2487 In Stock

• 1: ¥1,563.813383
• 10: ¥1,475.295641
• 100: ¥1,391.788340
• 500: ¥1,313.007873
查看所有的价格

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

3

108 MHz

1.44

BGA,

MICROSEMI CORP

活跃

有

AGL1000V5-FGG484

1.5000 V

1.425 V

1.575 V

300

Tray

AGL1000

活跃

40

1.5 V

1.425 V

1.575 V

网格排列

SQUARE

BGA

PLASTIC/EPOXY

85 °C

0 to 70 °C

IGLOO

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

不合格

OTHER

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

1152-BGA

YES

1152

1152-FPBGA (35x35)

400.011771 mg

1152

微芯片技术

1.575 V

1.5 V

40

684

Tray

AX2000

活跃

Compliant

1.425 V

Military grade

AX2000-1FGG1152M

有

活跃

MICROSEMI CORP

BGA, BGA1152,34X34,40

5.29

763 MHz

3

125 °C

-55 °C

PLASTIC/EPOXY

BGA

BGA1152,34X34,40

SQUARE

网格排列

-55°C ~ 125°C (TA)

Axcelerator

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

125 °C

-55 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

245

1 mm

compliant

S-PBGA-B1152

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

MILITARY

1.575 V

1.425 V

36 kB

850 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

294912

2000000

763 MHz

32256

MIL-STD-883 Class B

1

21504

0.84 ns

21504

32256

2000000

1.73 mm

35 mm

35 mm

无

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

网格排列

1.575 V

1.5 V

30

300

Tray

AGL1000

活跃

1.425 V

AGL1000V5-FG484I

无

活跃

MICROSEMI CORP

BGA,

1.61

108 MHz

3

100 °C

-40 °C

PLASTIC/EPOXY

BGA

SQUARE

-40°C ~ 85°C (TA)

IGLOO

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B484

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

23 mm

23 mm

N/A

-

YES

144

BGA144,12X12,40

SQUARE

GRID ARRAY, LOW PROFILE

2.75 V

2.5 V

30

2.25 V

A54SX08A-1FG144I

无

Obsolete

MICROSEMI CORP

LBGA, BGA144,12X12,40

5.28

278 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

111

不合格

2.5,3.3/5 V

INDUSTRIAL

111

768 CLBS, 12000 GATES

1.55 mm

现场可编程门阵列

1.1 ns

768

768

12000

13 mm

13 mm

N/A

-

表面贴装

289-TFBGA, CSBGA

YES

289-CSP (14x14)

289

微芯片技术

GRID ARRAY, THIN PROFILE, FINE PITCH

1.575 V

1.5 V

未说明

212

Tray

AGLP125

Obsolete

1.425 V

AGLP125V5-CS289I

无

活跃

MICROSEMI CORP

TFBGA, BGA289,17X17,32

1.64

250 MHz

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA289,17X17,32

SQUARE

-40°C ~ 100°C (TJ)

IGLOO PLUS

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.8 mm

unknown

S-PBGA-B289

212

不合格

1.5 V

INDUSTRIAL

212

3120 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3120

36864

125000

STD

3120

3120

125000

14 mm

14 mm

N/A

-

YES

256

SQUARE

BGA256,16X16,40

BGA

PLASTIC/EPOXY

-40 °C

85 °C

2.25 V

3

294 MHz

5.32

BGA, BGA256,16X16,40

MICROSEMI CORP

Obsolete

无

A54SX16A-2FG256I

30

2.5 V

2.75 V

网格排列

TIN LEAD/TIN LEAD SILVER

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

180

不合格

2.5,3.3/5 V

INDUSTRIAL

180

1452 CLBS, 24000 GATES

1.97 mm

现场可编程门阵列

1 ns

1452

1452

24000

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

1152-BGA

YES

1152

1152-FPBGA (35x35)

400.011771 mg

1152

微芯片技术

BGA1152,34X34,40

SQUARE

网格排列

1.575 V

1.5 V

20

684

Tray

AX2000

活跃

Compliant

1.425 V

Military grade

AX2000-1FG1152M

无

活跃

MICROSEMI CORP

BGA, BGA1152,34X34,40

5.29

ic

763 MHz

3

125 °C

-55 °C

PLASTIC/EPOXY

BGA

-55°C ~ 125°C (TA)

