品牌是'GSI' (10000)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

工厂交货时间

安装类型

包装/外壳

表面安装

引脚数

供应商器件包装

终端数量

厂商

操作温度

包装

系列

JESD-609代码

无铅代码

ECCN 代码

类型

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

子类别

技术

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

Reach合规守则

JESD-30代码

资历状况

电源

温度等级

内存大小

端口的数量

操作模式

时钟频率

电源电流-最大值

访问时间

内存格式

内存接口

建筑学

组织结构

输出特性

座位高度-最大

内存宽度

写入周期时间 - 字符、页面

地址总线宽度

产品类别

密度

待机电流-最大值

记忆密度

筛选水平

并行/串行

I/O类型

内存IC类型

待机电压-最小值

电压 - 供电 (最大值)

电压 - 供电 (最小值)

产品类别

组织的记忆

长度

宽度

辐射硬化

GS840H36AGT-166
GS840H36AGT-166
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8 Weeks

YES

100

100

Compliant

LQFP, QFP100,.63X.87

FLATPACK, LOW PROFILE

3

128000

PLASTIC/EPOXY

QFP100,.63X.87

未说明

8.5 ns

70 °C

GS840H36AGT-166

166 MHz

131072 words

3.3 V

LQFP

RECTANGULAR

GSI技术

活跃

GSI TECHNOLOGY

5.34

QFP

e3

3A991.B.2.B

纯哑光锡

70 °C

0 °C

FLOW-THROUGH OR PIPELINED ARCHITECTURE

8542.32.00.41

SRAMs

CMOS

3.3 V

QUAD

鸥翼

260

1

0.65 mm

compliant

R-PQFP-G100

不合格

2.5/3.3,3.3 V

COMMERCIAL

4

SYNCHRONOUS

0.31 mA

128KX36

3-STATE

1.6 mm

36

17 b

4.5 Mb

0.02 A

4718592 bit

PARALLEL

COMMON

缓存SRAM

3.14 V

3.6 V

3 V

20 mm

14 mm

GS8182R09BD-250I
GS8182R09BD-250I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Compliant

85 °C

-40 °C

1.8 V

1

19 b

18 Mb

GS816118DD-375
GS816118DD-375
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

10 Weeks

BGA-165

YES

165

165

Synchronous

1 MWords

18 Bit

2.7, 3.6 V

表面贴装

Compliant

375 MHz

+ 70 C

3.6 V

0 C

36

2.3 V

SMD/SMT

Parallel

GSI技术

GSI技术

SyncBurst

SDR

LBGA,

GRID ARRAY, LOW PROFILE

1000000

PLASTIC/EPOXY

未说明

4.2 ns

70 °C

GS816118DD-375

2.5 V

LBGA

RECTANGULAR

活跃

GSI TECHNOLOGY

5.26

BGA

Commercial grade

238@Flow-Through/375@Pipelined MHz

FBGA

SDR

2.5, 3.3 V

2.3, 3 V

0 to 70 °C

Bulk

GS816118DD

3A991.B.2.B

Pipeline/Flow Through

70 °C

0 °C

FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

未说明

1

1 mm

compliant

R-PBGA-B165

COMMERCIAL

18 Mbit

2

SYNCHRONOUS

250 mA, 320 mA

4.2 ns

Flow-Through/Pipelined

1 M x 18

1.4 mm

18

20 Bit

SRAM

18 Mbit

18874368 bit

Commercial

PARALLEL

缓存SRAM

2.7 V

2.3 V

SRAM

15 mm

13 mm

GS8182T08BGD-250I
GS8182T08BGD-250I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8 Weeks

YES

165

165

Compliant

LBGA,

GRID ARRAY, LOW PROFILE

3

2000000

PLASTIC/EPOXY

-40 °C

未说明

0.45 ns

85 °C

GS8182T08BGD-250I

2097152 words

1.8 V

LBGA

RECTANGULAR

GSI技术

活跃

GSI TECHNOLOGY

5.18

BGA

e1

3A991.B.2.B

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

PIPELINED ARCHITECTURE, LATE WRITE

8542.32.00.41

CMOS

1.8 V

BOTTOM

BALL

260

1

1 mm

compliant

R-PBGA-B165

不合格

INDUSTRIAL

1

SYNCHRONOUS

2MX8

1.4 mm

8

20 b

18 Mb

16777216 bit

PARALLEL

DDR SRAM

1.9 V

1.7 V

15 mm

13 mm

GS81302S09E-375I
GS81302S09E-375I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

