品牌是'AMD' (1092)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

触点镀层

底架

安装类型

包装/外壳

引脚数

供应商器件包装

介电材料

表面贴装的焊盘尺寸

厂商

Voltage Rating AC

操作温度

包装

系列

尺寸/尺寸

容差

零件状态

湿度敏感性等级(MSL)

终端

温度系数

连接器类型

类型

电阻

定位的数量

最高工作温度

最小工作温度

应用

行数

性别

电容量

紧固类型

子类别

额定功率

螺距

技术

电压 - 供电

深度

样式

频率

频率稳定性

输出量

触点表面处理

终端样式

功能

基本谐振器

最大电流源

箱码(公制)

箱码(英制)

接头数量

电介质

ESR(等效串联电阻)

引线间距

电流 - 电源(禁用)(最大值)

极化

阻抗

速度

内存大小

纹波电流@低频

核心处理器

纹波电流@高频

周边设备

连接方式

重置

建筑学

电压 - 阈值

监测的电压数量

重置超时

产品类别

增益

速度等级

绝对牵引范围 (APR)

主要属性

频带数量

闪光大小

产品

特征

产品类别

高度

座位高度(最大)

长度

宽度

触点表面处理厚度

器件厚度

板上高度

辐射硬化

评级结果

XC7Z030-1FB484I
XC7Z030-1FB484I
AMD 数据表

2360 In Stock

-

最小起订量: 1

最小包装量: 1

Gold

自由悬挂

484-BBGA, FCBGA

66

484-FCBGA (23x23)

AMD

Non-Compliant

130

Bulk

XC7Z030

活跃

-40°C ~ 100°C (TJ)

Bulk

Zynq®-7000

Crimp

Plug

66

175 °C

-65 °C

Male

Threaded

66

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 125K Logic Cells

-

Shielded

抗环境干扰

XC7Z007S-2CLG225I
XC7Z007S-2CLG225I
AMD 数据表

29 In Stock

-

最小起订量: 1

最小包装量: 1

225-LFBGA, CSPBGA

225-CSPBGA (13x13)

AMD

54

Tray

XC7Z007

活跃

-40°C ~ 100°C (TJ)

Zynq®-7000

766MHz

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 23K Logic Cells

-

XCZU3EG-2SFVA625I
XCZU3EG-2SFVA625I
AMD 数据表

565 In Stock

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

Non-Compliant

180

Tray

XCZU3

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

XCZU9CG-1FFVB1156I
XCZU9CG-1FFVB1156I
AMD 数据表

806 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

1156-FCBGA (35x35)

AMD

328

Tray

XCZU9

活跃

-20°C ~ 70°C

Tape & Reel (TR)

SiT8208

0.106 L x 0.094 W (2.70mm x 2.40mm)

活跃

XO (Standard)

3.3V

16MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

33mA

31mA

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

--

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

0.032 (0.80mm)

--

XC7Z012S-1CLG485I
XC7Z012S-1CLG485I
AMD 数据表

2426 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

Radial, Can - SMD

485-CSPBGA (19x19)

0.260 L x 0.260 W (6.60mm x 6.60mm)

United Chemi-Con

150

XC7Z012

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

6.3 V

2000 Hrs @ 105°C

-55°C ~ 105°C

Alchip™- MZA

0.248 Dia (6.30mm)

±20%

汽车

100 µF

-

-

Polar

360 mOhms

667MHz

256KB

96 mA @ 120 Hz

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

240 mA @ 100 kHz

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Artix™-7 FPGA, 55K Logic Cells

-

0.240 (6.10mm)

AEC-Q200

XCZU9CG-1FFVB1156E
XCZU9CG-1FFVB1156E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

SC-74A, SOT-753

SOT-25-5

Torex Semiconductor Ltd

Tape & Reel (TR)

XC6124

活跃

328

-40°C ~ 85°C (TA)

-

看门狗电路

开路漏极或开路集电极

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

低电平有效

MCU, FPGA

1.8V

1

400ms Typical

1

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

XCZU19EG-3FFVB1517E
XCZU19EG-3FFVB1517E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

1517-BBGA, FCBGA

1517-FCBGA (40x40)

Samtec Inc.

644

Strip

SEAM8-30

10mm

活跃

0°C ~ 100°C (TJ)

SEARAY™ SEAM

High Density Array, Male

300

10

0.031 (0.80mm)

Gold

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

电路板指南

30.0µin (0.76µm)

0.297 (7.54mm)

XC7Z010-2CLG400E
XC7Z010-2CLG400E
AMD 数据表

22 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA, CSPBGA

400-CSPBGA (17x17)

AMD

130

Tray

XC7Z010

活跃

0°C ~ 100°C (TJ)

Zynq®-7000

766MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 28K Logic Cells

-

XCZU15EG-L2FFVC900E
XCZU15EG-L2FFVC900E
AMD 数据表

608 In Stock

-

最小起订量: 1

最小包装量: 1

通孔

Radial

900-FCBGA (31x31)

Polypropylene (PP), Metallized

AMD

XCZU15

活跃

--

900V

2500V (2.5kV)

