类别是'category.专用模块' (1062)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 表面安装 | 越来越多的功能 | 终端数量 | 厂商 | 操作温度 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 连接器类型 | 类型 | 定位的数量 | 端子表面处理 | 应用 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | 触点表面处理 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 磁卡种类 | 内存大小 | 操作模式 | 电源电流-最大值 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 待机电流-最大值 | 记忆密度 | I/O类型 | 内存IC类型 | 插入、移除方法 | 产品 | 喷射器侧 | 特征 | 混合内存类型 | 长度 | 宽度 | 触点表面处理厚度 | 板上高度 | |||||||||||||||||||||
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![]() | SC-ISOSLICE-7 | Sensata Technologies | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Sensata-Cynergy3 | Bulk | SC-ISOSLICE | Obsolete | - | 输入模块 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DS9105-008# | Analog Devices | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Analog Devices Inc./Maxim Integrated | Bulk | DS9105 | Obsolete | EPROM | -40°C ~ 85°C | iButton® | User/Product Authentication | 128B | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DS1411-009# | Analog Devices | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Free Hanging (In-Line) | DB9 Adapter | Analog Devices Inc./Maxim Integrated | Bulk | 活跃 | DS1411 | iButton® | Retainer, Serial Port | Holder | 2 | - | iButton | Push In, Pull Out | Accessories | - | ID芯片 | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC17S20VOG8I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | -40 °C | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 5 V | TSOP2, | TSOP | XILINX INC | Obsolete | 有 | 3 | 178144 words | 178144 | 85 °C | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 30 | 8 | R-PDSO-G8 | 不合格 | 5.5 V | INDUSTRIAL | 4.5 V | SYNCHRONOUS | 178144X1 | 1.2 mm | 1 | 178144 bit | 存储器电路 | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||
![]() | SST34HF1641C-70-4C-L1P | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | 70 °C | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 V | Obsolete | SILICON STORAGE TECHNOLOGY INC | BGA | LFBGA, | 1048576 words | 1000000 | EAR99 | SRAM IS ORGANIZED AS 256K X 16 / 512K X 8; FLASH CAN ALSO BE ORGANIZED AS 2M X 8 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 56 | R-PBGA-B56 | 不合格 | 3.3 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 1MX16 | 1.4 mm | 16 | 16777216 bit | 存储器电路 | 10 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||
![]() | AM27C2048-150PC | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | CYPRESS SEMICONDUCTOR CORP | 活跃 | compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TMS4C1060-30SD | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 20 | PLASTIC/EPOXY | ZIP | ZIP20,.1 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | TEXAS INSTRUMENTS INC | ZIP, ZIP20,.1 | 25 ns | 70 °C | EAR99 | 8542.32.00.71 | ZIG-ZAG | THROUGH-HOLE | 未说明 | 1.27 mm | not_compliant | 未说明 | R-PZIP-T20 | 不合格 | COMMERCIAL | 0.05 mA | 0.01 A | 存储器电路 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | SN74LS189N | Motorola Mobility LLC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | DIP | RECTANGULAR | IN-LINE | 5 V | Obsolete | MOTOROLA INC | DIP | DIP, | 16 words | 16 | PLASTIC/EPOXY | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | unknown | 16 | R-PDIP-T16 | 不合格 | ASYNCHRONOUS | 16X4 | 4 | 64 bit | 存储器电路 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | HYG0UGG0MF1P-5SH0E | SK Hynix Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 149 | -30 °C | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.8 V | 活跃 | SK HYNIX INC | FBGA-149 | 33554432 words | 32000000 | 85 °C | EAR99 | IT ALSO CONTAINS 1GBIT(128M X 8BIT) NAND FLASH MEMORY OPERATES AT 2.7V NOM SUPPLY | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | R-PBGA-B149 | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 32MX16 | 1.4 mm | 16 | 536870912 bit | 存储器电路 | 14 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | ICS2121M001 | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 无 | Obsolete | INTEGRATED CIRCUIT SYSTEMS INC | , | EAR99 | 8542.32.00.71 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S71PL127JB0BAW9Z | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | -25 °C | 85 °C | 8000000 | 8388608 words | 3 | TFBGA, | BGA | SPANSION INC | Obsolete | 无 | 3 V | GRID ARRAY, THIN PROFILE, FINE PITCH | RECTANGULAR | TFBGA | PLASTIC/EPOXY | e0 | EAR99 | 锡铅 | PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 64 | R-PBGA-B64 | 不合格 | 3.6 V | OTHER | 2.7 V | ASYNCHRONOUS | 8MX16 | 1.2 mm | 16 | 134217728 bit | 存储器电路 | 11.6 mm | 8 mm | ||||||||||||||||||||||||||||||||||
![]() | TH50VSF1421ACXB | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | -20 °C | PLASTIC/EPOXY | BGA | BGA48,6X8,40 | RECTANGULAR | 网格排列 | 无 | Transferred | TOSHIBA CORP | BGA, BGA48,6X8,40 | 100 ns | 85 °C | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | BOTTOM | BALL | 1 mm | unknown | R-PBGA-B48 | 不合格 | OTHER | 0.04 mA | 0.00003 A | 存储器电路 | FLASH+SRAM | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST34HF1642C-70-4E-L1PE | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | 1000000 | 85 °C | -20 °C | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 V | Obsolete | SILICON STORAGE TECHNOLOGY INC | BGA | LFBGA, | 1048576 words | EAR99 | SRAM IS ORGANIZED AS 256K X 16 / 512K X 8; FLASH CAN ALSO BE ORGANIZED AS 2M X 8 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 56 | R-PBGA-B56 | 不合格 | 3.3 V | OTHER | 2.7 V | ASYNCHRONOUS | 1MX16 | 1.4 mm | 16 | 16777216 bit | 存储器电路 | 10 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||
