品牌是'Intel' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 输出的数量 | 资历状况 | 温度等级 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑块数量 | 逻辑单元数 | 长度 | 宽度 | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | EP1C12Q240C6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 240 | FQFP, | 405 MHz | 3 | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G240 | 不合格 | 12060 CLBS | 4.1 mm | 现场可编程门阵列 | 12060 | 32 mm | 32 mm | ||||||||||||
![]() | EP1S30F672I7 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | INTEL CORP | 35 X 35 MM, 1.27 MM PITCH, BGA-672 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA672,26X26,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | 不合格 | 现场可编程门阵列 | 3247 | 32470 | 27 mm | 27 mm | ||||||||||||
![]() | 5CEFA9F31C6N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 896 | ROHS COMPLIANT, FBGA-896 | 85 °C | PLASTIC/EPOXY | BGA | BGA896,30X30,40 | SQUARE | 网格排列 | 1.13 V | 1.07 V | 1.1 V | 有 | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 未说明 | S-PBGA-B896 | 480 | 不合格 | OTHER | 480 | 11356 CLBS | 2 mm | 现场可编程门阵列 | 301000 | 31 mm | 31 mm | |||||||||
![]() | EP1C12F324I7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | BGA, | 320 MHz | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B324 | 不合格 | 12060 CLBS | 2.2 mm | 现场可编程门阵列 | 12060 | 19 mm | 19 mm | ||||||||||||
![]() | EP1S30F1508I7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | INTEL CORP | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 不合格 | 现场可编程门阵列 | 3247 | 32470 | 40 mm | 40 mm | ||||||||||||
![]() | 5CGXFC7D7F27I7N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 672 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA672,26X26,40 | SQUARE | 网格排列 | 1.13 V | 1.07 V | 1.1 V | 活跃 | INTEL CORP | ROHS COMPLIANT, FBGA-672 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | 336 | 336 | 5648 CLBS | 2 mm | 现场可编程门阵列 | 27 mm | 27 mm | ||||||||||||||
![]() | EP1S60F1508C5ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 85 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 1022 | 不合格 | OTHER | 1022 | 5712 CLBS | 现场可编程门阵列 | 5712 | 57120 | 40 mm | 40 mm | |||||||||
![]() | 5AGZME5K2F40C4N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1517 | FBGA-1517 | 85 °C | PLASTIC/EPOXY | BGA | BGA1517,39X39,40 | SQUARE | 网格排列 | 1.13 V | 1.07 V | 1.1 V | 有 | 活跃 | INTEL CORP | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | 674 | OTHER | 674 | 15096 CLBS | 3.4 mm | 现场可编程门阵列 | 15096 | 400000 | 40 mm | 40 mm | |||||||||
![]() | EP4S100G5F45C1N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1932 | PLASTIC/EPOXY | BGA | BGA1932,44X44,40 | SQUARE | 网格排列 | 0.98 V | 0.92 V | 0.95 V | 活跃 | INTEL CORP | LEAD FREE, FBGA-1932 | 85 °C | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B | 781 | OTHER | 781 | 21248 CLBS | 3.6 mm | 现场可编程门阵列 | 212480 | 531200 | 45 mm | 45 mm | ||||||||||||
![]() | 5SGSED6N2F45I2 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1932 | INTEL CORP | FBGA-1932 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1932,44X44,40 | SQUARE | 网格排列 | 0.93 V | 0.87 V | 0.9 V | 无 | 活跃 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1932 | 840 | 不合格 | INDUSTRIAL | 840 | 22000 CLBS | 3.9 mm | 现场可编程门阵列 | 22000 | 583000 | 45 mm | 45 mm | |||||||||
![]() | 10AS057N4F40E3VG | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1517 | FBGA-1517 | 100 °C | PLASTIC/EPOXY | BGA | BGA1517,39X39,40 | SQUARE | 网格排列 | 0.93 V | 0.82 V | 0.85 V | 有 | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | 588 | OTHER | 588 | 21708 CLBS | 3.5 mm | 现场可编程门阵列 | 21708 | 570000 | 40 mm | 40 mm | |||||||||||
![]() | EP1C12F324C7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | BGA, | 320 MHz | PLASTIC/EPOXY | BGA | BGA324,18X18,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B324 | 不合格 | 12060 CLBS | 2.2 mm | 现场可编程门阵列 | 12060 | 19 mm | 19 mm | ||||||||||||
![]() | EP1C6T144C7ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | LFQFP, | 320 MHz | 3 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 1.5 V | 1.425 V | 1.575 V | 无 | Obsolete | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G144 | 不合格 | 5980 CLBS | 1.6 mm | 现场可编程门阵列 | 5980 | 20 mm | 20 mm | ||||||||||||
![]() | EP1C12F256I6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | 17 X 17 MM, 1.00 MM PITCH, LEAD FREE, FBGA-256 | 405 MHz | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B256 | 不合格 | 12060 CLBS | 2.2 mm | 现场可编程门阵列 | 12060 | 17 mm | 17 mm | ||||||||||||
![]() | EP2AGZ300FF35I4 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | 活跃 | INTEL CORP | , | 500 MHz | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 0.93 V | 0.87 V | 0.9 V | 无 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 554 | INDUSTRIAL | 554 | 11920 CLBS | 3.5 mm | 现场可编程门阵列 | 11920 | 298000 | 35 mm | 35 mm | |||||||
