类别是'category.片上系统(SoC)' (7720)

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品牌

数据表

库存

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Rohs

安装类型

包装/外壳

表面安装

越来越多的功能

触点形状

外壳材料

供应商器件包装

插入材料

终端数量

后壳材料,电镀

厂商

Voltage-Input

操作温度

包装

系列

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容差

零件状态

终止次数

终端

温度系数

连接器类型

类型

电阻

定位的数量

组成

颜色

应用

功率(瓦特)

HTS代码

电容量

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子类别

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额定电流

技术

端子位置

方向

终端形式

屏蔽/屏蔽

峰值回流焊温度(摄氏度)

入口保护

端子间距

Reach合规守则

频率

频率稳定性

外壳完成

外壳尺寸-插入

JESD-30代码

输出的数量

资历状况

房屋颜色

ESR(等效串联电阻)

失败率

引线间距

电源

温度等级

注意

电感,电感

界面

直流电阻(DCR)

振荡器类型

负载电容

速度

内存大小

反向泄漏电流@ Vr

操作模式

外壳尺寸,MIL

不同 If 时电压 - 正向 (Vf)

引线样式

电压 - 供电 (Vcc/Vdd)

输出电流

核心处理器

频率容差

周边设备

程序存储器类型

电源线保护

芯尺寸

程序内存大小

连接方式

电压 - 击穿

功率 - 最大

谐振@频率

电缆开口

功率 - 脉冲峰值

峰值脉冲电流(10/1000μs)

电压 - 输出

不同 Ipp 时电压 - 箝位(最大值)

建筑学

电压 - 反向断态(典型值)

频率开关

输入数量

座位高度-最大

使用的 IC/零件

提供的内容

单向通道

可编程逻辑类型

电压 - 齐纳(标准值)(Vz)

产品类别

包括

EEPROM 大小

电容@频率

显示类型

板型

主要目的

主要属性

输出和类型

调节器拓扑

逻辑单元数

核数量

视区

显示模式

背光

触摸屏

点像素

背景颜色

屏幕对角线尺寸

图形颜色

点尺寸

点距

闪光大小

控制器类型

特征

产品类别

座位高度(最大)

长度

宽度

厚度(最大)

触点表面处理厚度 - 配套

材料可燃性等级

评级结果

10AS032H2F35I1SG
10AS032H2F35I1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Axial

YES

Axial

1152

Vishay Dale

活跃

RNC55

Tape & Reel (TR)

384

Non-Compliant

35 X 35 MM, ROHS COMPLIANT, FBGA-1152

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

0.87 V

100 °C

有

10AS032H2F35I1SG

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.66

-65°C ~ 175°C

Tray

Military, MIL-PRF-55182/01, RNC55

0.094 Dia x 0.250 L (2.39mm x 6.35mm)

±1%

Discontinued at Digi-Key

2

±50ppm/°C

10 Ohms

Metal Film

0.125W, 1/8W

8542.39.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1152

R (0.01%)

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3.5 mm

现场可编程门阵列

FPGA - 320K Logic Elements

--

Military, Moisture Resistant, Weldable

-

35 mm

35 mm

10AS032E4F27E3LG
10AS032E4F27E3LG
ALTERA 数据表

625 In Stock

-

最小起订量: 1

最小包装量: 1

YES

672

活跃

Molex

INTEL CORP

0.93 V

5.45

活跃

090879

Bulk

240

Non-Compliant

BGA, BGA672,26X26,40

网格排列

PLASTIC/EPOXY

BGA672,26X26,40

0.9 V

未说明

0.87 V

100 °C

有

10AS032E4F27E3LG

BGA

SQUARE

Intel Corporation

0°C ~ 100°C (TJ)

Tray

*

活跃

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B672

240

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

240

3.25 mm

现场可编程门阵列

FPGA - 320K Logic Elements

320000

--

27 mm

27 mm

10AS048E3F29I2LG
10AS048E3F29I2LG
ALTERA 数据表

555 In Stock

-

最小起订量: 1

最小包装量: 1

0805 (2012 Metric)

YES

0805

780

480000 LE

1

SMD/SMT

60000 LAB

965034

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA780,28X28,40

Stackpole Electronics Inc

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS048E3F29I2LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.47

