category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.微处理器' (10000)

所有品牌

产品型号	品牌	数据表	库存	价格(含增值税)	数量	Contact plating	安装类型	包装/外壳	表面安装	Number of pins	供应商器件包装	房屋材料	终端数量	捆绑中心至安装中心		Conductor Diameter (Cross Section)		Connector pinout layout	Contacts pitch	Date Of Intro	Electrical mounting	Gross weight	Gross Weight		Kind of connector													Row pitch	Spatial orientation				Transport packaging size/quantity	Type of connector	Wire Insulation Color	Operating temperature	操作温度	包装	系列	JESD-609代码	无铅代码	零件状态	ECCN 代码	连接器类型	类型	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	深度	Reach合规守则	Current rating	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	资历状况	接头数量	电源	温度等级	速度	uPs/uCs/外围ICs类型	核心处理器	电源电流-最大值	位元大小	有ADC	DMA 通道	脉宽调制通道	数模转换器通道	座位高度-最大	地址总线宽度	线圈型	处理器系列	边界扫描	低功率模式	筛选水平	外部数据总线宽度	电压 - I/O	图形加速	内存控制器	USB	附加接口	定时器数量	协处理器/DSP	只读存储器可编程性	片上数据 RAM 宽度	保安功能	显示和界面控制器	DMA通道数	个人资料	饱和电流	高度	长度	宽度
XPC750PRX300LE	Freescale Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	360		Transferred		FREESCALE SEMICONDUCTOR INC							BGA		BGA,	100 MHz	CERAMIC, METAL-SEALED COFIRED	BGA	SQUARE	网格排列	2 V	1.8 V	1.9 V																			3A991.A.2				ALSO REQUIRES 3.3V SUPPLY	8542.31.00.01	BOTTOM	BALL		1.27 mm		unknown			360	S-CBGA-B360	不合格				300 MHz	MICROPROCESSOR, RISC			32					3.2 mm				NO	YES			固定点	NO														25 mm	25 mm
PC8640MGH1067NE	Teledyne e2v	数据表	N/A	-	最小起订量: 1 最小包装量: 1		TELEDYNE E2V (UK) LTD							166.66 MHz		125 °C	-40 °C	1.1 V	1 V	1.05 V												Obsolete												3A991.A.2				8542.31.00.01						unknown									1067 MHz	MICROPROCESSOR, RISC			32						32			YES			64	浮点
GG8067402570603	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1667		2017-04-20				BGA,		PLASTIC/EPOXY	BGA	SQUARE	网格排列								活跃				INTEL CORP													5A992.C				8542.31.00.01	BOTTOM	BALL				compliant				S-PBGA-B1667					2100 MHz	MICROPROCESSOR												NO	NO			固定点	YES
TMS9980AJDL	Texas Instruments	数据表	N/A	-	最小起订量: 1 最小包装量: 1	gold-plated	NO	66	40	Obsolete	2x33	2.54mm		THT	3.57 g		TEXAS INSTRUMENTS INC	female	DIP, DIP40,.6	70 °C	CERAMIC	DIP	DIP40,.6	RECTANGULAR	IN-LINE	socket					2.54mm	straight		无			pin strips			-40...163°C											8542.31.00.01	DUAL	THROUGH-HOLE	未说明	2.54 mm		not_compliant	1.5A	未说明		R-XDIP-T40	不合格			COMMERCIAL		MICROPROCESSOR, RISC			16																				60V						beryllium copper				0.75µm	UL94V-0
R7S910025CBG	Renesas Electronics Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	gold-plated	YES	22			320	0	socket		活跃	2x11	2.54mm		SMT	1.05 g		RENESAS ELECTRONICS CORP	female	FBGA,	25 MHz	209	125 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA320,20X20,32	SQUARE	GRID ARRAY, FINE PITCH	1.26 V	1.14 V	2.54mm	straight	1.2 V				pin strips			-40...163°C											8542.31.00.01	BOTTOM	BALL		0.8 mm		compliant	1.5A			S-PBGA-B320				AUTOMOTIVE	450 MHz	MICROCONTROLLER, RISC		651 mA	32	YES	YES	YES	NO	1.75 mm		1048576	CORTEX-R4	YES	YES		32	浮点	YES				60V	33	ROM LESS	20	8		32	beryllium copper			17 mm	17 mm	0.254µm	UL94V-0
