品牌是'ALTERA' (8847)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 最大电源电压 | 最小电源电压 | 内存大小 | 内存大小 | 数据率 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 产品类别 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 产品类别 | 高度 | 长度 | 宽度 | 辐射硬化 | 达到SVHC | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | EP4SGX290NF45I3 | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1932-BBGA, FCBGA | YES | 1932-FBGA, FC (45x45) | 1932 | 0.9 V | 30 | 0.87 V | 无 | EP4SGX290NF45I3 | 717 MHz | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 0.93 V | 5.22 | 920 | BGA, BGA1932,44X44,40 | 网格排列 | PLASTIC/EPOXY | BGA1932,44X44,40 | -40°C ~ 100°C (TJ) | Stratix® IV GX | e0 | 活跃 | 3A001.A.7.A | 锡铅 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 0.87 V ~ 0.93 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP4SGX290 | S-PBGA-B1932 | 920 | 不合格 | 0.9,1.2/3,1.5,2.5 V | 920 | 116480 CLBS | 3.6 mm | 现场可编程门阵列 | 291200 | 17661952 | 11648 | 116480 | 291200 | 45 mm | 45 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP4SGX70HF35C2G | ALTERA | 数据表 | 572 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | Intel Corporation | 活跃 | IC FPGA 488 I/O 1152FBGA | INTEL CORP | 5.24 | 488 | Compliant | BGA, | 网格排列 | PLASTIC/EPOXY | 未说明 | 85 °C | 有 | EP4SGX70HF35C2G | BGA | SQUARE | 0°C ~ 85°C (TJ) | Stratix® IV GX | 活跃 | 85 °C | 0 °C | 0.87 V ~ 0.93 V | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | OTHER | 923.4 kB | 2904 CLBS | 3.5 mm | 现场可编程门阵列 | 72600 | 7564880 | 2904 | 2904 | 2904 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP2C5T144C8N | ALTERA | 数据表 | 5400 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | QFP144,.87SQ,20 | 1.2 V | 40 | 1.15 V | 85 °C | 有 | EP2C5T144C8N | LFQFP | SQUARE | Intel Corporation | 活跃 | Cyclone Devices | INTEL CORP | 1.25 V | 0.8 | 89 | -- | Cyclone II | 20 x 20 x 1.4mm | 1.15 V | TQFP | +85 °C | 0 °C | 13 (18 x 18) | 1.25 V | LFQFP, QFP144,.87SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | 0°C ~ 85°C (TJ) | Cyclone® II | e3 | 活跃 | -- | EAR99 | Matte Tin (Sn) | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | EP2C5 | 144 | S-PQFP-G144 | 81 | 不合格 | 1.2,1.5/3.3,3.3 V | OTHER | 89 | 288 CLBS | 1.6 mm | 现场可编程门阵列 | 4608 | 119808 | 288 | 288 | 4608 | 1.4mm | 20mm | 20mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | EP3C40F324C7 | ALTERA | 数据表 | 2868 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 324-BGA | YES | 324-FBGA (19x19) | 324 | BGA, BGA324,18X18,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA324,18X18,40 | 1.2 V | 30 | 1.15 V | 85 °C | 无 | EP3C40F324C7 | 472.5 MHz | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 5.22 | 195 | 0°C ~ 85°C (TJ) | Cyclone® III | e0 | 活跃 | 3A001.A.7.A | 锡铅 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP3C40 | S-PBGA-B324 | 195 | 不合格 | OTHER | 195 | 39600 CLBS | 1.9 mm | 现场可编程门阵列 | 39600 | 1161216 | 2475 | 39600 | 39600 | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP1C6T144C7N | ALTERA | 数据表 | 2100 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | QFP | 98 | -- | 22 X 22 MM, 0.50 MM PITCH, TQFP-144 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP144,.87SQ,20 | 1.5 V | 40 | 1.425 V | 85 °C | 有 | EP1C6T144C7N | 320 MHz | LFQFP | SQUARE | Altera Corporation | Transferred | ALTERA CORP | 1.575 V | 3.5 | 0°C ~ 85°C (TJ) | Cyclone® | e3 | 有 | 活跃 | -- | EAR99 | Matte Tin (Sn) - annealed | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425 V ~ 1.575 V | QUAD | 鸥翼 | 260 | 0.5 mm | unknown | EP1C6 | 144 | S-PQFP-G144 | 98 | 不合格 | 1.5,1.5/3.3 V | OTHER | 185 | 5980 CLBS | 1.6 mm | 现场可编程门阵列 | 5980 | 92160 | 598 | 5980 | 5980 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP1C6T144I7N | ALTERA | 数据表 | 2050 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 7.58 | 98 | -- | LFQFP, QFP144,.87SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP144,.87SQ,20 | -65 °C | 1.5 V | 40 | 1.425 V | 135 °C | 有 | EP1C6T144I7N | 320 MHz | LFQFP | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 1.575 V | -40°C ~ 100°C (TJ) | Cyclone® | e3 | 活跃 | -- | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425 V ~ 1.575 V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | EP1C6 | S-PQFP-G144 | 98 | 不合格 | 1.5,1.5/3.3 V | MILITARY | 185 | 5980 CLBS | 1.6 mm | 现场可编程门阵列 | 5980 | 92160 | 598 | 5980 | 5980 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP2C5Q208I8N | ALTERA | 数据表 | 156 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | -- | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 1.2 V | 40 | 1.15 V | 有 | EP2C5Q208I8N | 402.5 MHz | FQFP | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 1.39 | 142 | -40°C ~ 100°C (TJ) | Cyclone® II | e3 | 活跃 | -- | EAR99 | MATTE TIN (472) OVER COPPER | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | EP2C5 | S-PQFP-G208 | 134 | 不合格 | 1.2,1.5/3.3,3.3 V | 142 | 288 CLBS | 4.1 mm | 现场可编程门阵列 | 4608 | 119808 | 288 | 288 | 4608 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP1S10F484I6 | ALTERA | 数据表 | 543 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BBGA, FCBGA | YES | 484-FBGA (23x23) | 484 | BGA484,22X22,40 | 1.5 V | 未说明 | 1.425 V | 无 | EP1S10F484I6 | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 1.575 V | 5.2 | 335 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | -40°C ~ 100°C (TJ) | Stratix® | e0 | Obsolete | 3A991 | 锡铅 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425 V ~ 1.575 V | BOTTOM | BALL | 未说明 | 1 mm | compliant | EP1S10 | S-PBGA-B484 | 426 | 不合格 | 1.5,1.5/3.3 V | 426 | 现场可编程门阵列 | 10570 | 920448 | 1057 | 10570 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP2C8T144C6N | ALTERA | 数据表 | 677 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 85 | -- | LFQFP, QFP144,.87SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP144,.87SQ,20 | 1.2 V | 40 | 1.15 V | 85 °C | 有 | EP2C8T144C6N | 500 MHz | LFQFP | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 1.39 | 0°C ~ 85°C (TJ) | Cyclone® II | e3 | 活跃 | -- | EAR99 | MATTE TIN (472) OVER COPPER | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | EP2C8 | S-PQFP-G144 | 77 | 不合格 | 1.2,1.5/3.3,3.3 V | OTHER | 85 | 516 CLBS | 1.6 mm | 现场可编程门阵列 | 8256 | 165888 | 516 | 516 | 8256 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP4CE6F17C6N | ALTERA | 数据表 | 29 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA | YES | 256 | 256-FBGA (17x17) | 256 | 1.56 | 6272 | 179 | -- | LBGA, BGA256,16X16,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 85 °C | EP4CE6F17C6N | 472.5 MHz | LBGA | SQUARE | Intel Corporation | INTEL CORP | Compliant | 1.2 V | 40 | 1.15 V | 有 | 活跃 | 1.25 V | 0°C ~ 85°C (TJ) | Cyclone® IV E | e1 | 活跃 | -- | 锡银铜 | 85 °C | 0 °C | 8542.39.00.01 | 现场可编程门阵列 | 1.15 V ~ 1.25 V | BOTTOM | BALL | 260 | 1 mm | compliant | EP4CE6 | S-PBGA-B256 | 179 | 不合格 | 1.2 V | 1.2,1.2/3.3,2.5 V | OTHER | 1.25 V | 1.15 V | 33.8 kB | 33.8 kB | 179 | 392 CLBS | 1.55 mm | 现场可编程门阵列 | 6272 | 276480 | 6272 | 200 MHz | 392 | 392 | 6 | 392 | 6272 | 17 mm | 17 mm | 无 | 无SVHC | 无铅 | |||||||||||||||||||||||||||||||||||||
![]() | EP2C8T144C8N | ALTERA | 数据表 | 6250 In Stock |
