品牌是'GSI' (10000)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

工厂交货时间

底架

安装类型

包装/外壳

表面安装

引脚数

供应商器件包装

终端数量

Current - Supply (Nom)

厂商

操作温度

包装

系列

JESD-609代码

无铅代码

ECCN 代码

类型

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

子类别

技术

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

Reach合规守则

频率

JESD-30代码

资历状况

电源

温度等级

内存大小

端口的数量

操作模式

时钟频率

电源电流-最大值

访问时间

内存格式

内存接口

建筑学

组织结构

输出特性

座位高度-最大

内存宽度

写入周期时间 - 字符、页面

地址总线宽度

产品类别

密度

待机电流-最大值

记忆密度

筛选水平

并行/串行

I/O类型

同步/异步

字长

内存IC类型

待机电压-最小值

电压 - 供电 (最大值)

电压 - 供电 (最小值)

产品类别

组织的记忆

长度

宽度

辐射硬化

GS8160Z36DGT-150
GS8160Z36DGT-150
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

10 Weeks

TQFP-100

YES

100

100

150 MHz

+ 85 C

3.6 V

0 C

2.3 V

SMD/SMT

Parallel

LQFP,

FLATPACK, LOW PROFILE

512000

PLASTIC/EPOXY

未说明

7.5 ns

70 °C

有

GS8160Z36DGT-150

2.5 V

LQFP

RECTANGULAR

GSI技术

活跃

GSI TECHNOLOGY

4.89

QFP

Commercial grade

133.3@Flow-Through/150@Pipelined MHz

TQFP

SDR

2.5, 3.3 V

2.3, 3 V

Synchronous

512 kWords

36 Bit

2.7, 3.6 V

表面贴装

0 to 85 °C

3A991.B.2.B

PIPELINE ARCHITECTURE, FLOW-THROUGH, ALSO OPERATES AT 3.3V

8542.32.00.41

CMOS

QUAD

鸥翼

未说明

1

0.65 mm

compliant

R-PQFP-G100

不合格

COMMERCIAL

18 Mbit

4

SYNCHRONOUS

180 mA, 190 mA

7.5 ns

Flow-Through/Pipelined

512 k x 36

1.6 mm

36

19 Bit

18 Mbit

18874368 bit

Commercial

PARALLEL

ZBT SRAM

2.7 V

2.3 V

20 mm

14 mm

GS882Z18CGB-200
GS882Z18CGB-200
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8 Weeks

YES

119

119

网格排列

3

512000

PLASTIC/EPOXY

未说明

6.5 ns

70 °C

有

GS882Z18CGB-200

524288 words

2.5 V

BGA

RECTANGULAR

GSI技术

活跃

GSI TECHNOLOGY

4.57

BGA

BGA,

e1

有

3A991.B.2.B

Tin/Silver/Copper (Sn/Ag/Cu)

FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY

8542.32.00.41

CMOS

BOTTOM

BALL

260

1

1.27 mm

compliant

R-PBGA-B119

不合格

COMMERCIAL

SYNCHRONOUS

512KX18

1.77 mm

18

9437184 bit

PARALLEL

ZBT SRAM

2.7 V

2.3 V

22 mm

14 mm

GS816018DGT-200V
GS816018DGT-200V
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

TQFP-100

100

GSI技术

SyncBurst

SDR

153.8@Flow-Through/200@Pipelined MHz

TQFP

1.8, 2.5 V

1.7, 2.3 V

Synchronous

18 Bit

2, 2.7 V

Compliant

有

200 MHz

+ 85 C

3.6 V

0.469316 oz

0 C

18

2.3 V

SMD/SMT

Parallel

GSI技术

0 to 85 °C

Bulk

GS816018DGT

Pipeline/Flow Through

85 °C

0 °C

Memory & Data Storage

18 Mbit

2

195 mA

6.5@Flow-Through/3@P

1 M x 18

21 b

SRAM

18 Mb

18

SRAM

无

GS816136DGD-200
GS816136DGD-200
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

