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首页 所有品牌 AMD category.片上系统（SoC）

品牌是'AMD' (1092)

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品牌

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数量

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安装类型

包装/外壳

越来越多的功能

触点形状

外壳材料

供应商器件包装

材料

插入材料

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厂商

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容差

湿度敏感性等级(MSL)

终端

温度系数

连接器类型

类型

定位的数量

颜色

应用

电容量

紧固类型

触点类型

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方向

屏蔽/屏蔽

入口保护

外壳完成

引脚数量

外壳尺寸-插入

房屋颜色

工作电源电压

失败率

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注意

速度

内存大小

外壳尺寸，MIL

引线样式

核心处理器

周边设备

连接方式

建筑学

数据总线宽度

粘合剂

包括

速度等级

图例

主要属性

数量

背景颜色

闪光大小

文字颜色

语言

特征

座位高度(最大)

厚度（最大）

触点表面处理厚度 - 配套

材料可燃性等级

评级结果
XAZU11EG-1FFVF1517I
XAZU11EG-1FFVF1517I
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

464

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

 XCZU6EG-2FFVC900I
XCZU6EG-2FFVC900I
 AMD 数据表

549 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU6

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

 XCZU6CG-L2FFVC900E
XCZU6CG-L2FFVC900E
 AMD 数据表

846 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU6

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

 XCZU9CG-L1FFVB1156I
XCZU9CG-L1FFVB1156I
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

328

Bulk

XCZU9

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

 XCZU48DR-L1FSVG1517I
XCZU48DR-L1FSVG1517I
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

Glenair

零售包装

活跃

561

-40°C ~ 100°C (TJ)

*

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

 XCZU7EG-L2FFVC1156E
XCZU7EG-L2FFVC1156E
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

Infineon Technologies

Bulk

MB9BF003

Obsolete

360

0°C ~ 100°C (TJ)

*

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

 XCZU7CG-L1FFVF1517I
XCZU7CG-L1FFVF1517I
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

Amphenol Positronic

Bulk

活跃

464

XCZU7

-40°C ~ 100°C (TJ)

*

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

 XCZU19EG-1FFVD1760I
XCZU19EG-1FFVD1760I
 AMD 数据表

569 In Stock

-

最小起订量: 1

最小包装量: 1

Free Hanging (In-Line)

1760-BBGA, FCBGA

-

Circular

铝合金

1760-FCBGA (42.5x42.5)

Plastic

ITT Cannon, LLC

Bulk

KJB6T

22D

活跃

308

-65°C ~ 175°C

KJB

Plug Housing

用于公引脚

6

Threaded

Crimp

C

Shielded

抗环境干扰

Cadmium over Electroless Nickel

9-35

橄榄色

不包括触点

500MHz, 600MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

联接螺母

-

 XCZU5EV-2FBVB900I
XCZU5EV-2FBVB900I
 AMD 数据表

883 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

PEI-Genesis

Bulk

活跃

204

XCZU5

-40°C ~ 100°C (TJ)

*

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

 XCZU47DR-L2FSVG1517I
XCZU47DR-L2FSVG1517I
 AMD 数据表

589 In Stock

-

最小起订量: 1

最小包装量: 1

Free Hanging (In-Line)

1517-BBGA, FCBGA

-

铝合金

1517-FCBGA (40x40)

ITT Cannon, LLC

50V

Bulk

Metal

CA310

活跃

Silver

561

-55°C ~ 125°C

MIL-DTL-5015, CA-B

焊杯

Plug, Female Sockets

5

橄榄色

反向卡口锁

41A, 245A

N (Normal)

-

IP67 - Dust Tight, Waterproof

橄榄色镉

32-1

533MHz, 1.333GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

-

-

 XCVC1802-1LSEVIVA1596
XCVC1802-1LSEVIVA1596
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

1596-FCBGA (40x40)

AMD

500

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

400MHz, 1GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

 XC7Z045-3FFG676E
XC7Z045-3FFG676E
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Surface Mount, MLCC

0603 (1608 Metric)

676-FCBGA (27x27)

1.2, 3.3 V

FCBGA

2

表面贴装

130

Tray

AMD

XC7Z045

活跃

Lead free / RoHS Compliant

200V

Thumb-2

-55°C ~ 150°C

Tape & Reel (TR)

GA

0.063 L x 0.032 W (1.60mm x 0.80mm)

±2%

1 (Unlimited)

