品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS81302D20E-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | GSI技术 | GSI技术 | SigmaQuad-II+ | N | QDR-II | Commercial grade | 400 MHz | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | 0 to 85 °C | Tray | GS81302D20E | SigmaQuad-II+ | Memory & Data Storage | 144 Mbit | 2 | 1.175 A | Pipelined | 8 M x 18 | 21 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88132CD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 2.3 V | SMD/SMT | Parallel | LBGA, | GRID ARRAY, LOW PROFILE | 256000 | PLASTIC/EPOXY | 未说明 | 70 °C | 无 | GS88132CD-250 | 262144 words | 3.3 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.16 | BGA | 250 MHz | + 70 C | 3.6 V | 0 C | GS88132CD | 3A991.B.2.B | ALSO OPERATES WITH 2.3V TO 2.7V SUPPLY, FLOW THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 不合格 | 3.6 V | COMMERCIAL | 3 V | 9 Mbit | SYNCHRONOUS | 155 mA, 195 mA | 5.5 ns | 256KX32 | 1.4 mm | 32 | 9 | SERIAL | 缓存SRAM | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | GS881E18CD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Tray | GS881E18CD | DCD Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 165 mA, 200 mA | 5.5 ns | 512 k x 18 | SRAM | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D09GE-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 333 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 333 MHz | FBGA | QDR | -40 to 100 °C | GS81302D09GE | 165 | 144 Mbit | 2 | 900 mA | Pipelined | 16 M x 9 | 22 Bit | 144 Mbit | Industrial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302T37E-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR-II | Industrial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS81302T37E | SigmaDDR-II+ B2 | Memory & Data Storage | 165 | 144 Mbit | 1 | 1.005 A | Pipelined | 4 M x 36 | 21 Bit | SRAM | 144 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T37BGD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 165 | GRID ARRAY, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 有 | GS8182T37BGD-300 | 300 MHz | 524288 words | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.2 | BGA | LBGA, BGA165,11X15,40 | e1 | 有 | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 不合格 | 1.9 V | 1.5/1.8,1.8 V | COMMERCIAL | 1.7 V | SYNCHRONOUS | 0.455 mA | 512KX36 | 3-STATE | 1.4 mm | 36 | 0.155 A | 18874368 bit | PARALLEL | COMMON | DDR SRAM | 1.7 V | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | GS881Z18CD-150I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T20BD-450M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 表面贴装 | 有 | 450 MHz | + 125 C | 1.9 V | - 55 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaCIO DDR-II | DDR | LBGA, | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | -55 °C | 未说明 | 0.45 ns | 125 °C | 无 | GS8662T20BD-450M | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.73 | Military grade | 450 MHz | FBGA | DDR | 1.8000 V | Synchronous | 4 MWords | 18 Bit | Tray | GS8662T20BD | 3A991.B.2.B | SigmaQuad-II+ | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 1.9 V | MILITARY | 1.7 V | 72 Mbit | SYNCHRONOUS | Pipelined | 4 M x 18 | 1.4 mm | 18 | 22 Bit | SRAM | 72 Mbit | 75497472 bit | Military | PARALLEL | DDR SRAM | SRAM | 15 mm | 13 mm | ||||||||||||||||||||||||
![]() | GS8673ED36BK-675I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-260 | YES | 260 | 1.4 V | 表面贴装 | 有 | 675 MHz | + 100 C | 1.4 V | - 40 C | 8 | 1.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-IIIe | DDR | HBGA, | GRID ARRAY, HEAT SINK/SLUG | 2000000 | PLASTIC/EPOXY | 未说明 | 无 | GS8673ED36BK-675I | 1.35 V | HBGA | RECTANGULAR | 不推荐 | GSI TECHNOLOGY | 5.81 | Industrial grade | 675/450 MHz | BGA | QDR | 1.3500 V | 1.3 V | Synchronous | 2 MWords | 36 Bit | -40 to 85 °C | Tray | GS8673ED36BK | 3A991.B.2.B | SigmaQuad-IIIe B4 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | 260 | R-PBGA-B260 | 1.4 V | 1.3 V | 72 Mbit | SYNCHRONOUS | 3.17 A | Pipelined | 2 M x 36 | 2.3 mm | 36 | 19 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | DDR SRAM | SRAM | 22 mm | 14 mm | |||||||||||||||||||||||