10 Weeks

BGA-165

YES

165

165

LBGA,

GRID ARRAY, LOW PROFILE

512000

PLASTIC/EPOXY

未说明

6.5 ns

70 °C

有

GS816136DGD-200

524288 words

2.5 V

LBGA

RECTANGULAR

活跃

GSI TECHNOLOGY

4.78

BGA

有

200 MHz

+ 70 C

3.6 V

0 C

36

2.3 V

SMD/SMT

Parallel

GSI技术

GSI技术

SyncBurst

Details

SDR

Tray

GS816136DGD

3A991.B.2.B

Pipeline/Flow Through

FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

未说明

1

1 mm

compliant

R-PBGA-B165

COMMERCIAL

18 Mbit

SYNCHRONOUS

210 mA

6.5 ns

512 k x 36

1.4 mm

36

SRAM

18874368 bit

PARALLEL

缓存SRAM

2.7 V

2.3 V

SRAM

15 mm

13 mm

GS8162Z36BD-150
GS8162Z36BD-150
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

165

190 mA

512000

Compliant

70 °C

0 °C

133.3 MHz

4

7.5 ns

19 b

18 Mb

Synchronous

36 b

3.6 V

2.3 V

无

GS8342Q09AE-250
GS8342Q09AE-250
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Compliant

70 °C

0 °C

1.8 V

2

21 b

36 Mb

无

GS8160Z36DGT-333IV
GS8160Z36DGT-333IV
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-100

100

100-TQFP (20x14)

GSI Technology Inc.

SMD/SMT

1.7 V

18

- 40 C

2.7 V

+ 100 C

333 MHz

有

Tray

GS8160Z36

活跃

Industrial grade

333 MHz

TQFP

SDR

1.8, 2.5 V

1.7, 2.3 V

Synchronous

512 kWords

36 Bit

2, 2.7 V

表面贴装

SDR

Details

NBT SRAM

GSI技术

GSI技术

Parallel

-40 to 85 °C

Tray

GS8160Z36DGT

NBT

Memory & Data Storage

SRAM - Synchronous, ZBT

1.7V ~ 2V, 2.3V ~ 2.7V

18 Mbit

4

333 MHz

260 mA, 330 mA

5 ns

SRAM

Parallel

Flow-Through/Pipelined

512 k x 36

-

19 Bit

SRAM

18 Mbit

Industrial

SRAM

512K x 36

GS8662T18BGD-400I
GS8662T18BGD-400I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-165

165

165-FPBGA (13x15)

GSI Technology Inc.

GSI技术

SigmaDDR-II

Details

DDR-II

Tray

GS8662T

活跃

Industrial grade

400 MHz

FBGA

DDR

1.8000 V

Synchronous

4 MWords

18 Bit

表面贴装

有

400 MHz

+ 85 C

1.9 V

- 40 C

15

1.7 V

SMD/SMT

Parallel

GSI技术

-40 to 100 °C

Tray

GS8662T18BGD

SigmaDDR-II B2

Memory & Data Storage

SRAM - Quad Port, Synchronous, DDR II

1.7V ~ 1.9V

72 Mbit

1

400 MHz

635 mA

SRAM

Parallel

Pipelined

4 M x 18

-

22 Bit

SRAM

72 Mbit

Industrial

SRAM

4M x 18

GS881Z36CGD-333I
GS881Z36CGD-333I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-165

165

165-FPBGA (13x15)

GSI Technology Inc.

2.3 V

SMD/SMT

Parallel

GSI技术

GSI技术

NBT SRAM

Details

SDR

Tray

GS881Z

活跃

Industrial grade

222.2@Flow-Through/333@Pipelined MHz

FBGA

SDR

2.5, 3.3 V

2.3, 3 V

Synchronous

256 kWords

36 Bit

2.7, 3.6 V

表面贴装

有

333 MHz

+ 85 C

3.6 V

- 40 C

36

-40 to 85 °C

Tray

GS881Z36CGD

NBT Pipeline/Flow Through

Memory & Data Storage

SRAM - Synchronous, ZBT

2.3V ~ 2.7V, 3V ~ 3.6V

9 Mbit

1

333 MHz

200 mA, 260 mA

4.5 ns

SRAM

Parallel

Flow-Through/Pipelined

256 k x 36

-

18 Bit

SRAM

9 Mbit

Industrial

SRAM

256K x 36

GS8342Q36BGD-357I
GS8342Q36BGD-357I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-165

165

165-FPBGA (13x15)

GSI Technology Inc.