165

1.7 V

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaSIO DDR-II

DDR-II

Industrial grade

375 MHz

FBGA

DDR

1.8000 V

1.7 V

Synchronous

16 MWords

9 Bit

1.9 V

表面贴装

Compliant

375 MHz

+ 85 C

1.9 V

- 40 C

10

-40 to 100 °C

Bulk

GS81302S09E

SigmaSIO DDR-II

100 °C

-40 °C

Memory & Data Storage

1.8 V

144 Mbit

2

1.005 A

Pipelined

16 M x 9

23 Bit

SRAM

144 Mbit

Industrial

SRAM

GS8342Q37BGD-357
GS8342Q37BGD-357
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

165

1.7 V

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaQuad-II+

DDR

Commercial grade

357 MHz

FBGA

QDR

1.8000 V

1.7 V

Synchronous

1 MWords

36 Bit

1.9 V

表面贴装

Compliant

357 MHz

+ 70 C

1.9 V

0 C

15

0 to 85 °C

Bulk

GS8342Q37BGD

SigmaQuad-II+ B2

85 °C

0 °C

Memory & Data Storage

1.8 V

36 Mbit

2

1.095 A

Pipelined

1 M x 36

19 Bit

SRAM

36 Mbit

Commercial

SRAM

GS832132AGD-333I
GS832132AGD-333I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

165

Parallel

GSI技术

GSI技术

SyncBurst

SDR

Industrial grade

FBGA

SDR

2.5, 3.3 V

2.3, 3 V

Synchronous

1 MWords

32 Bit

2.7, 3.6 V

表面贴装

Compliant

333 MHz

+ 85 C

3.6 V

- 40 C

18

2.3 V

SMD/SMT

-40 to 100 °C

Bulk

GS832132AGD

Pipeline/Flow Through

100 °C

-40 °C

Memory & Data Storage

36 Mbit

4

280 mA, 365 mA

4.5 ns

Flow-Through/Pipelined

1 M x 32

20 b

SRAM

36 Mbit

Industrial

SRAM

GS8182D09BD-375I
GS8182D09BD-375I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

165

1.7 V

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaQuad-II

DDR

Industrial grade

375 MHz

FBGA

QDR

1.8000 V

1.7 V

Synchronous

2 MWords

9 Bit

1.9 V

表面贴装

Compliant

375 MHz

+ 85 C

1.9 V

- 40 C

18

-40 to 85 °C

Tray

GS8182D09BD

SigmaQuad-II

85 °C

-40 °C

Memory & Data Storage

1.8 V

18 Mbit

2

690 mA

Pipelined

2 M x 9

19 Bit

SRAM

18 Mbit

Industrial

SRAM

GS864032GT-250I
GS864032GT-250I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

TQFP-100

100

2.3 V

SMD/SMT

Parallel

GSI技术

GSI技术

SyncBurst

SDR

Industrial grade

153.8@Flow-Through/250@Pipelined MHz

TQFP

SDR

2.5, 3.3 V

2.3, 3 V

Synchronous

2 MWords

32 Bit

2.7, 3.6 V

表面贴装

Compliant

250 MHz

+ 85 C

3.6 V

- 40 C

18

-40 to 85 °C

Tray

GS864032GT

Pipeline/Flow Through

85 °C

-40 °C

Memory & Data Storage

72 Mbit

4

275 mA, 380 mA

6.5 ns

Flow-Through/Pipelined

2 M x 32

21 Bit

SRAM

64 Mbit

Industrial

SRAM

GS8662DT11BGD-400I
GS8662DT11BGD-400I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

165

400 MHz

FBGA

QDR

1.8000 V

1.7 V

Synchronous

8 MWords

9 Bit

1.9 V

表面贴装

Compliant

400 MHz

+ 85 C

1.9 V

- 40 C

1.7 V

SMD/SMT

Parallel

Industrial grade

-40 to 100 °C

Bulk

100 °C

-40 °C

1.8 V

72 Mbit

2

745 mA

Pipelined

8 M x 9

21 Bit

72 Mbit

Industrial

GS8182D09BGD-400
GS8182D09BGD-400
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

165

400 MHz

1.8000 V

1.7 V

Synchronous

9 Bit

1.9 V

Compliant

400 MHz

+ 70 C

1.9 V

0 C

18

1.7 V

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaQuad-II

DDR

0 to 70 °C

Tray

GS8182D09BGD

SigmaQuad-II

70 °C

0 °C

Memory & Data Storage

1.8 V

18 Mbit

2

720 mA

0.45

2 M x 9

19 Bit

SRAM

18 Mb

18

SRAM

GS8322Z72GC-250I
GS8322Z72GC-250I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8 Weeks