C0G, NP0

汽车

270pF

676

1 V

-

-

1GHz

256KB

-

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32 Bit

Kintex™-7 FPGA, 350K Logic Cells

-

-

-

0.038 (0.97mm)

AEC-Q200

 XC7Z045-1FBG676I
XC7Z045-1FBG676I
 AMD 数据表

772 In Stock

-

最小起订量: 1

最小包装量: 1

通孔

Radial, Disc

676-FCBGA (27x27)

FCBGA

2

130

Tray

XC7Z045

AMD

活跃

Lead free / RoHS Compliant

400VAC

Thumb-2

1.2, 3.3 V

-30°C ~ 125°C

Bulk

Cera-Mite 125L

0.563 Dia (14.30mm)

±20%

1 (Unlimited)

Y5V (F)

Safety

10000pF

676

1 V

-

0.374 (9.50mm)

667MHz

256KB

Straight

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32 Bit

Kintex™-7 FPGA, 350K Logic Cells

-

-

0.689 (17.50mm)

-

X1, Y4

 XC7Z020-L1CLG484I
XC7Z020-L1CLG484I
 AMD 数据表

2353 In Stock

-

最小起订量: 1

最小包装量: 1

Surface Mount, MLCC

1812 (4532 Metric)

484-CSPBGA (19x19)

130

Tray

XC7Z020

活跃

AMD

Lead free / RoHS Compliant

50V

1 V

0.95 V

1.05 V

-55°C ~ 150°C

Tape & Reel (TR)

GA

0.177 L x 0.126 W (4.50mm x 3.20mm)

±20%

1 (Unlimited)

X7R

汽车

0.056µF

-

-

667MHz

256KB

-

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1L

Artix™-7 FPGA, 85K Logic Cells

-

-

-

0.086 (2.18mm)

AEC-Q200

 XCZU3CG-2SFVC784I
XCZU3CG-2SFVC784I
 AMD 数据表

628 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

252

Bulk

XCZU3

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

 XCVC1802-2LSEVSVA2197
XCVC1802-2LSEVSVA2197
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

Miscellaneous

活跃

Tray

770

0°C ~ 100°C (TJ)

Versal™ AI Core

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

 XCZU5EG-L2FBVB900E
XCZU5EG-L2FBVB900E
 AMD 数据表

689 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

Plastic

AMD

41700

Brady

不用于新设计

XCZU5

Tray

204

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

Pipe & Valve Marking

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

无

Air

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

0

Green

-

White

English

 XCVC1502-2MLINSVG1369
XCVC1502-2MLINSVG1369
 AMD 数据表

943 In Stock

-

最小起订量: 1

最小包装量: 1

AMD

478

Tray

活跃

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 800k Logic Cells

-

 XC7Z045-3FFV676E
XC7Z045-3FFV676E
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

676-BBGA, FCBGA

676-FCBGA (27x27)

AMD

130

Bulk

Obsolete

0°C ~ 100°C (TJ)

Zynq®-7000

1GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 350K Logic Cells

-

 XCVC1502-1MSIVSVA2197
XCVC1502-1MSIVSVA2197
 AMD 数据表

673 In Stock

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

586

Tray

活跃

Versal™ AI Core

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 800k Logic Cells

-

 XCZU6EG-3FFVB1156E
XCZU6EG-3FFVB1156E
 AMD 数据表

117 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

Metal

AMD

328

Tray

XCZU6

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

 XC7Z007S-1CLG225C
XC7Z007S-1CLG225C
 AMD 数据表

82 In Stock

-

最小起订量: 1

最小包装量: 1

225-LFBGA, CSPBGA

225-CSPBGA (13x13)

AMD

54

Tray

XC7Z007

活跃

0°C ~ 85°C (TJ)

Zynq®-7000

667MHz

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 23K Logic Cells

-

 XCZU3EG-L1SFVA625I
XCZU3EG-L1SFVA625I
 AMD 数据表

856 In Stock

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

180

Tray

XCZU3

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

 XCZU3EG-2SFVA625E
XCZU3EG-2SFVA625E
 AMD 数据表

706 In Stock

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

ITT Cannon, LLC

Bulk

MIK0

活跃

180

0°C ~ 100°C (TJ)

*

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

 XCZU2EG-1SBVA484I
XCZU2EG-1SBVA484I
 AMD 数据表

2695 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

484-FCBGA (19x19)

AMD

82

Tray

XCZU2

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-