N/A

-

YES

208

MICROSEMI CORP

1.575 V

5.88

QFF,

FLATPACK

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

无

M1AFS600-1PQ208

QFF

RECTANGULAR

Microsemi Corporation

Obsolete

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

QUAD

FLAT

225

0.5 mm

compliant

R-PQFP-F208

不合格

OTHER

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

13824

600000

30.6 mm

28 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

100 °C

微芯片技术

有

AGL060V2-VQG100I

108 MHz

TFQFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

1.61

71

Tray

AGL060

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.2 V

未说明

1.14 V

-40°C ~ 85°C (TA)

IGLOO

e3

Tin (Sn)

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

1536

18432

60000

STD

1536

60000

14 mm

14 mm

N/A

-

表面贴装

68-VFQFN Exposed Pad

YES

68-QFN (8x8)

68

微芯片技术

有

AGLN020V5-QNG68

HVQCCN

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

1.47

49

Tray

AGLN020

活跃

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

-20 °C

1.5 V

未说明

1.425 V

70 °C

-20°C ~ 85°C (TJ)

IGLOO nano

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

未说明

0.4 mm

compliant

S-XQCC-N68

不合格

OTHER

520 CLBS, 20000 GATES

1 mm

现场可编程门阵列

520

20000

STD

520

20000

8 mm

8 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

729-BBGA

YES

729

729-PBGA (35x35)

729

微芯片技术

有

AX1000-1BGG729

763 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.26

516

Tray

AX1000

活跃

Compliant

BGA, BGA729,27X27,50

网格排列

3

PLASTIC/EPOXY

BGA729,27X27,50

1.5 V

40

1.425 V

70 °C

0°C ~ 70°C (TA)

Axcelerator

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

245

1.27 mm

compliant

763 MHz

S-PBGA-B729

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

20.3 kB

850 ps

850 ps

516

12096 CLBS, 1000000 GATES

2.54 mm

现场可编程门阵列

12096

165888

1000000

763 MHz

18144

12096

1

12096

0.84 ns

12096

18144

1000000

1.73 mm

35 mm

35 mm

无

N/A

-

表面贴装

TQFP-100

100-TQFP (14x14)

微芯片技术

活跃

有

81 I/O

+ 85 C

2.75 V

0.023175 oz

- 40 C

90

2.25 V

SMD/SMT

Microchip

Microchip Technology / Atmel

227 MHz

Actel

Details

Tray

A54SX16

-40°C ~ 85°C (TA)

Tray

A54SX16A

可编程逻辑集成电路

2.25V ~ 5.25V

2.5 V

FPGA - Field Programmable Gate Array

24000

1452

STD

FPGA - Field Programmable Gate Array

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

176-LQFP

YES

176-TQFP (24x24)

176

40

3 V

微芯片技术

85 °C

有

A54SX16-2TQG176I

320 MHz

5.24

3.6 V

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

LFQFP

147

Tray

A54SX16

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-176

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP176,1.0SQ,20

-40 °C

3.3 V

-40°C ~ 85°C (TA)

SX

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

147

不合格

3.3,5 V

INDUSTRIAL

147

1452 CLBS, 16000 GATES

1.6 mm

现场可编程门阵列

24000

1452

2

0.7 ns

1452

1452

16000

24 mm

24 mm

N/A

-

表面贴装

329-BBGA

YES

329-PBGA (31x31)

329

30

2.25 V

微芯片技术

85 °C

无

A54SX32A-2BG329I

313 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

2.75 V

1.57

249

Tray

A54SX32

活跃

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

-40 °C

2.5 V

-40°C ~ 85°C (TA)

SX-A

e0

锡铅

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B329

249

不合格

2.5,3.3/5 V

INDUSTRIAL

249

2880 CLBS, 48000 GATES

2.7 mm

现场可编程门阵列

48000

2880

2

0.9 ns

2880

2880

48000

31 mm

31 mm

N/A

-

表面贴装

896-BGA

896-FBGA (31x31)

微芯片技术

377

Tray

M2GL050

活跃

0°C ~ 85°C (TJ)

IGLOO2

1.14V ~ 2.625V

56340

1869824

N/A

-

表面贴装

281-TFBGA, CSBGA

YES

281-CSP (10x10)

281

70 °C

微芯片技术

有

AGLP125V5-CSG281

250 MHz

TFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

1.47

212

Tray

AGLP125

Obsolete

TFBGA, BGA281,19X19,20

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA281,19X19,20

1.5 V

未说明

1.425 V

0°C ~ 85°C (TJ)

IGLOO PLUS

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B281

212

不合格

1.5 V

COMMERCIAL

212

3120 CLBS, 125000 GATES

1.05 mm

现场可编程门阵列

3120

36864

125000

STD

3120

3120

125000

10 mm

10 mm

N/A

-

表面贴装

100-TQFP

100-VQFP (14x14)

微芯片技术

71

Tray

A3PN060

Obsolete

-20°C ~ 85°C (TJ)

ProASIC3 nano

1.425V ~ 1.575V

18432

60000

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.26

267

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

20

1.14 V

85 °C

无

M2GL060-FG484

0°C ~ 85°C (TJ)

IGLOO2

e0

Tin/Lead (Sn63Pb37)

