N/A

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

微芯片技术

125 °C

无

M1A3PE3000L-1FG896M

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0.014110 oz

ProASIC3

27

有

350 MHz

SMD/SMT

+ 125 C

- 55 C

1.14 V

620 I/O

N

This product may require additional documentation to export from the United States.

1.575 V

Tray

M1A3PE3000

活跃

1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-55 °C

1.2 V

30

-55°C ~ 125°C (TJ)

Tray

M1A3PE3000L

e0

3A001.A.2.C

锡铅

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B896

620

不合格

1.2/1.5,1.2/3.3 V

MILITARY

25 mA

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

31 mm

31 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

活跃

MICROSEMI CORP

5.59

N

1500 LE

71 I/O

1.14 V

- 20 C

+ 70 C

SMD/SMT

250 MHz

有

90

IGLOO nano

1.575 V

Tray

AGLN125

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.2 V

30

70 °C

无

AGLN125V2-VQ100

TFQFP

SQUARE

-20°C ~ 85°C (TJ)

Tray

AGLN125V2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.2 V to 1.5 V

QUAD

鸥翼

230

0.5 mm

unknown

S-PQFP-G100

不合格

OTHER

18 uA

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

1 mm

14 mm

14 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

M1A3P1000-PQG208M

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.23

ProASIC3

24

有

350 MHz

SMD/SMT

+ 125 C

- 55 C

1.425 V

154 I/O

Details

This product may require additional documentation to export from the United States.

1.575 V

Tray

M1A3P1000

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-55 °C

1.5 V

40

125 °C

有

-55°C ~ 125°C (TJ)

Tray

M1A3P1000

e3

3A001.A.2.C

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5,1.5/3.3 V

MILITARY

8 mA

154

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

24576

24576

1000000

28 mm

28 mm

N/A

-

表面贴装

FBGA

144-FPBGA (13x13)

微芯片技术

+ 125 C

- 55 C

1.425 V

97 I/O

Details

This product may require additional documentation to export from the United States.

SMD/SMT

350 MHz

有

160

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3P1000

活跃

-55°C ~ 125°C (TJ)

Tray

M1A3P1000

1.5 V

8 mA

147456

1000000

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

5.27

This product may require additional documentation to export from the United States.

N

27696 LE

138 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL025-VF256

LFBGA

SQUARE

活跃

FPGA IGLOOu00ae2 Family 27696 Cells 1.2V 256-Pin VFBGA Tray

MICROSEMI CORP

0°C ~ 85°C (TJ)

Tray

M2GL025

8542.39.00.01

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

OTHER

1.56 mm

现场可编程门阵列

27696

1130496

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FBGA-484

YES

484

484-FPBGA (23x23)

484

IGLOO2

1.2000 V

1.14 V

1.26 V

微芯片技术

IGLOO®2

85C

Commercial

FBGA

0C to 85C

267

56340

1.26(V)

1.2(V)

无

1.14(V)

0C

有

56340

表面贴装

1.26 V

8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000

Tray

M2GL050

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

85 °C

有

M2GL050-FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.56

This product may require additional documentation to export from the United States.

Details

56340 LE

267 I/O

1.14 V

0 C

+ 85 C

SMD/SMT

有

60

0 to 85 °C

Tray

M2GL050

85 °C

0 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

228.3 kB

667 Mb/s

267

2.44 mm

现场可编程门阵列

56340

1869824

STD

4 Transceiver

56340

1.26 V

1.14 V

23 mm

23 mm

N/A

-

表面贴装

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

This product may require additional documentation to export from the United States.

Details

27696 LE

138 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

0°C ~ 85°C (TJ)

Tray

M2GL025TS

1.2 V

27696

1130496

2 Transceiver

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

341 I/O

1.14 V

- 55 C

+ 125 C

SMD/SMT

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

A3PE3000

活跃

1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

40

125 °C

有

A3PE3000L-1FGG484M

250 MHz

BGA

SQUARE

-55°C ~ 125°C (TJ)

Tray

A3PE3000L

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

125 °C

-55 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.2/1.5,1.2/3.3 V

MILITARY

63 kB

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

75264

75264

75264

1.575 V

1.14 V

3000000

23 mm

23 mm

无

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

N

27696 LE

180 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

176

IGLOO2

Tray

M2GL025

活跃

1.2 V

BGA, BGA325,21X21,20

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

无

M2GL025T-FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

1.47

-40°C ~ 100°C (TJ)

Tray

M2GL025T

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

180

现场可编程门阵列

27696

1130496

2 Transceiver

27696

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

1.2 V

This product may require additional documentation to export from the United States.

