品牌是'GSI' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 内存大小 | 端口的数量 | 操作模式 | 电源电流-最大值 | 访问时间 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS81302TT11E-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR-II | Commercial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302TT11E | SigmaDDR-II+ | Memory & Data Storage | 144 Mbit | 1 | 800 mA | Pipelined | 16 M x 9 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662T09BD-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaCIO DDR-II | N | DDR | Commercial grade | 350 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662T09BD | SigmaDDR-II B2 | Memory & Data Storage | 72 Mbit | 1 | 590 mA | Pipelined | 8 M x 9 | 22 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662R09BD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | N | DDR | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | 0 to 85 °C | Tray | GS8662R09BD | SigmaDDR-II B4 | Memory & Data Storage | 72 Mbit | 1 | 625 mA | Pipelined | 8 M x 9 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302T19E-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR-II | Commercial grade | 400 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302T19E | SigmaDDR-II+ B2 | Memory & Data Storage | 144 Mbit | 1 | 895 mA | Pipelined | 8 M x 18 | 22 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662DT11BGD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | 1.9 V | 0 C | 1.7 V | SMD/SMT | Parallel | Commercial grade | 400 MHz | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 9 Bit | 1.9 V | 400 MHz | + 70 C | 0 to 85 °C | 72 Mbit | 735 mA | 0.45 | 8 M x 9 | 72 | Commercial | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8673EQ18BK-714X | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 260 | 714 MHz | BGA | QDR | Synchronous | 4 MWords | 18 Bit | 表面贴装 | Commercial grade | 0 to 70 °C | 1 | Pipelined | 21 Bit | 72 Mbit | Commercial | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662Q18BD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 18 Bit | 1.9 V | 表面贴装 | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8662Q18BD-250I | 250 MHz | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.19 | BGA | 250 MHz | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | Industrial grade | 250 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | -40 to 100 °C | GS8662Q18BD | e0 | 无 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | 流水线结构 | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | 1.5/1.8,1.8 V | INDUSTRIAL | 72 Mbit | 2 | SYNCHRONOUS | 0.73 mA | Pipelined | 4MX18 | 3-STATE | 1.4 mm | 18 | 21 Bit | 72 Mbit | 75497472 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 1.9 V | 1.7 V | 15 mm | 13 mm | |||||||||||||||
![]() | GS8642Z36B-167IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 119 | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Industrial grade | 125@Flow-Through/167@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 167 MHz | + 85 C | 2.7 V | - 40 C | 14 | 1.7 V | SMD/SMT | -40 to 85 °C | Tray | GS8642Z36B | NBT Pipeline/Flow Through | Memory & Data Storage | 72 Mbit | 4 | 240 mA, 290 mA | 8 ns | Flow-Through/Pipelined | 2 M x 36 | 21 Bit | SRAM | 72 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8160E36DGT-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Commercial grade | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 375 MHz | + 85 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | 0 to 85 °C | Tray | GS8160E36DGT | Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 4 | 270 mA, 350 mA | 4.2 ns | Flow-Through/Pipelined | 512 k x 36 | SRAM | 18 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS78132AGB-8I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-119 | YES | 119 | 119 | 表面贴装 | + 85 C | 3.6 V | - 40 C | 21 | 3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | Details | SDR | BGA, | 网格排列 | 3 | 256000 | PLASTIC/EPOXY | -40 °C | 未说明 | 8 ns | 85 °C | 有 | GS78132AGB-8I | 3.3 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.23 | BGA | Industrial grade | FBGA | 3.3000 V | 3 V | Asynchronous | 256 kWords | 32 Bit | 3.6 V | -40 to 85 °C | GS78132AGB | e1 | 有 | 3A991.B.2.B | Asynchronous | 锡银铜 | THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT. | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | INDUSTRIAL | 8 Mbit | 4 | ASYNCHRONOUS | 280 mA | 8 ns | 256 k x 32 | 1.99 mm | 32 | 18 Bit | SRAM | 8 Mbit | 8388608 bit | Industrial | PARALLEL | 标准SRAM | 3.6 V | 3 V | SRAM | 22 mm | 14 mm | ||||||||||||||||