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

360

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

-55°C ~ 155°C

Tray

CSR

0.079 L x 0.049 W (2.00mm x 1.25mm)

±1%

活跃

2

±200ppm/°C

620 mOhms

厚膜

0.25W, 1/4W

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B780

360

不合格

-

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

360

3.35 mm

现场可编程门阵列

SoC FPGA

FPGA - 480K Logic Elements

480000

2 Core

--

电流感应

SoC FPGA

0.026 (0.65mm)

29 mm

29 mm

10AS032E2F27E2LG
10AS032E2F27E2LG
ALTERA 数据表

760 In Stock

-

最小起订量: 1

最小包装量: 1

通孔

Radial, Vertical Cylinder

YES

Radial

672

-

240

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

320000 LE

1

SMD/SMT

40000 LAB

964832

Intel

-

2 x 32 kB

中央技术

Details

Arria 10 SoC

Intel / Altera

BGA, BGA672,26X26,40

网格排列

PLASTIC/EPOXY

BGA672,26X26,40

0.9 V

未说明

0.87 V

100 °C

有

10AS032E2F27E2LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

-

-

活跃

1 kHz

Bulk

-25°C ~ 85°C

Tray

CTDR2F

0.866 Dia (22.00mm)

±10%

活跃

Drum Core, Wirewound

8542.39.00.01

SOC - Systems on a Chip

4 A

CMOS

BOTTOM

BALL

Unshielded

未说明

1 mm

compliant

S-PBGA-B672

240

不合格

0.9 V

OTHER

150 µH

98mOhm Max

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

-

MCU, FPGA

240

3.25 mm

现场可编程门阵列

SoC FPGA

FPGA - 320K Logic Elements

320000

2 Core

--

-

SoC FPGA

0.866 (22.00mm)

27 mm

27 mm

-

10AS057H3F34I2SG
10AS057H3F34I2SG
ALTERA 数据表

937 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

2-SMD, No Lead

YES

1152-FCBGA (35x35)

1152

24

SMD/SMT

71250 LAB

965307

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

微芯片技术

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS057H3F34I2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

Tape & Reel (TR)

活跃

492

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

570000 LE

-40°C ~ 85°C

Tray

VXM1

0.197 L x 0.126 W (5.00mm x 3.20mm)

活跃

兆赫晶体

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

25 MHz

±25ppm

S-PBGA-B1152

492

不合格

50 Ohms

0.9 V

INDUSTRIAL

16pF

1.5GHz

256KB

Fundamental

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

±10ppm

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

492

3.65 mm

现场可编程门阵列

SoC FPGA

FPGA - 570K Logic Elements

570000

2 Core

--

SoC FPGA

0.051 (1.30mm)

35 mm

35 mm

-

10AS057K2F35E2SG
10AS057K2F35E2SG
ALTERA 数据表

862 In Stock

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

24

SMD/SMT

71250 LAB

964919

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

Vishay Sfernice

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

未说明

0.87 V

100 °C

有

10AS057K2F35E2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

Bag

活跃

396

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

570000 LE

0°C ~ 100°C (TJ)

Tray

*

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

396

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

396

3.5 mm

现场可编程门阵列

SoC FPGA

FPGA - 570K Logic Elements

570000

2 Core

--

SoC FPGA

35 mm

35 mm

10AS032E2F29E1SG
10AS032E2F29E1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

0603 (1608 Metric)

YES

0603

780

Vishay Foil Resistors (Division of Vishay Precision Group)

Tray

活跃

360

Non-Compliant

29 X 29 MM, ROHS COMPLIANT, FBGA-780

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

0.9 V

未说明

0.87 V

100 °C

有

10AS032E2F29E1SG

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.66

-55°C ~ 150°C

Tray

VSMP

0.063 L x 0.032 W (1.60mm x 0.81mm)

±1%

Discontinued at Digi-Key

2

±0.2ppm/°C

4.02 kOhms

金属箔

0.1W, 1/10W

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B780

360

不合格

-

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

360

3.35 mm

现场可编程门阵列

FPGA - 320K Logic Elements

320000

--

Non-Inductive

0.025 (0.64mm)

29 mm

29 mm

10AS057K2F35I2LG
10AS057K2F35I2LG
ALTERA 数据表

760 In Stock

-

最小起订量: 1

最小包装量: 1

通孔

P600, Axial

YES

P600

1152

Vishay General Semiconductor - Diodes Division

Bulk

最后一次购买

396

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS057K2F35I2LG

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

0.93 V

5.45

-55°C ~ 175°C (TJ)

