类别是'category.片上系统(SoC)' (7720)

  • 所有品牌

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

生命周期状态

安装类型

包装/外壳

表面安装

供应商器件包装

材料

形状

终端数量

厂商

Voltage Rating AC

操作温度

包装

系列

JESD-609代码

零件状态

类型

定位的数量

端子表面处理

组成

附加功能

HTS代码

子类别

技术

电压 - 供电

端子位置

终端形式

屏蔽/屏蔽

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

额定电流

时间@峰值回流温度-最大值(s)

引脚数量

触点表面处理

终端样式

JESD-30代码

输出的数量

资历状况

接头数量

执行器类型

输出类型

工作电源电压

面板开孔尺寸

电源

温度等级

镀层

附着方法

速度

内存大小

uPs/uCs/外围ICs类型

核心处理器

周边设备

程序内存大小

连接方式

输入类型

电压 - 输出

家人

甲板数量

建筑学

输入数量

操作力

座位高度-最大

可编程逻辑类型

大小

产品类别

触点定时

筛选水平

索引停止

每层电路

面板后深度

速度等级

收发器数量

每个甲板的杆数

投掷角度

转换自(适配器端)

转换(适配器端)

主要属性

逻辑单元数

核数量

闪光大小

恒定电流负载 - 最大

连接类型

特征

产品类别

温度

电源类型

直径

高度

长度

宽度

电镀厚度

执行器长度

XCZU11EG-1FFVF1517I
XCZU11EG-1FFVF1517I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

139394

Schneider

0.8500 V

464

Tray

XCZU11

活跃

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

Inverted Flare

XAZU2EG-1SFVA625I
XAZU2EG-1SFVA625I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

XAZU2

活跃

31004

Greenlee

128

Tray

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 1.2GHz

1.2MB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, I²C, SPI, UART/USART, USB

MPU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

XAZU3EG-1SFVA625I
XAZU3EG-1SFVA625I
AMD 数据表

769 In Stock

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

0.808 V

0.892 V

128

Tray

XAZU3

活跃

E57LBL30A2SP

10 mm

Cutler Hammer, Div of Eaton Co

0.8500 V

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EG

Shielded

625

NC

500MHz, 1.2GHz

1.8MB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, I²C, SPI, UART/USART, USB

MPU, FPGA

1

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

3 Pin Micro Pigtail

AC

30 mm

XCZU11EG-3FFVB1517E
XCZU11EG-3FFVB1517E
AMD 数据表

642 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

TCHI-24

CE, cURus

ILME

488

Tray

XCZU11

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

Non-Metallic

None (Housing Only)

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

104mm x 27mm

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

-40-90 °C

XCZU4EV-1SFVC784I
XCZU4EV-1SFVC784I
AMD 数据表

987 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

XCZU4

活跃

31008805000

Pfannenberg

0.892 V

0.808 V

0.8500 V

252

Tray

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EV

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

XCZU17EG-2FFVE1924I
XCZU17EG-2FFVE1924I
AMD 数据表

890 In Stock

-

最小起订量: 1

最小包装量: 1

1924-BBGA, FCBGA

1924-FCBGA (45x45)

AMD

XCZU17

活跃

313902

PILZ

0.85 V

0.808 V

0.892 V

668

Tray

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EG

1924

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 926K+ Logic Cells

-

XCZU5CG-2FBVB900E
XCZU5CG-2FBVB900E
AMD 数据表

845 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

PDG53K0800E2NM

CE, CSA, UL

Cutler Hammer, Div of Eaton Corp

Panel

204

Tray

XCZU5

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

800 A

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

M2S025-VF400
M2S025-VF400
Microchip 数据表

2007 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

85 °C

无

M2S025-VF400

LFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.87

1.2000 V

1.14 V

1.26 V

207

Tray

M2S025

活跃

-

166 MHz

27696 LE

-

64 kB

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

0 to 85 °C

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

现场可编程门阵列

STD

FPGA - 25K Logic Modules

23988

1 Core

256KB

17 mm

17 mm

XCZU5EG-2SFVC784E
XCZU5EG-2SFVC784E
AMD 数据表

799 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

XCZU5

活跃

252

Tray

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

XCZU17EG-3FFVB1517E
XCZU17EG-3FFVB1517E
AMD 数据表

591 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

XCZU17

活跃

644

Tray

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 926K+ Logic Cells

-

M2S090T-FG676I
M2S090T-FG676I
Microchip 数据表

2012 In Stock

-

最小起订量: 1

最小包装量: 1

676-BGA

YES

676-FBGA (27x27)

