品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8342Q08BD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | Industrial grade | 300 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS8342Q08BD | SigmaQuad-II | Memory & Data Storage | 36 Mbit | 2 | 785 mA | Pipelined | 4 M x 8 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z36AGD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Commercial grade | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 14 | 2.3 V | SMD/SMT | Parallel | 0 to 85 °C | Tray | GS8322Z36AGD | NBT Pipeline/Flow Through | Memory & Data Storage | 36 Mbit | 4 | 260 mA, 345 mA | 4.5 ns | Flow-Through/Pipelined | 1 M x 36 | SRAM | 36 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8162Z18DB-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-119 | YES | 119 | 119 | Synchronous | 1.7, 2.3 V | 1.8, 2.5 V | SDR | FBGA | 153.8@Flow-Through/200@Pipelined MHz | SDR | NBT SRAM | GSI技术 | GSI技术 | Parallel | SMD/SMT | 1.7 V | 21 | - 40 C | 2.7 V | + 85 C | 200 MHz | 有 | BGA, | 网格排列 | 1000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 6.5 ns | 85 °C | 无 | GS8162Z18DB-200IV | BGA | 5.27 | GSI TECHNOLOGY | 活跃 | RECTANGULAR | BGA | 1.8 V | Industrial grade | 表面贴装 | 2, 2.7 V | 18 Bit | 1 MWords | -40 to 100 °C | Tray | GS8162Z18DB | 3A991.B.2.B | NBT Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | INDUSTRIAL | 18 Mbit | 2 | SYNCHRONOUS | 210 mA, 215 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 18 | 1.99 mm | 18 | 20 Bit | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | SRAM | 22 mm | 14 mm | ||||||||||||||||||
![]() | GS8182S36BGD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | DDR | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 70 °C | 有 | GS8182S36BGD-200 | 524288 words | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.19 | BGA | 有 | 200 MHz | + 70 C | 1.9 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | Details | Tray | GS8182S36BGD | e1 | 有 | 3A991.B.2.B | SigmaSIO DDR-II | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 18 Mbit | SYNCHRONOUS | 435 mA | 512 k x 36 | 1.4 mm | 36 | SRAM | 18874368 bit | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||||||||||||||||||||||||
![]() | GS881E36CGD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 200@Flow-Through/300@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 300 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | 0 to 70 °C | Tray | GS881E36CGD | DCD Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 4 | 165 mA, 225 mA | 5 ns | Flow-Through/Pipelined | 256 k x 36 | 18 Bit | SRAM | 9 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342T10BGD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 300 MHz | FBGA | 1.8000 V | 1.7 V | 9 Bit | 1.9 V | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | -40 to 100 °C | Tray | GS8342T10BGD | SigmaDDR-II+ B2 | Memory & Data Storage | 36 Mbit | 460 mA | 0.45 | 4 M x 9 | SRAM | 36 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88118CGD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 200@Flow-Through/300@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 300 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | 0 to 70 °C | Tray | GS88118CGD | Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 1 | 150 mA, 205 mA | 5 ns | Flow-Through/Pipelined | 512 k x 18 | 19 Bit | SRAM | 9 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816218DD-250IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 1.7, 2.3 V | Synchronous | 1 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 85 C | 2.7 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | BGA | 5.25 | GSI TECHNOLOGY | 活跃 | RECTANGULAR | LBGA | 1.8 V | GS816218DD-250IV | 无 | 85 °C | 5.5 ns | 未说明 | -40 °C | PLASTIC/EPOXY | 1000000 | GRID ARRAY, LOW PROFILE | LBGA, | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | -40 to 100 °C | Tray | GS816218DD | 3A991.B.2.B | Pipeline/Flow Through | ALSO OPERATES AT 2.5V | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | INDUSTRIAL | 18 Mbit | 2 | SYNCHRONOUS | 225 mA, 245 mA | 5.5 ns | Flow-Through/Pipelined | 1 M x 18 | 1.4 mm | 18 | 20 Bit | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||||||||||||