![]() | GS880E18CGT-150V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 70 C | 2.7 V | 0 C | 66 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | QFP100,.63X.87 | 未说明 | 7.5 ns | 70 °C | 有 | GS880E18CGT-150V | 150 MHz | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | QFP | Commercial grade | 133.3@Flow-Through/150@Pipelined MHz | 0 to 70 °C | Tray | GS880E18CGT | e3 | 有 | 3A991.B.2.B | DCD | 纯哑光锡 | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | 不合格 | 2 V | 1.8/2.5 V | COMMERCIAL | 1.7 V | 9 Mbit | 2 | SYNCHRONOUS | 105 mA, 115 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 18 | 3-STATE | 1.6 mm | 18 | 18 Bit | SRAM | 9 Mbit | 0.025 A | 9437184 bit | Commercial | PARALLEL | COMMON | 缓存SRAM | 1.7 V | SRAM | 20 mm | 14 mm | |||
![]() | GS881Z36CGD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | NBT SRAM | Details | SDR | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | Tray | GS881Z36CGD | NBT Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 175 mA, 215 mA | 5.5 ns | 256 k x 36 | SRAM | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88236CD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8673ET18BGK-550 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-260 | YES | 260 | Synchronous | 4 MWords | 18 Bit | 1.4 V | 表面贴装 | 有 | 550 MHz | + 85 C | 1.4 V | 0 C | 8 | 1.25 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-IIIe | Details | DDR-III | HBGA, | GRID ARRAY, HEAT SINK/SLUG | 4000000 | PLASTIC/EPOXY | 未说明 | 0.4 ns | 85 °C | 有 | GS8673ET18BGK-550 | 1.3 V | HBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.72 | Commercial grade | 550/375 MHz | BGA | DDR | 1.3500 V | 1.25 V | 0 to 70 °C | Tray | GS8673ET18BGK | 3A991.B.2.B | SigmaDDR-IIIe B2 | IT ALSO OPERATES AT 1.35 V TYPICAL VOLTAGE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | 260 | R-PBGA-B260 | 1.4 V | OTHER | 1.25 V | 72 Mbit | SYNCHRONOUS | 1.49 A | Pipelined | 4 M x 18 | 2.3 mm | 18 | SRAM | 72 Mbit | 75497472 bit | Commercial | PARALLEL | DDR SRAM | SRAM | 22 mm | 14 mm | |||||||||||||||||||
![]() | GS8182T19BD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881Z36CD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | NBT SRAM | N | SDR | 有 | 250 MHz | + 70 C | 3.6 V | 0 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | Tray | GS881Z36CD | NBT Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 155 mA, 195 mA | 5.5 ns | 256 k x 36 | SRAM | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88236CD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Tray | GS88236CD | Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 175 mA, 215 mA | 5.5 ns | 256 k x 36 | SRAM | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT19E-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SigmaDDR-II+ | N | DDR-II | Commercial grade | 450 MHz | FBGA | DDR | 1.8000 V | Synchronous | 8 MWords | 18 Bit | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | 0 to 85 °C | Tray | GS81302TT19E | SigmaDDR-II+ B2 | Memory & Data Storage | 165 | 144 Mbit | 1 | 1 A | Pipelined | 8 M x 18 | SRAM | 144 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS82582QT19GE-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | Details | 333 MHz | Parallel | 1.7 V | - 40 C | + 85 C | SMD/SMT | QDR-II | 有 | 10 | SigmaQuad-II+ | 1.9 V | Tray | GS82582QT19GE | SigmaQuad-II+ B2 | 288 Mbit | 1.02 A | 16 M x 18 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81284Z36B-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | Industrial grade | 200 MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 4 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 85 C | 3.6 V | - 40 C | 10 | 2.3 V | -40 to 85 °C | Tray | GS81284Z36B | NBT Pipeline/Flow Through | Memory & Data Storage | 119 | 144 Mbit | 4 | 385 mA, 475 mA | 7.5 ns | Flow-Through/Pipelined | 4 M x 36 | 21 Bit | SRAM | 144 