676

微芯片技术

活跃

Microsemi Corporation

SQUARE

BGA

M2S090T-FG676I

无

425

Tray

M2S090

活跃

-

166 MHz

86316 LE

SMD/SMT

-

64 kB

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

30

1.14 V

5.83

1.26 V

MICROSEMI CORP

-40°C ~ 100°C (TJ)

1500

e0

活跃

面板安装

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

120VAC

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B676

425

不合格

Terminals

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Terminals

120VAC, 140VAC

MCU, FPGA

425

2.44 mm

现场可编程门阵列

8.810 L x 7.250 W x 13.000 H (223.77mm x 184.15mm x 330.20mm)

FPGA - 90K Logic Modules

86316

1 Core

512KB

15A (2.1kVA)

27 mm

27 mm

XCZU49DR-1FFVF1760E
XCZU49DR-1FFVF1760E
AMD 数据表

912 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

622

Tray

活跃

0°C ~ 100°C (TJ)

*

活跃

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

M2S060TS-FCSG325I
M2S060TS-FCSG325I
Microchip 数据表

2688 In Stock

-

最小起订量: 1

最小包装量: 1

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)

Rectangle

325

微芯片技术

1.26 V

5.81

200

Tray

M2S060

活跃

-

166 MHz

56520 LE

-

64 kB

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

有

M2S060TS-FCSG325I

TFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

--

--

e1

活跃

泡沫外覆织物

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

200

不合格

1.2 V

--

Adhesive

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

0.079 (2.00mm)

18.000 (457.20mm)

0.161 (4.10mm)

--

XCZU43DR-1FSVG1517I
XCZU43DR-1FSVG1517I
AMD 数据表

839 In Stock

-

最小起订量: 1

最小包装量: 1

面板安装

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

561

Tray

活跃

28V

115V

银合金

-40°C ~ 100°C (TJ)

44

活跃

2

5A (AC), 1A (DC)

--

焊片

Flatted (6.35mm Dia)

--

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1

MCU, FPGA

5.761 ~ 83gfm

Non-Shorting (BBM)

固定式

单刀双掷

26.04mm

1

45°

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

轴和面板密封

11.10mm

MPFS250T-1FCVG484EES
MPFS250T-1FCVG484EES
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

面板安装

484-BFBGA, FCBGA

484-FCBGA (19x19)

微芯片技术

MCU - 136, FPGA - 372

Tray

活跃

28V

115V

银合金

0°C ~ 100°C

44

活跃

10

1A (AC/DC)

--

焊片

Flatted (6.35mm Dia)

--

-

2.2MB

RISC-V

DMA, PCI, PWM

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

1

MPU, FPGA

5.761 ~ 83gfm

Shorting (MBB)

固定式

SP10T

26.04mm

1

30°

FPGA - 254K Logic Modules

128kB

轴和面板密封

11.10mm

M2S050TS-VFG400
M2S050TS-VFG400
Microchip 数据表

2188 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

面板安装

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

MICROSEMI CORP

1.26 V

5.82

-

166 MHz

56340 LE

-

64 kB

28V

银合金

Non-Compliant

207

Tray

M2S050

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

1.14 V

85 °C

有

M2S050TS-VFG400

LFBGA

SQUARE

Microsemi Corporation

115V

活跃

0°C ~ 85°C (TJ)

44

e1

活跃

5

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

5A (AC), 1A (DC)

