品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 组织的记忆 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8672Q19BGE-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | Compliant | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | LBGA, | 有 | GS8672Q19BGE-450 | Obsolete | GSI TECHNOLOGY | 5.84 | Tray | GS8672Q19BGE | 3A991.B.2.B | SigmaQuad-II+ | 70 °C | 0 °C | Memory & Data Storage | 1.8 V | compliant | 72 Mbit | 2 | 1.49 A | 4 M x 18 | 21 b | SRAM | 72 Mb | 72 | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881E32CGD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Commercial grade | 200@Flow-Through/300@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 256 kWords | 32 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 300 MHz | + 70 C | 3.6 V | 0 C | 36 | 0 to 70 °C | Tray | GS881E32CGD | DCD Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 9 Mbit | 4 | 165 mA, 225 mA | 5 ns | Flow-Through/Pipelined | 256 k x 32 | 18 Bit | SRAM | 8 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342TT19BGD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Commercial grade | 300 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 15 | 0 to 85 °C | Bulk | GS8342TT19BGD | SigmaDDR-II+ B2 | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 1 | 450 mA | Pipelined | 2 M x 18 | 20 Bit | SRAM | 36 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672Q18BGE-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | QDR-II | Compliant | 有 | 200 MHz | + 70 C | 1.9 V | 0 C | 15 | Bulk | GS8672Q18BGE | SigmaQuad-II | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 850 mA | 4 M x 18 | 21 b | SRAM | 72 Mb | 72 | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342S36BGD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | DDR | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO-II | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8342S36BGD-333I | 333 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.35 | BGA | Industrial grade | 333 MHz | FBGA | -40 to 100 °C | Bulk | GS8342S36BGD | 3A991.B.2.B | SigmaSIO DDR-II | 100 °C | -40 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 785 mA | Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 19 Bit | SRAM | 36 Mbit | 0.215 A | 37748736 bit | Industrial | PARALLEL | SEPARATE | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||||||||||
![]() | GS8161Z36DGT-333V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | 200@Flow-Through/333@Pipelined MHz | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 36 Bit | 2, 2.7 V | Compliant | 有 | 333 MHz | + 70 C | 2.7 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Commercial grade | 0 to 85 °C | Bulk | GS8161Z36DGT | NBT | 85 °C | 0 °C | Memory & Data Storage | 18 Mbit | 4 | 240 mA, 310 mA | 5@Flow-Through/3@Pip | 512 k x 36 | 19 Bit | SRAM | 18 Mb | 18 | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8161Z18DGD-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | Compliant | 250 MHz | + 70 C | 2.7 V | 0 C | 1.7 V | SMD/SMT | Parallel | LBGA, | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | 未说明 | 5.5 ns | 70 °C | 有 | GS8161Z18DGD-250V | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.26 | BGA | Commercial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 0 to 85 °C | Bulk | GS8161Z18DGD | 3A991.B.2.B | 85 °C | 0 °C | FLOW THROUGH AND PIPELINED ARCHITECTURE, ALSO OPERATES AT 2.5V | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | COMMERCIAL | 18 Mbit | 2 | SYNCHRONOUS | 205 mA, 225 mA | 5.5 ns | Flow-Through/Pipelined | 1 M x 18 | 1.4 mm | 18 | 20 Bit | 18 Mbit | 18874368 bit | Commercial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | 15 mm | 13 mm | 无 | ||||||||||||||||||||||||||||||||||||
![]() | GS8342D10BGD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | SigmaQuad-II+ | DDR | Industrial grade | 300 MHz | FBGA | QDR | 1.8000 V | Synchronous | 4 MWords | 9 Bit | 表面贴装 | Compliant | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | -40 to 100 °C | Bulk | GS8342D10BGD | SigmaQuad-II+ B4 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 540 mA | Pipelined | 4 M x 9 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816218DGD-150V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Compliant | 150 MHz | + 70 C | 2.7 V | 0 C | 1.7 V | SMD/SMT | Parallel | 133.3@Flow-Through/150@Pipelined MHz | FBGA | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 18 Bit | 2, 2.7 V | 0 to 85 °C | Bulk | 85 °C | 0 °C | 18 Mbit | 2 | 160 mA, 180 mA | 7.5@Flow-Through/3.8 | 1 M x 18 | 20 b | 18 Mb | 18 | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342T36BGD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-165 | 165 | 165-FPBGA (15x13) | GSI Technology Inc. | GS8342T | 活跃 | Industrial grade | 1.9 V | 36 Bit | Synchronous | 1.7 V | 1.8000 V | 300 MHz | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaCIO DDR-II | Details | DDR | Tray | -40 to 100 °C | Tray | GS8342T36BGD | SigmaDDR-II B2 | 100 °C | -40 °C | Memory & Data Storage | SRAM - Quad Port, Synchronous, DDR II | 1.8 V | 36 Mbit | 1 | 300 MHz | 580 mA | 0.45 | SRAM | Parallel | 1 M x 36 | - | 20 b | SRAM | 36 Mb | 36 | Industrial | SRAM | 1M x 36 | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816218DGD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | BGA-165 | YES | 165 | 165-FPBGA (15x13) | 165 | SDR | Tray | GSI Technology Inc. | GS816218 | 活跃 | LBGA, | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 5.5 ns | 85 °C | 有 | GS816218DGD-250I | 1048576 words | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.25 | BGA | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | -40°C ~ 100°C (TJ) | Tray | GS816218DGD | 3A991.B.2.B | Pipeline/Flow Through | 100 °C | -40 °C | ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | SRAM - Synchronous, Standard | 2.3V ~ 2.7V, 3V ~ 3.6V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | INDUSTRIAL | 18 Mbit | 2 | SYNCHRONOUS | 250 MHz | 230 mA, 250 mA | 5.5 ns | SRAM | Parallel | 1 M x 18 | 1.4 mm | 18 | - | 20 b | SRAM | 18 Mb | 18874368 bit | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 1M x 18 | 15 mm | 13 mm | 无 | ||||||||||||||||||||||||||
![]() | GS8342D18BGD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | BGA-165 | YES | 165 | 165-FPBGA (15x13) | 165 | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | GSI Technology Inc. | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | DDR | Tray | GS8342D | 活跃 | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS8342D18BGD-300I | 300 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.34 | BGA | Industrial grade | 300 MHz | -40 to 100 °C | Tray | GS8342D18BGD | 3A991.B.2.B | SigmaQuad-II | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | SRAM - Quad Port, Synchronous | 1.7V ~ 1.9V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 300 MHz | 540 mA | SRAM | Parallel | Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | - | 19 Bit | SRAM | 36 Mbit | 0.21 A | 37748736 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 2M x 18 | 15 mm | 13 mm | ||||||||||
![]() | GS8321Z36AGD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | BGA-165 | YES | 165 | 165-FPBGA (15x13) | 165 | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 250 MHz | SDR | Details | NBT SRAM | GSI Technology Inc. | GSI技术 | GSI技术 | Parallel | SMD/SMT | 2.3 V | 18 | - 40 C | 3.6 V | + 85 C | Tray | GS8321Z | 活跃 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 1000000 | PLASTIC/EPOXY | 未说明 | 有 | GS8321Z36AGD-250I | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.61 | BGA | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | -40 to 100 °C | Tray | GS8321Z36AGD | e1 | 有 | 3A991.B.2.B | NBT | Tin/Silver/Copper (Sn/Ag/Cu) | IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE | Memory & Data Storage | SRAM - Synchronous, ZBT | 2.3V ~ 2.7V, 3V ~ 3.6V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 36 Mbit | 4 | SYNCHRONOUS | 250 MHz | 250 mA, 305 mA | 5.5 ns | SRAM | Parallel | Flow-Through/Pipelined | 1 M x 36 | 1.4 mm | 36 | - | 20 Bit | SRAM | 36 Mbit | 37748736 bit | Industrial | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 1M x 36 | 15 mm | 13 mm | |||||||||||||||||
![]() | GS816036DGT-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | TQFP-100 | YES | 100 | 100-TQFP (20x14) | 100 | Synchronous | 512 kWords/kB | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 250 MHz | + 100 C | 3.6 V | - 40 C | 36 | GSI Technology Inc. | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Tray | GS816036 | 活跃 | LQFP, | FLATPACK, LOW PROFILE | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 5.5 ns | 85 °C | 有 | GS816036DGT-250I | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 1.74 | QFP | Industrial grade | 181.8@Flow-Through/250@Pipelined MHz | SDR | 2.5, 3.3 V | 2.3, 3 V | -40 to 85 °C | Tray | GS816036DGT | 3A991.B.2.B | Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | SRAM - Synchronous, Standard | 2.3V ~ 2.7V, 3V ~ 3.6V | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | INDUSTRIAL | 18 Mbit | 4 | SYNCHRONOUS | 250 MHz | 250 mA, 270 mA | 5.5 ns | SRAM | Parallel | Flow-Through/Pipelined | 512 k x 36 | 1.6 mm | 36 | - | 20 Bit | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 512K x 36 | 20 mm | 14 mm | ||||||||||||||||||