- | 最小起订量: 1 最小包装量: 1 | YES | 144 | 85 °C | 有 | EP2C8T144C8N | 402.5 MHz | LFQFP | SQUARE | Intel Corporation | 活跃 | CYCLONE II FPGA | INTEL CORP | 1.25 V | 1.38 | 1.15 V | 40 | 1.2 V | QFP144,.87SQ,20 | PLASTIC/EPOXY | 3 | FLATPACK, LOW PROFILE, FINE PITCH | LFQFP, QFP144,.87SQ,20 | e3 | EAR99 | 哑光锡 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G144 | 77 | 不合格 | 1.2,1.5/3.3,3.3 V | OTHER | 85 | 516 CLBS | 1.6 mm | 现场可编程门阵列 | 516 | 8256 | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP3C25F324C7 | ALTERA | 数据表 | 2899 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 324-BGA | YES | 324-FBGA (19x19) | 324 | BGA, BGA324,18X18,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA324,18X18,40 | 1.2 V | 30 | 1.15 V | 85 °C | 无 | EP3C25F324C7 | 472.5 MHz | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 5.22 | 215 | 0°C ~ 85°C (TJ) | Cyclone® III | e0 | 活跃 | 3A991 | 锡铅 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP3C25 | S-PBGA-B324 | 215 | 不合格 | OTHER | 215 | 24624 CLBS | 1.9 mm | 现场可编程门阵列 | 24624 | 608256 | 1539 | 24624 | 24624 | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP2C5Q208C8N | ALTERA | 数据表 | 144 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 1.2 V | 40 | 1.15 V | 85 °C | 有 | EP2C5Q208C8N | 402.5 MHz | FQFP | SQUARE | Intel Corporation | 活跃 | Cyclone Devices | INTEL CORP | 1.25 V | 1.38 | 142 | -- | Cyclone II | 28 x 28 x 3.4mm | 1.15 V | PQFP | +85 °C | 0 °C | 13 (18 x 18) | 1.25 V | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | 0°C ~ 85°C (TJ) | Cyclone® II | e3 | 活跃 | -- | EAR99 | MATTE TIN (472) OVER COPPER | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | EP2C5 | 208 | S-PQFP-G208 | 134 | 不合格 | 1.2,1.5/3.3,3.3 V | OTHER | 142 | 288 CLBS | 4.1 mm | 现场可编程门阵列 | 4608 | 119808 | 288 | 288 | 4608 | 3.4mm | 28mm | 28mm | |||||||||||||||||||||||||||||||||||||||||
![]() | EP3C16F484C6 | ALTERA | 数据表 | 2924 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | YES | 484-FBGA (23x23) | 484 | 346 | -- | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.15 V | 85 °C | 无 | EP3C16F484C6 | 472.5 MHz | BGA | RECTANGULAR | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 1.71 | 0°C ~ 85°C (TJ) | Cyclone® III | e0 | 活跃 | -- | 3A991 | 锡铅 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP3C16 | R-PBGA-B484 | 346 | 不合格 | OTHER | 346 | 15408 CLBS | 2.6 mm | 现场可编程门阵列 | 15408 | 516096 | 963 | 15408 | 15408 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP2C8F256I8N | ALTERA | 数据表 | 5468 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FBGA (17x17) | 256 | -- | LBGA, BGA256,16X16,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 1.2 V | 40 | 1.15 V | 有 | EP2C8F256I8N | 402.5 MHz | LBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 1.39 | 182 | -40°C ~ 100°C (TJ) | Cyclone® II | e1 | 活跃 | -- | EAR99 | 锡银铜 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 260 | 1 mm | compliant | EP2C8 | S-PBGA-B256 | 174 | 不合格 | 1.2,1.5/3.3,3.3 V | 182 | 516 CLBS | 1.55 mm | 现场可编程门阵列 | 8256 | 165888 | 516 | 516 | 8256 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP1C4F324C6N | ALTERA | 数据表 | 141 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 324-BGA | YES | 324-FBGA (19x19) | 324 | 249 | BGA, BGA324,18X18,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA324,18X18,40 | 1.5 V | 40 | 1.425 V | 85 °C | 有 | EP1C4F324C6N | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 1.575 V | 7.76 | -- | 0°C ~ 85°C (TJ) | Cyclone® | e1 | 活跃 | -- | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425 V ~ 1.575 V | BOTTOM | BALL | 260 | 1 mm | compliant | EP1C4 | S-PBGA-B324 | 301 | 不合格 | 1.5,1.5/3.3 V | OTHER | 301 | 442 CLBS | 3.5 mm | 现场可编程门阵列 | 4000 | 78336 | 400 | 442 | 4000 | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP2C5F256C8N | ALTERA | 数据表 | 1500 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FBGA (17x17) | 256 | 0 C | 90 | 1.15 V | SMD/SMT | 288 LAB | 969718 | Intel | Intel / Altera | 260 MHz | Cyclone II | Details | LBGA, BGA256,16X16,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 1.2 V | 40 | 85 °C | 有 | EP2C5F256C8N | 402.5 MHz | LBGA | SQUARE | 活跃 | INTEL CORP | 1.38 | 158 | -- | 有 | 4608 LE | 119808 bit | + 70 C | 1.25 V | 0.052911 oz | 0°C ~ 85°C (TJ) | Tray | Cyclone® II | e1 | 活跃 | -- | EAR99 | 锡银铜 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 260 | 1 mm | compliant | EP2C5 | S-PBGA-B256 | 150 | 不合格 | 1.15 V to 1.25 V | 1.2,1.5/3.3,3.3 V | OTHER | - | 158 | 288 CLBS | 1.55 mm | 现场可编程门阵列 | 4608 | FPGA - Field Programmable Gate Array | 119808 | 288 | - | 288 | 4608 | FPGA - Field Programmable Gate Array | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||
