品牌是'AMD' (15)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

表面安装

终端数量

ECCN 代码

附加功能

HTS代码

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

资历状况

电源电压-最大值(Vsup)

温度等级

电源电压-最小值(Vsup)

操作模式

电源电流-最大值

组织结构

座位高度-最大

内存宽度

待机电流-最大值

记忆密度

内存IC类型

混合内存类型

长度

宽度

S71GL512NC0BFWEZ2
S71GL512NC0BFWEZ2
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

84

110 ns

85 °C

-25 °C

PLASTIC/EPOXY

FBGA

BGA84,10X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

活跃

ADVANCED MICRO DEVICES INC

FBGA, BGA84,10X12,32

EAR99

8542.32.00.71

BOTTOM

BALL

0.8 mm

compliant

R-PBGA-B84

不合格

OTHER

0.09 mA

0.005 A

存储器电路

FLASH+PSRAM

TH50VSF3580AASB
TH50VSF3580AASB
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

AM2764A
AM2764A
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

ADVANCED MICRO DEVICES INC

,

Obsolete

EAR99

8542.32.00.71

unknown

S71JL064H80BAW110
S71JL064H80BAW110
AMD 数据表

882 In Stock

-

最小起订量: 1

最小包装量: 1

YES

73

Transferred

ADVANCED MICRO DEVICES INC

BGA

11.60 X 8 MM, FBGA-73

70 ns

4194304 words

4000000

85 °C

-25 °C

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

3 V

EAR99

PSRAM IS ORGANIZED AS 512K X 16; FLASH CAN ALSO BE ORGANIZED AS 8M X 8

8542.32.00.71

BOTTOM

BALL

未说明

1

0.8 mm

compliant

未说明

73

R-PBGA-B73

不合格

3.3 V

OTHER

2.7 V

ASYNCHRONOUS

0.045 mA

4MX16

1.4 mm

16

67108864 bit

存储器电路

FLASH+PSRAM

11.6 mm

8 mm

S71WS256NC0BFWAP0
S71WS256NC0BFWAP0
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

84

FBGA, BGA84,10X12,32

80 ns

85 °C

-25 °C

PLASTIC/EPOXY

FBGA

BGA84,10X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

1.8 V

活跃

ADVANCED MICRO DEVICES INC

EAR99

8542.32.00.71

BOTTOM

BALL

0.8 mm

compliant

R-PBGA-B84

不合格

OTHER

0.066 mA

0.00004 A

存储器电路

FLASH+PSRAM

S71JL064HA0BAW110
S71JL064HA0BAW110
AMD 数据表

700 In Stock

-

最小起订量: 1

最小包装量: 1

YES

73

Transferred

ADVANCED MICRO DEVICES INC

BGA

LFBGA, BGA73,10X12,32

70 ns

4194304 words

4000000

85 °C

-25 °C

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

3 V

EAR99

PSRAM IS ORGANIZED AS 1M X 16; FLASH CAN ALSO BE ORGANIZED AS 8M X 8

8542.32.00.71

BOTTOM

BALL

未说明

1

0.8 mm

compliant

未说明

73

R-PBGA-B73

不合格

3.3 V

OTHER

2.7 V

ASYNCHRONOUS

0.045 mA

4MX16

1.4 mm

16

67108864 bit

存储器电路

FLASH+PSRAM

11.6 mm

8 mm

S71JL064HB0BAW01
S71JL064HB0BAW01
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

73

FBGA, BGA73,10X12,32

70 ns

85 °C

-25 °C

PLASTIC/EPOXY

FBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

3 V

Obsolete

ADVANCED MICRO DEVICES INC

EAR99

8542.32.00.71

BOTTOM

BALL

0.8 mm

compliant

R-PBGA-B73

不合格

OTHER

存储器电路

FLASH+SRAM

S71GL064A08BFW0B0
S71GL064A08BFW0B0
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

56

100 ns

85 °C

-25 °C

PLASTIC/EPOXY

FBGA

BGA56,8X8,32

SQUARE

GRID ARRAY, FINE PITCH

活跃

ADVANCED MICRO DEVICES INC

FBGA, BGA56,8X8,32

EAR99

8542.32.00.71

BOTTOM

BALL

0.8 mm

compliant

S-PBGA-B56

不合格

OTHER

0.06 mA

0.000005 A

存储器电路

FLASH+SRAM

S71JL064HA0BAW01
S71JL064HA0BAW01
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

