2144 In Stock

• 1: ¥2,069.606631
• 10: ¥1,952.459087
• 100: ¥1,841.942537
• 500: ¥1,737.681637
查看所有的价格

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

Fusion

微芯片技术

0.014110 oz

1.575 V

Tray

M1AFS250

活跃

FBGA-256

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M1AFS250-FG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

114 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1098.9 MHz

有

90

-40°C ~ 100°C (TJ)

Tray

M1AFS250

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

STD

6144

250000

1.2 mm

17 mm

17 mm

49 In Stock

• 1: ¥312.505180
• 10: ¥294.816208
• 100: ¥278.128495
• 500: ¥262.385372
查看所有的价格

-

表面贴装

CSP-196

YES

196-CSP (8x8)

196

0 C

+ 70 C

SMD/SMT

250 MHz

有

-

微芯片技术

348

36864 bit

IGLOOe

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGL250

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

未说明

85 °C

有

AGL250V2-CSG196

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.62

This product may require additional documentation to export from the United States.

Details

3000 LE

143 I/O

1.14 V

0 to 70 °C

Tray

AGL250V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B196

不合格

1.2 V to 1.5 V

OTHER

20 uA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

8 mm

8 mm

2684 In Stock

• 1: ¥1,285.217035
• 10: ¥1,212.468902
• 100: ¥1,143.838585
• 500: ¥1,079.093002
查看所有的价格

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

有

90

Fusion

微芯片技术

0.014110 oz

1.575 V

1.425 V

1.5000 V

Tray

M1AFS250

活跃

1.575 V

FBGA-256

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AFS250-FG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

114 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1098.9 MHz

0 to 70 °C

Tray

M1AFS250

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

OTHER

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

STD

6144

250000

1.2 mm

17 mm

17 mm

2093 In Stock

• 1: ¥1,974.598854
• 10: ¥1,862.829107
• 100: ¥1,757.385947
• 500: ¥1,657.911277
查看所有的价格

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

M1AFS1500

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AFS1500-FG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

N

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1098.9 MHz

有

90

Fusion

0.014110 oz

Tray

0°C ~ 85°C (TJ)

Tray

M1AFS1500

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

OTHER

38400 CLBS, 1500000 GATES

1.68 mm

现场可编程门阵列

276480

1500000

STD

38400

1500000

1.2 mm

17 mm

17 mm

36 In Stock

• 1: ¥337.342970
• 10: ¥318.248089
• 100: ¥300.234041
• 500: ¥283.239659
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

M1AGL250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.2 V

40

85 °C

有

M1AGL250V2-FGG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

3000 LE

97 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

有

160

IGLOOe

0.014110 oz

1.575 V

Tray

0°C ~ 70°C (TA)

Tray

M1AGL250V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.2 V to 1.5 V

OTHER

1.575 V

1.14 V

4.5 kB

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

6144

36864

250000

6144

250000

1.05 mm

13 mm

13 mm

49 In Stock

• 1: ¥119.481655
• 10: ¥112.718545
• 100: ¥106.338251
• 500: ¥100.319104
查看所有的价格

-

表面贴装

UCSP

YES

81-UCSP (4x4)

81

有

490

IGLOOe

微芯片技术

1.5000 V

1.425 V

1.575 V

Tray

AGL030

活跃

1.575 V

VFBGA,

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.5 V

未说明

100 °C

有

AGL030V5-UCG81I

108 MHz

VFBGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

330 LE

66 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

250 MHz

-40 to 85 °C

Tray

AGL030V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.4 mm

compliant

S-PBGA-B81

不合格

1.5 V

INDUSTRIAL

4 uA

768 CLBS, 30000 GATES

0.8 mm

现场可编程门阵列

768

30000

STD

768

30000

0.66 mm

4 mm

4 mm

2938 In Stock

• 1: ¥1,903.476813
• 10: ¥1,795.732842
• 100: ¥1,694.087585
• 500: ¥1,598.195833
查看所有的价格

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

Details

有

90

Fusion

114

Tray

U1AFS600

活跃

0°C ~ 85°C (TJ)

Tray

U1AFS600

1.425V ~ 1.575V

36864

250000

STD

781 In Stock

• 1: ¥210.163149
• 10: ¥198.267120
• 100: ¥187.044454
• 500: ¥176.457030
查看所有的价格

-

表面贴装

CSP-81

YES

81-CSP (5x5)

81

IGLOO nano

微芯片技术

0.118870 oz

Tray

AGLN250

活跃

1.575 V

VFBGA,

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

未说明

85 °C

有

AGLN250V5-CSG81I

VFBGA

SQUARE

活跃

MICROSEMI CORP

5.58

Details

3000 LE

60 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

250 MHz

有

640

-40°C ~ 100°C (TJ)

Tray

AGLN250V5

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B81

不合格

1.5 V

INDUSTRIAL

-

6144 CLBS, 250000 GATES

0.8 mm

现场可编程门阵列

6144

36864

250000

STD

-

6144

250000

0.66 mm

5 mm

5 mm

2307 In Stock

• 1: ¥1,103.377054
• 10: ¥1,040.921748
• 100: ¥982.001649
• 500: ¥926.416652
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

+ 85 C

SMD/SMT

有

160

IGLOOe

0.014110 oz

微芯片技术

FBGA

1.2, 1.5 V

1.14 V

600000

97

600000

1.575 V

表面贴装

1.575 V

Tray

M1AGL600

活跃

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.2 V

30

100 °C

无

M1AGL600V2-FG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

Industrial grade

This product may require additional documentation to export from the United States.

