品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 建筑学 | 数据总线宽度 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 组织的记忆 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS81302D10GE-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | Industrial grade | 300 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 10 | -40 to 100 °C | Tray | GS81302D10GE | SigmaQuad-II+ B4 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 825 mA | Pipelined | 16 M x 9 | 22 Bit | SRAM | 144 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832236AD-200IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | Synchronous | 36 Bit | 2, 2.7 V | Compliant | SDR | SyncBurst | GSI技术 | GSI技术 | Parallel | SMD/SMT | 1.7 V | 18 | - 40 C | 2.7 V | + 85 C | 200 MHz | 有 | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 6.5 ns | 85 °C | 无 | GS832236AD-200IV | 200 MHz | 1048576 words | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.12 | BGA | Industrial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | 1.8, 2.5 V | 1.7, 2.3 V | -40 to 100 °C | Bulk | GS832236AD | e0 | 无 | 3A991.B.2.B | Pipeline/Flow Through | Tin/Lead (Sn/Pb) | 100 °C | -40 °C | ALSO OPERATES AT 2.5V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.8/2.5 V | INDUSTRIAL | 36 Mbit | 4 | SYNCHRONOUS | 235 mA, 270 mA | 6.5@Flow-Through/3@P | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 20 b | SRAM | 36 Mb | 0.04 A | 36 | Industrial | PARALLEL | COMMON | 缓存SRAM | 1.7 V | 2 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||||||||||||
![]() | GS816136DGT-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 222.2@Flow-Through/333@Pipelined MHz | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | 表面贴装 | 2.7, 3.6 V | 36 Bit | 512 kWords | Synchronous | Compliant | 有 | 333 MHz | + 85 C | 3.6 V | - 40 C | 36 | -40 to 85 °C | Bulk | GS816136DGT | Pipeline/Flow Through | 85 °C | -40 °C | Memory & Data Storage | 18 Mbit | 4 | 280 mA, 335 mA | 4.5 ns | Flow-Through/Pipelined | 512 k x 36 | 19 Bit | SRAM | 18 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321E36AGD-150V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 133@Flow-Through/150@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | Compliant | 150 MHz | + 70 C | 2.7 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 0 to 85 °C | Bulk | GS8321E36AGD | 85 °C | 0 °C | 36 Mbit | 4 | 200 mA, 210 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 36 | 20 Bit | 36 Mbit | Commercial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662S09BD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Compliant | 333 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | FBGA | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | -40 to 100 °C | GS8662S09BD | 100 °C | -40 °C | 1.8 V | 72 Mbit | 2 | 640 mA | 0.45 | 8 M x 9 | 22 b | 72 Mb | 72 | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS864236GB-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 250 MHz | + 70 C | 3.6 V | 0 C | 2.3 V | SMD/SMT | Parallel | Commercial grade | FBGA | 0 to 70 °C | GS864236GB | 70 °C | 0 °C | 72 Mbit | 4 | 255 mA, 360 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 36 | 21 b | 72 Mb | Commercial | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T08BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 165 | Industrial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | -40 to 85 °C | 85 °C | -40 °C | 1.8 V | 1 | Pipelined | 20 Bit | 18 Mbit | Industrial | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D08BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | Industrial grade | 400 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Bulk | GS8342D08BGD | SigmaQuad-II | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 715 mA | Pipelined | 4 M x 8 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T06BGD-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Industrial grade | 500 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 500 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Tray | GS8662T06BGD | SigmaQuad-II+ | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 770 mA | Pipelined | 8 M x 8 | 22 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS864436E-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 200 MHz | + 70 C | 3.6 V | 0 C | 15 | 0 to 70 °C | Tray | GS864436E | 同步突发 | 70 °C | 0 °C | Memory & Data Storage | 72 Mbit | 4 | 270 mA, 345 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 36 