![]() | GS8662D19BD-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 165 | 1.7 V | Synchronous | 4 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | DDR | LBGA, | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8662D19BD-450I | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.45 | BGA | Industrial grade | 450 MHz | FBGA | QDR | 1.8000 V | -40 to 100 °C | Tray | GS8662D19BD | e0 | 无 | 3A991.B.2.B | SigmaQuad-II+ B4 | Tin/Lead (Sn/Pb) | 管道结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B165 | 不合格 | INDUSTRIAL | 72 Mbit | 2 | SYNCHRONOUS | 830 mA | Pipelined | 4 M x 18 | 1.4 mm | 18 | 20 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | DDR SRAM | 1.9 V | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||||||
![]() | GS881Z32CD-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 100 | 165 | BGA, | 网格排列 | 256000 | PLASTIC/EPOXY | 未说明 | 7.5 ns | 70 °C | 无 | GS881Z32CD-150 | 262144 words | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.29 | QFP | 有 | 150 MHz | + 70 C | 3.6 V | 0 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | Tray | GS881Z32CD | e0 | 无 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Lead (Sn/Pb) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | 鸥翼 | 未说明 | 1 | 1 mm | not_compliant | R-PBGA-B165 | 不合格 | COMMERCIAL | 9 Mbit | SYNCHRONOUS | 130 mA, 140 mA | 7.5 ns | 256 k x 32 | 1.4 mm | 32 | SRAM | 8388608 bit | PARALLEL | ZBT SRAM | 2.7 V | 2.3 V | SRAM | 15 mm | 13 mm | |||||||||||||||||||||||||||
![]() | GS81302TT07E-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR-II | Commercial grade | 333 MHz | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302TT07E | SigmaDDR-II+ B2 | Memory & Data Storage | 144 Mbit | 1 | 755 mA | Pipelined | 16 M x 8 | 23 Bit | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8644Z36GE-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Commercial grade | 153.8@Flow-Through/200@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 200 MHz | + 70 C | 2.7 V | 0 C | 15 | 1.7 V | 0 to 70 °C | Tray | GS8644Z36GE | NBT | Memory & Data Storage | 72 Mbit | 4 | 270 mA, 345 mA | 6.5 ns | Flow-Through/Pipelined | 2 M x 36 | 21 Bit | SRAM | 72 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832218AB-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-119 | YES | 119 | 119 | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 2 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 333 MHz | + 85 C | 3.6 V | - 40 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | BGA, BGA119,7X17,50 | 网格排列 | 2000000 | PLASTIC/EPOXY | BGA119,7X17,50 | -40 °C | 未说明 | 4.5 ns | 85 °C | 无 | GS832218AB-333I | 333 MHz | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.11 | BGA | Industrial grade | 222@Flow-Through/333@Pipelined MHz | FBGA | -40 to 100 °C | Tray | GS832218AB | e0 | 无 | 3A991.B.2.B | Pipeline/Flow Through | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | R-PBGA-B119 | 不合格 | 2.5/3.3 V | INDUSTRIAL | 36 Mbit | 2 | SYNCHRONOUS | 255 mA, 340 mA | 4.5 ns | Flow-Through/Pipelined | 2 M x 18 | 3-STATE | 1.99 mm | 18 | 21 Bit | SRAM | 36 Mbit | 0.04 A | 37748736 bit | Industrial | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 22 mm | 14 mm | ||||
![]() | GS864272GC-167IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-209 | 209 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | 125@Flow-Through/167@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 72 Bit | 2, 2.7 V | 表面贴装 | 有 | 167 MHz | + 85 C | 2.7 V | - 40 C | 14 | 1.7 V | -40 to 85 °C | Tray | GS864272GC | SCD/DCD Pipeline/Flow Through | Memory & Data Storage | 72 Mbit | 8 | 280 mA, 360 mA | 8 ns | Flow-Through/Pipelined | 1 M x 72 | 20 Bit | SRAM | 72 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8321E36AGD-333IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | 200@Flow-Through/333@Pipelined MHz | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | 有 | 333 MHz | + 85 C | 2.7 V | - 40 C | 18 | 1.7 V | -40 to 100 °C | Tray | GS8321E36AGD | 同步突发 | Memory & Data Storage | 36 Mbit | 4 | 290 mA, 375 mA | 5 ns | Flow-Through/Pipelined | 1 M x 36 | 20 Bit | SRAM | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662D08BGD-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | Details | DDR | 400 MHz | FBGA | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 8 Bit | 1.9 V | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | -40 to 100 °C | Tray | GS8662D08BGD | SigmaQuad-II | Memory & Data Storage | 72 Mbit | 745 mA | 0.45 | 8 M x 8 | SRAM | 72 