Details

6060 LE

171 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

有

90

IGLOO2

0.287305 oz

Tray

M2GL005

活跃

1.26 V

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

5.3

MICROSEMI CORP

活跃

SQUARE

LFBGA

M2GL005-1VFG400I

有

30

-40°C ~ 100°C (TJ)

Tray

M2GL005

100 °C

-40 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

171

不合格

1.2 V

87.9 kB

667 Mb/s

171

1.51 mm

现场可编程门阵列

6060

719872

1

6060

17 mm

17 mm

无铅

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

BGA-484

YES

484

484-FPBGA (23x23)

484

微芯片技术

SQUARE

活跃

FPGA - Field Programmable Gate Array IGLOO 2

MICROSEMI CORP

5.3

85 °C

20

1.2 V

BGA484,22X22,40

PLASTIC/EPOXY

3

网格排列

BGA, BGA484,22X22,40

This product may require additional documentation to export from the United States.

N

6060 LE

209 I/O

1.14 V

0 C

+ 85 C

SMD/SMT

703 kbit

64 kB

400 MHz

有

11 LAB

60

128 kB

IGLOO2

Tray

M2GL005

活跃

1.26 V

无

M2GL005-FG484

BGA

0°C ~ 85°C (TJ)

Tray

M2GL005

85 °C

0 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

209

不合格

1.2 V

OTHER

128 kB

87.9 kB

-

209

2.44 mm

现场可编程门阵列

6060

719872

400 MHz

11

STD

-

6060

1.26 V

1.14 V

23 mm

23 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

0 C

+ 85 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL090

活跃

3

PLASTIC

BGA325,21X21,20

1.2 V

有

M2GL090-FCSG325

活跃

MICROSEMI CORP

5.81

This product may require additional documentation to export from the United States.

Details

86184 LE

180 I/O

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL090

8542.39.00.01

CMOS

1.2 V

compliant

180

不合格

1.2 V

180

现场可编程门阵列

86184

2648064

86316

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

86184 LE

267 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL090

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

85 °C

无

M2GL090-1FG484

BGA

SQUARE

活跃

0°C ~ 85°C (TJ)

Tray

M2GL090

85 °C

0 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

323.3 kB

267

2.44 mm

现场可编程门阵列

86316

2648064

1

86316

23 mm

23 mm

N/A

-

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

5.27

Details

86184 LE

267 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

0.630643 oz

1.2 V

Tray

M2GL090

活跃

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

有

M2GL090-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

-40°C ~ 100°C (TJ)

Tray

M2GL090

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

667 Mb/s

267

2.44 mm

现场可编程门阵列

86184

2648064

STD

4 Transceiver

86316

23 mm

23 mm

N/A

-

表面贴装

FCV-484

484-FBGA (19x19)

微芯片技术

1

3.6 MB

1.03 V/1.08 V

Tray

活跃

48000 LE

176 I/O

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

500 MHz

-40°C ~ 100°C (TJ)

Tray

-

1 V, 1.05 V

3774874

48000

N/A

-

表面贴装

FCV-484

484-FBGA (19x19)

微芯片技术

1

3.6 MB

Tray

活跃

1.03 V/1.08 V

48000 LE

176 I/O

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

500 MHz

-40°C ~ 100°C (TJ)

Tray

-

1 V, 1.05 V

3774874

48000

N/A

-

表面贴装

FCS-325

325-BGA (11x11)

微芯片技术

1

3.6 MB

Tray

活跃

1.03 V/1.08 V

48000 LE

176 I/O

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

500 MHz

-40°C ~ 100°C (TJ)

Tray

-

1 V, 1.05 V

3774874

48000

N/A

-

表面贴装

FCS-325

325-BGA (11x11)

微芯片技术

1

3.6 MB

1.03 V/1.08 V

Tray

活跃

48000 LE

176 I/O

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

500 MHz

-40°C ~ 100°C (TJ)

