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XC7Z035-1FFG900I备选型号: XC7Z045-1FFG900C

XC7Z035-1FFG900I

Xilinx Inc.

FPGA Zynq-7000 275000 Cells 28nm Technology 1V 900-Pin FCBGA Tray

10 Weeks
900-BBGA, FCBGA
YES
900
130
-40°C~100°C TJ
Tray
2010
Zynq®-7000
e1
活跃
4 (72 Hours)
900
Tin/Silver/Copper (Sn/Ag/Cu)
BOTTOM
BALL
245
1V
667MHz
30
1V
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
256KB
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
DMA
130 ps
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
MCU, FPGA
ARM
YES
1
256000
Kintex™-7 FPGA, 275K Logic Cells
343800
CAN; ETHERNET; I2C; SPI; UART; USB
3.35mm
ROHS3 Compliant
-
-
-
-
-
-
-
-
-
-
-
XC7Z045-1FFG900C

Xilinx Inc.

IC SOC CORTEX-A9 667MHZ 900FCBGA

10 Weeks
900-BBGA, FCBGA
YES
900
ROMless
0°C~85°C TJ
Tray
2009
Zynq®-7000
e1
活跃
4 (72 Hours)
900
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
BOTTOM
BALL
245
1V
667MHz
30
-
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
256KB
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
DMA
-
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
MCU, FPGA
ARM
YES
-1
256000
Kintex™-7 FPGA, 350K Logic Cells
-
CAN; ETHERNET; I2C; SPI; UART; USB
3.35mm
ROHS3 Compliant
Copper, Silver, Tin
3A991.D
8542.39.00.01
1mm
XC7Z045
3.3V
1.2V
32b
190000
31mm
无
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集成电路（IC）相关产品

图片	产品型号	品牌	分类	封装	描述	对比
	XC7Z045-1FFG900C	Xilinx Inc.	嵌入式 - 片上系统（SoC）	900-BBGA, FCBGA	IC SOC CORTEX-A9 667MHZ 900FCBGA	对比
	XC7K325T-L2FBG900E	Xilinx Inc.	嵌入式 - FPGA（现场可编程门阵列）	900-BBGA, FCBGA	IC FPGA 500 I/O 900FCBGA	对比