Axcelerator

e0

3A001.A.2.C

TIN LEAD/TIN LEAD SILVER

125 °C

-55 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B1152

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

MILITARY

1.575 V

1.425 V

36 kB

850 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

294912

2000000

763 MHz

32256

MIL-STD-883 Class B

1

21504

0.84 ns

21504

32256

2000000

1.73 mm

35 mm

35 mm

无

20 In Stock

• 1: ¥502.786712
• 10: ¥474.327088
• 100: ¥447.478381
• 500: ¥422.149422
查看所有的价格

-

表面贴装

196-TFBGA, CSBGA

YES

196-CSP (8x8)

196

微芯片技术

MICROSEMI CORP

活跃

有

AGL400V5-CSG196

1.5000 V

1.425 V

1.575 V

143

Tray

AGL400

活跃

1.425 V

1.575 V

1.5 V

未说明

GRID ARRAY, THIN PROFILE, FINE PITCH

SQUARE

TFBGA

PLASTIC/EPOXY

85 °C

3

5.25

TFBGA,

0 to 70 °C

IGLOO

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B196

不合格

OTHER

9216 CLBS, 400000 GATES

1.2 mm

现场可编程门阵列

9216

55296

400000

STD

9216

400000

8 mm

8 mm

N/A

-

表面贴装

1152-BGA

YES

1152-FPBGA (35x35)

1152

微芯片技术

MICROSEMI CORP

活跃

有

APA1000-FGG1152

712

Tray

APA1000

活跃

2.3 V

40

2.5 V

2.7 V

网格排列

SQUARE

BGA1152,34X34,40

BGA

PLASTIC/EPOXY

70 °C

3

180 MHz

5.26

BGA, BGA1152,34X34,40

0°C ~ 70°C (TA)

ProASICPLUS

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

2.3V ~ 2.7V

BOTTOM

BALL

245

1 mm

compliant

S-PBGA-B1152

712

不合格

2.5,2.5/3.3 V

COMMERCIAL

712

1000000 GATES

2.44 mm

现场可编程门阵列

202752

1000000

56320

1000000

35 mm

35 mm

N/A

-

表面贴装

表面贴装

144-LBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

有

活跃

MICROSEMI CORP

1 MM PITCH, ROHS COMPLIANT, FBGA-144

5.24

280 MHz

3.3, 5 V

2.97, 4.75 V

3.63, 5.25 V

111

Tray

A54SX08

活跃

Compliant

3 V

3

70 °C

PLASTIC/EPOXY

LBGA

BGA144,12X12,40

SQUARE

GRID ARRAY, LOW PROFILE

3.6 V

3.3 V

40

A54SX08-1FGG144

0 to 70 °C

SX

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

260

1 mm

compliant

280 MHz

S-PBGA-B144

111

不合格

5 V

3.3,5 V

COMMERCIAL

5.25 V

4.75 V

800 ps

800 ps

111

768 CLBS, 8000 GATES

1.55 mm

现场可编程门阵列

768

12000

280 MHz

768

768

1

256

0.8 ns

768

768

8000

1.05 mm

13 mm

13 mm

无

2157 In Stock

• 1: ¥2,142.836729
• 10: ¥2,021.544081
• 100: ¥1,907.117058
• 500: ¥1,799.167038
查看所有的价格

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

微芯片技术

1.5 V

30

A3P1000-FGG144T

有

活跃

MICROSEMI CORP

LBGA, BGA144,12X12,40

5.23

350 MHz

3

97

Tray

A3P1000

活跃

Automotive grade

125 °C

-40 °C

PLASTIC/EPOXY

LBGA

BGA144,12X12,40

SQUARE

GRID ARRAY, LOW PROFILE

1.575 V

1.425 V

-40°C ~ 125°C (TA)