![]() | EP2C8F256C8N | ALTERA | 数据表 | 664 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FBGA (17x17) | 256 | 182 | -- | LBGA, BGA256,16X16,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 1.2 V | 40 | 1.15 V | 85 °C | 有 | EP2C8F256C8N | 402.5 MHz | LBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 1.38 | 0°C ~ 85°C (TJ) | Cyclone® II | e1 | 活跃 | -- | EAR99 | 锡银铜 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 260 | 1 mm | compliant | EP2C8 | S-PBGA-B256 | 174 | 不合格 | 1.2,1.5/3.3,3.3 V | OTHER | 182 | 516 CLBS | 1.55 mm | 现场可编程门阵列 | 8256 | 165888 | 516 | 516 | 8256 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP1S40F780C7 | ALTERA | 数据表 | 852 In Stock | - | 最小起订量: 1 最小包装量: 1 | YES | 780 | BGA, BGA780,28X28,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA780,28X28,40 | 1.5 V | 30 | 1.425 V | 85 °C | 无 | EP1S40F780C7 | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 1.575 V | 5.21 | e0 | 3A001.A.7.A | 锡铅 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 220 | 1 mm | compliant | S-PBGA-B780 | 822 | 不合格 | 1.5,1.5/3.3 V | 商业扩展 | 822 | 4697 CLBS | 3.5 mm | 现场可编程门阵列 | 4697 | 41250 | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP2C35U484C6 | ALTERA | 数据表 | 2800 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-FBGA | YES | 484-UBGA (19x19) | 484 | FBGA, BGA484,22X22,40 | GRID ARRAY, FINE PITCH | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.15 V | 85 °C | 无 | EP2C35U484C6 | 500 MHz | FBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 5.23 | 322 | 0°C ~ 85°C (TJ) | Cyclone® II | e0 | 活跃 | 3A991 | 锡铅 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 220 | 0.8 mm | compliant | EP2C35 | S-PBGA-B484 | 306 | 不合格 | 1.2,1.5/3.3,3.3 V | OTHER | 322 | 2076 CLBS | 2.2 mm | 现场可编程门阵列 | 33216 | 483840 | 2076 | 2076 | 33216 | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP2S30F672C3 | ALTERA | 数据表 | 590 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 672-BBGA, FCBGA | YES | 672-FBGA (27x27) | 672 | BGA, BGA672,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA672,26X26,40 | 1.2 V | 30 | 1.15 V | 85 °C | 无 | EP2S30F672C3 | 717 MHz | BGA | SQUARE | Intel Corporation | 不推荐 | INTEL CORP | 1.25 V | 5.28 | 500 | 0°C ~ 85°C (TJ) | Stratix® II | e0 | 活跃 | 3A001.A.7.A | 锡铅 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 220 | 1.27 mm | compliant | EP2S30 | S-PBGA-B672 | 492 | 不合格 | 1.2,1.5/3.3,3.3 V | OTHER | 500 | 13552 CLBS | 2.6 mm | 现场可编程门阵列 | 33880 | 1369728 | 1694 | 4.45 ns | 13552 | 33880 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP3C40F484C8 | ALTERA | 数据表 | 2404 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | YES | 484-FBGA (23x23) | 484 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.15 V | 85 °C | 无 | EP3C40F484C8 | 472.5 MHz | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 5.25 | 331 | 0°C ~ 85°C (TJ) | Cyclone® III | e0 | 活跃 | 3A991 | 锡铅 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP3C40 | S-PBGA-B484 | 331 | 不合格 | OTHER | 331 | 39600 CLBS | 2.4 mm | 现场可编程门阵列 | 39600 | 1161216 | 2475 | 39600 | 39600 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP3C55F780C7 | ALTERA | 数据表 | 2194 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 780-BGA | YES | 780-FBGA (29x29) | 780 | BGA, BGA780,28X28,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA780,28X28,40 | 1.2 V | 30 | 1.15 V | 85 °C | 