204

Tray

-55°C ~ 110°C

Tray

MKP385

1.024 L x 0.236 W (26.00mm x 6.00mm)

±5%

活跃

--

PC引脚

DC Link, DC Filtering; High Frequency, Switching; High Pulse, DV/DT

620pF

0.886 (22.50mm)

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

-

--

0.472 (12.00mm)

--

XCZU7EV-3FFVC1156E
XCZU7EV-3FFVC1156E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

活跃

100 V

100 V

Compliant

360

Tray

XCZU7

0°C ~ 100°C (TJ)

Tape & Reel

Zynq® UltraScale+™ MPSoC EV

SMD/SMT

125 °C

-55 °C

4.3 pF

810 µm

1608

0603

C0G

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

1.6 mm

812.8 µm

889 µm

XCZU46DR-L1FSVH1760I
XCZU46DR-L1FSVH1760I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

Non-Compliant

574

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCVC1802-2LSEVSVD1760
XCVC1802-2LSEVSVD1760
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

Molex

Bulk

100026

最后一次购买

692

0°C ~ 100°C (TJ)

*

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

XCVM1502-2MSIVSVA2197
XCVM1502-2MSIVSVA2197
AMD 数据表

698 In Stock

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

608

Tray

活跃

Versal™ Prime

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1M Logic Cells

-

XCZU9EG-1FFVC900I
XCZU9EG-1FFVC900I
AMD 数据表

548 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU9

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

XCZU2EG-2SFVC784I
XCZU2EG-2SFVC784I
AMD 数据表

2925 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

252

Tray

XCZU2

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

XCVC1702-2LLEVSVA2197
XCVC1702-2LLEVSVA2197
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

608

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

450MHz, 1.08GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1M Logic Cells

-

XCVM1802-2LLIVSVA2197
XCVM1802-2LLIVSVA2197
AMD 数据表

952 In Stock

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

648

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XCZU15EG-L1FFVC900I
XCZU15EG-L1FFVC900I
AMD 数据表

761 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

Integrated

204

Tray

XCZU15

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

-

XC7Z014S-1CLG400C
XC7Z014S-1CLG400C
AMD 数据表

2502 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA, CSPBGA

400-CSPBGA (17x17)

AMD

125

Tray

XC7Z014

活跃

0°C ~ 85°C (TJ)

Zynq®-7000

667MHz

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 65K Logic Cells

-

XCVC1702-1MSEVSVA2197
XCVC1702-1MSEVSVA2197
AMD 数据表

657 In Stock

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

608

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1M Logic Cells

-

XC7Z045-L2FBG676I
XC7Z045-L2FBG676I
AMD 数据表

822 In Stock

-

最小起订量: 1

最小包装量: 1

676-BBGA, FCBGA

676-FCBGA (27x27)

AMD

Other

130

Tray

XC7Z045

活跃

-40°C ~ 100°C (TJ)

Zynq®-7000

70

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 350K Logic Cells

-

27

70

XC7Z007S-2CLG225E
XC7Z007S-2CLG225E
AMD 数据表

38 In Stock

-

最小起订量: 1

最小包装量: 1

225-LFBGA, CSPBGA

225-CSPBGA (13x13)

AMD

-

-

Whip

1

磁性安装

460 MHz

TE Connectivity

TE Connectivity / Laird External Antennas

UHF

-

54

Tray

XC7Z007

活跃

0°C ~ 100°C (TJ)

QW

无源天线

Mobile Antennas

Antennas

带底座的直线型

-

766MHz

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

GPS Antennas - GNSS, GLONASS, Galileo, Beidou

Unity

Artix™-7 FPGA, 23K Logic Cells

1 Band

-

室外天线

Antennas

6 in

XAZU2EG-1SFVA625Q
XAZU2EG-1SFVA625Q
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

0402

1005

+ 155 C

0.000023 oz

- 55 C

10000

PCB 安装

Vishay

Vishay / Dale

Details

128

Tray

XAZU2

活跃

-40°C ~ 125°C (TJ)

Reel

RCWE

1 %

2 Terminal

200 PPM / C

厚膜表面贴装片式电阻器

80.6 mOhms

电流感应

Resistors

125 mW (1/8 W)

厚膜

SMD/SMT

500MHz, 1.2GHz

1.2MB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, I²C, SPI, UART/USART, USB

MPU, FPGA

电流检测电阻器

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

厚膜电阻器

Current Sense Resistors - SMD

0.35 mm

1.05 mm

0.55 mm

XCZU15EG-L1FFVB1156I
XCZU15EG-L1FFVB1156I
AMD 数据表

926 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

25

132041-0864

ITT Cannon

ITT Cannon

Details

328

Tray

XCZU15

活跃

-40°C ~ 100°C (TJ)

PL

Circular Connectors

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

圆形推拽连接器

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

-

圆形推拽连接器

XCVP1502-2MLEVSVA3340
XCVP1502-2MLEVSVA3340
AMD 数据表

880 In Stock

-

最小起订量: 1

最小包装量: 1

3340-BFBGA

3340-BGA (55x55)

AMD

Fix mounted

486

Tray

活跃

3

IP65/IP67

With screws

3

0°C ~ 100°C (TJ)

Versal® Premium

56.9

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Premium FPGA, 3.7M Logic Cells

-

25.4

44.5