类别是'category.USB闪存驱动器' (1612)

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引导模块

W25Q32FVZPIG TRAY
W25Q32FVZPIG TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3.3|3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

Compliant

3A991.b.1.a

NOR

32M

Symmetrical

24

8

4M

Synchronous

7

50/Chip

Obsolete

Sectored

4Kbyte x 1024

256byte

W25Q32JVSNIQ/TUBE
W25Q32JVSNIQ/TUBE
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NOR

32M

Symmetrical

Bottom|Top

24

8

4M

Synchronous

6

50/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3|3.3

3.6

2.7 to 3.6

25

25

-40

85

Industrial

100000

表面贴装

1.5(Max)

4(Max)

5(Max)

8

SOIC N

Gull-wing

Compliant

3A991.b.1.a

活跃

8

Sectored

4Kbyte x 1024

256byte

W25Q80BVSNIG/TUBE
W25Q80BVSNIG/TUBE
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Serial-SPI

2.7

3.3

3.6

2.7 to 3.6

18

-40

85

Industrial

100000

Compliant

EAR99

NOR

8M

Symmetrical

1

8

1M

Synchronous

8.5

6/Chip

3/Page

Obsolete

Sectored

4Kbyte x 256

256byte

W25Q64CVSSAG/REEL
W25Q64CVSSAG/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Unknown

NOR

64M

Symmetrical

24

8

8M

Synchronous

7

30/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3|3.3

3.6

2.7 to 3.6

18

25

-40

105

汽车

100000

表面贴装

1.8

5.28

5.28

8

SOP

SOIC W

Gull-wing

Compliant

3A991.b.1.a

Obsolete

8

Sectored

4Kbyte x 2048

256byte

W25Q64FWZEIG/REEL
W25Q64FWZEIG/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NOR

64M

Symmetrical

Top|Bottom

24

8

8M

Synchronous

6

100/Chip

5/Page

Serial (SPI, Dual SPI, Quad SPI)

1.65

1.8

1.95

1.65 to 1.95

20

25

-40

85

Industrial

100000

表面贴装

0.73

8

6

8

WSON EP

Compliant

3A991.b.1.a

Obsolete

8

Sectored

4Kbyte x 2048

256byte

W25Q32FWZPIG/TUBE
W25Q32FWZPIG/TUBE
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1.65

1.8

1.95

1.65 to 1.95

20

25

-40

85

Industrial

100000

Compliant

3A991.b.1.a

NOR

32M

Symmetrical

24

8

4M

Synchronous

6

50/Chip

5/Page

Serial (SPI, Dual SPI, Quad SPI)

Obsolete

Sectored

4Kbyte x 1024

256byte

W25Q256FVCIG/REEL
W25Q256FVCIG/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NOR

256M

Symmetrical

32

8

32M

Synchronous

7

400/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3|3.3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

表面贴装

0.85(Max)

6

8

24

BGA

TFBGA

Ball

Compliant

3A991.b.1.a

Obsolete

24

Sectored

4Kbyte x 8192

256byte

W25Q40BWSNIG/TRAY
W25Q40BWSNIG/TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NOR

4M

Symmetrical

Top|Bottom

24

8

512K

Synchronous

7

4/Chip

0.8/Page

Serial (SPI, Dual SPI, Quad SPI)

1.65

1.8

1.95

1.65 to 1.95

24

25

-40

85

Industrial

表面贴装

1.5(Max)

4(Max)

5(Max)

8

SOP

SOIC

Gull-wing

Compliant

EAR99

Obsolete

8

Sectored

4Kbyte x 128

256byte

W25Q80BWZPIG/TRAY
W25Q80BWZPIG/TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NOR

8M

Symmetrical

Bottom|Top

24

8

1M

Synchronous

7.5

6/Chip

0.8/Page

Serial (SPI, Dual SPI, Quad SPI)

1.65

1.8

1.95

1.65 to 1.95

18

20

-40

85

Industrial

100000

表面贴装

0.73

6

5

8

SON

WSON EP

Compliant

EAR99

Obsolete

8

Sectored

4Kbyte x 256

256byte

W25Q20EWSNIG/REEL
W25Q20EWSNIG/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NOR

2M

Symmetrical

24

8

256K

Synchronous

6

2/Chip

0.8/Page

Serial (SPI, Dual SPI, Quad SPI)

1.65

1.8

1.95

1.65 to 1.95

20

20

-40

85

Industrial

100000

表面贴装

1.45

3.9

4.85

8

SOP

SOIC N

Compliant

EAR99

Tube

活跃

8

Sectored

4Kbyte x 64

256byte

W25Q32JVTCIQ/REEL
W25Q32JVTCIQ/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3A991.b.1.a

NOR

32M

Symmetrical

Bottom|Top

24

8

4M

Synchronous

6

50/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3|3.3

3.6

2.7 to 3.6

25

25

-40

85

Industrial

100000

表面贴装

0.85(Max)

6

8

24

BGA

TFBGA

Ball

Compliant

活跃

24

Sectored

4Kbyte x 1024

256byte

W25Q64DWSSIG/REEL
W25Q64DWSSIG/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NOR

64M

Symmetrical

Bottom|Top

1

8

8M

Synchronous

7

60/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

1.7

1.8

1.95

1.7 to 1.95

40

-40

85

Industrial

表面贴装

1.8

5.28

5.28

8

SOP

SOIC

Gull-wing

Compliant

3A991.b.1.a

Obsolete

8

Sectored

4Kbyte x 2048

256byte

W25X20CVSNSG/REEL
W25X20CVSNSG/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