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

OTHER

2.44 mm

现场可编程门阵列

56520

1869824

23 mm

23 mm

N/A

-

表面贴装

100-LQFP

YES

100-TQFP (14x14)

100

70 °C

微芯片技术

5.25

2.75 V

MICROSEMI CORP

Obsolete

Microsemi Corporation

SQUARE

LFQFP

172 MHz

A54SX32A-FTQ100

无

81

Tray

A54SX32A

Obsolete

1.40 MM HEIGHT, TQFP-100

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

2.5 V

30

2.25 V

0°C ~ 70°C (TA)

SX-A

e0

Tin/Lead (Sn/Pb)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G100

81

不合格

2.5,2.5/5 V

COMMERCIAL

81

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

48000

2880

1.7 ns

2880

2880

48000

14 mm

14 mm

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

175

Tray

A54SX16A

Obsolete

-40°C ~ 85°C (TA)

SX-A

2.25V ~ 5.25V

24000

1452

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

85 °C

无

A42MX36-1PQ208I

83 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.23

QFP

176

Tray

A42MX36

Obsolete

Compliant

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.5 mm

compliant

208

S-PQFP-G208

不合格

5 V

INDUSTRIAL

5.5 V

3 V

320 B

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

2560

54000

151 MHz

1184

1

1822

2.3 ns

2438

54000

3.4 mm

28 mm

28 mm

无

含铅

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

Cast Iron

Cast Steel;Black Oxide

208

-40 °C

微芯片技术

1.2 V

30

1.14 V

85 °C

无

350 MHz

FQFP

SQUARE

Obsolete

MICROSEMI CORP

1.575 V

5.61

SFT-210TM

Sealmaster

0.05

147

Tray

M1A3PE3000L

Obsolete

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40°C ~ 100°C (TJ)

ProASIC3L

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

INDUSTRIAL

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

Two Bolt Flange

516096

3000000

75264

75264

3000000

28 mm

28 mm

N/A

-

50 microinches Gold Plate

通孔

Wall - Front Mount - Thru Holes

84

不锈钢

Hard Dielectric

14#20,1#16

I

D15

Copper Alloy

69

Non-Compliant

70 °C

0 °C

有

57 MHz

5 V

Socket

Meets IP67

5.25 V

4.75 V

3.8 ns

547

2000

547

1

273

Passivated

无

N/A

-

50 microinches Gold Plate

Wall - Front Mount - Thru Holes

不锈钢

Hard Dielectric

66#22D

M

F35

Copper Alloy

有

Socket

Meets IP67

化学镍

N/A

-

PEI-Genesis

Bulk

活跃

*

N/A

-

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

1.304431 oz

- 40 C

60

1.14 V

SMD/SMT

Microchip

Microchip Technology / Atmel

IGLOO2

微芯片技术

Details

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL060-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

有

56520 LE

267 I/O

+ 100 C

1.26 V

-40°C ~ 100°C (TJ)

Tray

M2GL060

8542.39.00.01

可编程逻辑集成电路

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

1.2 V

667 Mb/s

2.44 mm

现场可编程门阵列

56520

FPGA - Field Programmable Gate Array

1869824

STD

4 Transceiver

FPGA - Field Programmable Gate Array

23 mm

23 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

70 °C

微芯片技术

有

A54SX16P-PQG208

240 MHz

FQFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

3.6 V

1.38

175

Tray

A54SX16

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

3.3 V

40

3 V

0°C ~ 70°C (TA)

SX

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

175

不合格

3.3,3.3/5 V

COMMERCIAL

175

1452 CLBS, 16000 GATES

4.1 mm

现场可编程门阵列

24000

1452

STD

0.9 ns

1452

1452

16000

28 mm

28 mm

N/A

-

面板安装

Flange

Aluminum

Thermoplastic

-

Amphenol Aerospace Operations

-

Bulk

Metal

TVP00RW

活跃

Copper Alloy

Gold

-65°C ~ 175°C

MIL-DTL-38999 Series III, Tri-Start™ TV

Crimp

Receptacle, Male Pins

43

橄榄色

Aviation, Marine, Military

Threaded

-

E

Shielded

抗环境干扰

橄榄色镉

25-43

-

-

-

50.0µin (1.27µm)

-

N/A

-

PEI-Genesis

Bulk

活跃

*

N/A

-

Free Hanging (In-Line)

68-VFQFN Exposed Pad

YES

-

Thermoplastic

68-QFN (8x8)

68

1.5 V

ITT Cannon, LLC

未说明

1.425 V

70 °C

有

AGLN015V5-QNG68

HVQCCN

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

1.51

1000VAC, 1500VDC

Bulk

Plastic

NLDFT

活跃

Silver

49

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

-20 °C

-30°C ~ 125°C

Powerlock

固定螺钉

Line Drain, Female Sockets

1

-

8542.39.00.01

卡口锁

400A

CMOS

1.425V ~ 1.575V

QUAD

Keyed

无铅

-

未说明

IP67 - Dust Tight, Waterproof

0.4 mm

compliant

-

-

S-XQCC-N68

不合格

OTHER

-

384 CLBS, 15000 GATES

1 mm

现场可编程门阵列

384

15000

STD

384

15000

Hand Grip, Locking Pin

8 mm

8 mm

-

N/A

-

N/A

-