![]() | S71WS256NC0BFWAP2 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 84 | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 1.8 V | 有 | 活跃 | ADVANCED MICRO DEVICES INC | FBGA, BGA84,10X12,32 | 80 ns | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B84 | 不合格 | OTHER | 0.066 mA | 0.00004 A | 存储器电路 | FLASH+PSRAM | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | RD28F3204W30B70 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 80 | 2000000 | 85 °C | -25 °C | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.8 V | Obsolete | INTEL CORP | BGA | LFBGA, | 2097152 words | EAR99 | SRAM IS CONFIGURED AS 256K X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 80 | R-PBGA-B80 | 不合格 | 1.9 V | OTHER | 1.7 V | SYNCHRONOUS | 2MX16 | 1.4 mm | 16 | 33554432 bit | 存储器电路 | 14 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||
![]() | S71PL129JB0BAW9Z0 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | -25 °C | PLASTIC/EPOXY | FBGA | BGA64,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 有 | 活跃 | ADVANCED MICRO DEVICES INC | FBGA, BGA64,10X12,32 | 70 ns | 85 °C | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B64 | 不合格 | OTHER | 0.07 mA | 0.000005 A | 存储器电路 | FLASH+PSRAM | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RP-SMLF32RP0 | Panasonic Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M4-4106-Z3 | Moujen Switch | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S71GL128NB0BFW9Z | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SD8SBAT-256G | Western Digital Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 微电子组件 | 接触制造商 | WESTERN DIGITAL CORP | , | 274877906944 words | 256000000000 | 70 °C | UNSPECIFIED | RECTANGULAR | EAR99 | 8542.32.00.71 | UNSPECIFIED | 无铅 | 1 | unknown | R-XXMA-N | COMMERCIAL | ASYNCHRONOUS | 256GX8 | 8 | 2199023255552 bit | 存储器电路 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TC57256D-20 | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 无 | Transferred | TOSHIBA CORP | , | e0 | EAR99 | 锡铅 | 8542.32.00.71 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC17S40SOG20I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | SOP, | 3 | 329312 words | 329312 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 5 V | 有 | Obsolete | XILINX INC | SOIC | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 30 | 20 | R-PDSO-G20 | 不合格 | 5.5 V | INDUSTRIAL | 4.5 V | SYNCHRONOUS | 329312X1 | 2.65 mm | 1 | 329312 bit | 存储器电路 | 12.8 mm | 7.5 mm | ||||||||||||||||||||||||||||||||
![]() | MM5260N | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | 1000 | 70 °C | -25 °C | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 无 | Obsolete | NATIONAL SEMICONDUCTOR CORP | DIP, DIP16,.3 | 1024 words | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T16 | 不合格 | OTHER | 1KX1 | 3-STATE | 1 | 1024 bit | COMMON | ||||||||||||||||||||||||||||||||||||||||||||
![]() | S71PL032J80BAW070 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | TFBGA, | 3 | 2097152 words | 2000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 V | 有 | Obsolete | SPANSION INC | BGA | e1 | EAR99 | 锡银铜 | PSRAM IS ORGANIZED AS 512K X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 56 | R-PBGA-B56 | 不合格 | 3.6 V | OTHER | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.2 mm | 16 | 33554432 bit | 存储器电路 | 9 mm | 7 mm | ||||||||||||||||||||||||||||||||||
![]() | S71PL032J80BAW070 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | BGA56,8X8,32 | SQUARE | GRID ARRAY, FINE PITCH | 3 V | 有 | Obsolete | ADVANCED MICRO DEVICES INC | FBGA, BGA56,8X8,32 | 70 ns | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B56 | 不合格 | OTHER | 0.07 mA | 0.000005 A | 存储器电路 | FLASH+PSRAM |
SC-ISOSLICE-7
Sensata Technologies
分类:Specialized
DS9105-008#
Analog Devices
分类:Specialized
DS1411-009#
Analog Devices
分类:Specialized
XC17S20VOG8I
AMD Xilinx
分类:Specialized
SST34HF1641C-70-4C-L1P
Silicon Storage Technology
分类:Specialized
AM27C2048-150PC
Cypress Semiconductor
分类:Specialized
TMS4C1060-30SD
Texas Instruments
分类:Specialized
SN74LS189N
Motorola Mobility LLC
分类:Specialized
HYG0UGG0MF1P-5SH0E
SK Hynix Inc
分类:Specialized
ICS2121M001
Integrated Device Technology Inc
分类:Specialized
S71PL127JB0BAW9Z
Spansion
分类:Specialized
TH50VSF1421ACXB
Toshiba America Electronic Components
分类:Specialized
SST34HF1642C-70-4E-L1PE
Silicon Storage Technology
分类:Specialized
S71WS256NC0BFWAP2
AMD
分类:Specialized
RD28F3204W30B70
Intel Corporation
分类:Specialized
S71PL129JB0BAW9Z0
AMD
分类:Specialized
RP-SMLF32RP0
Panasonic Electronic Components
分类:Specialized
M4-4106-Z3
Moujen Switch
分类:Specialized
S71GL128NB0BFW9Z
Spansion
分类:Specialized
SD8SBAT-256G
Western Digital Corp
分类:Specialized
TC57256D-20
Toshiba America Electronic Components
分类:Specialized
XC17S40SOG20I
AMD Xilinx
分类:Specialized
MM5260N
Texas Instruments
分类:Specialized
S71PL032J80BAW070
Spansion
分类:Specialized
S71PL032J80BAW070
AMD
分类:Specialized