无 | EP3C55F780C7 | 472.5 MHz | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 5.26 | 377 | 0°C ~ 85°C (TJ) | Cyclone® III | e0 | 活跃 | 3A991 | 锡铅 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP3C55 | S-PBGA-B780 | 377 | 不合格 | OTHER | 377 | 55856 CLBS | 2.4 mm | 现场可编程门阵列 | 55856 | 2396160 | 3491 | 55856 | 55856 | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP3C25F324I7 | ALTERA | 数据表 | 2188 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 324-BGA | YES | 324 | 324-FBGA (19x19) | 324 | Non-Compliant | BGA, BGA324,18X18,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA324,18X18,40 | -40 °C | 1.2 V | 30 | 1.15 V | 100 °C | 无 | EP3C25F324I7 | 472.5 MHz | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 1.56 | 215 | -40°C ~ 100°C (TJ) | Cyclone® III | e0 | 活跃 | 3A991 | Tin/Lead (Sn/Pb) | 100 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 220 | 1 mm | compliant | 437.5 MHz | EP3C25 | S-PBGA-B324 | 215 | 不合格 | INDUSTRIAL | 1.25 V | 1.15 V | 74.3 kB | 74.3 kB | 215 | 24624 CLBS | 1.9 mm | 现场可编程门阵列 | 24624 | 608256 | 315 MHz | 1539 | 1539 | 24624 | 24624 | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | EP4CE22F17C7 | ALTERA | 数据表 | 40 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | YES | 256-FBGA (17x17) | 256 | LBGA, BGA256,16X16,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 1.2 V | 30 | 1.15 V | 85 °C | 无 | EP4CE22F17C7 | 472.5 MHz | LBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.25 V | 5.23 | 153 | 0°C ~ 85°C (TJ) | Cyclone® IV E | e0 | 活跃 | 锡铅 | 8542.39.00.01 | 现场可编程门阵列 | 1.15 V ~ 1.25 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP4CE22 | S-PBGA-B256 | 153 | 不合格 | 1.2,1.2/3.3,2.5 V | OTHER | 153 | 1395 CLBS | 1.55 mm | 现场可编程门阵列 | 22320 | 608256 | 1395 | 1395 | 22320 | 17 mm | 17 mm |
EP4SGX290NF45I3
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分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4SGX70HF35C2G
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分类:Embedded - FPGAs (Field Programmable Gate Array)
26,779.083015
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226.638346
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2,065.480258
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295.742360
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691.745358
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253.368774
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346.820350
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1,303.397245
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277.422479
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分类:Embedded - FPGAs (Field Programmable Gate Array)
964.600916
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545.199579
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分类:Embedded - FPGAs (Field Programmable Gate Array)
264.653554
EP2C8F256C8N
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分类:Embedded - FPGAs (Field Programmable Gate Array)
416.050374
EP1S40F780C7
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分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2C35U484C6
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分类:Embedded - FPGAs (Field Programmable Gate Array)
3,149.218110
EP2S30F672C3
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分类:Embedded - FPGAs (Field Programmable Gate Array)
EP3C40F484C8
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分类:Embedded - FPGAs (Field Programmable Gate Array)
1,828.935882
EP3C55F780C7
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分类:Embedded - FPGAs (Field Programmable Gate Array)
3,831.746779
EP3C25F324I7
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
1,605.181798
EP4CE22F17C7
ALTERA
分类:Embedded - FPGAs (Field Programmable Gate Array)
693.693430