1.7 V

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaQuad-II

Details

DDR

Tray

GS8342Q

活跃

Industrial grade

357 MHz

FBGA

QDR

1.8000 V

1.7 V

Synchronous

1 MWords

36 Bit

1.9 V

表面贴装

有

357 MHz

+ 85 C

1.9 V

- 40 C

15

-40 to 100 °C

Tray

GS8342Q36BGD

SigmaQuad-II

Memory & Data Storage

SRAM - Quad Port, Synchronous, QDR II

1.7V ~ 1.9V

36 Mbit

2

357 MHz

1.155 A

SRAM

Parallel

Pipelined

1 M x 36

-

19 Bit

SRAM

36 Mbit

Industrial

SRAM

1M x 36

GS8320Z18AGT-250I
GS8320Z18AGT-250I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8 Weeks

表面贴装

100-LQFP

YES

100

100-TQFP (20x14)

100

- 40 C

GSI Technology Inc.

2.3 V

SMD/SMT

Parallel

LQFP,

FLATPACK, LOW PROFILE

2000000

PLASTIC/EPOXY

未说明

有

GS8320Z18AGT-250I

2097152 words

2.5 V

LQFP

RECTANGULAR

GSI技术

活跃

GSI TECHNOLOGY

4.85

181.8@Flow-Through/250@Pipelined MHz

TQFP

2.5, 3.3 V

2.3, 3 V

Synchronous

18 Bit

2.7, 3.6 V

Tray

GS8320Z

活跃

Volatile

250 MHz

+ 85 C

3.6 V

-40 to 85 °C

-

3A991.B.2.B

IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE

SRAM - Synchronous, ZBT

2.3V ~ 2.7V, 3V ~ 3.6V

QUAD

鸥翼

未说明

1

0.65 mm

compliant

R-PQFP-G100

36Mbit

SYNCHRONOUS

250 MHz

235 mA, 275 mA

5.5@Flow-Through/2.5

SRAM

Parallel

2 M x 18

1.6 mm

18

-

36

PARALLEL

ZBT SRAM

2.7 V

2.3 V

2M x 18

20 mm

14 mm

GS8642Z36GB-250IV
GS8642Z36GB-250IV
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8 Weeks

表面贴装

BGA-119

YES

119

119-FPBGA (22x14)

119

SDR

1.8, 2.5 V

1.7, 2.3 V

Synchronous

2 MWords

36 Bit

2, 2.7 V

表面贴装

有

250 MHz

+ 85 C

2.7 V

- 40 C

GSI Technology Inc.

14

1.7 V

SMD/SMT

Parallel

GSI技术

GSI技术

NBT SRAM

Details

SDR

Tray

GS8642Z

活跃

BGA,

网格排列

3

2000000

PLASTIC/EPOXY

-40 °C

未说明

6.5 ns

85 °C

有

GS8642Z36GB-250IV

1.8 V

BGA

RECTANGULAR

活跃

GSI TECHNOLOGY

5.16

BGA

Industrial grade

166.6@Flow-Through/250@Pipelined MHz

FBGA

-40 to 85 °C

Tray

GS8642Z36GB

e1

有

3A991.B.2.B

NBT Pipeline/Flow Through

Tin/Silver/Copper (Sn/Ag/Cu)

FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY

8542.32.00.41

Memory & Data Storage

SRAM - Synchronous, ZBT

1.7V ~ 2V, 2.3V ~ 2.7V

BOTTOM

BALL

260

1

1.27 mm

compliant

R-PBGA-B119

不合格

INDUSTRIAL

72 Mbit

4

SYNCHRONOUS

250 MHz

275 mA, 380 mA

6.5 ns

SRAM

Parallel

Flow-Through/Pipelined

2 M x 36

1.99 mm

36

-

21 Bit

SRAM

72 Mbit

75497472 bit

Industrial

PARALLEL

ZBT SRAM

2 V

1.7 V

SRAM

2M x 36

22 mm

14 mm

GS816136DGD-333I
GS816136DGD-333I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-165

165

165-FPBGA (13x15)

GSI Technology Inc.

2.3 V

SMD/SMT

Parallel

GSI技术

GSI技术

SyncBurst

Details

SDR

Tray

GS816136

活跃

Industrial grade

222.2@Flow-Through/333@Pipelined MHz

FBGA

SDR

2.5, 3.3 V

2.3, 3 V

Synchronous

512 kWords

36 Bit

2.7, 3.6 V

表面贴装

有

333 MHz

+ 85 C

3.6 V

- 40 C

36

-40 to 85 °C

Tray

GS816136DGD

Pipeline/Flow Through

Memory & Data Storage

SRAM - Synchronous, Standard

2.3V ~ 2.7V, 3V ~ 3.6V

18 Mbit

4

333 MHz

280 mA, 335 mA

4.5 ns

SRAM

Parallel

Flow-Through/Pipelined

512 k x 36

-

19 Bit

SRAM

18 Mbit

Industrial

SRAM

512K x 36

GS8342T18BGD-400I
GS8342T18BGD-400I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA-165

165

165-FPBGA (13x15)

GSI Technology Inc.