256K

Synchronous

8

2/Chip

3/Page

Serial (SPI, Dual SPI)

2.6

3.3

3.6

14

15

100000

表面贴装

1.5(Max)

4(Max)

5(Max)

8

SOIC N

Gull-wing

Compliant

EAR99

Unknown

2M

Symmetrical

24

8

Unconfirmed

8

Sectored

4Kbyte x 64

256byte

W25Q80BVZPIG/REEL
W25Q80BVZPIG/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Serial-SPI

2.7

3.3

3.6

2.7 to 3.6

18

-40

85

Industrial

100000

Compliant

EAR99

NOR

8M

Symmetrical

1

8

1M

Synchronous

8.5

6/Chip

3/Page

Obsolete

Sectored

4Kbyte x 256

256byte

W25Q64DWZPIG/TUBE
W25Q64DWZPIG/TUBE
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NOR

64M

Symmetrical

Top|Bottom

1

8

8M

Synchronous

7

60/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

1.7

1.8

1.95

1.7 to 1.95

40

-40

85

Industrial

表面贴装

0.73

6

5

8

SON

WSON EP

No Lead

Compliant

3A991.b.1.a

Obsolete

8

Sectored

4Kbyte x 2048

256byte

W25Q256FVCIF/TRAY
W25Q256FVCIF/TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Synchronous

7

400/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3|3.3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

Compliant

3A991.b.1.a

NOR

256M

Symmetrical

32

8

32M

Obsolete

Sectored

4Kbyte x 8192

256byte

W25Q80BWBYIG/REEL
W25Q80BWBYIG/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

7.5

6/Chip

0.8/Page

Serial-SPI

1.65

1.8

1.95

1.65 to 1.95

18

20

-40

85

Industrial

100000

Compliant

EAR99

NOR

8M

Symmetrical

Bottom|Top

24

8

1M

Synchronous

Obsolete

Sectored

4Kbyte x 256

256byte

W25Q64BVSFIG/TRAY
W25Q64BVSFIG/TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NOR

64M

Symmetrical

1

1

64M

Synchronous

7

30/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3|3.3

3.6

2.7 to 3.6

18

-40

85

Industrial

表面贴装

2.31

7.49

10.31

16

SOP

SOIC

Gull-wing

Compliant

3A991.b.1.a

Obsolete

16

Sectored

4Kbyte x 2048

256byte

W25Q80DVZPIG/REEL
W25Q80DVZPIG/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

EAR99

NOR

8M

Symmetrical

24

8

1M

Synchronous

6

6/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

104

2.7

3|3.3

3.6

2.7 to 3.6

25

25

-40

85

Industrial

100000

表面贴装

0.73

6

5

8

SON

WSON EP

No Lead

Compliant

Tube

活跃

8

Sectored

4Kbyte x 256

256byte

W25Q64FVZPIG/REEL
W25Q64FVZPIG/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Compliant

3A991.b.1.a

NOR

64M

Symmetrical

Bottom|Top

24

8

8M

Synchronous

7

100/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

104

2.7

3|3.3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

表面贴装

0.73

6

5

8

SON

WSON EP

No Lead

Obsolete

8

Sectored

4Kbyte x 2048

256byte

W25Q16DVSNJG/TRAY
W25Q16DVSNJG/TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

16M

Symmetrical

24

8

2M

Synchronous

8

10/Chip

4/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3|3.3

3.6

2.7 to 3.6

30

25

-40

105

工业级

表面贴装

1.5(Max)

4(Max)

5(Max)

8

SOIC N

Compliant

EAR99

NOR

Obsolete

8

Sectored

4Kbyte x 512

256byte

W25Q32FVZEIG/REEL
W25Q32FVZEIG/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NOR

32M

Symmetrical

24

8

4M

Synchronous

7

50/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3|3.3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

表面贴装

0.73

8

6

8

SON

WSON EP

No Lead

Compliant

3A991.b.1.a

Obsolete

8

Sectored

4Kbyte x 1024

256byte

W25Q64FWBYIG/REEL
W25Q64FWBYIG/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NOR

64M

Symmetrical

Bottom|Top

24

8

8M

Synchronous

6

100/Chip

5/Page

Serial (SPI, Dual SPI, Quad SPI)

1.65

1.8

1.95

1.65 to 1.95

20

25

-40

85

Industrial

100000

表面贴装

0.31

16

WLCSP

Compliant

3A991.b.1.a

Tube

Obsolete

16

Sectored

4Kbyte x 2048

256byte

W25Q80DVZPIG/TUBE
W25Q80DVZPIG/TUBE
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

6/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

104

2.7

3|3.3

3.6

2.7 to 3.6

25

25

-40

85

Industrial

100000

Compliant

EAR99

NOR

8M

Symmetrical

24

8

1M

Synchronous

6

Tube

活跃

Sectored

4Kbyte x 256

256byte

W25Q16CLSNIG TRAY
W25Q16CLSNIG TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

EAR99

NOR

16M

Symmetrical

24

8

2M

Synchronous

9

10/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

80

2.3

3.3|3|2.5

3.6

2.3 to 3.6

18

25

Gull-wing

SOIC

SOP

8

5(Max)

4(Max)

1.5(Max)

表面贴装

100000

Industrial

85

-40

Compliant

Obsolete

8

Sectored

4Kbyte x 512

256byte