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8640Z36GT-167IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 100 | 100 | PLASTIC/EPOXY | -40 °C | 未说明 | 8 ns | 85 °C | 有 | GS8640Z36GT-167IV | 1.8 V | LQFP | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.36 | QFP | Industrial grade | 125@Flow-Through/167@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 2 MWords | 36 Bit | 2, 2.7 V | 表面贴装 | LQFP, | FLATPACK, LOW PROFILE | 3 | 2000000 | -40 to 85 °C | e3 | 有 | 3A991.B.2.B | Matte Tin (Sn) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | INDUSTRIAL | 4 | SYNCHRONOUS | Flow-Through/Pipelined | 2MX36 | 1.6 mm | 36 | 21 Bit | 72 Mbit | 75497472 bit | Industrial | PARALLEL | ZBT SRAM | 2 V | 1.7 V | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||
![]() | GS880E18CGT-333 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | Synchronous | 18 Bit | 2.7, 3.6 V | 有 | 333 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | QFP100,.63X.87 | 未说明 | 4.5 ns | 70 °C | 有 | GS880E18CGT-333 | 333 MHz | 524288 words | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.6 | QFP | 222.2@Flow-Through/333@Pipelined MHz | TQFP | 2.5, 3.3 V | 2.3, 3 V | 0 to 70 °C | Tray | GS880E18CGT | e3 | 有 | 3A991.B.2.B | DCD | 纯哑光锡 | PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 2.5/3.3 V | COMMERCIAL | 9 Mbit | SYNCHRONOUS | 165 mA, 220 mA | 4.5@Flow-Through/2.5 | 512 k x 18 | 3-STATE | 1.6 mm | 18 | SRAM | 0.025 A | 9 | PARALLEL | COMMON | 缓存SRAM | 2.3 V | 2.7 V | 2.3 V | SRAM | 20 mm | 14 mm | |||||||||||
![]() | GS8640E36GT-250V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 100 | 153.8@Flow-Through/250@Pipelined MHz | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 36 Bit | 2, 2.7 V | 有 | 250 MHz | + 70 C | 2.7 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | 0 to 70 °C | Tray | GS8640E36GT | DCD | Memory & Data Storage | 72 Mbit | 255 mA, 360 mA | 6.5@Flow-Through/3@P | 2 M x 36 | SRAM | 72 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8662QT19BGD-357 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | QDR-II | Commercial grade | 357 MHz | FBGA | 1.8000 V | 1.7 V | Synchronous | 18 Bit | 1.9 V | 有 | 357 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | Details | 0 to 85 °C | Tray | GS8662QT19BGD | SigmaQuad-II+ B2 | Memory & Data Storage | 72 Mbit | 985 mA | 0.45 | 4 M x 18 | SRAM | 72 | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS832272C-200V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-209 | YES | 209 | 209 | 2.7 V | 0 C | 1.7 V | SMD/SMT | Parallel | LBGA, | GRID ARRAY, LOW PROFILE | 512000 | PLASTIC/EPOXY | 未说明 | 7.5 ns | 70 °C | 无 | GS832272C-200V | 1.8 V | LBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.14 | BGA | Commercial grade | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 72 Bit | 2, 2.7 V | 表面贴装 | 200 MHz | + 70 C | 0 to 70 °C | GS832272C | 无 | 3A991.B.2.B | FLOW-THROUGH OR PIELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | R-PBGA-B209 | 不合格 | COMMERCIAL | 36 Mbit | 8 | SYNCHRONOUS | 235 mA, 320 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 72 | 1.7 mm | 72 | 36 Mbit | 37748736 bit | Commercial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | 22 mm | 14 mm | ||||||||||||||||||||||||||
![]() | GS832018AGT-333IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 100 | Synchronous | 2 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 333 MHz | + 85 C | 2.7 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, | FLATPACK, LOW PROFILE | 2000000 | PLASTIC/EPOXY | 未说明 | 5 ns | 有 | GS832018AGT-333IV | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.34 | QFP | Industrial grade | 200@Flow-Through/333@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | -40 to 100 °C | Tray | GS832018AGT | 3A991.B.2.B | 同步突发 | ALSO OPERTAES AT 2.5, SYNCHRONOUS BURST | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | 36 Mbit | 2 | SYNCHRONOUS | 265 mA, 350 mA | 5 ns | Flow-Through/Pipelined | 2 M x 18 | 1.6 mm | 18 | 21 Bit | SRAM | 36 Mbit | 37748736 bit | Industrial | PARALLEL | 缓存SRAM | 2 V | 1.7 V | SRAM | 20 mm | 14 mm | |||||||||||||||||
![]() | GS81302D08GE-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | QDR-II | Industrial grade | 375 MHz | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 375 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | -40 to 100 °C | Tray | GS81302D08GE | SigmaQuad-II | Memory & Data Storage | 144 Mbit | 2 | 1.005 A | Pipelined | 16 M x 8 | 22 Bit | SRAM | 144 Mbit | Industrial | SRAM |
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