Tray

Automotive, AEC-Q101, TransZorb®

活跃

Zener

Automotive, Telecom

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

396

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

无

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

14.4V

5000W (5kW)

233A

21.5V

MCU, FPGA

13V

396

3.5 mm

1

现场可编程门阵列

-

FPGA - 570K Logic Elements

570000

--

35 mm

35 mm

10AS022E4F27E3LG
10AS022E4F27E3LG
ALTERA 数据表

680 In Stock

-

最小起订量: 1

最小包装量: 1

0603 (1608 Metric)

YES

0603

672

2 x 32 kB

1.2 GHz

220000 LE

1

SMD/SMT

27500 LAB

964908

Intel

Intel / Altera

Arria 10 SoC

2 x 32 kB

-

KOA Speer Electronics, Inc.

BGA, BGA672,26X26,40

网格排列

PLASTIC/EPOXY

BGA672,26X26,40

0.9 V

未说明

0.87 V

100 °C

有

10AS022E4F27E3LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

1.95

Tape & Reel (TR)

RN731J

Obsolete

240

Non-Compliant

有

This product may require additional documentation to export from the United States.

-55°C ~ 155°C

Tray

RN73

0.063 L x 0.031 W (1.60mm x 0.80mm)

±0.5%

活跃

2

±10ppm/°C

2.1 kOhms

Thin Film

0.063W, 1/16W

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B672

240

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

240

3.25 mm

现场可编程门阵列

SoC FPGA

FPGA - 220K Logic Elements

220000

2 Core

--

Moisture Resistant

SoC FPGA

0.022 (0.55mm)

27 mm

27 mm

10AS022C4U19I3LG
10AS022C4U19I3LG
ALTERA 数据表

974 In Stock

-

最小起订量: 1

最小包装量: 1

YES

484

活跃

Phoenix Contact

INTEL CORP

0.93 V

1.95

Bulk

Obsolete

192

Non-Compliant

FBGA, BGA484,22X22,32

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

BGA484,22X22,32

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS022C4U19I3LG

FBGA

SQUARE

Intel Corporation

-40°C ~ 100°C (TJ)

Tray

-

活跃

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

0.8 mm

compliant

S-PBGA-B484

192

不合格

0.9 V

INDUSTRIAL

Display Port, RS-232, USB

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

192

3.25 mm

现场可编程门阵列

-

FPGA - 220K Logic Elements

220000

-

-

无背光

Capacitive

800 x 480 (WVGA)

-

7 (177.80mm)

-

-

-

--

-

19 mm

19 mm

10AS048E2F29E2LG
10AS048E2F29E2LG
ALTERA 数据表

689 In Stock

-

最小起订量: 1

最小包装量: 1

面板安装

FBGA-780

YES

Flange

不锈钢

Thermoplastic

780

-

360

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

480000 LE

1

SMD/SMT

60000 LAB

964901

Intel

Intel / Altera

Corsair

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA780,28X28,40

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

0.9 V

未说明

0.87 V

100 °C

有

10AS048E2F29E2LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.47

-

Bag

Metal

D38999/20KH

活跃

Copper Alloy

Gold

-65°C ~ 200°C

Tray

Military, MIL-DTL-38999 Series III

活跃

Crimp

Receptacle, Male Pins

21

-

Aviation, Marine, Military

8542.39.00.01

Threaded

SOC - Systems on a Chip

13A

CMOS

BOTTOM

B

BALL

Shielded

未说明

IP67 - Dust Tight, Waterproof

1 mm

compliant

Passivated

23-21

S-PBGA-B780

360

不合格

0.9 V

OTHER

1.5GHz

256KB

H

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

-

MCU, FPGA

360

3.35 mm

现场可编程门阵列

SoC FPGA

FPGA - 480K Logic Elements

480000

2 Core

--

-

SoC FPGA

29 mm

29 mm

50.0µin (1.27µm)

-

10AS032E2F29E2LG
10AS032E2F29E2LG
ALTERA 数据表

759 In Stock

-

最小起订量: 1

最小包装量: 1

FBGA-780

YES

780

320000 LE

1

SMD/SMT

40000 LAB

964837

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA780,28X28,40

Panduit Corp

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

0.9 V

未说明

0.87 V

100 °C

有

10AS032E2F29E2LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

Bulk

Obsolete

360

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

0°C ~ 100°C (TJ)

