类别是'category.FPGA 评估板' (3802)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 内存大小 | 操作模式 | 传播延迟 | 电源电流-最大值 | 输入数量 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 可编程逻辑类型 | 待机电流-最大值 | 记忆密度 | 并行/串行 | 内存IC类型 | 速度等级 | 输出功能 | 编程电压 | 宏细胞数 | 耐力 | CLB-Max的组合延时 | 逻辑块数量 | JTAG BST | 逻辑单元数 | 数据轮询 | 专用输入数量 | 拨动位 | 命令用户界面 | 页面尺寸 | 等效门数 | 系统内可编程 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||
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![]() | XCS40XL-3PQG240C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 240 | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 3.6 V | 3.3 V | 30 | 3 V | XCS40XL-3PQG240C | 有 | Obsolete | XILINX INC | QFP | FQFP, | 5.81 | 3 | 85 °C | e3 | 有 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | 240 | S-PQFP-G240 | 不合格 | OTHER | 784 CLBS, 13000 GATES | 4.1 mm | 现场可编程门阵列 | 784 | 13000 | 32 mm | 32 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4VLX160-12FFG1513I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | XC4VLX160-12FFG1513I | 有 | 活跃 | XILINX INC | , | 5.29 | 4 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | not_compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC3195A-2PG175C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 175 | CERAMIC, METAL-SEALED COFIRED | HPGA | PGA175,16X16 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 5.25 V | 5 V | 4.75 V | XC3195A-2PG175C | 有 | Obsolete | XILINX INC | PGA | HPGA, PGA175,16X16 | 5.77 | 323 MHz | 85 °C | MAX USABLE 7500 LOGIC GATES | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | 175 | S-CPGA-P175 | 144 | 不合格 | 5 V | OTHER | 144 | 484 CLBS, 6500 GATES | 4.318 mm | 现场可编程门阵列 | 2.2 ns | 484 | 484 | 6500 | 42.164 mm | 42.164 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV300E-8PQG240I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 240 | 3 | PLASTIC/EPOXY | FQFP | QFP240,1.3SQ,20 | SQUARE | FLATPACK, FINE PITCH | 1.89 V | 1.8 V | 30 | 1.71 V | XCV300E-8PQG240I | 有 | Obsolete | XILINX INC | QFP | FQFP, QFP240,1.3SQ,20 | 5.81 | 416 MHz | e3 | 有 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | 240 | S-PQFP-G240 | 158 | 不合格 | 1.2/3.6,1.8 V | 158 | 1536 CLBS, 82944 GATES | 4.1 mm | 现场可编程门阵列 | 0.4 ns | 1536 | 6912 | 82944 | 32 mm | 32 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | XCV200E-6FGG456I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 456 | 3 | PLASTIC/EPOXY | BGA | BGA456,22X22,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | 1.71 V | XCV200E-6FGG456I | 有 | Obsolete | XILINX INC | BGA | FBGA-456 | 5.8 | 357 MHz | e1 | 有 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | unknown | 456 | S-PBGA-B456 | 284 | 不合格 | 1.2/3.6,1.8 V | 284 | 1176 CLBS, 63504 GATES | 2.6 mm | 现场可编程门阵列 | 0.47 ns | 1176 | 5292 | 63504 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | XCV300E-7BGG432I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 432 | 3 | PLASTIC/EPOXY | LBGA | BGA432,31X31,50 | SQUARE | GRID ARRAY, LOW PROFILE | 1.89 V | 1.8 V | 30 | 1.71 V | XCV300E-7BGG432I | 有 | Obsolete | XILINX INC | BGA | BGA-432 | 5.81 | 400 MHz | e1 | 有 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | unknown | 432 | S-PBGA-B432 | 316 | 不合格 | 1.2/3.6,1.8 V | 316 | 1536 CLBS, 82944 GATES | 1.7 mm | 现场可编程门阵列 | 0.42 ns | 1536 | 6912 | 82944 | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | XC3130A-2PQ100I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 3 | PLASTIC/EPOXY | QFP | QFP100,.7X.9 | RECTANGULAR | FLATPACK | 5.5 V | 5 V | 30 | 4.5 V | XC3130A-2PQ100I | 无 | Obsolete | XILINX INC | QFP | QFP, QFP100,.7X.9 | 5.78 | 323 MHz | e0 | 无 | Tin/Lead (Sn85Pb15) | MAX USABLE 2000 LOGIC GATES | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.65 mm | not_compliant | 100 | R-PQFP-G100 | 80 | 不合格 | 5 V | 80 | 100 CLBS, 1500 GATES | 3.4 mm | 现场可编程门阵列 | 2.2 ns | 100 | 100 | 1500 | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | XCV400E-8FGG676I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 676 | 3 | PLASTIC/EPOXY | BGA | BGA676,26X26,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | 1.71 V | XCV400E-8FGG676I | 有 | Obsolete | XILINX INC | BGA | BGA, BGA676,26X26,40 | 5.81 | 416 MHz | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | 676 | S-PBGA-B676 | 404 | 不合格 | 1.2/3.6,1.8 V | 404 | 2400 CLBS, 129600 GATES | 2.6 mm | 现场可编程门阵列 | 0.4 ns | 2400 | 10800 | 129600 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | XC5VSX240T-2FFG1738I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1738 | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1738,42X42,40 | SQUARE | 网格排列 | 1.05 V | 1 V | 30 | 0.95 V | XC5VSX240T-2FFG1738I | 有 | 活跃 | XILINX INC | BGA | BGA-1738 | 5.24 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 245 | 1 mm | not_compliant | 1738 | S-PBGA-B1738 | 960 | 不合格 | 1,2.5 V | INDUSTRIAL | 960 | 18720 CLBS | 3.25 mm | FPGA | 0.77 ns | 18720 | 239616 | 42.5 mm | 42.5 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | XCR3064XL-6CS48I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | 5.15 | 167 MHz | 3 | 32 | 85 °C | -40 °C | PLASTIC/EPOXY | FBGA | SQUARE | GRID ARRAY, FINE PITCH | 3.6 V | 3.3 V | 30 | 2.7 V | XCR3064XL-6CS48I | 无 | 活跃 | XILINX INC | BGA | FBGA, | e0 | 无 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.8 mm | compliant | 48 | S-PBGA-B48 | 不合格 | INDUSTRIAL | 6 ns | 32 I/O | 1.8 mm | EE PLD | MACROCELL | 7 mm | 7 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV300E-8FGG456I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 456 | 3 | PLASTIC/EPOXY | BGA | BGA456,22X22,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | 1.71 V | XCV300E-8FGG456I | 有 | Obsolete | XILINX INC | BGA | BGA, BGA456,22X22,40 | 5.81 | 416 MHz | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | 456 | S-PBGA-B456 | 312 | 不合格 | 1.2/3.6,1.8 V | 312 | 1536 CLBS, 82944 GATES | 2.6 mm | 现场可编程门阵列 | 0.4 ns | 1536 | 6912 | 82944 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | X28VC256K-55 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 28 | 70 °C | CERAMIC, METAL-SEALED COFIRED | PGA | PGA28,5X6 | RECTANGULAR | 网格排列 | 5 V | 未说明 | X28VC256K-55 | 无 | Obsolete | XICOR INC | CERAMIC, PGA-28 | 5.91 | 55 ns | 32768 words | 32000 | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | 未说明 | 1 | 2.54 mm | unknown | R-CPGA-P28 | 不合格 | 5.5 V | 5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.08 mA | 32KX8 | 3-STATE | 4.62 mm | 8 | 0.025 A | 262144 bit | PARALLEL | EEPROM | 5 V | 10000 Write/Erase Cycles | YES | YES | NO | 128 words | 16.51 mm | 14 mm | |||||||||||||||||||||||||||||||||||
![]() | XC3190A-3PG175C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 175 | 5 V | 4.75 V | XC3190A-3PG175C | 接触制造商 | ROCHESTER ELECTRONICS LLC | PGA, | 5.78 | 270 MHz | 85 °C | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | 网格排列 | 5.25 V | e0 | 锡铅 | MAX USABLE 6000 LOGIC GATES | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | S-CPGA-P175 | OTHER | 320 CLBS, 5000 GATES | 4.318 mm | 现场可编程门阵列 | 2.7 ns | 320 | 5000 | 42.164 mm | 42.164 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4VFX140-10FFG1760I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1760 | 4 | PLASTIC/EPOXY | BGA | BGA1760,42X42,40 | SQUARE | 网格排列 | 1.26 V | 1.2 V | 30 | 1.14 V | XC4VFX140-10FFG1760I | 有 | 活跃 | XILINX INC | BGA | 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760 | 5.24 | 1028 MHz | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 245 | 1 mm | not_compliant | 1760 | S-PBGA-B1760 | 896 | 不合格 | 1.2,1.2/3.3,2.5 V | 896 | 15792 CLBS | 3.5 mm | 现场可编程门阵列 | 15792 | 142128 | 42.5 mm | 42.5 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | XC2064-100PC44C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | 3 | 85 °C | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | 5.25 V | 5 V | 4.75 V | XC2064-100PC44C | 无 | Obsolete | XILINX INC | LCC | PLASTIC, LCC-44 | 8.73 | 100 MHz | e0 | EAR99 | Tin/Lead (Sn85Pb15) | 122 FLIP-FLOPS; TYP. GATES = 600-1000 | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | not_compliant | 44 | S-PQCC-J44 | 34 | 不合格 | 5 V | OTHER | 34 | 64 CLBS, 600 GATES | 4.318 mm | 现场可编程门阵列 | 8 ns | 64 | 64 | 600 | 16.5862 mm | 16.5862 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | XC4VLX200-12FFG1513C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1513 | 1205 MHz | 4 | 85 °C | PLASTIC/EPOXY | BGA | BGA1513,39X39,40 | SQUARE | 网格排列 | 1.26 V | 1.2 V | 30 | 1.14 V | XC4VLX200-12FFG1513C | 有 | 活跃 | XILINX INC | BGA | LEAD FREE, FBGA-1513 | 5.27 | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 245 | 1 mm | not_compliant | 1513 | S-PBGA-B1513 | 960 | 不合格 | OTHER | 960 | 22272 CLBS | 3.25 mm | 现场可编程门阵列 | 22272 | 200448 | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XCR5064C-12VQ44I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | XCR5064C-12VQ44I | 无 | Obsolete | XILINX INC | QFP | TQFP, TQFP44,.47SQ,32 | 5.36 | 8542.39.00.01 | unknown | 44 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCS30XL-3TQG144C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 3.6 V | 3 V | 3.3 V | 30 | XCS30XL-3TQG144C | 有 | Obsolete | XILINX INC | QFP | LFQFP, | 5.81 | 3 | 85 °C | e3 | 有 | Matte Tin (Sn) | 30000 EQUIVALENT GATES AVAILABLE | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | 144 | S-PQFP-G144 | 不合格 | OTHER | 576 CLBS, 10000 GATES | 1.6 mm | 现场可编程门阵列 | 576 | 10000 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7272A-25PC84C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 84 | 40 MHz | 3 | 42 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | 5.25 V | 5 V | 4.75 V | XC7272A-25PC84C | 无 | Obsolete | XILINX INC | LCC | PLASTIC, MO-047AF, LCC-84 | 5.83 | e0 | EAR99 | Tin/Lead (Sn85Pb15) | PAL BLOCKS INTERCONNECTED BY PIA; 72 MACROCELLS | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | unknown | 84 | S-PQCC-J84 | 不合格 | 5 V | COMMERCIAL | 40 ns | 12 DEDICATED INPUTS, 42 I/O | 5.08 mm | OT PLD | MACROCELL | 72 | NO | 12 | NO | 29.3116 mm | 29.3116 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | XCV1000-6BGG560C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 560 | 3 | 85 °C | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 2.625 V | 2.5 V | 30 | 2.375 V | XCV1000-6BGG560C | 有 | Obsolete | XILINX INC | BGA | LBGA, | 5.8 | 333 MHz | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 560 | S-PBGA-B560 | 不合格 | OTHER | 6144 CLBS, 1124022 GATES | 1.7 mm | 现场可编程门阵列 | 0.6 ns | 6144 | 1124022 | 42.5 mm | 42.5 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV100E-6FGG256I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | 3 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | 1.71 V | XCV100E-6FGG256I | 有 | Obsolete | XILINX INC | BGA | FBGA-256 | 5.8 | 357 MHz | e1 | 有 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 mm | unknown | 256 | S-PBGA-B256 | 176 | 不合格 | 1.2/3.6,1.8 V | 176 | 600 CLBS, 32400 GATES | 2 mm | 现场可编程门阵列 | 0.47 ns | 600 | 2700 | 32400 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | XC4VLX200-12FF1513C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1513 | 1205 MHz | 4 | 85 °C | PLASTIC/EPOXY | BGA | BGA1513,39X39,40 | SQUARE | 网格排列 | 1.26 V | 1.2 V | 30 | 1.14 V | XC4VLX200-12FF1513C | 无 | 