MC68HC000P10	Freescale Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	64	无		Obsolete							MOTOROLA SEMICONDUCTOR PRODUCTS		DIP, DIP64,.9	70 °C	PLASTIC/EPOXY	DIP	DIP64,.9	RECTANGULAR	IN-LINE	5 V																		e0					Tin/Lead (Sn/Pb)			DUAL	THROUGH-HOLE		2.54 mm		unknown				R-PDIP-T64	不合格		5 V	COMMERCIAL	10 MHz	MICROPROCESSOR, RISC		30 mA	32
MPC750ARX266TH	Freescale Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES		nylon PA66 (UL94V0), black	255		无	0.12mm2 (26AWG), insulation - PVC 0.4mm	Obsolete						4.48	FREESCALE SEMICONDUCTOR INC		BGA	CERAMIC, BGA-255	266 MHz	105 °C	-40 °C	CERAMIC, METAL-SEALED COFIRED	BGA	BGA360,19X19,50	SQUARE	网格排列	2.6 V							483222.5/3000		red; black	4*300mm		0…+80 °C		e0			3A991	BLS-4 with 2.54mm pitch	Interconnect Power Cable Connector (F - F) 2 x BLS	锡铅	ALSO REQUIRES 3.3V I/O SUPPLY	8542.31.00.01	BOTTOM	BALL		1.27 mm	connector housing - 14mm	not_compliant			255	S-CBGA-B255	不合格	4		INDUSTRIAL	266 MHz	MICROPROCESSOR, RISC			32						32			NO	YES		64	浮点	YES												1	connector housing - 2.6mm		connector housing - 10.16mm
TDA2HVBRQABCRQ1	Texas Instruments	数据表	N/A	-	最小起订量: 1 最小包装量: 1	gold-plated	YES	6	760		有		活跃	2x3	2.54mm		THT	0.36 g		TEXAS INSTRUMENTS INC	female	FBGA,	125 °C	-40 °C	PLASTIC/EPOXY	FBGA	SQUARE	GRID ARRAY, FINE PITCH	1.2 V	1.11 V	1.15 V	socket		2.54mm	straight					pin strips			-40...163°C			e1	有		5A992.C			锡银铜		8542.31.00.01	BOTTOM	BALL	250	0.8 mm		compliant	1.5A	30		S-PBGA-B760				AUTOMOTIVE		SoC								2.96 mm						AEC-Q100							60V							beryllium copper	3		23 mm	23 mm	0.75µm	UL94V-0
AMD-K6-2/400ACK	AMD	数据表	606 In Stock	-	最小起订量: 1 最小包装量: 1	gold-plated	NO	49			321		2 V		1.9 V	1x49	2.54mm		THT	4.66 g		2.1 V	female	网格排列	SQUARE	SPGA321,37X37	PGA	CERAMIC, METAL-SEALED COFIRED	80 °C	100 MHz	PGA, SPGA321,37X37	PGA	ADVANCED MICRO DEVICES INC	Obsolete	无		straight	socket				pin strips			-40...163°C			e0			3A991.A.2			锡铅	ALSO REQUIRES 3.135V TO 3.6V FOR I/O	8542.31.00.01	PERPENDICULAR	PIN/PEG		2.54 mm		unknown	1.5A		321	S-CPGA-P321	不合格			商业扩展	400 MHz	MICROPROCESSOR, RISC			32					3.63 mm	32			YES	YES		64	浮点	YES				60V							beryllium copper			49.53 mm	49.53 mm	0.75µm	UL94V-0