Tray

-

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B780

360

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

360

3.35 mm

现场可编程门阵列

SoC FPGA

FPGA - 320K Logic Elements

320000

2 Core

--

SoC FPGA

29 mm

29 mm

10AS022E3F27I2SG
10AS022E3F27I2SG
ALTERA 数据表

634 In Stock

-

最小起订量: 1

最小包装量: 1

面板安装

FBGA-672

YES

Flange

Circular

铝合金

-

672

1.2 GHz

220000 LE

1

SMD/SMT

27500 LAB

964738

Intel

Intel / Altera

Arria 10 SoC

2 x 32 kB

Conesys

-

BGA, BGA672,26X26,40

网格排列

PLASTIC/EPOXY

BGA672,26X26,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS022E3F27I2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.46

Box

D38999/20FJ

20 (2), 10 Power (9)

活跃

240

Non-Compliant

有

This product may require additional documentation to export from the United States.

2 x 32 kB

-65°C ~ 200°C

Tray

Military, MIL-DTL-38999 Series III, Tri-Start™ TV

活跃

插座外壳

用于内螺纹插座

11 (2 + 9 Power)

8542.39.00.01

Threaded

SOC - Systems on a Chip

Crimp

CMOS

BOTTOM

E

BALL

Shielded

未说明

抗环境干扰

1 mm

compliant

化学镍

25-11

S-PBGA-B672

240

不合格

Silver

0.9 V

INDUSTRIAL

不包括触点

1.5GHz

256KB

J

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

240

3.25 mm

现场可编程门阵列

SoC FPGA

-

FPGA - 220K Logic Elements

220000

2 Core

--

-

SoC FPGA

27 mm

27 mm

-

10AS032E2F27I2SG
10AS032E2F27I2SG
ALTERA 数据表

691 In Stock

-

最小起订量: 1

最小包装量: 1

FBGA-672

YES

672

1.2 GHz

320000 LE

1

SMD/SMT

40000 LAB

964963

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA672,26X26,40

Vishay Sfernice

网格排列

PLASTIC/EPOXY

BGA672,26X26,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS032E2F27I2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

Tape & Reel (TR)

最后一次购买

240

有

This product may require additional documentation to export from the United States.

2 x 32 kB

-40°C ~ 100°C (TJ)

Tray

*

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B672

240

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

240

3.25 mm

现场可编程门阵列

SoC FPGA

FPGA - 320K Logic Elements

320000

2 Core

--

SoC FPGA

27 mm

27 mm

10AS022E3F29E2LG
10AS022E3F29E2LG
ALTERA 数据表

768 In Stock

-

最小起订量: 1

最小包装量: 1

0603 (1608 Metric)

YES

0603

780

2 x 32 kB

1.2 GHz

220000 LE

1

SMD/SMT

27500 LAB

964739

Intel

Intel / Altera

Arria 10 SoC

2 x 32 kB

-

KOA Speer Electronics, Inc.

BGA, BGA780,28X28,40

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

0.9 V

未说明

0.87 V

100 °C

有

10AS022E3F29E2LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.46

Tape & Reel (TR)

RN731J

Obsolete

288

Non-Compliant

有

This product may require additional documentation to export from the United States.

-55°C ~ 155°C

Tray

RN73

0.063 L x 0.031 W (1.60mm x 0.80mm)

±0.5%

活跃

2

±10ppm/°C

517 Ohms

Thin Film

0.063W, 1/16W

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B780

288

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

288

3.35 mm

现场可编程门阵列

SoC FPGA

FPGA - 220K Logic Elements

220000

2 Core

--

Moisture Resistant

SoC FPGA

0.022 (0.55mm)

29 mm

29 mm

10AS057K3F35E2SG
10AS057K3F35E2SG
ALTERA 数据表

943 In Stock

-

最小起订量: 1

最小包装量: 1

面板安装

1152-BBGA, FCBGA

YES

Bulkhead - Front Side Nut

Composite

1152-FCBGA (35x35)