40

--

焊片

S-PBGA-B400

207

不合格

Flatted (6.35mm Dia)

--

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

4

MCU, FPGA

207

5.761 ~ 83gfm

1.51 mm

现场可编程门阵列

Shorting (MBB)

固定式

SP5T

52.40mm

1

45°

FPGA - 50K Logic Modules

56340

1 Core

256KB

--

17 mm

17 mm

11.10mm

MSCMMX6XYCM08AA
MSCMMX6XYCM08AA
NXP 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Industrial grade

BGA

Microprocessor

无

有

表面贴装

,

MSCMMX6XYCM08AA

恩智浦半导体

Obsolete

NXP SEMICONDUCTORS

5.77

8542.31.00.01

unknown

265

MICROPROCESSOR, RISC

MSCMMX6XYCM08

Industrial

XCZU4CG-1SFVC784E
XCZU4CG-1SFVC784E
AMD 数据表

971 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

XCZU4

活跃

252

Tray

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

XCZU2CG-2SFVA625E
XCZU2CG-2SFVA625E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Panel Mount, Bulkhead

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

180

Tray

XCZU2

活跃

0°C ~ 100°C (TJ)

USBF电视

活跃

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

USB - A, Receptacle

USB - A, Receptacle

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

XCZU9CG-L1FFVC900I
XCZU9CG-L1FFVC900I
AMD 数据表

839 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

XCZU9

活跃

204

Bulk

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

AGFA022R31C2E3VAA
AGFA022R31C2E3VAA
Intel 数据表

782 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Intel

720

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

10AS032H2F35E2SG
10AS032H2F35E2SG
ALTERA 数据表

536 In Stock

-

最小起订量: 1

最小包装量: 1

FBGA-1152

YES

1152

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

未说明

0.87 V

100 °C

有

10AS032H2F35E2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

384

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

320000 LE

1

SMD/SMT

40000 LAB

964856

Intel

Intel / Altera

Arria 10 SoC

Details

0°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

384

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

384

3.5 mm

现场可编程门阵列

SoC FPGA

FPGA - 320K Logic Elements

320000

2 Core

--

SoC FPGA

35 mm

35 mm

10AS057N2F40I2SG
10AS057N2F40I2SG
ALTERA 数据表

640 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

YES

1517-FCBGA (40x40)

1517

2 x 32 kB

-

BGA, BGA1517,39X39,40

网格排列

PLASTIC/EPOXY

BGA1517,39X39,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS057N2F40I2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

588

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

570000 LE

21

SMD/SMT

71250 LAB

965096

Intel

Intel / Altera

Arria 10 SoC

Details

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1517

588

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

588

3.5 mm

现场可编程门阵列

SoC FPGA

FPGA - 570K Logic Elements

570000

2 Core

--

SoC FPGA

40 mm

40 mm

10AS022E3F29I2SG
10AS022E3F29I2SG
ALTERA 数据表

1000 In Stock

-

最小起订量: 1

最小包装量: 1

FBGA-780

YES

780

2 x 32 kB

-

BGA, BGA780,28X28,40

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS022E3F29I2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.46

288

Non-Compliant

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

220000 LE

1

SMD/SMT

27500 LAB

964921

Intel

Intel / Altera

Arria 10 SoC

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B780

288

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

288

3.35 mm

现场可编程门阵列

SoC FPGA

FPGA - 220K Logic Elements

220000

2 Core

--

SoC FPGA

29 mm

29 mm

10AS032H1F35E1HG
10AS032H1F35E1HG
ALTERA 数据表

634 In Stock

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

1152-FBGA (35x35)

384

有

2 x 32 kB

1.2 GHz

320000 LE

+ 100 C

0 C

24

SMD/SMT

40000 LAB

965293

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

有

10AS032H1F35E1HG

活跃

INTEL CORP

5.66

0°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

SOC - Systems on a Chip

unknown

950 mV

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

SoC FPGA

24 Transceiver

FPGA - 320K Logic Elements

2 Core

--

SoC FPGA