N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

微芯片技术

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

172 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1282.05 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

M1AFS600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AFS600-1FG484

0°C ~ 85°C (TJ)

Tray

M1AFS600

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

OTHER

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

40

70 °C

有

M1A3PE1500-2PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.59

This product may require additional documentation to export from the United States.

Details

147 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

24

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE1500

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

0 to 70 °C

Tray

M1A3PE1500

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

2

38400

38400

1500000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

676-FBGA (27x27)

676

微芯片技术

70 °C

有

M1A3PE1500-FGG676

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

444 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

40

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3PE1500

活跃

27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.5 V

40

0°C ~ 85°C (TJ)

Tray

M1A3PE1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

444

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

444

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

STD

38400

38400

1500000

1.73 mm

27 mm

27 mm

N/A

-

表面贴装

CSP-196

YES

196-CSP (8x8)

196

微芯片技术

AGL250V2-CS196

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

3000 LE

143 I/O

1.14 V

0 C

+ 85 C

SMD/SMT

250 MHz

有

348

IGLOOe

1.304431 oz

Tray

AGL250

活跃

1.575 V

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

未说明

85 °C

无

0°C ~ 70°C (TA)

Tray

AGL250V2

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

unknown

S-PBGA-B196

不合格

1.2 V to 1.5 V

OTHER

20 uA

-

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

-

6144

250000

0.7 mm

8 mm

8 mm

N/A

-

表面贴装

CSP-289

YES

289-CSP (14x14)

289

微芯片技术

活跃

MICROSEMI CORP

5.26

N

157 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

119

IGLOO PLUS

1.575 V

Tray

AGLP060

Obsolete

TFBGA, BGA289,17X17,32

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA289,17X17,32

1.5 V

未说明

70 °C

无

AGLP060V5-CS289

250 MHz

TFBGA

SQUARE

0°C ~ 85°C (TJ)

Tray

AGLP060V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.8 mm

unknown

S-PBGA-B289

157

不合格

1.5 V

1.5 V

COMMERCIAL

157

1584 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

1584

18432

60000

STD

1584

1584

60000

0.81 mm

14 mm

14 mm

N/A

-

表面贴装

QFN EP

YES

68-QFN (8x8)

68

微芯片技术

活跃

MICROSEMI CORP

5.26

Details

49 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

350 MHz

有

260

ProASIC3 nano

1.575 V

Tray

A3PN020

活跃

8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

-40 °C

1.5 V

30

85 °C

有

A3PN020-1QNG68I

HVQCCN

SQUARE

-40°C ~ 100°C (TJ)

Tray

A3PN020

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

不合格

1.5 V

INDUSTRIAL

1 mA

520 CLBS, 20000 GATES

1 mm

现场可编程门阵列

20000

1

520

20000

0.88 mm

8 mm

8 mm

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

56520 LE

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL060

活跃

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL060TS-1FG484

BGA

SQUARE

0°C ~ 85°C (TJ)

Tray

M2GL060TS

e0

Tin/Lead (Sn63Pb37)

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

1.2 V

OTHER

2.44 mm

现场可编程门阵列

56520

1869824

4 Transceiver

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

无

AX1000-FG484M

649 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

Military grade

This product may require additional documentation to export from the United States.

N

317 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

649 MHz

有

60

Actel

0.014110 oz

Tray

AX1000

活跃

1.575 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.5 V

30

125 °C

-55°C ~ 125°C (TA)

Tray

AX1000

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

MILITARY

1.575 V

1.425 V

20.3 kB

990 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

649 MHz

18144

MIL-STD-883 Class B

12096

0.99 ns

12096

18144

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

微芯片技术

-40 °C

1.5 V

40

100 °C

有

M1A3P250-VQG100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

68 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

350 MHz

有

90

ProASIC3

0.420854 oz

1.5000 V

1.425 V

1.575 V

Tray

M1A3P250

活跃

1.575 V

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 to 85 °C

Tray

M1A3P250

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

STD

6144

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

CSP-281

YES

281-CSP (10x10)

281

微芯片技术

活跃

MICROSEMI CORP

5.26

N

212 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

184

IGLOO PLUS

Tray

AGLP125

Obsolete

1.575 V

TFBGA, BGA281,19X19,20

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA281,19X19,20

1.5 V

未说明

70 °C

无

AGLP125V2-CS281

160 MHz

TFBGA

SQUARE

0°C ~ 85°C (TJ)

Tray

AGLP125V2

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

unknown

S-PBGA-B281

212

不合格

1.2 V to 1.5 V

1.2/1.5 V

COMMERCIAL

212

3120 CLBS, 125000 GATES

1.05 mm

现场可编程门阵列

3120

36864

125000

STD

3120

3120

125000

0.71 mm

10 mm

10 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

M1A3P1000-1PQG208I

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

154 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

24

ProASIC3

1.575 V

Tray

M1A3P1000

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

-40°C ~ 100°C (TJ)

Tray

M1A3P1000

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

70 °C

有

M1A3P1000L-FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

97 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

781.25 MHz

有

160

ProASIC3

0.014110 oz

1.26 V

Tray

M1A3P1000

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.2 V

40

0°C ~ 85°C (TJ)

Tray

M1A3P1000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

STD

24576

24576

1000000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

40

70 °C

有

A3PE1500-2PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.6

This product may require additional documentation to export from the United States.