Thermoplastic

1152

-

TE Connectivity Deutsch 连接器

INTEL CORP

0.93 V

5.45

-

Bulk

Composite

ACT94

Discontinued at Digi-Key

Copper Alloy

Gold

396

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

未说明

0.87 V

100 °C

有

10AS057K3F35E2SG

BGA

SQUARE

Intel Corporation

活跃

-65°C ~ 175°C

Tray

MIL-DTL-38999 Series III, ACT

活跃

Crimp

Receptacle, Female Sockets

32

橄榄色

Aerospace, Military

8542.39.00.01

Threaded

现场可编程门阵列

7.5A

CMOS

BOTTOM

A

BALL

Shielded

未说明

抗环境干扰

1 mm

compliant

橄榄色镉

19-32

S-PBGA-B1152

396

不合格

0.9 V

OTHER

1.5GHz

256KB

F

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

-

MCU, FPGA

396

3.5 mm

现场可编程门阵列

FPGA - 570K Logic Elements

570000

--

-

35 mm

35 mm

-

-

10AS066K4F40E3LG
10AS066K4F40E3LG
ALTERA 数据表

939 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

YES

1517-FBGA (40x40)

1517

21

SMD/SMT

82500 LAB

978967

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

Analog Devices Inc./Maxim Integrated

BGA,

网格排列

PLASTIC/EPOXY

0.9 V

0.87 V

100 °C

有

10AS066K4F40E3LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.46

Bulk

MAX150

Obsolete

696

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

4.5V ~ 40V

660000 LE

0°C ~ 100°C (TJ)

Tray

-

活跃

8542.39.00.01

SOC - Systems on a Chip

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1517

OTHER

1.5GHz

256KB

1A, 50mA

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

3.3V, 5V

MCU, FPGA

500kHz

3.5 mm

MAX15015A

Board(s)

现场可编程门阵列

SoC FPGA

Fully Populated

DC/DC, Step Down with LDO

FPGA - 660K Logic Elements

2, Non-Isolated

巴克

2 Core

--

SoC FPGA

40 mm

40 mm

10AS048K3F35E2LG
10AS048K3F35E2LG
ALTERA 数据表

976 In Stock

-

最小起订量: 1

最小包装量: 1

面板安装

FBGA-1152

YES

Bulkhead - Front Side Nut

Aluminum

Thermoplastic

1152

-

396

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

480000 LE

1

SMD/SMT

60000 LAB

965009

Intel

Intel / Altera

Corsair

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

未说明

0.87 V

100 °C

有

10AS048K3F35E2LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.47

-

Bag

Metal

D38999/24ZD

活跃

Copper Alloy

Gold

-65°C ~ 200°C

Tray

Military, MIL-DTL-38999 Series III

活跃

Crimp

Receptacle, Female Sockets

19

Black

Aviation, Marine, Military

8542.39.00.01

Threaded

SOC - Systems on a Chip

7.5A

CMOS

BOTTOM

C

BALL

Shielded

未说明

IP67 - Dust Tight, Waterproof

1 mm

compliant

黑锌镍

15-19

S-PBGA-B1152

396

不合格

0.9 V

OTHER

1.5GHz

256KB

D

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

-

MCU, FPGA

396

3.5 mm

现场可编程门阵列

SoC FPGA

FPGA - 480K Logic Elements

480000

2 Core

--

-

SoC FPGA

35 mm

35 mm

50.0µin (1.27µm)

-

10AS066K2F35I2LG
10AS066K2F35I2LG
ALTERA 数据表

764 In Stock

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

1152

Diodes Incorporated

Tape & Reel (TR)

Obsolete

396

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS066K2F35I2LG

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

0.93 V

5.46

-40°C ~ 100°C (TJ)

Tray

-

活跃

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

396

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

396

3.5 mm

现场可编程门阵列

FPGA - 660K Logic Elements

660000

--

35 mm

35 mm

10AS027E4F27E3LG
10AS027E4F27E3LG
ALTERA 数据表

554 In Stock

-

最小起订量: 1

最小包装量: 1

FBGA-672

YES

672

270000 LE

1

SMD/SMT

33750 LAB

965282

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

1.92

Intel

0.93 V

INTEL CORP

活跃

SQUARE

BGA

10AS027E4F27E3LG

有

100 °C

0.87 V

未说明

0.9 V

BGA672,26X26,40

PLASTIC/EPOXY

网格排列

BGA, BGA672,26X26,40

Tray

Obsolete

240

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

0°C ~ 100°C (TJ)

