品牌是'Intel' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | Contact plating | 表面安装 | Number of pins | 终端数量 | Connector pinout layout | Contacts pitch | Date Of Intro | Electrical mounting | Gross weight | Kind of connector | Row pitch | Spatial orientation | Type of connector | Operating temperature | JESD-609代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | Current rating | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 输出的数量 | 资历状况 | 温度等级 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | Rated voltage | 个人资料 | 长度 | 宽度 | Plating thickness | Flammability rating | |||||||||||||||||
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![]() | EP3C40F324I6N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | 活跃 | INTEL CORP | BGA, BGA324,18X18,40 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | 有 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B324 | 195 | 不合格 | 195 | 2475 CLBS | 1.9 mm | 现场可编程门阵列 | 39600 | 19 mm | 19 mm | ||||||||||||||||||||||||||||
![]() | EP1SGX25DF1020C5ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1020 | INTEL CORP | BGA, | 6 MHz | 85 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.5 V | 1.425 V | 1.575 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1020 | 607 | 不合格 | OTHER | 607 | 2566 CLBS | 3.5 mm | 现场可编程门阵列 | 7.49 ns | 33 mm | 33 mm | ||||||||||||||||||||||||||||
![]() | EP2SGX30CF780I4 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 780 | 无 | 活跃 | INTEL CORP | 29 X 29 MM, 1 MM PITCH, FBGA-780 | 622.08 MHz | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA780,28X28,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B780 | 361 | 不合格 | INDUSTRIAL | 361 | 33880 CLBS | 3.5 mm | 现场可编程门阵列 | 3.337 ns | 33880 | 33880 | 29 mm | 29 mm | ||||||||||||||||||||||||
![]() | EP1S10F1508C6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | INTEL CORP | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 85 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 不合格 | OTHER | 现场可编程门阵列 | 1057 | 10570 | 40 mm | 40 mm | |||||||||||||||||||||||||||||||
![]() | EP2S15F484I3 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | 活跃 | INTEL CORP | 3 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 334 | 不合格 | 342 | 现场可编程门阵列 | 15600 | ||||||||||||||||||||||||||||||||
![]() | EP1C12Q240C6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 240 | INTEL CORP | FQFP, | 405 MHz | 3 | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G240 | 不合格 | 12060 CLBS | 4.1 mm | 现场可编程门阵列 | 12060 | 32 mm | 32 mm | |||||||||||||||||||||||||||||||
![]() | EP1S20F1508I5ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | 活跃 | INTEL CORP | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 不合格 | 现场可编程门阵列 | 1846 | 18460 | 40 mm | 40 mm | |||||||||||||||||||||||||||||||
![]() | EP2C35F672I7 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | INTEL CORP | FBGA-672 | PLASTIC/EPOXY | BGA | BGA672,26X26,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | 无 | 活跃 | e0 | 锡铅 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | 459 | 不合格 | 475 | 2100 CLBS | 2.6 mm | 现场可编程门阵列 | 2100 | 33216 | 27 mm | 27 mm | ||||||||||||||||||||||||||||
![]() | EP1C4F324C7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | INTEL CORP | BGA, | 320 MHz | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B324 | 不合格 | 4000 CLBS | 2.2 mm | 现场可编程门阵列 | 4000 | 19 mm | 19 mm | |||||||||||||||||||||||||||||||
![]() | EP2S180F1508I5 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | 1.15 V | 1.25 V | 网格排列 | SQUARE | BGA1508,39X39,40 | BGA | PLASTIC/EPOXY | -40 °C | 100 °C | 3 | INTEL CORP | 活跃 | 无 | 1.2 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 1162 | 不合格 | 1170 | 现场可编程门阵列 | 179400 | ||||||||||||||||||||||||||||||||
![]() | EP4SE820H40I2N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1517 | HBGA-1517 | PLASTIC/EPOXY | BGA | BGA1517,39X39,40 | SQUARE | 网格排列 | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | 325220 CLBS | 3.8 mm | 现场可编程门阵列 | 325220 | 42.5 mm | 42.5 mm | |||||||||||||||||||||||||||||||||||||||
![]() | EP1C3T100I6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | INTEL CORP | 16 X 16 MM, 0.50 MM PITCH, LEAD FREE, TQFP-100 | 405 MHz | 3 | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | 2910 CLBS | 1.2 mm | 现场可编程门阵列 | 2910 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||
![]() | 5AGZME1E2H29I3L | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 780 | 2020-06-17 | HBGA-780 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA780,28X28,40 | SQUARE | 网格排列 | 1.18 V | 1.12 V | 1.15 V | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B780 | 414 | INDUSTRIAL | 414 | 8302 CLBS | 3.6 mm | 现场可编程门阵列 | 8302 | 220000 | 33 mm | 33 mm | |||||||||||||||||||||||||||||
![]() | EP1C20F400I8ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 400 | INTEL CORP | 21 X 21 MM, 1.00 MM PITCH, LEAD FREE, FBGA-400 | 275 MHz | PLASTIC/EPOXY | BGA | BGA400,20X20,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B400 | 不合格 | 20060 CLBS | 2.2 mm | 现场可编程门阵列 | 20060 | 21 mm | 21 mm | |||||||||||||||||||||||||||||||
![]() | 5CEBA7F23I7N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | ROHS COMPLIANT, FBGA-484 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.13 V | 1.07 V | 1.1 V | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 2 mm | 现场可编程门阵列 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||