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182R36BD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 165 | 无 | GS8182R36BD-250 | 524288 words | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.19 | BGA | LBGA, | GRID ARRAY, LOW PROFILE | 512000 | PLASTIC/EPOXY | 未说明 | 0.45 ns | 70 °C | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | 流水线结构 | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | not_compliant | 165 | R-PBGA-B165 | 不合格 | 1.9 V | COMMERCIAL | 1.7 V | SYNCHRONOUS | 512KX36 | 1.4 mm | 36 | 18874368 bit | PARALLEL | DDR SRAM | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8673EQ36BGK-625 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-260 | 1.3500 V | 1.3 V | Synchronous | 2 MWords | 36 Bit | 1.4 V | 表面贴装 | 625 MHz | + 85 C | 1.4 V | 0 C | 1.3 V | SMD/SMT | Parallel | Commercial grade | 625/400 MHz | BGA | QDR | 0 to 70 °C | GS8673EQ36BGK | 260 | 72 Mbit | 2.97 A | Pipelined | 2 M x 36 | 20 Bit | 72 Mbit | Commercial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS882Z18CGD-150I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | Details | SDR | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | -40 °C | 未说明 | 7.5 ns | 85 °C | 有 | GS882Z18CGD-150I | 524288 words | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.13 | BGA | 有 | 150 MHz | + 85 C | 3.6 V | - 40 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Tray | GS882Z18CGD | e1 | 有 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 不合格 | 2.7 V | INDUSTRIAL | 2.3 V | 9 Mbit | SYNCHRONOUS | 140 mA, 150 mA | 7.5 ns | 512 k x 18 | 1.4 mm | 18 | SRAM | 9437184 bit | PARALLEL | ZBT SRAM | SRAM | 15 mm | 13 mm | |||||||||||||||||||||||||
![]() | GS81302D06E-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 450 MHz | + 70 C | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 450 MHz | FBGA | QDR | 0 to 85 °C | GS81302D06E | 165 | 144 Mbit | 2 | 1.175 mA | Pipelined | 16 M x 8 | 22 Bit | 144 Mbit | Commercial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662TT37BGD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 有 | GS8662TT37BGD-400 | 400 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.22 | BGA | Commercial grade | 400 MHz | 0 to 85 °C | Tray | GS8662TT37BGD | e1 | 有 | 3A991.B.2.B | SigmaDDR-II+ B2 | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED ARCHITECTURE, LATE WRITE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 不合格 | 1.9 V | 1.5/1.8,1.8 V | COMMERCIAL | 1.7 V | 72 Mbit | 1 | SYNCHRONOUS | 800 mA | Pipelined | 2 M x 36 | 3-STATE | 1.4 mm | 36 | 20 Bit | SRAM | 72 Mbit | 0.245 A | 75497472 bit | Commercial | PARALLEL | COMMON | DDR SRAM | 1.7 V | SRAM | 15 mm | 13 mm | ||||
![]() | GS81302TT07E-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR-II | Industrial grade | 333 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | -40 to 100 °C | Tray | GS81302TT07E | SigmaDDR-II+ B2 | Memory & Data Storage | 165 | 144 Mbit | 1 | 765 mA | Pipelined | 16 M x 8 | 23 Bit | SRAM | 144 Mbit | Industrial | SRAM |
GS81302D20E-400
GSI Technology
分类:Memory
GS88132CD-250
GSI Technology
分类:Memory
GS881E18CD-250I
GSI Technology
分类:Memory
GS81302D09GE-333I
GSI Technology
分类:Memory
GS81302T37E-400I
GSI Technology
分类:Memory
GS8182T37BGD-300
GSI Technology
分类:Memory
GS881Z18CD-150I
GSI Technology
分类:Memory
GS8662T20BD-450M
GSI Technology
分类:Memory
GS8673ED36BK-675I
GSI Technology
分类:Memory
GS880E18CGT-150V
GSI Technology
分类:Memory
GS881Z36CGD-250I
GSI Technology
分类:Memory
GS88236CD-200
GSI Technology
分类:Memory
GS8673ET18BGK-550
GSI Technology
分类:Memory
GS8182T19BD-300
GSI Technology
分类:Memory
GS881Z36CD-250
GSI Technology
分类:Memory
GS88236CD-250I
GSI Technology
分类:Memory
GS81302TT19E-450
GSI Technology
分类:Memory
GS82582QT19GE-333I
GSI Technology
分类:Memory
GS81284Z36B-200IV
GSI Technology
分类:Memory
GS8182R36BD-250
GSI Technology
分类:Memory
GS8673EQ36BGK-625
GSI Technology
分类:Memory
GS882Z18CGD-150I
GSI Technology
分类:Memory
GS81302D06E-450
GSI Technology
分类:Memory
GS8662TT37BGD-400
GSI Technology
分类:Memory
GS81302TT07E-333I
GSI Technology
分类:Memory
