类别是'category.专用模块' (1062)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | Contact plating | 表面安装 | Number of pins | 终端数量 | Connector pinout layout | Contacts pitch | Electrical mounting | Gross weight | Kind of connector | Row pitch | Spatial orientation | Type of connector | Operating temperature | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | Current rating | 频率 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 操作模式 | 电源电流-最大值 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 并行/串行 | I/O类型 | 内存IC类型 | 编程电压 | Rated voltage | 个人资料 | 饱和电流 | 混合内存类型 | 温度 | 长度 | 宽度 | Plating thickness | Flammability rating | ||||||||||||||||||||
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![]() | W29N04GZBJBA | Winbond | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9X11mm2 | VFBGA - 63 | 40MHz | 1.7 ~ 1.95V | 4Gb | -40~+85˚C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | W29N08GVBIAA | Winbond | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9X11mm2 | VFBGA - 63 | 40MHz | 2.7 ~ 3.6V | 8Gb | -40~+85˚C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | W29N08GVSIAA | Winbond | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12X20mm2 | TSOPI - 48 | 40MHz | 2.7 ~ 3.6V | 8Gb | -40~+85˚C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST32HF164-70-4C-TBK | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | SILICON STORAGE TECHNOLOGY INC | BGA | TBGA, BGA48,6X8,40 | 70 ns | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | TBGA | BGA48,6X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | 3 V | 无 | Obsolete | e0 | EAR99 | 锡铅 | ALSO CONTAINS 256K X 16 SRAM | 8542.32.00.71 | BOTTOM | BALL | 1 | 1 mm | unknown | 48 | R-PBGA-B48 | 不合格 | 3.3 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 1MX16 | 1.2 mm | 16 | 0.00003 A | 16777216 bit | 存储器电路 | FLASH+SRAM | 12 mm | 10 mm | |||||||||||||||||||||||||||||||||||
![]() | S71PL256NC0HFW5U0 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 84 | Obsolete | SPANSION INC | BGA | 8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84 | 70 ns | 3 | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 V | 有 | e1 | EAR99 | 锡银铜 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 84 | R-PBGA-B84 | 不合格 | 3.1 V | OTHER | 2.7 V | ASYNCHRONOUS | 16MX16 | 1.2 mm | 16 | 268435456 bit | 存储器电路 | FLASH+PSRAM | 11.6 mm | 8 mm | ||||||||||||||||||||||||||||||||||
![]() | M5M410092AFP-13 | Mitsubishi Electric | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 128 | LFQFP, | 327680 words | 320000 | PLASTIC/EPOXY | LFQFP | RECTANGULAR | FLATPACK, LOW PROFILE, FINE PITCH | 3.3 V | Obsolete | MITSUBISHI ELECTRIC CORP | QFP | EAR99 | 8542.32.00.71 | QUAD | 鸥翼 | 1 | 0.5 mm | unknown | 128 | R-PQFP-G128 | 不合格 | 3.465 V | 3.135 V | SYNCHRONOUS | 320KX32 | 1.7 mm | 32 | 10485760 bit | 存储器电路 | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | CDP1824 | General Electric Solid State | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete | GENERAL ELECTRIC SOLID STATE | EAR99 | 8542.32.00.71 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SLF9000N | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 活跃 | INFINEON TECHNOLOGIES AG | EAR99 | 8542.32.00.71 | compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST32HF802-70-4C-L3KE | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | gold-plated | YES | 20 | 48 | 2x10 | 2.54mm | THT | 0.94 g | female | LFBGA, BGA48,6X8,32 | 70 ns | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | LFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 V | socket | 有 | Obsolete | SILICON STORAGE TECHNOLOGY INC | 2.54mm | straight | BGA | pin strips | -40...163°C | e1 | EAR99 | 锡银铜 | SRAM IS ORGANIZED AS 128K X 16 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 1.5A | 48 | R-PBGA-B48 | 不合格 | 3.3 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.055 mA | 512KX16 | 1.4 mm | 16 | 0.00004 A | 8388608 bit | 存储器电路 | 60V | beryllium copper | FLASH+SRAM | 8 mm | 6 mm | 0.254µm | UL94V-0 | |||||||||||||||||