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302S36GE-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | DDR-II | Commercial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 10 | 0 to 85 °C | Bulk | GS81302S36GE | SigmaSIO DDR-II | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 144 Mbit | 2 | 1.055 A | Pipelined | 4 M x 36 | 21 Bit | SRAM | 144 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662TT37BD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | Industrial grade | 333 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 36 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | -40 to 100 °C | Bulk | GS8662TT37BD | SigmaDDR-II+ B2 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 1 | 695 mA | Pipelined | 2 M x 36 | 20 Bit | SRAM | 72 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D19GE-300I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | YES | 165 | 165 | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 300 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | LBGA, | GRID ARRAY, LOW PROFILE | 3 | 8000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 有 | GS81302D19GE-300I | 1.8 V | LBGA | RECTANGULAR | 不推荐 | GSI TECHNOLOGY | 5.33 | BGA | Industrial grade | 300 MHz | QDR | 1.8000 V | -40 to 100 °C | Tray | GS81302D19GE | e1 | 有 | 3A991.B.2.B | SigmaQuad-II+ B4 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 144 Mbit | 2 | SYNCHRONOUS | 825 mA | Pipelined | 8 M x 18 | 1.5 mm | 18 | 21 Bit | SRAM | 144 Mbit | 150994944 bit | Industrial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 17 mm | 15 mm | |||||||||||||||||||||||||||||
![]() | GS8662TT06BD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 表面贴装 | Compliant | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 8000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 0.45 ns | 70 °C | 无 | GS8662TT06BD-400 | 400 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.23 | BGA | Commercial grade | 400 MHz | FBGA | DDR | 0 to 85 °C | Bulk | GS8662TT06BD | e0 | 无 | 3A991.B.2.B | SigmaQuad-II+ | Tin/Lead (Sn/Pb) | 85 °C | 0 °C | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | COMMERCIAL | 72 Mbit | 1 | SYNCHRONOUS | 625 mA | Pipelined | 8 M x 8 | 3-STATE | 1.4 mm | 8 | 22 Bit | SRAM | 72 Mbit | 0.235 A | 67108864 bit | Commercial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | 无 | ||||||||||||||||||
![]() | GS8342D36BD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | DDR | Industrial grade | 400 MHz | FBGA | 1.8000 V | 1.7 V | Synchronous | 36 Bit | 1.9 V | Compliant | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | -40 to 100 °C | Bulk | GS8342D36BD | SigmaQuad-II | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 915 mA | 0.45 | 1 M x 36 | 18 b | SRAM | 36 Mb | 36 | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8342D10BD-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | Industrial grade | 350 MHz | FBGA | 1.8000 V | 1.7 V | Synchronous | 9 Bit | 1.9 V | Compliant | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | DDR | SigmaQuad-II+ | GSI技术 | -40 to 100 °C | Bulk | GS8342D10BD | SigmaQuad-II+ B4 | 100 °C | -40 °C | Memory & Data Storage | 1.8 V | 36 Mbit | 2 | 675 mA | 0.45 | 4 M x 9 | 20 b | SRAM | 36 Mb | 36 | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS4288S09L-25 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 144 | Compliant | 95 °C | 0 °C | 1.8 V | 9 b | 24 b | 288 Mb | 400 MHz | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182R09BD-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 165 | 165 | 未说明 | 0.45 ns | 70 °C | 无 | GS8182R09BD-375 | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.19 | BGA | Commercial grade | 375 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 9 Bit | 1.9 V | 表面贴装 | Compliant | LBGA, | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | 0 to 70 °C | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 流水线结构 | 8542.32.00.41 | CMOS | 1.8 V | BOTTOM | BALL | 未说明 | 1 | 1 mm | not_compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 1 | SYNCHRONOUS | Pipelined | 2MX9 | 1.4 mm | 9 | 19 Bit | 18 Mbit | 18874368 bit | Commercial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | 15 mm | 13 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS864236GB-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | BGA-119 | YES | 119 | 119-FPBGA (22x14) | 119 | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | GSI Technology Inc. | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Tray | GS864236 | 