Details

147 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

24

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE1500

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

0 to 70 °C

Tray

A3PE1500

e3

Matte Tin (Sn)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

33.8 kB

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

310 MHz

2

38400

38400

38400

1500000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

微芯片技术

TQFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

57 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

175 MHz

有

90

Actel

5.5 V

Tray

A40MX02

活跃

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-80

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A40MX02-2VQG80I

101 MHz

-40°C ~ 85°C (TA)

Tray

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

3.3 V, 5 V

INDUSTRIAL

295 CLBS, 3000 GATES

1.2 mm

现场可编程门阵列

3000

2 ns

295

3000

1 mm

14 mm

14 mm

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

微芯片技术

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

249 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

278 MHz

有

27

Actel

2.75 V

Tray

A54SX32

活跃

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

2.5 V

40

70 °C

有

A54SX32A-1BGG329

278 MHz

0°C ~ 70°C (TA)

Tray

A54SX32A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

250

1.27 mm

compliant

S-PBGA-B329

249

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

249

2880 CLBS, 48000 GATES

2.7 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

1.8 mm

31 mm

31 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

-40 °C

1.5 V

30

100 °C

无

M1A3P250-1FG144I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 to 85 °C

Tray

M1A3P250

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

1

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

676-FBGA (27x27)

676

微芯片技术

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

-40 °C

1.5 V

40

85 °C

有

M1A3PE1500-2FGG676I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

444 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

40

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

M1A3PE1500

活跃

1.575 V

-40 to 85 °C

Tray

M1A3PE1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

444

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

444

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

2

38400

38400

1500000

1.73 mm

27 mm

27 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

PLASTIC/EPOXY

1.2 V

30

85 °C

无

AGL400V2-FG256

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

178 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

250 MHz

有

90

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGL400

活跃

BGA,

网格排列

3

0 to 70 °C

Tray

AGL400V2

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B256

不合格

1.2 V to 1.5 V

OTHER

27 uA

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

9216

55296

400000

STD

9216

400000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

VTQFP-128

YES

128-VTQFP (14x14)

128

微芯片技术

1.5 V

未说明

70 °C

有

AGLP030V5-VQG128

250 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

101 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

90

IGLOO PLUS

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AGLP030

活跃

TFQFP, TQFP128,.63SQ,16

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP128,.63SQ,16

0 to 70 °C

Tray

AGLP030V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

未说明

0.4 mm

compliant

S-PQFP-G128

101

不合格

1.5 V

1.5 V

COMMERCIAL

16 uA

101

792 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

792

30000

STD

792

792

30000

14 mm

14 mm

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

This product may require additional documentation to export from the United States.

N

12084 LE

138 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

119

IGLOO2

Tray

M2GL010

活跃

1.2 V

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

无

M2GL010T-1VF256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

-40°C ~ 100°C (TJ)

Tray

M2GL010T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.2 V

1.56 mm

现场可编程门阵列

12084

933888

2 Transceiver

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FBGA-484

YES

484

484-FPBGA (23x23)

484

微芯片技术

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

N

27696 LE

267 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M2GL025

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

无

M2GL025T-1FG484I

-40 to 100 °C

Tray

M2GL025T

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

138 kB

667 Mb/s

267

2.44 mm

现场可编程门阵列

27696

1130496

1

4 Transceiver

27696

23 mm

23 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

PQFP-208

208

208-PQFP (28x28)

微芯片技术

SX-A

70C

Commercial

PQFP

108000

0C to 70C

171

72000

6036

0.25um

2.75(V)

2.5(V)

无

2.25(V)

0C

有

4024

4024

表面贴装

8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000

5.25 V

Tray

A54SX72

活跃

Details

4024 LE

171 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

217 MHz

有

6036 LAB

24

Actel

1.607905 oz

2.5000 V

2.25 V

2.75 V

0 to 70 °C

Tray

A54SX72A

70 °C

0 °C

2.25V ~ 5.25V

217(MHz)

208

2.25 V to 5.25 V

2.75 V

2.25 V

3.6 mA

1.5 ns

1.5 ns

-

6036

108000

217 MHz

6036

6036

STD

-

4024

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

70 °C

无

M1A3P1000L-FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

97 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

781.25 MHz

有

160

ProASIC3

0.014110 oz

1.26 V

Tray

M1A3P1000

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

1.2 V

30

0°C ~ 85°C (TJ)

Tray

M1A3P1000L

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

STD

24576

24576

1000000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

微芯片技术

无

A3PE1500-1FG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

444 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

40

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3PE1500

活跃

1.575 V

27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-676

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

0 to 70 °C

Tray

A3PE1500

e0

锡铅

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B676

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

272 MHz

1

38400

38400

1500000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

微芯片技术

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

40

85 °C

有

M1A3PE1500-1FGG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

280 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE1500

活跃

-40 to 85 °C

Tray

M1A3PE1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

280

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

280

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1

38400

38400

1500000

1.73 mm

23 mm

23 mm