Samsung Semiconductor K9F8G08U0M-PCB0000

底架

表面贴装

引脚数

48

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

HTS

8542.32.00.71

Automotive

无

PPAP

无

Cell Type

SLC NAND

Chip Density (bit)

8G

Block Organization

Symmetrical

Address Bus Width (bit)

30

Number of Bits/Word (bit)

8

Number of Words

1G

Programmability

有

Timing Type

Asynchronous

Max. Access Time (ns)

25000

Maximum Erase Time (S)

0.002/Block

Maximum Page Access Time (ns)

25(Min)

Maximum Programming Time (ms)

0.7

Interface Type

Parallel

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Page Read Current (mA)

30

Program Current (mA)

30

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

125

Supplier Temperature Grade

Industrial

Command Compatible

无

ECC Support

有

Support of Page Mode

有

Mounting

表面贴装

Package Height

1

Package Width

18.4

Package Length

12

PCB changed

48

Standard Package Name

SOP

Supplier Package

TSOP-I

Lead Shape

Gull-wing

RoHS

Compliant

Memory Types

NAND

零件状态

Obsolete

最高工作温度

125 °C

最小工作温度

-40 °C

引脚数量

48

工作电源电压

3.3 V

界面

Parallel

最大电源电压

3.6 V

最小电源电压

2.7 V

访问时间

25 µs

建筑学

Sectored

地址总线宽度

30 b

密度

8 Gb

同步/异步

Asynchronous

字长

8 b

行业规模

256Kbyte x 4096

页面尺寸

4Kbyte

引导模块

无