![]() | EP4CE10U14 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | UBGA-256 | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.24 V | 1.16 V | 1.2 V | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B256 | 47 CLBS | 1.5 mm | 现场可编程门阵列 | 47 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||
![]() | EP2AGX95EF25I5N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 572 | 有 | 活跃 | INTEL CORP | 25 X 25 MM, LEAD FREE, MS-034, FBGA-572 | 500 MHz | 100 °C | -40 °C | PLASTIC/EPOXY | HBGA | BGA572,24X24,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 0.93 V | 0.87 V | 0.9 V | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B572 | 260 | INDUSTRIAL | 260 | 3747 CLBS | 2.2 mm | 现场可编程门阵列 | 3747 | 89178 | 25 mm | 25 mm | ||||||||||||||||||||||||||
![]() | 5CSEBA2U23C8 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | INTEL CORP | UBGA-672 | 85 °C | PLASTIC/EPOXY | FBGA | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | 1.13 V | 1.07 V | 1.1 V | 无 | 活跃 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 未说明 | S-PBGA-B672 | 145 | 不合格 | OTHER | 145 | 1.85 mm | 现场可编程门阵列 | 25000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||
![]() | EP2AGX45DF29 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 780 | FBGA-780 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 0.93 V | 0.87 V | 0.9 V | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B780 | 364 | 364 | 2.7 mm | 现场可编程门阵列 | 42959 | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||
![]() | 10M16DAU324C6G | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | 85 °C | PLASTIC/EPOXY | LFBGA | BGA324,18X18,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 3.15 V | 2.85 V | 3 V | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 未说明 | S-PBGA-B324 | 246 | 246 | 1000 CLBS | 1.55 mm | 现场可编程门阵列 | 1000 | 16000 | 15 mm | 15 mm | |||||||||||||||||||||||||||||||
![]() | EP4CE15F23 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | FBGA-484 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.24 V | 1.16 V | 1.2 V | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 47 CLBS | 2.4 mm | 现场可编程门阵列 | 47 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||
![]() | 1SG280LN2F43E2LG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | gold-plated | YES | 16 | 1760 | 2x8 | 2.54mm | 2018-08-08 | THT | 0.86 g | female | BGA1760,42X42,40 | SQUARE | 网格排列 | 0.88 V | 0.82 V | 0.85 V | socket | 活跃 | INTEL CORP | 2.54mm | straight | 100 °C | PLASTIC/EPOXY | BGA | pin strips | -40...163°C | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | 1.5A | S-PBGA-B1760 | 704 | OTHER | 704 | 344125 CLBS | 3.881 mm | 现场可编程门阵列 | 344125 | 2753000 | 60V | beryllium copper | 42.5 mm | 42.5 mm | 0.254µm | UL94V-0 | ||||||||||||||
![]() | 1SG280LN2F43I2LG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | gold-plated | YES | 28 | 1760 | 2x14 | 2.54mm | 2018-08-08 | THT | 1.5 g | female | -40 °C | PLASTIC/EPOXY | BGA | BGA1760,42X42,40 | SQUARE | 网格排列 | 0.88 V | 0.82 V | 0.85 V | socket | 2.54mm | straight | 活跃 | INTEL CORP | 100 °C | pin strips | -40...163°C | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | 1.5A | S-PBGA-B1760 | 704 | INDUSTRIAL | 704 | 344125 CLBS | 3.881 mm | 现场可编程门阵列 | 344125 | 2753000 | 60V | beryllium copper | 42.5 mm | 42.5 mm | 0.254µm | UL94V-0 | |||||||||||||
![]() | EP20K200CP240I8 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 活跃 | INTEL CORP | , | 8542.39.00.01 | compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EP1C4F324I7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | INTEL CORP | BGA, | 320 MHz | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B324 | 不合格 | 4000 CLBS | 2.2 mm | 现场可编程门阵列 | 4000 | 19 mm | 19 mm |
EP3C40F324I6N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1SGX25DF1020C5ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2SGX30CF780I4
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S10F1508C6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2S15F484I3
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C12Q240C6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S20F1508I5ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2C35F672I7
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C4F324C7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2S180F1508I5
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4SE820H40I2N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C3T100I6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5AGZME1E2H29I3L
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C20F400I8ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5CEBA7F23I7N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4CE10U14
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2AGX95EF25I5N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5CSEBA2U23C8
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2AGX45DF29
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10M16DAU324C6G
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4CE15F23
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
1SG280LN2F43E2LG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
1SG280LN2F43I2LG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP20K200CP240I8
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C4F324I7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