![]() | GS8342Q37BGD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | DDR | Commercial grade | 250 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 表面贴装 | 1.9 V | 36 Bit | 有 | 250 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8342Q37BGD | SigmaQuad-II+ B2 | Memory & Data Storage | 36 Mbit | 2 | 765 mA | Pipelined | 1 M x 36 | 19 Bit | SRAM | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832136AGD-150I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 150 MHz | + 85 C | 3.6 V | - 40 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 7.5 ns | 85 °C | 有 | GS832136AGD-150I | 150 MHz | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.16 | BGA | Industrial grade | 133.3@Flow-Through/150@Pipelined MHz | -40 to 100 °C | Tray | GS832136AGD | 3A991.B.2.B | Pipeline/Flow Through | PIPELINE OR FLOW THROUGH ARCHITECTUREL; ALSO OPERATES AT 3.3 V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 36 Mbit | 4 | SYNCHRONOUS | 210 mA, 220 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 20 Bit | SRAM | 36 Mbit | 0.04 A | 37748736 bit | Industrial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | ||||||||||
![]() | GS816218DD-150I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 150 MHz | + 85 C | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | Industrial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | -40 to 100 °C | 18 Mbit | 2 | 190 mA, 200 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 18 | 20 Bit | 18 Mbit | Industrial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342TT06BGD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | Commercial grade | 450 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8342TT06BGD | SigmaQuad-II+ | Memory & Data Storage | 36 Mbit | 1 | 670 mA | Pipelined | 4 M x 8 | 21 Bit | SRAM | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832218AGD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 153.8@Flow-Through/200@Pipelined MHz | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 18 Bit | 2.7, 3.6 V | 有 | 200 MHz | + 85 C | 3.6 V | - 40 C | 18 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | -40 to 100 °C | Tray | GS832218AGD | Pipeline/Flow Through | Memory & Data Storage | 36 Mbit | 205 mA, 240 mA | 6.5@Flow-Through/3@P | 2 M x 18 | SRAM | 36 | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D36BGD-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | DDR | Commercial grade | 350 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8342D36BGD | SigmaQuad-II | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 850 mA | Pipelined | 1 M x 36 | 18 Bit | SRAM | 36 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161Z18DGT-333V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | TQFP-100 | YES | 100 | 100 | 1.7, 2.3 V | Synchronous | 1 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 333 MHz | + 70 C | 2.7 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 1000000 | PLASTIC/EPOXY | 未说明 | 5 ns | 70 °C | 有 | GS8161Z18DGT-333V | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.12 | QFP | Commercial grade | 200@Flow-Through/333@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | 0 to 85 °C | Tray | GS8161Z18DGT | 3A991.B.2.B | NBT | 85 °C | 0 °C | ALSO OPERATES AT 2.5V | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | COMMERCIAL | 18 Mbit | 2 | SYNCHRONOUS | 220 mA, 280 mA | 5 ns | Flow-Through/Pipelined | 1 M x 18 | 1.6 mm | 18 | 20 Bit | SRAM | 18 Mbit | 18874368 bit | Commercial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | SRAM | 20 mm | 14 mm | 无 | ||||||||||||||||
![]() | GS8342Q10BD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 300 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 300 MHz | 0 to 85 °C | Bulk | GS8342Q10BD | 85 °C | 0 °C | 1.8 V | 36 Mbit | 2 | 775 mA | Pipelined | 4 M x 9 | 21 Bit | 36 Mbit | Commercial | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816218DGB-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-119 | YES | 119 | 119 | 1 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 250 MHz | + 70 C | 2.7 V | 0 C | 21 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | BGA, | 网格排列 | 1000000 | PLASTIC/EPOXY | 未说明 | 5.5 ns | 70 °C | 有 | GS816218DGB-250V | 1.8 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.25 | BGA | Commercial grade | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 0 to 85 °C | Tray | GS816218DGB | 3A991.B.2.B | Pipeline/Flow Through | 85 °C | 0 °C | ALSO OPERATES AT 2.5V | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | COMMERCIAL | 18 Mbit | 2 | SYNCHRONOUS | 205 mA, 225 mA | 5.5 ns | Flow-Through/Pipelined | 1 M x 18 | 1.99 mm | 18 | 20 b | SRAM | 18 Mbit | 18874368 bit | Commercial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 22 mm | 14 mm | 无 | |||||||||||||||||
