别是'category.FPGA 评估板' (3802)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 系列 | 容差 | JESD-609代码 | 无铅代码 | ECCN 代码 | 温度系数 | 电阻 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 包装方式 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | 结构 | 电阻器类型 | Reach合规守则 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 额定功率损耗(P) | 工作电压 | 电源 | 温度等级 | 内存大小 | 传播延迟 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 压差电压1-标称 | 输出电压1-最大值 | 输出电压1-最小值 | 调节器类型 | 最大电压允差 | 总 RAM 位数 | 输出电流1-最大值 | 筛选水平 | 速度等级 | 输入电压绝对-最大 | 输出功能 | 宏细胞数 | CLB-Max的组合延时 | 逻辑块数量 | 可调节性 | JTAG BST | 逻辑单元数 | 输出电压1-正常值 | 等效门数 | 系统内可编程 | 长度 | 宽度 | ||||||||||||||||||||||||||||||||||
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![]() | M2GL060TS-1VFG400T2 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 微芯片技术 | 未说明 | 5.8 | , | MICROSEMI CORP | 活跃 | 有 | M2GL060TS-1VFG400T2 | 1.2000 V | 207 | Tray | M2GL060 | 活跃 | -40 to 125 °C | Automotive, AEC-Q100, IGLOO2 | 有 | 1.14V ~ 2.625V | 未说明 | compliant | 现场可编程门阵列 | 56520 | 1869824 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL025S-1VF400I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 400 | 400 | 无 | 活跃 | MICROSEMI CORP | 5.87 | PLASTIC/EPOXY | FBGA | BGA400,20X20,32 | SQUARE | GRID ARRAY, FINE PITCH | 1.2 V | 207 | Non-Compliant | M2GL025S-1VF400I | 100 °C | -40 °C | BOTTOM | BALL | 0.8 mm | unknown | S-PBGA-B400 | 207 | 不合格 | 1.2 V | 138 kB | 207 | 现场可编程门阵列 | 27696 | 27696 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HW133 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2 | Axial | 9.02 mm | 3.76 mm | 5.59 | NTE ELECTRONICS INC | 活跃 | HW133 | 2% | EAR99 | 100 ppm/°C | 330 Ω | Flameproof | 固定电阻 | unknown | 0.5 W | 350 V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL025TS-1FGG484T2 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 活跃 | MICROSEMI CORP | , | 5.8 | 未说明 | 1.2000 V | 267 | Tray | M2GL025 | 活跃 | M2GL025TS-1FGG484T2 | 有 | -40 to 125 °C | Automotive, AEC-Q100, IGLOO2 | 有 | 1.14V ~ 2.625V | 未说明 | compliant | 现场可编程门阵列 | 27696 | 1130496 | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL025TS-1VFG400T2 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 微芯片技术 | M2GL025TS-1VFG400T2 | 有 | 活跃 | MICROSEMI CORP | , | 5.82 | 未说明 | 1.2000 V | 207 | Tray | M2GL025 | 活跃 | -40 to 125 °C | Automotive, AEC-Q100, IGLOO2 | 有 | 1.14V ~ 2.625V | 未说明 | compliant | 现场可编程门阵列 | 27696 | 1130496 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL025TS-1VFG256T2 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LFBGA | YES | 256-FPBGA (14x14) | 256 | 微芯片技术 | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.26 V | 1.2 V | 未说明 | 1.2000 V | 138 | Tray | M2GL025 | 活跃 | 1.14 V | Automotive grade | M2GL025TS-1VFG256T2 | 有 | 活跃 | MICROSEMI CORP | VFBGA-256 | 5.8 | 3 | 125 °C | -40 °C | -40 to 125 °C | Automotive, AEC-Q100, IGLOO2 | 有 | 1.14V ~ 2.625V | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | S-PBGA-B256 | AUTOMOTIVE | 1.56 mm | 现场可编程门阵列 | 27696 | 1130496 | AEC-Q100 | 1 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC5204-6PCG84I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 84 | SQUARE | CHIP CARRIER | 5.5 V | 5 V | 40 | 4.5 V | XC5204-6PCG84I | 有 | Obsolete | XILINX INC | LCC | QCCJ, | 5.82 | 83 MHz | 3 | PLASTIC/EPOXY | QCCJ | e3 | 有 | Matte Tin (Sn) | MAX AVAILABLE 6000 LOGIC GATES | QUAD | J BEND | 250 | 1.27 mm | compliant | 84 | S-PQCC-J84 | 不合格 | 120 CLBS, 4000 GATES | 5.08 mm | 现场可编程门阵列 | 5.6 ns | 120 | 4000 | 29.3116 mm | 29.3116 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC2C64-5CP56C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | 70 °C | PLASTIC/EPOXY | LFBGA | BGA56,10X10,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.9 V | 1.8 V | 30 | 1.7 V | XC2C64-5CP56C | 无 | Obsolete | XILINX INC | BGA | 6 X 6 MM, 0.50 MM PITCH, CSP-56 | 5.19 | 3 | 45 | e0 | EAR99 | Tin/Lead (Sn63Pb37) | 真正的数字设计技术 | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | 56 | S-PBGA-B56 | 不合格 | 1.5/3.3,1.8 V | COMMERCIAL | 5 ns | 0 DEDICATED INPUTS, 45 I/O | 1.35 mm | 闪存 PLD | MACROCELL | 64 | YES | YES | 6 mm | 6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC5210-3PCG84C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 84 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | 5.25 V | 5 V | 40 | 4.75 V | XC5210-3PCG84C | 有 | Obsolete | XILINX INC | LCC | QCCJ, | 5.83 | 83 MHz | 3 | 85 °C | e3 | 有 | Matte Tin (Sn) | MAX AVAILABLE 16000 LOGIC GATES | 8542.39.00.01 | QUAD | J BEND | 250 | 1.27 mm | compliant | 84 | S-PQCC-J84 | 不合格 | OTHER | 324 CLBS, 10000 GATES | 5.08 mm | 现场可编程门阵列 | 3 ns | 324 | 10000 | 29.3116 mm | 29.3116 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC2C64-7CP56I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | 45 | 85 °C | -40 °C | PLASTIC/EPOXY | LFBGA | BGA56,10X10,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.9 V | 1.8 V | 30 | 1.7 V | XC2C64-7CP56I | 无 | Obsolete | XILINX INC | BGA | 6 X 6 MM, 0.50 MM PITCH, CSP-56 | 5.19 | 3 | e0 | EAR99 | Tin/Lead (Sn63Pb37) | 真正的数字设计技术 | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | 56 | S-PBGA-B56 | 不合格 | 1.5/3.3,1.8 V | INDUSTRIAL | 7.5 ns | 0 DEDICATED INPUTS, 45 I/O | 1.35 mm | 闪存 PLD | MACROCELL | 64 | YES | YES | 6 mm | 6 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC5202-5VQ64I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | TFQFP | TQFP64,.47SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 5.5 V | 5 V | 30 | 4.5 V | XC5202-5VQ64I | 无 | Obsolete | XILINX INC | QFP | PLASTIC, VQFP-64 | 5.86 | 83 MHz | 3 | PLASTIC/EPOXY | e0 | 无 | 3A001.A.7 | Tin/Lead (Sn/Pb) | MAX AVAILABLE 3000 LOGIC GATES | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | unknown | 64 | S-PQFP-G64 | 84 | 不合格 | 5 V | 84 | 64 CLBS, 2000 GATES | 1.2 mm | 现场可编程门阵列 | 4.6 ns | 64 | 64 | 2000 | 10 mm | 10 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC6201P182PR | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 3 | 0.03888% | 0.03% | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | TO-243 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG | 未说明 | XC6201P182PR | 有 | 活跃 | TOREX SEMICONDUCTOR LTD | SOT-89 | SOT-89, 3 PIN | 2.2 | 10 V | 1.8 V | 有 | EAR99 | 8542.39.00.01 | TAPE AND REEL | SINGLE | FLAT | 未说明 | 1 | 1.5 mm | compliant | 3 | R-PSSO-F3 | 1 | 不合格 | 1.6 mm | 0.45 V | 1.836 V | 1.764 V | 固定正向单输出标准稳压器 | 2% | 0.08 A | 12 V | FIXED | 1.8 V | 4.5 mm | 2.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC9502B095AR | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 5.77 | 1 | XC9502B095AR | 有 | 活跃 | TOREX SEMICONDUCTOR LTD | , | compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC9216A156MR | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 5.84 | 1 | XC9216A156MR | 有 | Obsolete | TOREX SEMICONDUCTOR LTD | , | compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XQKU040-1RBA676I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 676 | XQKU040-1RBA676I | 活跃 | XILINX INC | FCBGA-676 | 5.8 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 0.979 V | 0.95 V | 0.922 V | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B676 | INDUSTRIAL | 30300 CLBS | 3.44 mm | 现场可编程门阵列 | 30300 