1.7 V

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaCIO DDR-II

Details

DDR

Tray

GS8342T

活跃

Industrial grade

400 MHz

FBGA

DDR

1.8000 V

1.7 V

Synchronous

2 MWords

18 Bit

1.9 V

表面贴装

有

400 MHz

+ 85 C

1.9 V

- 40 C

15

-40 to 100 °C

Tray

GS8342T18BGD

SigmaDDR-II B2

Memory & Data Storage

SRAM - Quad Port, Synchronous, DDR II

1.7V ~ 1.9V

36 Mbit

1

400 MHz

610 mA

SRAM

Parallel

Pipelined

2 M x 18

-

21 Bit

SRAM

36 Mbit

Industrial

SRAM

2M x 18

GS816018DGT-250I
GS816018DGT-250I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

10 Weeks

表面贴装

TQFP-100

YES

100

100-TQFP (20x14)

100

Details

SDR

Tray

GSI Technology Inc.

GS816018

活跃

LQFP,

FLATPACK, LOW PROFILE

1000000

PLASTIC/EPOXY

-40 °C

未说明

5.5 ns

85 °C

有

GS816018DGT-250I

1048576 words

2.5 V

LQFP

RECTANGULAR

活跃

GSI TECHNOLOGY

4.84

QFP

有

250 MHz

+ 100 C

3.6 V

- 40 C

36

2.3 V

SMD/SMT

Parallel

GSI技术

GSI技术

SyncBurst

-40°C ~ 100°C (TJ)

Tray

GS816018DGT

3A991.B.2.B

Pipeline/Flow Through

FLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V

8542.32.00.41

Memory & Data Storage

SRAM - Synchronous, Standard

2.3V ~ 2.7V, 3V ~ 3.6V

QUAD

鸥翼

未说明

1

0.65 mm

compliant

R-PQFP-G100

INDUSTRIAL

18 Mbit

SYNCHRONOUS

250 MHz

230 mA, 250 mA

5.5 ns

SRAM

Parallel

1 M x 18

1.6 mm

8

-

SRAM

8388608 bit

PARALLEL

缓存SRAM

2.7 V

2.3 V

SRAM

1M x 18

20 mm

14 mm

GS88036CGT-333I
GS88036CGT-333I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-100

100

100-TQFP (20x14)

GSI Technology Inc.

Parallel

GSI技术

GSI技术

SyncBurst

Details

SDR

Tray

GS88036

活跃

Industrial grade

TQFP

SDR

2.5, 3.3 V

2.3, 3 V

Synchronous

256 kWords

36 Bit

2.7, 3.6 V

表面贴装

有

333 MHz

+ 85 C

3.6 V

- 40 C

36

2.3 V

SMD/SMT

-40 to 85 °C

Tray

GS88036CGT

Pipeline/Flow Through

Memory & Data Storage

SRAM - Synchronous, Standard

2.3V ~ 2.7V, 3V ~ 3.6V

9 Mbit

4

333 MHz

200 mA, 260 mA

4.5 ns

SRAM

Parallel

Flow-Through/Pipelined

256 k x 36

-

SRAM

9 Mbit

Industrial

SRAM

256K x 36

GS816036DGT-150
GS816036DGT-150
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

TQFP-100

100

2.3 V

SMD/SMT

Parallel

GSI技术

GSI技术

SyncBurst

Details

SDR

Commercial grade

133.3@Flow-Through/150@Pipelined MHz

TQFP

SDR

2.5, 3.3 V

2.3, 3 V

Synchronous

512 kWords

36 Bit

2.7, 3.6 V

表面贴装

有

150 MHz

+ 85 C

3.6 V

0 C

36

0 to 85 °C

Tray

GS816036DGT

Pipeline/Flow Through

Memory & Data Storage

18 Mbit

4

180 mA, 190 mA

7.5 ns

Flow-Through/Pipelined

512 k x 36

20 Bit

SRAM

18 Mbit

Commercial

SRAM

GS8342Q36BGD-333I
GS8342Q36BGD-333I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