Automotive, AEC-Q100, ProASIC3

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.5/3.3 V

AUTOMOTIVE

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

AEC-Q100

STD

24576

24576

1000000

13 mm

13 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

YES

256

400.011771 mg

256

1.575 V

1.2 V

30

177

Compliant

1.14 V

A3P600L-1FG256I

无

Obsolete

MICROSEMI CORP

BGA, BGA256,16X16,40

5.27

350 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

网格排列

TIN LEAD/TIN LEAD SILVER

85 °C

-40 °C

8542.39.00.01

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

177

不合格

1.2 V

1.5/3.3 V

INDUSTRIAL

1.26 V

1.14 V

5 mA

13.5 kB

177

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

600000

892.86 MHz

1

13824

13824

13824

600000

1.2 mm

17 mm

17 mm

无

2146 In Stock

• 1: ¥845.019463
• 10: ¥797.188175
• 100: ¥752.064313
• 500: ¥709.494639
查看所有的价格

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

微芯片技术

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.575 V

1.2 V

30

1.2, 1.5 V

1.14 V

1.575 V

178

Tray

AGL400

活跃

1.14 V

AGL400V2-FG256I

无

活跃

MICROSEMI CORP

BGA,

5.28

3

100 °C

-40 °C

-40 to 85 °C

IGLOO

e0

3A001.A.7.A

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

1.14V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B256

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

9216

55296

400000

STD

9216

400000

17 mm

17 mm

N/A

-

YES

144

2.75 V

2.5 V

30

2.25 V

A54SX32A-1FG144

无

Obsolete

MICROSEMI CORP

1 MM PITCH, FBGA-144

5.32

278 MHz

3

70 °C

PLASTIC/EPOXY

LBGA

BGA144,12X12,40

SQUARE

GRID ARRAY, LOW PROFILE

e0

Tin/Lead/Silver (Sn/Pb/Ag)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B144

111

不合格

2.5,2.5/5 V

COMMERCIAL

111

2880 CLBS, 48000 GATES

1.55 mm

现场可编程门阵列

1.1 ns

2880

2880

48000

13 mm

13 mm

41 In Stock

• 1: ¥152.875244
• 10: ¥144.221931
• 100: ¥136.058423
• 500: ¥128.357005
查看所有的价格

-

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

微芯片技术

SMD/SMT

Microchip Technology / Atmel

350 MHz

ProASIC3

Details

Tray

A3P250

活跃

1.425 V

A3P250-FGG144I

有

活跃

MICROSEMI CORP

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

1.3

350 MHz

3

100 °C

-40 °C

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

1.575 V

1.5 V

40

MSL 3 - 168 hours

有

3000 LE

36864 bit

97 I/O

+ 100 C

0.108878 oz

- 40 C

160

-40°C ~ 100°C (TJ)

Tray

A3P250

e1

3A001.A.7.B

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

可编程逻辑集成电路

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

30 mA

-

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

36Kbit

250000

STD

-

6144

250000

FPGA - Field Programmable Gate Array

1.05 mm

13 mm

13 mm

N/A

-

YES

144

AGL400V2-FG144

无

Obsolete

MICROSEMI CORP

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

5.9

3

85 °C

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

1.575 V

1.2 V

30

1.14 V

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B144

不合格

OTHER

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

9216

400000

13 mm

13 mm

N/A

-

YES

484

1.575 V

1.5 V

30

1.425 V

AGL600V5-FG484

无

Transferred

ACTEL CORP

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

5.84

108 MHz

3

70 °C

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

网格排列

e0

锡铅银

BOTTOM

BALL

230

1 mm

compliant

S-PBGA-B484

235

不合格

1.5 V

COMMERCIAL

235

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

13824

13824

600000

23 mm

23 mm

N/A

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

微芯片技术

有

AX250-1FGG256M

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

1.575 V

1.5 V

40

138

Tray

AX250

活跃

1.425 V

Military grade

PLASTIC/EPOXY

-55 °C

125 °C

3

763 MHz

5.3

LBGA, BGA256,16X16,40

MICROSEMI CORP

活跃

-55°C ~ 125°C (TA)

Axcelerator

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

250000 SYSTEM GATES AVAILABLE

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

248

不合格

1.5,1.5/3.3,2.5/3.3 V

MILITARY

248

2816 CLBS, 250000 GATES

1.7 mm

现场可编程门阵列

55296

250000

4224

MIL-STD-883 Class B

0.84 ns

2816

4224

250000

17 mm

17 mm

N/A

-

YES

484

400000

130NM

1.575(V)

1.5(V)

无

1.425(V)