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC95288XV-10TQ144I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 3 | 117 | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 2.62 V | 2.5 V | 30 | 2.37 V | XC95288XV-10TQ144I | 无 | Obsolete | XILINX INC | QFP | TQFP-144 | 5.65 | 100 MHz | e0 | EAR99 | Tin/Lead (Sn85Pb15) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.5 mm | not_compliant | 144 | S-PQFP-G144 | 不合格 | 1.8/3.3,2.5 V | INDUSTRIAL | 10 ns | 0 DEDICATED INPUTS, 117 I/O | 1.6 mm | 闪存 PLD | MACROCELL | 288 | YES | YES | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC95288XV-7TQG144C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 3 | 117 | 70 °C | PLASTIC/EPOXY | LFQFP | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 2.62 V | 2.5 V | 30 | 2.37 V | XC95288XV-7TQG144C | 有 | Obsolete | XILINX INC | QFP | TQFP-144 | 5.6 | 125 MHz | e3 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 0.5 mm | unknown | 144 | S-PQFP-G144 | 不合格 | 1.8/3.3,2.5 V | COMMERCIAL | 7.5 ns | 0 DEDICATED INPUTS, 117 I/O | 1.6 mm | 闪存 PLD | MACROCELL | 288 | YES | YES | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC95288XV-7PQG208I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 3 | 168 | 85 °C | -40 °C | PLASTIC/EPOXY | FQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | 2.62 V | 2.5 V | 40 | 2.37 V | XC95288XV-7PQG208I | 有 | Obsolete | XILINX INC | QFP | PLASTIC, QFP-208 | 5.62 | 125 MHz | e3 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | unknown | 208 | S-PQFP-G208 | 不合格 | 1.8/3.3,2.5 V | INDUSTRIAL | 7.5 ns | 0 DEDICATED INPUTS, 168 I/O | 4.1 mm | 闪存 PLD | MACROCELL | 288 | YES | YES | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV3200E-6FG1156C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1156 | 85 °C | PLASTIC/EPOXY | BGA | BGA1156,34X34,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 未说明 | 1.71 V | XCV3200E-6FG1156C | 无 | Obsolete | XILINX INC | BGA | FBGA-1156 | 5.85 | 357 MHz | 1 | 3A001.A.7.A | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | unknown | 1156 | S-PBGA-B1156 | 804 | 不合格 | 1.2/3.6,1.8 V | OTHER | 804 | 16224 CLBS, 876096 GATES | 2.6 mm | 现场可编程门阵列 | 0.47 ns | 16224 | 73008 | 876096 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC95288XV-7CS280I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 280 | 3 | 192 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | BGA280,19X19,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | 2.62 V | 2.5 V | 30 | 2.37 V | XC95288XV-7CS280I | 无 | Obsolete | XILINX INC | BGA | CSP-280 | 5.65 | 125 MHz | e0 | EAR99 | Tin/Lead (Sn63Pb37) | YES | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | 280 | S-PBGA-B280 | 不合格 | 1.8/3.3,2.5 V | INDUSTRIAL | 7.5 ns | 0 DEDICATED INPUTS, 192 I/O | 1.2 mm | 闪存 PLD | MACROCELL | 288 | YES | YES | 16 mm | 16 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4020XL-09HTG144C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | 3.6 V | 3.3 V | 3 V | XC4020XL-09HTG144C | 有 | Obsolete | XILINX INC | QFP | HLFQFP, | 5.79 | 217 MHz | 85 °C | PLASTIC/EPOXY | HLFQFP | SQUARE | e3 | 哑光锡 | TYPICAL GATES = 13000-40000 | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | 144 | S-PQFP-G144 | 不合格 | OTHER | 784 CLBS, 13000 GATES | 1.6 mm | 现场可编程门阵列 | 1.2 ns | 784 | 13000 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV1600E-8FG1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1156 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 未说明 | 1.71 V | XCV1600E-8FG1156I | 无 | Obsolete | XILINX INC | BGA | BGA, BGA1156,34X34,40 | 5.84 | 416 MHz | PLASTIC/EPOXY | BGA | BGA1156,34X34,40 | e0 | 无 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 1156 | S-PBGA-B1156 | 724 | 不合格 | 1.2/3.6,1.8 V | 724 | 7776 CLBS, 419904 GATES | 2.6 mm | 现场可编程门阵列 | 0.4 ns | 7776 | 34992 | 419904 | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC95144XV-5TQ144I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 85 °C | -40 °C | 30 | 2.5 V | 2.6 V | FLATPACK, LOW PROFILE, FINE PITCH | SQUARE | LFQFP | PLASTIC/EPOXY | 2.4 V | XC95144XV-5TQ144I | 无 | Obsolete | XILINX INC | QFP | PLASTIC, TQFP-144 | 5.7 | 3 | 117 | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | 144 | S-PQFP-G144 | 不合格 | INDUSTRIAL | 4 ns | 0 DEDICATED INPUTS, 117 I/O | 1.6 mm | 闪存 PLD | REGISTERED | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV1600E-8FGG680I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 680 | BGA | BGA680,39X39,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | 1.71 V | XCV1600E-8FGG680I | 有 | Obsolete | XILINX INC | BGA | BGA, BGA680,39X39,40 | 5.81 | 416 MHz | 3 | PLASTIC/EPOXY | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 mm | compliant | 680 | S-PBGA-B680 | 512 | 不合格 | 1.2/3.6,1.8 V | 512 | 7776 CLBS, 419904 GATES | 1.9 mm | 现场可编程门阵列 | 0.4 ns | 7776 | 34992 | 419904 | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC3190A-09PP175C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 175 | HPGA | PGA175,16X16 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 5.25 V | 4.75 V | 5 V | 未说明 | XC3190A-09PP175C | 无 | Obsolete | XILINX INC | PGA | HPGA, PGA175,16X16 | 5.81 | 370 MHz | 85 °C | PLASTIC/EPOXY | 无 | MAX USABLE 6000 LOGIC GATES | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 未说明 | 2.54 mm | compliant | 175 | S-PPGA-P175 | 144 | 不合格 | 5 V | OTHER | 144 | 320 CLBS, 5000 GATES | 4.191 mm | 现场可编程门阵列 | 1.5 ns | 320 | 320 | 5000 | 42.164 mm | 42.164 mm |
M2GL060TS-1VFG400T2
Microchip
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2GL025S-1VF400I
Microchip
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
HW133
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2GL025TS-1FGG484T2
Microchip
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2GL025TS-1VFG400T2
Microchip
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2GL025TS-1VFG256T2
Microchip
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC5204-6PCG84I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC2C64-5CP56C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC5210-3PCG84C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC2C64-7CP56I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC5202-5VQ64I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC6201P182PR
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC9502B095AR
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC9216A156MR
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XQKU040-1RBA676I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC95288XV-10TQ144I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC95288XV-7TQG144C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC95288XV-7PQG208I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV3200E-6FG1156C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC95288XV-7CS280I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC4020XL-09HTG144C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV1600E-8FG1156I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC95144XV-5TQ144I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV1600E-8FGG680I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC3190A-09PP175C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