BGA-209

YES

209

209

2.5, 3.3 V

2.3, 3 V

Synchronous

512 kWords

72 Bit

2.7, 3.6 V

表面贴装

Compliant

250 MHz

+ 85 C

3.6 V

- 40 C

14

2.3 V

SMD/SMT

Parallel

GSI技术

GSI技术

NBT SRAM

SDR

LBGA,

GRID ARRAY, LOW PROFILE

3

512000

PLASTIC/EPOXY

-40 °C

未说明

6.5 ns

85 °C

GS8322Z72GC-250I

2.5 V

LBGA

RECTANGULAR

活跃

GSI TECHNOLOGY

5.14

BGA

Industrial grade

153.8@Flow-Through/250@Pipelined MHz

FBGA

SDR

-40 to 85 °C

Tray

GS8322Z72GC

e1

3A991.B.2.B

NBT Pipeline/Flow Through

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

260

1

1 mm

compliant

R-PBGA-B209

不合格

INDUSTRIAL

36 Mbit

8

SYNCHRONOUS

285 mA, 400 mA

6.5 ns

Flow-Through/Pipelined

512 k x 72

1.7 mm

72

19 Bit

SRAM

36 Mbit

37748736 bit

Industrial

PARALLEL

ZBT SRAM

2.7 V

2.3 V

SRAM

22 mm

14 mm

GS8161E18DD-333
GS8161E18DD-333
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

165

2.3 V

SMD/SMT

Parallel

GSI技术

GSI技术

SyncBurst

SDR

Commercial grade

222.2@Flow-Through/333@Pipelined MHz

FBGA

SDR

2.5, 3.3 V

2.3, 3 V

Synchronous

1 MWords

18 Bit

2.7, 3.6 V

表面贴装

Compliant

333 MHz

+ 70 C

3.6 V

0 C

36

0 to 70 °C

Bulk

GS8161E18DD

DCD Pipeline/Flow Through

70 °C

0 °C

Memory & Data Storage

18 Mbit

2

240 mA, 285 mA

4.5 ns

Flow-Through/Pipelined

1 M x 18

20 Bit

SRAM

18 Mbit

Commercial

SRAM

GS88132CD-150V
GS88132CD-150V
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

165

133.3@Flow-Through/150@Pipelined MHz

1.8, 2.5 V

1.7, 2.3 V

Synchronous

32 Bit

2, 2.7 V

Compliant

150 MHz

+ 70 C

2.7 V

0 C

66

1.7 V

SMD/SMT

Parallel

GSI技术

GSI技术

SyncBurst

SDR

0 to 70 °C

Tray

GS88132CD

同步突发

70 °C

0 °C

Memory & Data Storage

9 Mbit

1

110 mA, 125 mA

7.5@Flow-Through/3.8

256 k x 32

18 b

SRAM

9 Mb

9

SRAM

GS8342TT06BD-450I
GS8342TT06BD-450I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

165

1.7 V

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaDDR-II+

DDR

Industrial grade

450 MHz

表面贴装

1.9 V

8 Bit

4 MWords

Synchronous

1.7 V

1.8000 V

DDR

FBGA

Compliant

450 MHz

+ 85 C

1.9 V

- 40 C

15

-40 to 100 °C

Bulk

GS8342TT06BD

SigmaQuad-II+

100 °C

-40 °C

Memory & Data Storage

1.8 V

36 Mbit

1

680 mA

Pipelined

4 M x 8

21 Bit

SRAM

36 Mbit

Industrial

SRAM

GS864236GB-250I
GS864236GB-250I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8 Weeks

表面贴装

BGA-119

YES

119

119-FPBGA (22x14)

119

SDR

2.5, 3.3 V

2.3, 3 V

Synchronous

2 MWords

36 Bit

2.7, 3.6 V

表面贴装

250 MHz

+ 85 C

3.6 V

- 40 C

GSI Technology Inc.