Tray

-

1 V, 1.05 V

3774874

48000

N/A

-

表面贴装

FCV-484

484-FBGA (19x19)

微芯片技术

+ 100 C

SMD/SMT

500 MHz

1

3.6 MB

MSL 3 - 168 hours

1.03 V/1.08 V

Tray

活跃

48000 LE

176 I/O

970 mV/1.02 V

0 C

0°C ~ 100°C (TJ)

Tray

-

1 V, 1.05 V

3774874

3686.4Kbit

48000

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

微芯片技术

RECTANGULAR

活跃

FPGA - Field Programmable Gate Array MX

MICROSEMI CORP

1.55

Details

336 LE

83 I/O

3 V

0 C

+ 70 C

SMD/SMT

有

66

Actel

0.062040 oz

5.25 V

Tray

A42MX09

活跃

ROHS COMPLIANT, PLASTIC, QFP-100

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX09-PQG100

117 MHz

QFP

0°C ~ 70°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

COMMERCIAL

-

684 CLBS, 14000 GATES

3.4 mm

现场可编程门阵列

14000

STD

-

2.5 ns

684

14000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

100-TQFP

YES

100

100-VQFP (14x14)

100

微芯片技术

PLASTIC/EPOXY

-55 °C

3.3 V

30

3 V

125 °C

无

A42MX16-VQ100M

94 MHz

TFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.24

QFP

Obsolete

A42MX16

Tray

83

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

-55°C ~ 125°C (TC)

MX

3A001.A.2.C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

240

0.5 mm

compliant

S-PQFP-G100

不合格

MILITARY

1232 CLBS, 24000 GATES

1.2 mm

现场可编程门阵列

24000

2.8 ns

1232

24000

14 mm

14 mm

N/A

-

Obsolete (Last Updated: 1 month ago)

表面贴装

表面贴装

100-BQFP

YES

100

100-PQFP (20x14)

1.758804 g

100

微芯片技术

无

A42MX16-3PQ100

129 MHz

QFP

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.24

QFP

83

Compliant

Tray

A42MX16

Obsolete

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

5 V

QUAD

鸥翼

225

0.65 mm

compliant

R-PQFP-G100

不合格

COMMERCIAL

1232 CLBS, 24000 GATES

3.4 mm

现场可编程门阵列

608

24000

237 MHz

608

3

928

1.9 ns

1232

5.25 V

3 V

24000

2.7 mm

20 mm

14 mm

无

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

160-BQFP

YES

160

160-PQFP (28x28)

5.566797 g

160

微芯片技术

125 °C

无

A42MX24-PQ160M

QFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.23

QFP

125

Compliant

Obsolete

A42MX24

Tray

PLASTIC, QFP-160

FLATPACK

3

PLASTIC/EPOXY

-55 °C

3.3 V

30

3 V

-55°C ~ 125°C (TC)

MX

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

5 V

QUAD

鸥翼

225

0.65 mm

compliant

S-PQFP-G160

不合格

MILITARY

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

912

1410

2.5 ns

1890

5.5 V

3 V

36000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

100-BQFP

YES

100

100-PQFP (20x14)

100

微芯片技术

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

无

A40MX04-3PQ100I

109 MHz

QFP

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.24

QFP

69

Tray

A40MX04

Obsolete

QFP,

FLATPACK

3

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

R-PQFP-G100

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

3.4 mm

现场可编程门阵列

6000

1.7 ns

547

6000

20 mm

14 mm

N/A

-

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

174

Tray

A54SX32

Obsolete

Compliant

QFP, QFP208,1.2SQ,20

FLATPACK

PLASTIC/EPOXY

QFP208,1.2SQ,20

70 °C

无

A54SX32-PQ208

240 MHz

QFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.84

0°C ~ 70°C (TA)

SX

70 °C

0 °C

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

0.5 mm

unknown

240 MHz

S-PQFP-G208

174

不合格

3.3,5 V

COMMERCIAL

900 ps

900 ps

174

现场可编程门阵列

2880

48000

240 MHz

2880

2880

1080

2880

5.25 V

4.75 V

3.4 mm

28 mm

28 mm

无