![]() | GS8342D07BD-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | Commercial grade | 350 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 15 | 0 to 70 °C | Tray | GS8342D07BD | SigmaQuad-II+ B4 | 70 °C | 0 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 665 mA | Pipelined | 4 M x 8 | 20 Bit | SRAM | 36 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS880E18CGT-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Commercial grade | 200@Flow-Through/300@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 300 MHz | + 70 C | 3.6 V | 0 C | 36 | 0 to 70 °C | Tray | GS880E18CGT | DCD | 70 °C | 0 °C | Memory & Data Storage | 9 Mbit | 2 | 150 mA, 205 mA | 5 ns | Flow-Through/Pipelined | 512 k x 18 | 18 Bit | SRAM | 9 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672T37BE-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR-II | Compliant | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | Tray | GS8672T37BE | SigmaDDR-II+ B2 | 70 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 1.57 A | 2 M x 36 | 21 b | SRAM | 72 Mb | 72 | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182S36BGD-167 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | LBGA, | GRID ARRAY, LOW PROFILE | BGA | 5.19 | GSI TECHNOLOGY | 活跃 | RECTANGULAR | LBGA | 1.8 V | 524288 words | GS8182S36BGD-167 | 有 | 70 °C | 0.5 ns | 未说明 | PLASTIC/EPOXY | 512000 | 3 | Compliant | 有 | 167 MHz | + 70 C | 1.9 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR | Tray | GS8182S36BGD | e1 | 有 | 3A991.B.2.B | SigmaSIO DDR-II | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 18 Mbit | 2 | SYNCHRONOUS | 380 mA | 512 k x 36 | 1.4 mm | 36 | 18 b | SRAM | 18 Mb | 18874368 bit | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||||||||||||||||||||||||||||||||
![]() | GS8672T37BE-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR-II | Compliant | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | Tray | GS8672T37BE | SigmaDDR-II+ B2 | 85 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 1.59 A | 2 M x 36 | 21 b | SRAM | 72 Mb | 72 | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672T36BE-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | 2000000 | PLASTIC/EPOXY | 0.45 ns | 85 °C | GS8672T36BE-400 | 2097152 words | 1.8 V | LBGA | RECTANGULAR | Obsolete | GSI TECHNOLOGY | 5.84 | Compliant | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | DDR-II | LBGA, | GRID ARRAY, LOW PROFILE | Tray | GS8672T36BE | 3A991.B.2.B | SigmaDDR-II | 70 °C | 0 °C | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B165 | OTHER | 72 Mbit | 1 | SYNCHRONOUS | 1.43 A | 2 M x 36 | 1.5 mm | 36 | 21 b | SRAM | 72 Mb | 72 | PARALLEL | 标准SRAM | 1.9 V | 1.7 V | SRAM | 17 mm | 15 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182D09BGD-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | Compliant | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 18 | Tray | GS8182D09BGD | SigmaQuad-II | 85 °C | -40 °C | Memory & Data Storage | 1.8 V | 18 Mbit | 2 | 495 mA | 2 M x 9 | 19 b | SRAM | 18 Mb | SRAM | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342Q08BD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | Industrial grade | 333 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Bulk | GS8342Q08BD | SigmaQuad-II | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 895 mA | Pipelined | 4 M x 8 | 21 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z18AD-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 150 MHz | + 70 C | 3.6 V | 0 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 7.5 ns | 70 °C | 无 | GS8322Z18AD-150 | 150 MHz | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.13 | BGA | Commercial grade | 133.3@Flow-Through/150@Pipelined MHz | FBGA | SDR | 0 to 85 °C | Bulk | GS8322Z18AD | e0 | 无 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Lead (Sn/Pb) | 85 °C | 0 °C | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | COMMERCIAL | 36 Mbit | 2 | SYNCHRONOUS | 175 mA, 190 mA | 7.5 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 21 Bit | SRAM | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||||||||
![]() | GS8342S36BGD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-165 | YES | 165 | 165 | 1.8000 V | 1.7 V | Synchronous | 1 MWords | 36 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 300 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO-II | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 有 | GS8342S36BGD-300 | 300 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.2 | BGA | Commercial grade | 300 MHz | FBGA | DDR | 0 to 85 °C | Bulk | GS8342S36BGD | 3A991.B.2.B | SigmaSIO DDR-II | 85 °C | 0 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 36 Mbit | 2 | SYNCHRONOUS | 675 mA | Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 19 Bit | SRAM | 36 Mbit | 0.2 A | 37748736 bit | Commercial | PARALLEL | SEPARATE | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | |||||||||||||||||||
![]() | GS8672T37BGE-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR-II | Compliant | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | Tray | GS8672T37BGE | SigmaDDR-II+ B2 | 70 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 1.57 A | 2 M x 36 | 21 b | SRAM | 72 Mb | 72 | SRAM | 无 |
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