Tray

-

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B672

240

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

240

3.25 mm

现场可编程门阵列

SoC FPGA

FPGA - 270K Logic Elements

270000

2 Core

--

SoC FPGA

27 mm

27 mm

10AS057K2F35I2SG
10AS057K2F35I2SG
ALTERA 数据表

583 In Stock

-

最小起订量: 1

最小包装量: 1

通孔

Radial, Disc

YES

1152-FCBGA (35x35)

1152

KYOCERA AVX

PLASTIC/EPOXY

Tape & Reel (TR)

Obsolete

100V

396

BGA, BGA1152,34X34,40

网格排列

5.45

0.93 V

INTEL CORP

活跃

Intel Corporation

SQUARE

BGA

10AS057K2F35I2SG

有

100 °C

0.87 V

未说明

0.9 V

-40 °C

BGA1152,34X34,40

-30°C ~ 85°C

Tray

-

0.197 Dia (5.00mm)

±5%

活跃

C0G, NP0

通用型

8542.39.00.01

22 pF

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

396

不合格

-

0.197 (5.00mm)

0.9 V

INDUSTRIAL

1.5GHz

256KB

Straight

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

396

3.5 mm

现场可编程门阵列

FPGA - 570K Logic Elements

570000

--

-

0.157 (4.00mm)

35 mm

35 mm

-

-

10AS048E1F29E1SG
10AS048E1F29E1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

DO-213AB, MELF (Glass)

YES

DO-213AB (MELF, LL41)

780

微芯片技术

5.68

Bulk

1N3027

22 Ohms

活跃

360

网格排列

29 X 29 MM, ROHS COMPLIANT, FBGA-780

PLASTIC/EPOXY

BGA780,28X28,40

0.9 V

未说明

0.87 V

100 °C

有

10AS048E1F29E1SG

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

-55°C ~ 175°C

Tray

Military, MIL-PRF-19500/115

±2%

Discontinued at Digi-Key

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B780

360

不合格

0.9 V

OTHER

1.5GHz

256KB

10 µA @ 15.2 V

1.2 V @ 200 mA

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1 W

MCU, FPGA

360

3.35 mm

现场可编程门阵列

20 V

FPGA - 480K Logic Elements

480000

--

29 mm

29 mm

10AS048E2F29E2SG
10AS048E2F29E2SG
ALTERA 数据表

680 In Stock

-

最小起订量: 1

最小包装量: 1

YES

780

Corsair

100 °C

有

Bag

MS27497E12B

活跃

360

10AS048E2F29E2SG

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

0.93 V

5.47

BGA, BGA780,28X28,40

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

0.9 V

未说明

0.87 V

0°C ~ 100°C (TJ)

Tray

*

活跃

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B780

360

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

360

3.35 mm

现场可编程门阵列

FPGA - 480K Logic Elements

480000

--

29 mm

29 mm

10AS066K4F35E3SG
10AS066K4F35E3SG
ALTERA 数据表

827 In Stock

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

1152

1.2 GHz

660000 LE

24

SMD/SMT

82500 LAB

973546

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

Molex

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

未说明

0.87 V

100 °C

有

10AS066K4F35E3SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.46

Bulk

121065

活跃

396

有

This product may require additional documentation to export from the United States.

2 x 32 kB

0°C ~ 100°C (TJ)

Tray

*

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

396

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

396

3.5 mm

现场可编程门阵列

SoC FPGA

FPGA - 660K Logic Elements

660000

2 Core

--

SoC FPGA

35 mm

35 mm

10AS032H1F35E1SG
10AS032H1F35E1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

100-LQFP

YES

100-LQFP (14x20)

1152

Renesas Electronics America Inc

82

Tray

R5F100

A/D 20x8/10b

活跃

Non-Compliant

35 X 35 MM, ROHS COMPLIANT, FBGA-1152

网格排列

PLASTIC/EPOXY

0.9 V

0.87 V

100 °C

有

10AS032H1F35E1SG

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.66

-40°C ~ 85°C (TA)

Tray

RL78/G13

Discontinued at Digi-Key

8542.39.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1152

OTHER

Internal

32MHz

20K x 8

1.6V ~ 5.5V

RL78

DMA, LVD, POR, PWM, WDT

FLASH

16-Bit

256KB (256K x 8)

CSI, I²C, LINbus, UART/USART

MCU, FPGA

3.5 mm

现场可编程门阵列

8K x 8

FPGA - 320K Logic Elements

--

35 mm

35 mm