![]() | GS816218DGD-150I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 150 MHz | + 85 C | 3.6 V | - 40 C | 2.3 V | SMD/SMT | Parallel | Industrial grade | 133.3@Flow-Through/150@Pipelined MHz | -40 to 100 °C | Bulk | 100 °C | -40 °C | 18 Mbit | 2 | 190 mA, 200 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 18 | 20 Bit | 18 Mbit | Industrial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672Q19BGE-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | QDR-II | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | Tray | GS8672Q19BGE | SigmaQuad-II+ | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 1.1 A | 4 M x 18 | 21 b | SRAM | 72 Mb | 72 | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816218DGB-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-119 | YES | 119 | 119 | 250 MHz | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | Compliant | BGA, | 网格排列 | 1000000 | PLASTIC/EPOXY | 未说明 | 5.5 ns | 70 °C | 有 | GS816218DGB-250 | 1048576 words | 2.5 V | BGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.25 | BGA | Bulk | GS816218DGB | 3A991.B.2.B | 85 °C | 0 °C | ALSO OPERATES AT 3.3V | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | COMMERCIAL | 18 Mbit | 2 | SYNCHRONOUS | 210 mA, 230 mA | 5.5 ns | 1MX18 | 1.99 mm | 18 | 20 b | 18 Mb | 18874368 bit | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | 22 mm | 14 mm | 无 | ||||||||||||||||||||||||||||||||||||||
![]() | GS8182Q18BGD-133I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | Details | DDR | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 1000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.5 ns | 85 °C | 有 | GS8182Q18BGD-133I | 1048576 words | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.19 | BGA | 有 | 133 MHz | + 85 C | 1.9 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Tray | GS8182Q18BGD | e1 | 有 | 3A991.B.2.B | SigmaQuad-II | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 18 Mbit | 2 | SYNCHRONOUS | 385 mA | 1 M x 18 | 1.4 mm | 18 | 19 b | SRAM | 18 Mb | 18874368 bit | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||||||||||||||||||||
![]() | GS8160E36DGT-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | 200 MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 200 MHz | + 85 C | 2.7 V | 0 C | 18 | 1.7 V | 0 to 70 °C | Tray | GS8160E36DGT | DCD Synchronous Burst | Memory & Data Storage | 18 Mbit | 4 | 205 mA, 210 mA | 6.5 ns | 512 k x 36 | SRAM | 18 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342T08BGD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SigmaCIO DDR-II | Details | DDR | Commercial grade | 250 MHz | FBGA | DDR | 1.8000 V | Synchronous | 4 MWords | 8 Bit | 表面贴装 | 有 | 250 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | 0 to 85 °C | Tray | GS8342T08BGD | SigmaDDR-II B2 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 1 | 395 mA | Pipelined | 4 M x 8 | 21 Bit | SRAM | 36 Mbit | Commercial | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816236DD-333V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | YES | 165 | 165 | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.25 | BGA | 200@Flow-Through/333@Pipelined MHz | FBGA | 1.8, 2.5 V | 1.7, 2.3 V | 36 Bit | 2, 2.7 V | Compliant | LBGA, | GRID ARRAY, LOW PROFILE | 512000 | PLASTIC/EPOXY | 未说明 | 5 ns | 70 °C | 无 | GS816236DD-333V | 524288 words | 1.8 V | LBGA | 0 to 85 °C | Bulk | 3A991.B.2.B | 85 °C | 0 °C | ALSO OPERATES AT 2.5V | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | COMMERCIAL | 4 | SYNCHRONOUS | 5@Flow-Through/3@Pip | 512KX36 | 1.4 mm | 36 | 19 Bit | 18 Mb | 18 | PARALLEL | 缓存SRAM | 2 V | 1.7 V | 15 mm | 13 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342T36BD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | DDR | SigmaDDR-II | GSI技术 | GSI技术 | Compliant | Industrial grade | 333 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | -40 to 100 °C | Tray | GS8342T36BD | SigmaDDR-II B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 1 | 670 mA | Pipelined | 1 M x 36 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 |
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