![]() | SST32HF802-70-4C-L3KE | Greenliant Systems Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | gold-plated | YES | 16 | 48 | 2x8 | 2.54mm | THT | 0.72 g | female | 70 °C | PLASTIC/EPOXY | LFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 V | socket | Obsolete | GREENLIANT SYSTEMS LTD | , | 70 ns | 524288 words | 2.54mm | straight | 512000 | pin strips | -40...163°C | EAR99 | SRAM IS ORGANIZED AS 128K X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 1.5A | R-PBGA-B48 | 3.3 V | 2.7 V | ASYNCHRONOUS | 512KX16 | 1.4 mm | 16 | 8388608 bit | 存储器电路 | 60V | beryllium copper | FLASH+SRAM | 8 mm | 6 mm | 0.254µm | UL94V-0 | |||||||||||||||||||||||||||
![]() | MR2A16AVYS35 | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | tinned | YES | 17 | 44 | 1x17 | 1.27mm | THT | 1.18 g | female | 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 | 35 ns | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | TSOP2 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 有 | 3.3 V | socket | Transferred | FREESCALE SEMICONDUCTOR INC | straight | TSOP2 | pin strips | -40...163°C | e3 | EAR99 | 哑光锡 | 8542.32.00.71 | DUAL | 鸥翼 | 260 | 1 | 0.8 mm | compliant | 1.5A | 40 | 44 | R-PDSO-G44 | 不合格 | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 256KX16 | 1.2 mm | 16 | 0.028 A | 4194304 bit | 存储器电路 | 125V | bronze | 3 | 18.41 mm | 10.16 mm | 4µm | UL94V-0 | |||||||||||||||||||
![]() | CY7C261-25WMB | Teledyne e2v | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | gold-plated | NO | 30 | 24 | 2x15 | 2.54mm | SMT | 3.83 g | female | 8192 words | 8000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | WDIP | DIP24,.3 | RECTANGULAR | IN-LINE, WINDOW | 5 V | socket | 活跃 | TELEDYNE E2V (UK) LTD | DIP-24 | 2.54mm | straight | 25 ns | pin strips | -40...163°C | 3A001.A.2.C | 8542.32.00.61 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | compliant | 3A | R-CDIP-T24 | 5.5 V | 4.5 V | ASYNCHRONOUS | 0.14 mA | 8KX8 | 3-STATE | 5.08 mm | 8 | 0.04 A | 65536 bit | PARALLEL | COMMON | UVPROM | 12.5 V | 150V | beryllium copper | 31.877 mm | 7.62 mm | 0.75µm | UL94V-0 | ||||||||||||||||||||||
![]() | SST32HF164-90-4C-EK | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | gold-plated | YES | 43 | 48 | 1x43 | 2.54mm | THT | 2.15 g | female | TSOP1, TSSOP48,.8,20 | 90 ns | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 3 V | socket | 无 | Obsolete | SILICON STORAGE TECHNOLOGY INC | straight | TSOP1 | pin strips | -40...163°C | e0 | EAR99 | Tin/Lead (Sn/Pb) | ALSO CONTAINS 256K X 16 SRAM | 8542.32.00.71 | DUAL | 鸥翼 | 1 | 0.5 mm | unknown | 3A | 48 | R-PDSO-G48 | 不合格 | 3.3 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.045 mA | 1MX16 | 1.2 mm | 16 | 0.00004 A | 16777216 bit | 存储器电路 | 150V | beryllium copper | FLASH+SRAM | 18.4 mm | 12 mm | 0.75µm | UL94V-0 | |||||||||||||||||||
![]() | M4-4112S-Z2 | Moujen Switch | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RD38F2030W0ZTQ0 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 88 | INTEL CORP | BGA | TFBGA, BGA88,8X12,32 | 70 ns | 4194304 words | 4000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 无 | Obsolete | e0 | 无 | EAR99 | 锡铅 | CONTAINS 16 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 88 | R-PBGA-B88 | 不合格 | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 0.055 mA | 4MX16 | 1.2 mm | 16 | 0.000015 A | 67108864 bit | 存储器电路 | FLASH+SRAM | 10 mm | 8 mm | |||||||||||||||||||||||||||||||||
![]() | MCM66734P | Motorola Semiconductor Products | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 24 | PLASTIC/EPOXY | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | 无 | Obsolete | MOTOROLA INC | 70 °C | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T24 | 不合格 | COMMERCIAL | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST30VR021-500-C-WH | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | SILICON STORAGE TECHNOLOGY INC | TSOP1 | TSOP1, TSSOP32,.56,20 | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 3 V | 无 | Obsolete | e0 | EAR99 | 锡铅 | ALSO CONTAINS 128K X 8 SRAM | 8542.32.00.71 | DUAL | 鸥翼 | 1 | 0.5 mm | unknown | 32 | R-PDSO-G32 | 不合格 | 3.3 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.0065 mA | 256KX8 | 1.2 mm | 8 | 0.00001 A | 2097152 bit | 存储器电路 | ROM+SRAM | 12.4 mm | 8 mm | ||||||||||||||||||||||||||||||||||||
