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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 最大功率耗散 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 输出启用 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 通用闪存接口 | I2C控制字节 | 产品类别 | 组织的记忆 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||||||||||||||||||||||||||||||||||||||||
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 | BR24G08-3A | ROHM Semiconductor | 数据表 | 44 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 通孔 | 8-DIP (0.300, 7.62mm) | NO | Non-Volatile | -40°C~85°C TA | Tube | 2014 | Obsolete | 1 (Unlimited) | 8 | SEATED HT-CALCULATED AND IT ALSO OPERATES AT 1.6V WITH 400KHZ | 1.6V~5.5V | DUAL | 未说明 | 1 | 2.5V | 2.54mm | 未说明 | R-PDIP-T8 | 5.5V | 1.7V | 8Kb 1K x 8 | SYNCHRONOUS | 1MHz | EEPROM | I2C | 1KX8 | 8 | 5ms | 8192 bit | SERIAL | I2C | 5ms | 4.21mm | 9.3mm | 7.62mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FL512SAGBHIA13 | Cypress Semiconductor Corp | 数据表 | 10000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 24-TBGA | YES | 24 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2015 | FL-S | 活跃 | 3 (168 Hours) | 24 | IT ALSO HAVE MEMORY WIDTH X1 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 1 | 3V | 1mm | 不合格 | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 512Mb 64M x 8 | SYNCHRONOUS | 133MHz | 0.061mA | FLASH | SPI - Quad I/O | 64MX8 | 8 | 0.0001A | 512753664 bit | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1 | 1.2mm | 8mm | 6mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | HM1-65642B/883 | Intersil (Renesas Electronics America) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 28 | Harris Semiconductor | Transferred | HARRIS SEMICONDUCTOR | 5.82 | Military grade | DIP, DIP28,.6 | IN-LINE | 8000 | CERAMIC, GLASS-SEALED | DIP28,.6 | -55 °C | 150 ns | 125 °C | 无 | HM1-65642B/883 | 8192 words | 5 V | DIP | RECTANGULAR | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.32.00.41 | SRAMs | CMOS | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-GDIP-T28 | 不合格 | 5.5 V | 5 V | MILITARY | 4.5 V | 1 | ASYNCHRONOUS | 0.048 mA | 8KX8 | 3-STATE | 8 | 0.000075 A | 65536 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | 标准SRAM | 2 V | YES | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR25G256F-3GE2 | ROHM Semiconductor | 数据表 | 5000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 8-SOIC (0.173, 4.40mm Width) | YES | Non-Volatile | -40°C~85°C TA | Cut Tape (CT) | 活跃 | 1 (Unlimited) | 8 | SEATED HT-CALCULATED | 1.6V~5.5V | DUAL | 未说明 | 1 | 1.27mm | 未说明 | R-PDSO-G8 | 5.5V | 1.6V | 256Kb 32K x 8 | SYNCHRONOUS | 20MHz | EEPROM | SPI | 32KX8 | 8 | 5ms | 262144 bit | SERIAL | SPI | 5ms | 1.71mm | 5mm | 4.4mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1382D-200AXC | Cypress Semiconductor Corp | 数据表 | 17 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 2004 | e3 | yes | Obsolete | 3 (168 Hours) | 100 | Matte Tin (Sn) | 流水线结构 | 3.135V~3.6V | QUAD | 260 | 1 | 3.3V | 0.65mm | 20 | CY7C1382 | 100 | 3.3V | 3.6V | 3.135V | 18Mb 1M x 18 | 2 | 300mA | 200MHz | 3ns | SRAM | Parallel | 1MX18 | 3-STATE | 18 | 20b | 18 Mb | 0.07A | COMMON | Synchronous | 18b | 3.14V | 1.6mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT28C256-15PC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | 28-DIP (0.600, 15.24mm) | 28-PDIP | Non-Volatile | Military grade | 0°C~70°C TC | Tube | 1997 | Obsolete | 1 (Unlimited) | 4.5V~5.5V | AT28C256 | 256Kb 32K x 8 | 150ns | EEPROM | Parallel | 10ms | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W25Q32FVSFIG | Winbond Electronics | 数据表 | 2640 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | Non-Volatile | -40°C~85°C TA | Tube | 2012 | SpiFlash® | Obsolete | 3 (168 Hours) | 16 | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 32Mb 4M x 8 | 20mA | 104MHz | 8.5 ns | FLASH | SPI - Quad I/O, QPI | 32MX1 | 1 | 50μs, 3ms | 24b | 32 Mb | 0.00002A | Synchronous | 8b | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 2.64mm | 10.31mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MX25L25673GMI-08G | Macronix | 数据表 | 1200 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | Non-Volatile | -40°C~85°C TA | Tube | MXSMIO™ | 活跃 | 2.7V~3.6V | 未说明 | 未说明 | 256Mb 32M x 8 | 120MHz | FLASH | SPI | 30μs, 750μs | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29GL064S80TFIV20 | Cypress Semiconductor Corp | 数据表 | 546 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 56-TFSOP (0.724, 18.40mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tray | 2017 | GL-S | 活跃 | 3 (168 Hours) | 56 | 8542.32.00.51 | 1.65V~3.6V | DUAL | 1 | 3V | 0.5mm | R-PDSO-G56 | 3V | 3.6V | 2.7V | 64Mb 8M x 8 4M x 16 | ASYNCHRONOUS | 80ns | FLASH | Parallel | 8MX8 | 8 | 60ns | 64 Mb | 3V | 1.2mm | 18.4mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M25P80-VMN3TPB | Micron | 数据表 | 804 In Stock | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 8388608 words | SOP | RECTANGULAR | Micron Technology Inc | Obsolete | MICRON TECHNOLOGY INC | 5.45 | SON | Automotive grade | 有 | SOP, SOP8,.25 | 小概要 | 8000000 | PLASTIC/EPOXY | SOP8,.25 | -40 °C | 30 | 85 °C | 有 | M25P80-VMN3TPB | 75 MHz | 有 | EAR99 | NOR型号 | 8542.32.00.51 | 闪存 | CMOS | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | 不合格 | 3.6 V | 3/3.3 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.015 mA | 8MX1 | 1.75 mm | 1 | 0.0001 A | 8388608 bit | AEC-Q100 | SERIAL | FLASH | 2.7 V | SPI | 100000 Write/Erase Cycles | 15 ms | 20 | HARDWARE/SOFTWARE | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT24CSW010-UUM0B-T | Microchip Technology | 数据表 | 55950 In Stock | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 4-XFBGA, WLCSP | YES | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 2016 | e1 | yes | 活跃 | 1 (Unlimited) | 4 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.7V~3.6V | BOTTOM | 1 | 1.8V | 0.4mm | R-PBGA-B4 | 3.6V | 1.7V | 1Kb 128 x 8 | SYNCHRONOUS | 1MHz | 450ns | EEPROM | I2C | 128X8 | 8 | 5ms | 1024 bit | SERIAL | I2C | 5ms | 0.33mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR24T08FV-WE2 | ROHM Semiconductor | 数据表 | 2500 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Tin | 表面贴装 | 表面贴装 | 8-LSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) | 1.6V~5.5V | DUAL | 225 | 1 | 2.5V | 0.65mm | 未说明 | BR24T08 | 不合格 | 5.5V | 1.6V | 2-Wire, I2C, Serial | 8Kb 1K x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 8 | 5ms | 8 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DMMR | 1.35mm | 4.4mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C037-15AC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-LQFP | YES | Volatile | 0°C~70°C TA | Tray | 2001 | e0 | Obsolete | 3 (168 Hours) | 100 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | 中断标志 | 8542.32.00.41 | 4.5V~5.5V | QUAD | 未说明 | 1 | 5V | 0.5mm | not_compliant | 15GHz | 未说明 | CY7C037 | 100 | S-PQFP-G100 | 不合格 | 5.5V | 5V | 4.5V | 576Kb 32K x 18 | 2 | SRAM | Parallel | 32KX18 | 3-STATE | 18 | 15ns | 0.00025A | 589824 bit | 15 ns | COMMON | 2V | YES | 1.6mm | 14mm | 14mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29AL008J55BFIR23 | Cypress Semiconductor Corp | 数据表 | 5722 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 48-VFBGA | YES | 48 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1997 | AL-J | e1 | 活跃 | 3 (168 Hours) | 48 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 底部启动区块 | 8542.32.00.51 | 3V~3.6V | BOTTOM | 未说明 | 1 | 3.3V | 0.8mm | 未说明 | 不合格 | 3.6V | 3.3V | 3V | 8Mb 1M x 8 512K x 16 | ASYNCHRONOUS | 0.012mA | FLASH | Parallel | 512KX16 | 16 | 55ns | 0.000005A | 8388608 bit | 55 ns | 3V | 8 | YES | YES | YES | 12115 | 16K8K32K64K | YES | BOTTOM | YES | 1mm | 8.15mm | 6.15mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | R1EX25032ASA00I#S0 | Renesas Electronics America | 数据表 | 2738 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 20 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | yes | 活跃 | 1 (Unlimited) | 8 | 1.8V~5.5V | DUAL | 1 | 3.6V | 1.27mm | R1EX25032 | 8 | 5.5V | 2.5V | SPI, Serial | 32Kb 4K x 8 | SYNCHRONOUS | 5MHz | EEPROM | SPI | 8 | 5ms | SPI | 5ms | 1.73mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S71VS128RC0AHK4L0 | Cypress Semiconductor Corp | 数据表 | 15 In Stock | - | 最小起订量: 1 最小包装量: 1 | 26 Weeks | 表面贴装 | 56-VFBGA | YES | 56 | Non-Volatile | -25°C~85°C TA | Tray | VS-R | 活跃 | 3 (168 Hours) | 56 | 3A991.B.1.A | PSRAM IS ORGANISED AS 4M X 16 | 8542.32.00.71 | 1.7V~1.95V | BOTTOM | 1 | 1.8V | 0.5mm | 1.8V | 1.95V | 1.7V | 128Mbit Flash 64Mbit RAM | 108MHz | FLASH, RAM | Parallel | 2MX16 | 16 | 33554432 bit | 1mm | 7.7mm | 6.2mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q64JVSFIM | Winbond Electronics | 数据表 | 870 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | SpiFlash® | yes | 活跃 | 3 (168 Hours) | 16 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 1.27mm | 未说明 | R-PDSO-G16 | 3.6V | 2.7V | 64Mb 8M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O | 8MX8 | 8 | 3ms | 67108864 bit | SERIAL | 3V | 2.64mm | 10.31mm | 7.49mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | FM28V020-TGTR | Cypress Semiconductor Corp | 数据表 | 15 In Stock | - | 最小起订量: 1 最小包装量: 1 | 26 Weeks | 表面贴装 | 表面贴装 | 32-TFSOP (0.724, 18.40mm Width) | 32 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2011 | F-RAM™ | e3 | 活跃 | 3 (168 Hours) | 32 | EAR99 | Tin (Sn) | 2V~3.6V | DUAL | 260 | 1 | 3.3V | 0.5mm | 40 | FM28V020 | 32 | 不合格 | 3.3V | 3.6V | 2V | 256Kb 32K x 8 | 12mA | SYNCHRONOUS | FRAM | Parallel | 8b | 8 | 140ns | 256 kb | 0.00015A | 140 ns | 8b | 1.2mm | 11.8mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST25VF040B-80-4I-QAE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 8-WDFN Exposed Pad | 8 | Non-Volatile | Automotive grade | -40°C~85°C TA | Tape & Reel (TR) | 2005 | SST25 | e3 | Obsolete | 3 (168 Hours) | 8 | 哑光锡 | 2.7V~3.6V | DUAL | 1 | 3.3V | 0.55mm | SST25VF040B | 3.3V | 3.6V | 2.7V | SPI, Serial | 4Mb 512K x 8 | 20mA | 80MHz | 8 ns | FLASH | SPI | 8b | 4MX1 | 1 | 10μs | 1b | 4 Mb | 0.00015A | TS 