N

97 I/O

1.14 V

- 40 C

-40 to 85 °C

Tray

M1AGL600V2

e0

Tin/Lead/Silver (Sn/Pb/Ag)

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

144

S-PBGA-B144

不合格

1.2 V to 1.5 V

INDUSTRIAL

1.575 V

1.14 V

13.5 kB

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

13824

110592

600000

Industrial

STD

13824

13824

600000

1.05 mm

13 mm

13 mm

2315 In Stock

• 1: ¥2,609.712097
• 10: ¥2,461.992546
• 100: ¥2,322.634477
• 500: ¥2,191.164603
查看所有的价格

-

表面贴装

FBGA

YES

676-FBGA (27x27)

676

+ 85 C

SMD/SMT

231 MHz

有

40

ProASIC3

微芯片技术

0.014110 oz

1.5000 V

1.575 V

1.425 V

1.575 V

Tray

M1A3PE1500

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

-40 °C

1.5 V

30

85 °C

无

M1A3PE1500-FG676I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

444 I/O

1.425 V

- 40 C

-40 to 85 °C

Tray

M1A3PE1500

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B676

444

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

444

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

STD

38400

38400

1500000

1.73 mm

27 mm

27 mm

2284 In Stock

• 1: ¥924.805128
• 10: ¥872.457669
• 100: ¥823.073276
• 500: ¥776.484216
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

272 MHz

有

60

ProASIC3

微芯片技术

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P600-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

235 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

-40 to 85 °C

Tray

M1A3P600

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.73 mm

23 mm

23 mm

36 In Stock

• 1: ¥746.786845
• 10: ¥704.515890
• 100: ¥664.637637
• 500: ¥627.016637
查看所有的价格

-

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

350 MHz

有

60

ProASIC3

微芯片技术

0.014110 oz

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

M1A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P600-FGG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

235 I/O

1.425 V

0 C

+ 85 C

SMD/SMT

0 to 70 °C

Tray

M1A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

STD

13824

600000

1.73 mm

23 mm

23 mm

2772 In Stock

• 1: ¥2,431.090444
• 10: ¥2,293.481554
• 100: ¥2,163.661837
• 500: ¥2,041.190414
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

+ 85 C

SMD/SMT

231 MHz

有

60

ProASIC3

微芯片技术

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE1500

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

30

85 °C

无

M1A3PE1500-FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

280 I/O

1.425 V

- 40 C

-40 to 85 °C

Tray

M1A3PE1500

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

280

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

280

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

STD

38400

38400

1500000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

有

60

ProASIC3

微芯片技术

0.014110 oz

1.425 V

1.575 V

Tray

M1A3P600

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1A3P600-2FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

235 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

-40°C ~ 100°C (TJ)

Tray

M1A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.73 mm

23 mm

23 mm

703 In Stock

• 1: ¥4,754.568276
• 10: ¥4,485.441771
• 100: ¥4,231.548838
• 500: ¥3,992.027205
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

+ 85 C

SMD/SMT

231 MHz

有

60

ProASIC3

微芯片技术

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

40

85 °C

有

M1A3PE3000-FGG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

341 I/O

1.425 V

- 40 C

-40 to 85 °C

Tray

M1A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

2074 In Stock

• 1: ¥2,838.553218
• 10: ¥2,677.880394
• 100: ¥2,526.302261
• 500: ¥2,383.304022
查看所有的价格

-

表面贴装

FBGA

YES

676-FBGA (27x27)

676

+ 85 C

SMD/SMT

272 MHz

有

40

ProASIC3

微芯片技术

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE1500

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

-40 °C

1.5 V

30

85 °C

无

M1A3PE1500-1FG676I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

444 I/O

1.425 V

- 40 C

-40 to 85 °C

Tray

M1A3PE1500

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B676

444

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

444

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1

38400

38400

1500000

1.73 mm

27 mm

27 mm

2379 In Stock

• 1: ¥3,074.435901
• 10: ¥2,900.411230
• 100: ¥2,736.237008
• 500: ¥2,581.355670
查看所有的价格

-

表面贴装

FBGA

YES

676-FBGA (27x27)