73

Obsolete

ADVANCED MICRO DEVICES INC

LFBGA, BGA73,10X12,32

70 ns

4194304 words

4000000

85 °C

-25 °C

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

3 V

EAR99

SRAM IS ORGANISED AS 1KX16

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

compliant

R-PBGA-B73

不合格

3.3 V

OTHER

2.7 V

ASYNCHRONOUS

4MX16

1.4 mm

16

67108864 bit

存储器电路

FLASH+SRAM

11.6 mm

8 mm

S71JL064H80BAW010
S71JL064H80BAW010
AMD 数据表

486 In Stock

-

最小起订量: 1

最小包装量: 1

YES

73

Transferred

ADVANCED MICRO DEVICES INC

BGA

LFBGA, BGA73,10X12,32

70 ns

4194304 words

4000000

85 °C

-25 °C

PLASTIC/EPOXY

LFBGA

BGA73,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

3 V

EAR99

SRAM IS ORGANIZED AS 512K X 16 / 1M X 8; FLASH CAN ALSO BE ORGANIZED AS 8M X 8

8542.32.00.71

BOTTOM

BALL

未说明

1

0.8 mm

compliant

未说明

73

R-PBGA-B73

不合格

3.3 V

OTHER

2.7 V

ASYNCHRONOUS

0.045 mA

4MX16

1.4 mm

16

67108864 bit

存储器电路

FLASH+SRAM

11.6 mm

8 mm

S72WS256NEEBFWUB0
S72WS256NEEBFWUB0
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

137

FBGA, BGA137,10X14,32

70 ns

85 °C

-25 °C

PLASTIC/EPOXY

FBGA

BGA137,10X14,32

RECTANGULAR

GRID ARRAY, FINE PITCH

1.8 V

活跃

ADVANCED MICRO DEVICES INC

EAR99

8542.32.00.71

BOTTOM

BALL

0.8 mm

compliant

R-PBGA-B137

不合格

OTHER

0.06 mA

0.00004 A

存储器电路

FLASH+SDRAM

S71PL129JC0BFW9U0
S71PL129JC0BFW9U0
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

64

70 ns

85 °C

-25 °C

PLASTIC/EPOXY

FBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

活跃

ADVANCED MICRO DEVICES INC

FBGA, BGA64,10X12,32

EAR99

8542.32.00.71

BOTTOM

BALL

0.8 mm

compliant

R-PBGA-B64

不合格

OTHER

0.07 mA

0.000005 A

存储器电路

FLASH+PSRAM

S71WS256NC0BFWAP2
S71WS256NC0BFWAP2
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

84

FBGA, BGA84,10X12,32

80 ns

85 °C

-25 °C

PLASTIC/EPOXY

FBGA

BGA84,10X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

1.8 V

活跃

ADVANCED MICRO DEVICES INC

EAR99

8542.32.00.71

BOTTOM

BALL

0.8 mm

compliant

R-PBGA-B84

不合格

OTHER

0.066 mA

0.00004 A

存储器电路

FLASH+PSRAM

S71PL129JB0BAW9Z0
S71PL129JB0BAW9Z0
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

64

70 ns

85 °C

-25 °C

PLASTIC/EPOXY

FBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

活跃

ADVANCED MICRO DEVICES INC

FBGA, BGA64,10X12,32

EAR99

8542.32.00.71

BOTTOM

BALL

0.8 mm

compliant

R-PBGA-B64

不合格

OTHER

0.07 mA

0.000005 A

存储器电路

FLASH+PSRAM

S71PL032J80BAW070
S71PL032J80BAW070
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

56

FBGA, BGA56,8X8,32

70 ns

85 °C

-25 °C

PLASTIC/EPOXY

FBGA

BGA56,8X8,32

SQUARE

GRID ARRAY, FINE PITCH

3 V

Obsolete

ADVANCED MICRO DEVICES INC

EAR99

8542.32.00.71

BOTTOM

BALL

0.8 mm

compliant

S-PBGA-B56

不合格

OTHER

0.07 mA

0.000005 A

存储器电路

FLASH+PSRAM