0C

有

9216

表面贴装

1.425 V

A3P400-FGG484

有

Obsolete

MICROSEMI CORP

BGA,

7.56

350 MHz

3

85 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.575 V

1.5 V

40

ProASIC®3

85C

Commercial

FBGA

400000

0C to 85C

194

Tray

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

231(MHz)

484

S-PBGA-B484

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

2.44 mm

现场可编程门阵列

9216

400000

23 mm

23 mm

N/A

-

YES

208

20

3 V

A14V100A-RQ208C

无

Obsolete

MICROSEMI CORP

PLASTIC, RQFP-208

5.88

75 MHz

4

70 °C

PLASTIC/EPOXY

HFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

3.6 V

3.3 V

e0

锡铅

MAX 175 I/OS

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

1377 CLBS, 10000 GATES

4.1 mm

现场可编程门阵列

3.9 ns

1377

10000

28 mm

28 mm

N/A

-

表面贴装

YES

84

84

A1020B-1CQ84C

无

Obsolete

MICROSEMI CORP

5.81

53 MHz

70 °C

CERAMIC

GQFF

TPAK84,1.63SQ,25

SQUARE

FLATPACK, GUARD RING

5 V

8542390000/8542390000/8542390000/8542390000/8542390000

69

Non-Compliant

70 °C

0 °C

8542.39.00.01

QUAD

FLAT

0.635 mm

unknown

57 MHz

S-XQFP-F84

69

不合格

5 V

5 V

COMMERCIAL

5.25 V

4.75 V

3.8 ns

69

现场可编程门阵列

547

2000

547

1

273

547

N/A

-

YES

172

5.5 V

5 V

30

4.5 V

A1280A-CQ172M

无

Transferred

ACTEL CORP

CERAMIC, CQFP-172

5.84

41 MHz

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

GQFF

TPAK172,2.5SQ,25

SQUARE

FLATPACK

e0

Tin/Lead (Sn/Pb)

MAX 140 I/OS

QUAD

FLAT

225

0.635 mm

compliant

S-CQFP-F172

140

不合格

5 V

MILITARY

140

1232 CLBS, 8000 GATES

2.9464 mm

现场可编程门阵列

5 ns

1232

1232

8000

29.972 mm

29.972 mm

N/A

-

YES

84

30

4.5 V

A1280A-PL84I

无

Obsolete

MICROSEMI CORP

PLASTIC, MS-007-AE, LCC-84

8.19

3

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

5.5 V

5 V

e0

EAR99

锡铅

MAX 72 I/OS

8542.39.00.01

QUAD

J BEND

225

1.27 mm

unknown

S-PQCC-J84

不合格

INDUSTRIAL

1232 CLBS, 8000 GATES

4.45 mm

现场可编程门阵列

5 ns

1232

8000

29.21 mm

29.21 mm

N/A

-

YES

8

512000

85 °C

-40 °C

UNSPECIFIED

SON

SOLCC8,.25

SQUARE

小概要

3.3 V

30

AT17N512-10CI

无

Obsolete

ATMEL CORP

SOIC

SON, SOLCC8,.25

5.92

10 MHz

3

524288 words

e0

EAR99

Tin/Lead (Sn/Pb)

8542.32.00.51

DUAL

无铅

240

1

1.27 mm

compliant

8

S-XDSO-N8

不合格

3.6 V

3.3 V

INDUSTRIAL

3 V

SYNCHRONOUS

0.005 mA

512KX1

1.14 mm

1

0.0001 A

524288 bit

SERIAL

配置存储器

10 Write/Erase Cycles

20

5.99 mm

5.99 mm

N/A

-

YES

8

131072 words

128000

70 °C

UNSPECIFIED

SON

SOLCC8,.25

SQUARE

小概要

3.3 V

30

AT17LV128-10CC

无

Obsolete

ATMEL CORP

SOIC

SON, SOLCC8,.25

5.88

75 ns

10 MHz

3

e0

EAR99

Tin/Lead (Sn/Pb)

IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO

8542.32.00.51

DUAL

无铅

240

1

1.27 mm

compliant

8

S-XDSO-N8

不合格

3.6 V

3.3 V

COMMERCIAL

3 V

SYNCHRONOUS

0.005 mA

128KX1

1.14 mm

1

0.00005 A

131072 bit

SERIAL

配置存储器

5.99 mm

5.99 mm