TDA2SXBTQABCQ1	Texas Instruments	数据表	N/A	-	最小起订量: 1 最小包装量: 1	gold-plated	YES	31		760		有		Obsolete	1x31	2.54mm		THT	2.95 g		TEXAS INSTRUMENTS INC	female	FCBGA-760	38.4 MHz	125 °C	-40 °C	PLASTIC/EPOXY	HBGA	SQUARE	GRID ARRAY, HEAT SINK/SLUG	1.2 V	1.11 V	1.15 V	socket		straight					pin strips			-40...163°C			e1	无		3A991.A.2			锡银铜		8542.31.00.01	BOTTOM	BALL	250	0.8 mm		unknown	1.5A	30		S-PBGA-B760				AUTOMOTIVE	1176 MHz	MICROPROCESSOR, RISC			32					2.96 mm	16			YES	YES	AEC-Q100	32	浮点	NO				60V							beryllium copper	3		23 mm	23 mm	0.75µm	UL94V-0
IBM25PPC403GA-JC33C1	IBM	数据表	N/A	-	最小起订量: 1 最小包装量: 1
SB80486SX-25	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1
XPC745BPX350LD	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	255		NXP SEMICONDUCTORS							BGA,		PLASTIC/EPOXY	BGA	RECTANGULAR	网格排列	2.1 V	1.9 V	2 V										活跃																8542.31.00.01	BOTTOM	BALL				unknown				R-PBGA-B255					350 MHz	MICROPROCESSOR, RISC												YES	NO			固定点	NO
UPD70208L-8	NEC Electronics Group	数据表	N/A	-	最小起订量: 1 最小包装量: 1
HW8076503693501	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2018-07-27												活跃		INTEL CORP																		5A992.C					8542.31.00.01					compliant										MICROPROCESSOR
LR33310MC-40	Avago Technologies	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	160	无		Obsolete							AVAGO TECHNOLOGIES INC		QFP, QFP160,1.2SQ	70 °C	METAL	QFP	QFP160,1.2SQ	SQUARE	FLATPACK	5 V																		e0					Tin/Lead (Sn/Pb)		8542.31.00.01	QUAD	鸥翼		0.635 mm		compliant				S-MQFP-G160	不合格			COMMERCIAL	40 MHz	MICROPROCESSOR, RISC		620 mA	32
CN6880-1200BG1936-AAP-Y22-G	Cavium Networks	数据表	N/A	-	最小起订量: 1 最小包装量: 1
XPC862DTZP80	Motorola Mobility LLC	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES		357		Obsolete		MOTOROLA INC							BGA		BGA, BGA357,19X19,50	80 MHz	PLASTIC/EPOXY	BGA	BGA357,19X19,50	SQUARE	网格排列	3.465 V	3.135 V	3.3 V																		3A991.A.2					8542.31.00.01	BOTTOM	BALL		1.27 mm		unknown			357	S-PBGA-B357	不合格				80 MHz	MICROPROCESSOR, RISC			32					2.05 mm	32			YES	YES		32	固定点	YES														25 mm	25 mm
ST40RA200XH6	STMicroelectronics	数据表	N/A	-	最小起订量: 1 最小包装量: 1		YES				372		无		不推荐							STMICROELECTRONICS		BGA	27 X 27 MM, 2.33 MM HEIGHT, PLASTIC, BGA-372	27 MHz	85 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA372,20X20,50	SQUARE	网格排列	1.95 V	1.8 V			1.87 V										e0	无		3A991.A.2			锡铅	ALSO REQUIRES 3.3V SUPPLY	8542.31.00.01	BOTTOM	BALL		1.27 mm		not_compliant			372	S-PBGA-B372	不合格			INDUSTRIAL	200 MHz	MICROPROCESSOR, RISC			32					2.6 mm	32			YES	YES		32	浮点	YES														27 mm	27 mm
XPC823ZT50Z3	Freescale Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	256							BGA,		70 °C	PLASTIC/EPOXY	BGA	SQUARE	网格排列										Transferred		FREESCALE SEMICONDUCTOR INC																8542.31.00.01	BOTTOM	BALL				unknown				S-PBGA-B256				COMMERCIAL	50 MHz	MICROPROCESSOR			32									YES	YES			固定点	YES