活跃 | BGA, | 网格排列 | 3 | 2000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 6.5 ns | 85 °C | 有 | GS864236GB-250I | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 4.59 | BGA | Industrial grade | 153.8@Flow-Through/250@Pipelined MHz | FBGA | -40 to 85 °C | Tray | GS864236GB | e1 | 有 | 3A991.B.2.B | SCD/DCD Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | SRAM - Synchronous, Standard | 2.3V ~ 2.7V, 3V ~ 3.6V | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | INDUSTRIAL | 72 Mbit | 4 | SYNCHRONOUS | 250 MHz | 275 mA, 380 mA | 6.5 ns | SRAM | Parallel | Flow-Through/Pipelined | 2 M x 36 | 1.99 mm | 36 | - | 21 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | 缓存SRAM | 2.7 V | 2.3 V | SRAM | 2M x 36 | 22 mm | 14 mm | ||||||||||||||
![]() | GS81302T18GE-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-165 | 165 | 165-FPBGA (15x17) | GSI Technology Inc. | Details | DDR-II | Tray | GS81302T18 | 活跃 | 350 MHz | FBGA | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | -40 to 100 °C | Tray | GS81302T18GE | SigmaDDR-II B2 | Memory & Data Storage | SRAM - Quad Port, Synchronous, DDR II | 1.7V ~ 1.9V | 144 Mbit | 350 MHz | 810 mA | 0.45 | SRAM | Parallel | 8 M x 18 | - | SRAM | 144 | SRAM | 8M x 18 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816118DGT-333IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | 200@Flow-Through/333@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | Compliant | 有 | 333 MHz | + 100 C | 2.7 V | - 40 C | 18 | -40 to 100 °C | Bulk | GS816118DGT | 同步突发 | 100 °C | -40 °C | Memory & Data Storage | 18 Mbit | 2 | 240 mA, 300 mA | 5 ns | Flow-Through/Pipelined | 1 M x 18 | 20 Bit | SRAM | 18 Mbit | Industrial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8322Z36AGD-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | Compliant | 有 | 375 MHz | + 70 C | 3.6 V | 0 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 3 | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 4.2 ns | 70 °C | 有 | GS8322Z36AGD-375 | 375 MHz | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.12 | BGA | Commercial grade | 238@Flow-Through/375@Pipelined MHz | FBGA | 0 to 85 °C | Bulk | GS8322Z36AGD | e1 | 有 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | 0 °C | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 2.5/3.3 V | COMMERCIAL | 36 Mbit | 4 | SYNCHRONOUS | 270 mA, 380 mA | 4.2 ns | Flow-Through/Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 20 Bit | SRAM | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | 无 | |||||||||||||||||
![]() | GS864036GT-167V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | Synchronous | 1.7, 2.3 V | 1.8, 2.5 V | SDR | TQFP | 125@Flow-Through/167@Pipelined MHz | Compliant | 有 | 167 MHz | + 70 C | 2.7 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | LQFP, | FLATPACK, LOW PROFILE | 3 | 2000000 | PLASTIC/EPOXY | 未说明 | 8 ns | 70 °C | 有 | GS864036GT-167V | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.37 | QFP | Commercial grade | 表面贴装 | 2, 2.7 V | 36 Bit | 2 MWords | 0 to 70 °C | Tray | GS864036GT | e3 | 有 | 3A991.B.2.B | 同步突发 | Matte Tin (Sn) | 70 °C | 0 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | COMMERCIAL | 72 Mbit | 4 | SYNCHRONOUS | 220 mA, 270 mA | 8 ns | Flow-Through/Pipelined | 2 M x 36 | 1.6 mm | 36 | 21 Bit | SRAM | 72 Mbit | 75497472 bit | Commercial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 20 mm | 14 mm | 无 | ||||||||||||||||||||||||
![]() | GS8662S36BD-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | GSI技术 | SigmaSIO DDR-II | DDR | Commercial grade | 333 MHz | FBGA | DDR | 1.8000 V | Synchronous | 2 MWords | 36 Bit | 表面贴装 | Compliant | 有 | 333 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | 0 to 85 °C | Tray | GS8662S36BD | SigmaSIO DDR-II | 85 °C | 0 °C | Memory & Data Storage | 1.8 V | 72 Mbit | 2 | 810 mA | Pipelined | 2 M x 36 | 20 Bit | SRAM | 72 Mbit | Commercial | SRAM | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816036DGT-333IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | Industrial grade | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 36 Bit | 2, 2.7 V | 表面贴装 | Compliant | 有 | 333 MHz | + 100 C | 3.6 V | - 40 C | 18 | 2.3 V | SMD/SMT | -40 to 100 °C | Bulk | GS816036DGT | Pipeline/Flow Through | 100 °C | -40 °C | Memory & Data Storage | 18 Mbit | 4 | 280 mA, 335 mA | 4.5 ns | Flow-Through/Pipelined | 512 k x 36 | 20 b | SRAM | 18 Mbit | Industrial | SRAM | 无 |
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