14

2.3 V

SMD/SMT

Parallel

GSI技术

GSI技术

SyncBurst

Details

SDR

Tray

GS864236

活跃

BGA,

网格排列

3

2000000

PLASTIC/EPOXY

-40 °C

未说明

6.5 ns

85 °C

GS864236GB-250I

2.5 V

BGA

RECTANGULAR

活跃

GSI TECHNOLOGY

4.59

BGA

Industrial grade

153.8@Flow-Through/250@Pipelined MHz

FBGA

-40 to 85 °C

Tray

GS864236GB

e1

3A991.B.2.B

SCD/DCD Pipeline/Flow Through

Tin/Silver/Copper (Sn/Ag/Cu)

FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY

8542.32.00.41

Memory & Data Storage

SRAM - Synchronous, Standard

2.3V ~ 2.7V, 3V ~ 3.6V

BOTTOM

BALL

260

1

1.27 mm

compliant

R-PBGA-B119

不合格

INDUSTRIAL

72 Mbit

4

SYNCHRONOUS

250 MHz

275 mA, 380 mA

6.5 ns

SRAM

Parallel

Flow-Through/Pipelined

2 M x 36

1.99 mm

36

-

21 Bit

SRAM

72 Mbit

75497472 bit

Industrial

PARALLEL

缓存SRAM

2.7 V

2.3 V

SRAM

2M x 36

22 mm

14 mm

GS81302T18GE-350I
GS81302T18GE-350I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-165

165

165-FPBGA (15x17)

GSI Technology Inc.

Details

DDR-II

Tray

GS81302T18

活跃

350 MHz

FBGA

1.8000 V

1.7 V

Synchronous

8 MWords

18 Bit

1.9 V

350 MHz

+ 85 C

1.9 V

- 40 C

10

1.7 V

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaDDR-II

-40 to 100 °C

Tray

GS81302T18GE

SigmaDDR-II B2

Memory & Data Storage

SRAM - Quad Port, Synchronous, DDR II

1.7V ~ 1.9V

144 Mbit

350 MHz

810 mA

0.45

SRAM

Parallel

8 M x 18

-

SRAM

144

SRAM

8M x 18

GS8342S18BD-400I
GS8342S18BD-400I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

165

1.7 V

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaSIO DDR-II

DDR

Industrial grade

400 MHz

FBGA

DDR

1.8000 V

1.7 V

Synchronous

2 MWords

18 Bit

1.9 V

表面贴装

Compliant

400 MHz

+ 85 C

1.9 V

- 40 C

15

-40 to 100 °C

Bulk

GS8342S18BD

SigmaSIO DDR-II

100 °C

-40 °C

Memory & Data Storage

1.8 V

36 Mbit

2

715 mA

Pipelined

2 M x 18

20 Bit

SRAM

36 Mbit

Industrial

SRAM

GS8662DT38BGD-500
GS8662DT38BGD-500
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

165

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaQuad-II+

Details

DDR

Commercial grade

500 MHz

FBGA

QDR

1.8000 V

1.7 V

Synchronous

2 MWords

36 Bit

1.9 V

表面贴装

500 MHz

+ 70 C

1.9 V

0 C

15

1.7 V

0 to 85 °C

Tray

GS8662DT38BGD

SigmaQuad-II+

Memory & Data Storage

72 Mbit

2

1.16 A

Pipelined

2 M x 36

19 Bit

SRAM

72 Mbit

Commercial

SRAM

GS8662TT38BGD-500I
GS8662TT38BGD-500I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8 Weeks

表面贴装

BGA-165

YES

165

165-FPBGA (15x13)

165

500 MHz

FBGA

DDR

1.8000 V

1.7 V

Synchronous

2 MWords

36 Bit

1.9 V

表面贴装

500 MHz

+ 85 C

1.9 V

- 40 C

GSI Technology Inc.

15

1.7 V

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaDDR-II+

Details

DDR

活跃

GS8662TT

Tray

LBGA, BGA165,11X15,40

GRID ARRAY, LOW PROFILE

3

2000000

PLASTIC/EPOXY

BGA165,11X15,40

-40 °C

未说明

0.45 ns

85 °C

GS8662TT38BGD-500I

500 MHz

1.8 V

LBGA

RECTANGULAR

活跃

GSI TECHNOLOGY

5.19

BGA

Industrial grade

-40 to 100 °C

Tray

GS8662TT38BGD

e1

3A991.B.2.B

SigmaQuad-II+

Tin/Silver/Copper (Sn/Ag/Cu)

流水线结构

8542.32.00.41

Memory & Data Storage

SRAM - Quad Port, Synchronous

1.7V ~ 1.9V

BOTTOM

BALL

260

1

1 mm

compliant

R-PBGA-B165

不合格

1.5/1.8,1.8 V

INDUSTRIAL

72 Mbit

1

SYNCHRONOUS

500 MHz

995 mA

SRAM

Parallel

Pipelined

2 M x 36

3-STATE

1.4 mm

36

-

20 Bit

SRAM

72 Mbit

0.285 A

75497472 bit

Industrial

PARALLEL

COMMON

DDR SRAM

1.7 V

1.9 V

1.7 V

SRAM

2M x 36

15 mm

13 mm

GS8182T37BGD-400I
GS8182T37BGD-400I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

165-LBGA

165-FPBGA (15x13)

GSI Technology Inc.