XPC755BRX300LE	Freescale Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES		360		Obsolete		FREESCALE SEMICONDUCTOR INC							BGA		25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360	100 MHz	CERAMIC, METAL-SEALED COFIRED	BGA	BGA360,19X19,50	SQUARE	网格排列	2.1 V	1.8 V	2 V																		3A991				ALSO REQUIRES 2.5V OR 3.3V SUPPLY	8542.31.00.01	BOTTOM	BALL		1.27 mm		unknown			360	S-CBGA-B360	不合格				300 MHz	MICROPROCESSOR, RISC			32					3.2 mm	32			YES	YES		64	浮点	YES														25 mm	25 mm
AM6234ATGGHIALWR	Texas Instruments	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	425-VFBGA, FCCSPBGA	425-FCCSP (13x13)																						-40°C ~ 125°C (TJ)	Tape & Reel (TR)	Sitara™			活跃																				1.4GHz		ARM® Cortex®-A53																	1.1V, 1.2V, 1.8V, 3.3V	10/100/1000Mbps (2)	4 Core, 64-Bit	无	DDR4, LPDDR4	USB 2.0 (2)	DMA, GPIO, I2C, I2S, MMC/SD, QSPI, SPDIF, SPI, TDM, UART/USART			ARM® Cortex®-M4F, ARM® Cortex®-R5F, Multimedia; NEON™				AES, ARM TZ, Cryptography, DRBG, ECC, MD5, PKA, Random Number Generator, RSA, Secure Boot, SHA2, SMS	LVDS, MIPI/CSI, MIPI-DPI, OLDI
MT8395AV/ZA	MediaTek	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	1046-VFBGA	1046-VFBGA (15x15)																						-20°C ~ 65°C (TA)	Tape & Reel (TR);Cut Tape (CT);Digi-Reel®				活跃																				2GHz, 2.2GHz		ARM® Cortex®-A55, ARM® Cortex®-A78																	1.2V, 1.8V	MII, RGMII, RMII	4, 4 Core, 64-Bit	有	LPDDR4x	USB 2.0 (2), USB 3.1 (2)	I2C, I2S, MMC/SD/SDIO, PCM, SPI, UART			ARM® Mali-G57MC5				AES, ARM TZ, Boot Security	MIPI-CSI
MC9328MXLVM20	Motorola Semiconductor Products	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES			256		有		Transferred							MOTOROLA INC		14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-256	16 MHz	70 °C	PLASTIC/EPOXY	LFBGA	BGA256,16X16,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	2 V	1.8 V	1.9 V																						8542.31.00.01	BOTTOM	BALL		0.8 mm		unknown				S-PBGA-B256	不合格			COMMERCIAL	200 MHz	MICROPROCESSOR, RISC			32					1.6 mm	25			YES	YES		32	固定点	YES														14 mm	14 mm
AM6231ASGGHIALWR	Texas Instruments	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	425-VFBGA, FCCSPBGA	425-FCCSP (13x13)																						-40°C ~ 125°C (TJ)	Tape & Reel (TR)	Sitara™			活跃																				1GHz		ARM® Cortex®-A53																	1.1V, 1.2V, 1.8V, 3.3V	10/100/1000Mbps (2)	1 Core, 64-Bit	无	DDR4, LPDDR4	USB 2.0 (2)	DMA, GPIO, I2C, I2S, MMC/SD, QSPI, SPDIF, SPI, TDM, UART/USART			ARM® Cortex®-M4F, ARM® Cortex®-R5F, Multimedia; NEON™				AES, ARM TZ, Cryptography, DRBG, ECC, MD5, PKA, Random Number Generator, RSA, Secure Boot, SHA2, SMS	LVDS, MIPI/CSI, MIPI-DPI, OLDI