16949 | Synchronous | 8b | 2.7V | 100000 Write/Erase Cycles | 10ms | YES | YES | 64words | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39VF800A-70-4I-M1QE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 48-WFBGA | YES | 48 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2000 | SST39 MPF™ | e1 | yes | Obsolete | 3 (168 Hours) | 48 | 锡银铜 | 2.7V~3.6V | BOTTOM | 260 | 0.5mm | 40 | SST39VF800A | 3.3V | 8Mb 512K x 16 | 30mA | 70ns | FLASH | Parallel | 16b | 512KX16 | 16 | 20μs | 19b | 8 Mb | 0.00002A | Asynchronous | 16b | YES | YES | YES | 256 | 2K | YES | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BR93G86FJ-3BGTE2 | Rohm Semiconductor | 数据表 | 50 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 8-SOIC (0.154", 3.90mm Width) | YES | 8-SOP-J | 8 | BR93G86 | 3 MHz | + 85 C | 5.5 V | - 40 C | 2500 | 3 mA | 1.7 V | SMD/SMT | 3-Wire | 40 Year | BR93G86FJ-3B | Rohm Semiconductor | ROHM 半导体 | ROHM 半导体 | Details | LSOP, | SMALL OUTLINE, LOW PROFILE | 1000 | PLASTIC/EPOXY | 未说明 | -40 °C | 85 °C | 有 | BR93G86FJ-3BGTE2 | 3 MHz | 1024 words | 5 V | LSOP | RECTANGULAR | 活跃 | ROHM CO LTD | 2.25 | 活跃 | Non-Volatile | -40°C ~ 85°C (TA) | MouseReel | - | SEATED HT-CALCULATED AND ALSO OPERATES AT 1.7V WITH 1MHZ AMD 2.5V AT 2MHZ | Memory & Data Storage | 1.7V ~ 5.5V | DUAL | 鸥翼 | 未说明 | 1 | 1.27 mm | compliant | R-PDSO-G8 | 1.7 V to 5.5 V | 5.5 V | INDUSTRIAL | 4.5 V | 16Kbit | SYNCHRONOUS | 3 MHz | 3 mA | EEPROM | Microwire | 1 k x 16 | 1.65 mm | 16 | 5ms | EEPROM | 16384 bit | SERIAL | EEPROM | 3-WIRE | 5 ms | EEPROM | 1K x 16 | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY14B101J1-SXI | Cypress Semiconductor Corp | 数据表 | 22 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e4 | yes | Obsolete | 3 (168 Hours) | 8 | EAR99 | 镍钯金 | 1W | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 20 | CY14B101 | 8 | 3.3V | 3.6V | 3V | 2.7V | 2-Wire, I2C, Serial | 1Mb 128K x 8 | 1mA | 3.4MHz | 900 ns | NVSRAM | I2C | 8b | 8 | 1 Mb | 0.00015A | 8b | 1.727mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT34C02D-XHMHL-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | 8-TSSOP | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1997 | 活跃 | 3 (168 Hours) | 85°C | -40°C | 1.7V~5.5V | 1MHz | AT34C02 | 2-Wire, I2C, Serial | 2Kb 256 x 8 | 1MHz | EEPROM | I2C | 5ms | 2 kb | 1MHz | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W29N04GZBIBA | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 63-VFBGA | YES | 63 | Non-Volatile | -40°C~85°C TA | Tray | 2016 | yes | 活跃 | 3 (168 Hours) | 63 | 1.7V~1.95V | BOTTOM | 1 | 1.8V | 0.8mm | 1.95V | 1.7V | 4Gb 512M x 8 | ASYNCHRONOUS | FLASH | Parallel | 512MX8 | 8 | 35ns | 4294967296 bit | 1.8V | 1mm | 11mm | 9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | PCF8582C-2T/03,112 | NXP USA Inc. | 数据表 | 3800 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2000 | e4 | Obsolete | 1 (Unlimited) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.71 | 2.5V~6.0V | DUAL | 260 | 1 | 3.3V | 1.27mm | 30 | PCF8582 | 8 | R-PDSO-G8 | 不合格 | 6V | 3/5V | 2.5V | 2Kb 256 x 8 | SYNCHRONOUS | 100kHz | 0.002mA | EEPROM | I2C | 256X8 | 8 | 0.0000035A | 2048 bit | SERIAL | I2C | 1000000 Write/Erase Cycles | 10ms | 10 | 1010DDDR | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant |
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