IC FPGA 60K GATES 128KB 256FBGA
2 Weeks
表面贴装
256-LBGA
256
MCU - 26, FPGA - 66
0°C~85°C TJ
Tray
SmartFusion®
2015
e1
Obsolete
3 (168 Hours)
256
Tin/Silver/Copper (Sn/Ag/Cu)
8542.39.00.01
BOTTOM
BALL
250
1.5V
1mm
80MHz
30
A2F060M3E
1.5V
EBI/EMI, I2C, SPI, UART, USART
1.575V
1.425V
4.5kB
3mA
ARM® Cortex®-M3
DMA, POR, WDT
EBI/EMI, I2C, SPI, UART/USART
400 kbps
MCU, FPGA
现场可编程门阵列
660
ARM
60000
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
128KB
17mm
1.7mm
17mm
符合RoHS标准
-
-
-
-
-
IC FPGA 200K GATES 256KB 256-BGA
16 Weeks
-
256-LBGA
256
MCU - 25, FPGA - 66
-40°C~100°C TJ
Tray
SmartFusion®
1997
-
活跃
3 (168 Hours)
-
-
-
-
-
-
-
-
80MHz
-
A2F200
1.5V
EBI/EMI, Ethernet, I2C, SPI, UART, USART
1.575V
1.425V
4.5kB
7mA
ARM® Cortex®-M3
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, SPI, UART/USART
400 kbps
MCU, FPGA
-
2500
ARM
200000
ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
256KB
-
-
-
符合RoHS标准
256-FPBGA (17x17)
100°C
-40°C
80MHz
100MHz
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IC FPGA 60K GATES 128KB 256FBGA2 Weeks表面贴装256-LBGA256MCU - 26, FPGA - 660°C~85°C TJTraySmartFusion®2015e1Obsolete3 (168 Hours)256Tin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01BOTTOMBALL2501.5V1mm80MHz30A2F060M3E1.5VEBI/EMI, I2C, SPI, UART, USART1.575V1.425V4.5kB3mAARM® Cortex®-M3DMA, POR, WDTEBI/EMI, I2C, SPI, UART/USART400 kbpsMCU, FPGA现场可编程门阵列660ARM60000ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops128KB17mm1.7mm17mm符合RoHS标准-----
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