676

+ 85 C

SMD/SMT

310 MHz

有

40

ProASIC3

微芯片技术

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE1500

活跃

27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

-40 °C

1.5 V

30

85 °C

无

M1A3PE1500-2FG676I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

444 I/O

1.425 V

- 40 C

-40 to 85 °C

Tray

M1A3PE1500

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B676

444

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

444

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

2

38400

38400

1500000

1.73 mm

27 mm

27 mm

613 In Stock

• 1: ¥9,197.028553
• 10: ¥8,894.611751
• 25: ¥8,832.782279
• 50: ¥8,771.382599
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

+ 85 C

SMD/SMT

781.25 MHz

有

60

ProASIC3

微芯片技术

0.014110 oz

1.26 V

1.14 V

1.2000 V

1.26 V

Tray

M1A3PE3000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.2 V

40

85 °C

有

M1A3PE3000L-FGG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

341 I/O

1.14 V

- 40 C

-40 to 85 °C

Tray

M1A3PE3000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

2611 In Stock

• 1: ¥2,113.991701
• 10: ¥1,994.331798
• 100: ¥1,881.445090
• 500: ¥1,774.948194
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

SMD/SMT

231 MHz

有

60

ProASIC3

微芯片技术

0.014110 oz

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

M1A3PE1500

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

30

70 °C

无

M1A3PE1500-FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

280 I/O

1.425 V

0 C

+ 70 C

0 to 70 °C

Tray

M1A3PE1500

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

280

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

280

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

STD

38400

38400

1500000

1.73 mm

23 mm

23 mm

894 In Stock

• 1: ¥7,543.543738
• 10: ¥7,116.550695
• 100: ¥6,713.727074
• 500: ¥6,333.704781
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M1AFS1500-2FG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.29

N

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

M1AFS1500

活跃

-40°C ~ 100°C (TJ)

Tray

M1AFS1500

TIN LEAD/TIN LEAD SILVER

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

33.8 kB

1500000 GATES

1.7 mm

现场可编程门阵列

276480

1500000

1.47059 GHz

2

38400

1500000

1.2 mm

17 mm

17 mm

无

2364 In Stock

• 1: ¥2,655.961993
• 10: ¥2,505.624521
• 100: ¥2,363.796721
• 500: ¥2,229.996905
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

+ 85 C

SMD/SMT

272 MHz

有

0.014110 oz

ProASIC3

微芯片技术

60

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE1500

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

30

85 °C

无

M1A3PE1500-1FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

280 I/O

1.425 V

- 40 C

-40 to 85 °C

Tray

M1A3PE1500

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

280

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

280

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1

38400

38400

1500000

1.73 mm

23 mm

23 mm

514 In Stock

• 1: ¥6,325.588483
• 10: ¥5,967.536303
• 100: ¥5,629.751232
• 500: ¥5,311.086068
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

微芯片技术

Tray

M1AFS1500

活跃

1.575 V

FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

M1AFS1500-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0.014110 oz

Fusion

60

有

1282.05 MHz

SMD/SMT

+ 85 C

- 40 C

1.425 V

223 I/O

Details

-40°C ~ 100°C (TJ)

Tray

M1AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1

38400

1500000

1.73 mm

23 mm

23 mm

929 In Stock

• 1: ¥4,658.076039
• 10: ¥4,394.411357
• 100: ¥4,145.671090
• 500: ¥3,911.010465
查看所有的价格

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

SMD/SMT

+ 85 C

- 40 C

1.425 V

620 I/O

Details

微芯片技术

This product may require additional documentation to export from the United States.

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE3000

活跃

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.5 V

40

85 °C

有

M1A3PE3000-FGG896I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0.014110 oz

ProASIC3

27

有

231 MHz

-40 to 85 °C

Tray

M1A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

31 mm

31 mm

2062 In Stock

• 1: ¥1,718.222109
• 10: ¥1,620.964256
• 100: ¥1,529.211564
• 500: ¥1,442.652416
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-256

YES

256

256-FPBGA (17x17)

256

90

IGLOOe

微芯片技术

1.2, 1.5 V

1.2 V

1.5 V

Tray

M1AGL1000

活跃

5.3

1.575 V

MICROSEMI CORP

活跃

SQUARE

BGA

108 MHz

M1AGL1000V2-FGG256I

有

100 °C

1.14 V

40

1.2 V

-40 °C

PLASTIC/EPOXY

3

网格排列

BGA,

This product may require additional documentation to export from the United States.

Details

11000 LE

177 I/O

- 40 C

+ 85 C

SMD/SMT

250 MHz

有

-40 to 85 °C

Tray

M1AGL1000V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

127 uA

18 kB

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

24576

147456

1000000

250 MHz

STD

24576

1000000

17 mm

17 mm

无铅

2087 In Stock

• 1: ¥1,516.371692
• 10: ¥1,430.539330
• 100: ¥1,349.565407
• 500: ¥1,273.174912
查看所有的价格

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

0.014110 oz

1.575 V

Tray

M1AFS250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AFS250-2FG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

114 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

90

Fusion

0°C ~ 85°C (TJ)

Tray

M1AFS250

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

OTHER

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

2

6144

250000

1.2 mm

17 mm

17 mm