![]() | EP1S10F1508I5ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | INTEL CORP | 40 X 40 MM, 1 MM PITCH, FBGA-1508 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1508,39X39,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1508 | 不合格 | 现场可编程门阵列 | 1057 | 10570 | 40 mm | 40 mm | ||||||||||||
![]() | EP1C12Q240C8ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 240 | FQFP, | 275 MHz | 3 | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G240 | 不合格 | 12060 CLBS | 4.1 mm | 现场可编程门阵列 | 12060 | 32 mm | 32 mm | ||||||||||||
![]() | EP2C15AF256I7 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | PLASTIC/EPOXY | LBGA | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | 1.25 V | 1.15 V | 1.2 V | 无 | 活跃 | INTEL CORP | FBGA-256 | e0 | 锡铅 | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B256 | 144 | 不合格 | 152 | 1.55 mm | 现场可编程门阵列 | 14448 | 17 mm | 17 mm | |||||||||||
![]() | EP1AGX35CF780I6N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 780 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA780,28X28,40 | SQUARE | 网格排列 | 1.25 V | 1.15 V | 1.2 V | 活跃 | INTEL CORP | 29 X 29 MM, 1 MM PITCH, BGA-780 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B780 | 不合格 | INDUSTRIAL | 33520 CLBS | 现场可编程门阵列 | 33520 | 33250 | 29 mm | 29 mm | |||||||||||||
![]() | EP1S25F484C5 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | 23 X 23 MM, 1 MM PITCH, FBGA-484 | 85 °C | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | 活跃 | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 不合格 | 商业扩展 | 现场可编程门阵列 | 2566 | 25660 | 23 mm | 23 mm | ||||||||||||
![]() | EP4S40G5H40C3 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1517 | 717 MHz | 85 °C | PLASTIC/EPOXY | BGA | BGA1517,39X39,40 | SQUARE | 网格排列 | 0.98 V | 0.92 V | 0.95 V | 活跃 | INTEL CORP | HBGA-1517 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B | 654 | OTHER | 654 | 21248 CLBS | 3.8 mm | 现场可编程门阵列 | 212480 | 531200 | 42.5 mm | 42.5 mm | |||||||||||
![]() | 5SEE9F45C3 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1932 | FBGA-1932 | 85 °C | PLASTIC/EPOXY | BGA | BGA1932,44X44,40 | SQUARE | 网格排列 | 0.88 V | 0.82 V | 0.85 V | 无 | 活跃 | INTEL CORP | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1932 | 840 | 不合格 | OTHER | 840 | 31700 CLBS | 3.9 mm | 现场可编程门阵列 | 31700 | 840000 | 45 mm | 45 mm | ||||||||||
![]() | EP4SE820H35C2N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | SQUARE | 网格排列 | 活跃 | INTEL CORP | FBGA-1152 | 85 °C | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | OTHER | 325220 CLBS | 3.7 mm | 现场可编程门阵列 | 325220 | 42.5 mm | 42.5 mm | ||||||||||||||||||
![]() | EP1S60F1508I6ES | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1508 | BGA, | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.575 V | 1.425 V | 1.5 V | 无 | Obsolete | INTEL CORP | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | compliant | S-PBGA-B1508 | 1022 | 不合格 | 1022 | 5712 CLBS | 现场可编程门阵列 | |||||||||||||||
![]() | EP1M120B484C8A | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | INTEL CORP | , | 活跃 | 8542.39.00.01 | compliant |
EP1C12Q240C6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S30F672I7
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5CEFA9F31C6N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C12F324I7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S30F1508I7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5CGXFC7D7F27I7N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S60F1508C5ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5AGZME5K2F40C4N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4S100G5F45C1N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5SGSED6N2F45I2
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
10AS057N4F40E3VG
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C12F324C7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C6T144C7ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C12F256I6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2AGZ300FF35I4
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S10F1508I5ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1C12Q240C8ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP2C15AF256I7
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1AGX35CF780I6N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S25F484C5
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4S40G5H40C3
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
5SEE9F45C3
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP4SE820H35C2N
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1S60F1508I6ES
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
EP1M120B484C8A
Intel Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