活跃

Volatile

Compliant

Tray

GS8182T37

-40°C ~ 85°C (TA)

-

85 °C

-40 °C

SRAM - Synchronous

1.8 V

18Mbit

1

400 MHz

SRAM

Parallel

-

18 b

18 Mb

512K x 36

GS8662T18BGD-350I
GS8662T18BGD-350I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-165

165

165-FPBGA (15x13)

GSI Technology Inc.

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaCIO DDR-II

Details

DDR-II

Tray

GS8662T

活跃

Industrial grade

350 MHz

FBGA

DDR

1.8000 V

1.7 V

Synchronous

4 MWords

18 Bit

1.9 V

表面贴装

350 MHz

+ 85 C

1.9 V

- 40 C

15

1.7 V

-40 to 100 °C

Tray

GS8662T18BGD

SigmaDDR-II B2

Memory & Data Storage

SRAM - Quad Port, Synchronous, DDR II

1.7V ~ 1.9V

72 Mbit

1

350 MHz

600 mA

SRAM

Parallel

Pipelined

4 M x 18

-

22 Bit

SRAM

72 Mbit

Industrial

SRAM

2M x 36

GS8342TT37BGD-450I
GS8342TT37BGD-450I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

10 Weeks

表面贴装

BGA-165

YES

165

165-FPBGA (15x13)

165

FBGA

DDR

1.8000 V

1.7 V

Synchronous

1 MWords

36 Bit

1.9 V

表面贴装

450 MHz

+ 85 C

1.9 V

- 40 C

GSI Technology Inc.

15

1.7 V

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaDDR-II+

Details

DDR

Tray

GS8342TT

活跃

LBGA, BGA165,11X15,40

GRID ARRAY, LOW PROFILE

1000000

PLASTIC/EPOXY

BGA165,11X15,40

-40 °C

未说明

0.45 ns

85 °C

GS8342TT37BGD-450I

450 MHz

1.8 V

LBGA

RECTANGULAR

活跃

GSI TECHNOLOGY

4.69

BGA

Industrial grade

450 MHz

-40 to 100 °C

Tray

GS8342TT37BGD

3A991.B.2.B

SigmaDDR-II+ B2

PIPELINED ARCHITECTURE, LATE WRITE

8542.32.00.41

Memory & Data Storage

SRAM - Quad Port, Synchronous

1.7V ~ 1.9V

BOTTOM

BALL

未说明

1

1 mm

compliant

R-PBGA-B165

不合格

1.5/1.8,1.8 V

INDUSTRIAL

36 Mbit

1

SYNCHRONOUS

450 MHz

870 mA

SRAM

Parallel

Pipelined

1 M x 36

3-STATE

1.4 mm

36

-

19 Bit

SRAM

36 Mbit

37748736 bit

Industrial

PARALLEL

COMMON

DDR SRAM

1.7 V

1.9 V

1.7 V

SRAM

1M x 36

15 mm

13 mm

GS8161Z32DD-375
GS8161Z32DD-375
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

165

238@Flow-Through/375@Pipelined MHz

FBGA

SDR

2.5, 3.3 V

2.3, 3 V

Synchronous

512 kWords

32 Bit

2.7, 3.6 V

表面贴装

Compliant

375 MHz

+ 70 C

3.6 V

0 C

2.3 V

SMD/SMT

Parallel

Commercial grade

0 to 70 °C

Bulk

GS8161Z32DD

70 °C

0 °C

18 Mbit

4

270 mA, 350 mA

4.2 ns

Flow-Through/Pipelined

512 k x 32

19 Bit

18 Mbit

Commercial

GS816036DGT-333IV
GS816036DGT-333IV
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

TQFP-100

100

Parallel

GSI技术

GSI技术

SyncBurst

SDR

Industrial grade

TQFP

SDR

1.8, 2.5 V

1.7, 2.3 V

Synchronous

512 kWords

36 Bit

2, 2.7 V

表面贴装

Compliant

333 MHz

+ 100 C

3.6 V

- 40 C

18

2.3 V

SMD/SMT

-40 to 100 °C

Bulk

GS816036DGT

Pipeline/Flow Through

100 °C

-40 °C

Memory & Data Storage

18 Mbit

4

280 mA, 335 mA

4.5 ns

Flow-Through/Pipelined

512 k x 36

20 b

SRAM

18 Mbit

Industrial

SRAM