活跃 | XILINX INC | BGA | FBGA-1513 | 5.25 | e0 | 无 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1 mm | not_compliant | 1513 | S-PBGA-B1513 | 960 | 不合格 | OTHER | 960 | 22272 CLBS | 3.25 mm | 现场可编程门阵列 | 22272 | 200448 | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV300E-6BGG352C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 352 | 5.81 | 357 MHz | 30 | 1.8 V | 1.89 V | GRID ARRAY, LOW PROFILE | SQUARE | BGA352,26X26,50 | LBGA | PLASTIC/EPOXY | 85 °C | 3 | Compliant | 1.71 V | XCV300E-6BGG352C | 有 | Obsolete | XILINX INC | BGA | BGA-352 | e1 | 有 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 85 °C | 0 °C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | unknown | 352 | S-PBGA-B352 | 260 | 不合格 | 1.8 V | 1.2/3.6,1.8 V | OTHER | 16 kB | 260 | 1536 CLBS, 82944 GATES | 1.7 mm | 现场可编程门阵列 | 6 | 0.47 ns | 1536 | 6912 | 82944 | 35 mm | 35 mm | 无 | ||||||||||||||||||||||||||||||||
![]() | XCV300E-6FGG456I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 456 | 3 | PLASTIC/EPOXY | BGA | BGA456,22X22,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | 1.71 V | XCV300E-6FGG456I | 有 | Obsolete | XILINX INC | BGA | FBGA-456 | 5.79 | 357 MHz | e1 | 有 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | unknown | 456 | S-PBGA-B456 | 312 | 不合格 | 1.2/3.6,1.8 V | 312 | 1536 CLBS, 82944 GATES | 2.6 mm | 现场可编程门阵列 | 0.47 ns | 1536 | 6912 | 82944 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | XC3190A-2PG175C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 175 | 85 °C | CERAMIC, METAL-SEALED COFIRED | HPGA | PGA175,16X16 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 5.25 V | 5 V | 未说明 | 4.75 V | XC3190A-2PG175C | 无 | Obsolete | XILINX INC | PGA | HPGA, PGA175,16X16 | 5.8 | 323 MHz | 无 | MAX USABLE 6000 LOGIC GATES | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 未说明 | 2.54 mm | compliant | 175 | S-CPGA-P175 | 144 | 不合格 | 5 V | OTHER | 144 | 320 CLBS, 5000 GATES | 4.318 mm | 现场可编程门阵列 | 2.2 ns | 320 | 320 | 5000 | 42.164 mm | 42.164 mm |
XCS40XL-3PQG240C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC4VLX160-12FFG1513I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC3195A-2PG175C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV300E-8PQG240I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV200E-6FGG456I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV300E-7BGG432I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC3130A-2PQ100I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV400E-8FGG676I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC5VSX240T-2FFG1738I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCR3064XL-6CS48I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV300E-8FGG456I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
X28VC256K-55
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC3190A-3PG175C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC4VFX140-10FFG1760I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC2064-100PC44C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC4VLX200-12FFG1513C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCR5064C-12VQ44I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCS30XL-3TQG144C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC7272A-25PC84C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV1000-6BGG560C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV100E-6FGG256I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC4VLX200-12FF1513C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV300E-6BGG352C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV300E-6FGG456I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC3190A-2PG175C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