10 Weeks

BGA-165

YES

165

165

QDR

1.8000 V

1.7 V

Synchronous

1 MWords

36 Bit

1.9 V

表面贴装

有

333 MHz

+ 85 C

1.9 V

- 40 C

15

1.7 V

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaQuad-II

Details

DDR

LBGA, BGA165,11X15,40

GRID ARRAY, LOW PROFILE

1000000

PLASTIC/EPOXY

BGA165,11X15,40

-40 °C

未说明

0.45 ns

85 °C

有

GS8342Q36BGD-333I

333 MHz

1.8 V

LBGA

RECTANGULAR

活跃

GSI TECHNOLOGY

4.91

BGA

Industrial grade

333 MHz

FBGA

-40 to 100 °C

Tray

GS8342Q36BGD

3A991.B.2.B

SigmaQuad-II

流水线结构

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

未说明

1

1 mm

compliant

R-PBGA-B165

不合格

1.5/1.8,1.8 V

INDUSTRIAL

36 Mbit

2

SYNCHRONOUS

1.065 A

450 ps

Pipelined

1 M x 36

3-STATE

1.4 mm

36

19 Bit

SRAM

36 Mbit

0.245 A

37748736 bit

Industrial

PARALLEL

SEPARATE

QDR SRAM

1.7 V

1.9 V

1.7 V

SRAM

15 mm

13 mm

GS8342Q09BD-250I
GS8342Q09BD-250I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

10 Weeks

BGA-165

YES

165

165

Synchronous

4 MWords

9 Bit

表面贴装

有

250 MHz

+ 85 C

1.9 V

0.541455 oz

- 40 C

15

1.7 V

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaQuad-II

DDR

LBGA, BGA165,11X15,40

GRID ARRAY, LOW PROFILE

4000000

PLASTIC/EPOXY

BGA165,11X15,40

-40 °C

0.45 ns

85 °C

无

GS8342Q09BD-250I

250 MHz

1.8 V

LBGA

RECTANGULAR

活跃

GSI TECHNOLOGY

5.06

BGA

Industrial grade

250 MHz

FBGA

QDR

1.8000 V

-40 to 100 °C

Tray

GS8342Q09BD

3A991.B.2.B

SigmaQuad-II

流水线结构

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

1

1 mm

compliant

R-PBGA-B165

不合格

1.5/1.8,1.8 V

INDUSTRIAL

36 Mbit

2

SYNCHRONOUS

675 mA

450 ps

Pipelined

4 M x 9

3-STATE

1.4 mm

9

21 Bit

SRAM

36 Mbit

0.215 A

37748736 bit

Industrial

PARALLEL

SEPARATE

QDR SRAM

1.7 V

1.9 V

1.7 V

SRAM

15 mm

13 mm

GS8160Z36DGT-333I
GS8160Z36DGT-333I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-100

100

100-TQFP (20x14)

GSI Technology Inc.

36

2.3 V

SMD/SMT

Parallel

GSI技术

GSI技术

NBT SRAM

SDR

Tray

GS8160Z36

活跃

Industrial grade

222.2@Flow-Through/333@Pipelined MHz

TQFP

SDR

2.5, 3.3 V

2.3, 3 V

Synchronous

512 kWords

36 Bit

2.7, 3.6 V

表面贴装

Compliant

有

333 MHz

+ 100 C

3.6 V

- 40 C

-40 to 100 °C

Bulk

GS8160Z36DGT

NBT Pipeline/Flow Through

100 °C

-40 °C

Memory & Data Storage

SRAM - Synchronous, ZBT

2.3V ~ 2.7V, 3V ~ 3.6V

18 Mbit

4

333 MHz

280 mA, 335 mA

4.5 ns

SRAM

Parallel

Flow-Through/Pipelined

512 k x 36

-

19 Bit

SRAM

18 Mbit

Industrial

SRAM

512K x 36

无

GS8320Z18AGT-333I
GS8320Z18AGT-333I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-100

100

100-TQFP (20x14)

GSI Technology Inc.

2.3 V

SMD/SMT

Parallel

GSI技术

GSI技术

NBT SRAM

Details

SDR

Tray

GS8320Z

活跃

Industrial grade

333 MHz

TQFP

SDR

2.5, 3.3 V

2.3, 3 V

Synchronous

2 MWords

18 Bit

2.7, 3.6 V

表面贴装

有

333 MHz

+ 85 C

3.6 V

- 40 C

18

-40 to 85 °C

Tray

GS8320Z18AGT

NBT Pipeline/Flow Through

Memory & Data Storage

SRAM - Synchronous, ZBT

2.3V ~ 2.7V, 3V ~ 3.6V

36 Mbit

2

333 MHz

255 mA, 340 mA

4.5 ns

SRAM

Parallel

Flow-Through/Pipelined

2 M x 18

-

21 Bit

SRAM

36 Mbit

Industrial

SRAM

2M x 18

GS8320Z18AGT-150V
GS8320Z18AGT-150V
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