![]() | M36W0R6050B1ZAQF | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 88 | STMICROELECTRONICS | BGA | 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88 | 70 ns | 4194304 words | 4000000 | 85 °C | -30 °C | PLASTIC/EPOXY | TFBGA | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 有 | Transferred | e1 | EAR99 | 锡银铜 | PSRAM IS ORGANIZED AS 2M X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 88 | R-PBGA-B88 | 不合格 | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | 4MX16 | 1.2 mm | 16 | 67108864 bit | 存储器电路 | FLASH+PSRAM | 10 mm | 8 mm | ||||||||||||||||||||||||||||||||||||
![]() | M36W0R6050B1ZAQF | Micron Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 88 | MICRON TECHNOLOGY INC | BGA | TFBGA, BGA88,8X12,32 | 70 ns | 4194304 words | 4000000 | 85 °C | -30 °C | PLASTIC/EPOXY | TFBGA | BGA88,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 有 | Obsolete | e1 | 有 | EAR99 | 锡银铜 | PSRAM IS ORGANIZED AS 2M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 88 | R-PBGA-B88 | 不合格 | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | 4MX16 | 1.2 mm | 16 | 67108864 bit | 存储器电路 | FLASH+PSRAM | 10 mm | 8 mm | |||||||||||||||||||||||||||||||||||
![]() | S71GL064A08BFW0B0 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | FBGA, BGA56,8X8,32 | 100 ns | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | BGA56,8X8,32 | SQUARE | GRID ARRAY, FINE PITCH | 有 | 活跃 | ADVANCED MICRO DEVICES INC | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B56 | 不合格 | OTHER | 0.06 mA | 0.000005 A | 存储器电路 | FLASH+SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC17S150XLSOG20I | AMD Xilinx | 数据表 | 98 In Stock | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | XILINX INC | SOIC | SOP, | 3 | 1040128 words | 1040128 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 3.3 V | 有 | Obsolete | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 30 | 20 | R-PDSO-G20 | 不合格 | 3.6 V | INDUSTRIAL | 3 V | SYNCHRONOUS | 1040128X1 | 2.65 mm | 1 | 1040128 bit | 存储器电路 | 12.8 mm | 7.5 mm | ||||||||||||||||||||||||||||||||||||
![]() | ST93C46 | KOA Speer Electronics Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete | KOA SPEER ELECTRONICS INC | EAR99 | 8542.32.00.71 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST32HF64A2-70-4E-L2SE | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | SILICON STORAGE TECHNOLOGY INC | BGA | LFBGA, | 4194304 words | 4000000 | 85 °C | -20 °C | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 V | 有 | Obsolete | e1 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | PSRAM IS ORGANIZED AS 1024K X 16 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 24 | 64 | R-PBGA-B64 | 不合格 | 3.3 V | OTHER | 2.7 V | ASYNCHRONOUS | 4MX16 | 1.4 mm | 16 | 67108864 bit | 存储器电路 | 10 mm | 8 mm | |||||||||||||||||||||||||||||||||||||
![]() | SSDSC2KB240G801 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2704 | SGS-Ates Componenti Electronici SPA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 24 | DIP, DIP24,.6 | 450 ns | 512 words | 512 | 70 °C | CERAMIC | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | 无 | Obsolete | SGS-ATES COMPONENTI ELECTRONICI S P A | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T24 | 不合格 | COMMERCIAL | 512X8 | 3-STATE | 8 | 4096 bit | COMMON |
W29N04GZBJBA
Winbond
分类:Specialized
W29N08GVBIAA
Winbond
分类:Specialized
W29N08GVSIAA
Winbond
分类:Specialized
SST32HF164-70-4C-TBK
Silicon Storage Technology
分类:Specialized
S71PL256NC0HFW5U0
Spansion
分类:Specialized
M5M410092AFP-13
Mitsubishi Electric
分类:Specialized
CDP1824
General Electric Solid State
分类:Specialized
SLF9000N
Infineon Technologies AG
分类:Specialized
SST32HF802-70-4C-L3KE
Silicon Storage Technology
分类:Specialized
SST32HF802-70-4C-L3KE
Greenliant Systems Ltd
分类:Specialized
MR2A16AVYS35
Freescale Semiconductor
分类:Specialized
CY7C261-25WMB
Teledyne e2v
分类:Specialized
SST32HF164-90-4C-EK
Silicon Storage Technology
分类:Specialized
M4-4112S-Z2
Moujen Switch
分类:Specialized
RD38F2030W0ZTQ0
Intel Corporation
分类:Specialized
MCM66734P
Motorola Semiconductor Products
分类:Specialized
SST30VR021-500-C-WH
Silicon Storage Technology
分类:Specialized
M36W0R6050B1ZAQF
STMicroelectronics
分类:Specialized
M36W0R6050B1ZAQF
Micron Technology Inc
分类:Specialized
S71GL064A08BFW0B0
AMD
分类:Specialized
XC17S150XLSOG20I
AMD Xilinx
分类:Specialized
ST93C46
KOA Speer Electronics Inc
分类:Specialized
SST32HF64A2-70-4E-L2SE
Silicon Storage Technology
分类:Specialized
SSDSC2KB240G801
Intel Corporation
分类:Specialized
M2704
SGS-Ates Componenti Electronici SPA
分类:Specialized