TQFP-100

100

133.3@Flow-Through/150@Pipelined MHz

TQFP

SDR

1.8, 2.5 V

1.7, 2.3 V

Synchronous

2 MWords

18 Bit

2, 2.7 V

表面贴装

Compliant

150 MHz

+ 70 C

2.7 V

0 C

1.7 V

SMD/SMT

Parallel

Commercial grade

0 to 85 °C

Bulk

GS8320Z18AGT

85 °C

0 °C

36 Mbit

2

185 mA, 200 mA

7.5 ns

Flow-Through/Pipelined

2 M x 18

21 Bit

36 Mbit

Commercial

无

GS8322Z36AD-200
GS8322Z36AD-200
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8 Weeks, 5 Days

BGA-165

YES

165

165

Synchronous

表面贴装

2.7, 3.6 V

36 Bit

1 MWords

有

200 MHz

+ 70 C

3.6 V

0 C

14

2.3 V

SMD/SMT

Parallel

GSI技术

GSI技术

NBT SRAM

N

SDR

LBGA, BGA165,11X15,40

GRID ARRAY, LOW PROFILE

1000000

PLASTIC/EPOXY

BGA165,11X15,40

未说明

6.5 ns

70 °C

无

GS8322Z36AD-200

200 MHz

2.5 V

LBGA

RECTANGULAR

活跃

GSI TECHNOLOGY

4.74

BGA

Commercial grade

FBGA

SDR

2.5, 3.3 V

2.3, 3 V

0 to 85 °C

Tray

GS8322Z36AD

e0

无

3A991.B.2.B

NBT Pipeline/Flow Through

Tin/Lead (Sn/Pb)

85 °C

0 °C

ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

未说明

1

1 mm

compliant

R-PBGA-B165

不合格

2.5/3.3 V

COMMERCIAL

36 Mbit

4

SYNCHRONOUS

205 mA, 240 mA

6.5 ns

Flow-Through/Pipelined

1 M x 36

3-STATE

1.4 mm

36

20 b

SRAM

36 Mbit

0.03 A

37748736 bit

Commercial

PARALLEL

COMMON

ZBT SRAM

2.3 V

2.7 V

2.3 V

SRAM

15 mm

13 mm

无

GS880F36CGT-6.5I
GS880F36CGT-6.5I
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8 Weeks

TQFP-100

YES

100

100

GSI技术

SyncBurst

Details

SDR

LQFP, QFP100,.63X.87

FLATPACK, LOW PROFILE

3

256000

PLASTIC/EPOXY

QFP100,.63X.87

-40 °C

未说明

6.5 ns

85 °C

有

GS880F36CGT-6.5I

153 MHz

262144 words

2.5 V

LQFP

RECTANGULAR

活跃

GSI TECHNOLOGY

4.9

QFP

有

-

+ 85 C

3.6 V

- 40 C

72

2.3 V

SMD/SMT

Parallel

GSI技术

Tray

GS880F36CGT

e3

有

3A991.B.2.B

流过

纯哑光锡

FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY

8542.32.00.41

Memory & Data Storage

CMOS

QUAD

鸥翼

260

1

0.65 mm

compliant

R-PQFP-G100

不合格

2.5/3.3 V

INDUSTRIAL

9 Mbit

SYNCHRONOUS

160 mA

6.5 ns

256 k x 36

3-STATE

1.6 mm

36

SRAM

0.045 A

9437184 bit

PARALLEL

COMMON

缓存SRAM

2.3 V

2.7 V

2.3 V

SRAM

20 mm

14 mm

GS8342Q09BD-250
GS8342Q09BD-250
GSI Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

BGA-165

165

1.7 V

SMD/SMT

Parallel

GSI技术

GSI技术

SigmaQuad-II

N

DDR

Commercial grade

250 MHz

FBGA

QDR

1.8000 V

1.7 V

Synchronous

4 MWords

9 Bit

1.9 V

表面贴装

有

250 MHz

+ 70 C

1.9 V

0 C

15

0 to 85 °C

Tray

GS8342Q09BD

SigmaQuad-II

Memory & Data Storage

36 Mbit

2

665 mA

450 ps

Pipelined

4 M x 9

21 Bit

SRAM

36 Mbit

Commercial

SRAM