N/A

-

前端安装

676-BGA

12

676-FBGA (27x27)

300 VAC, 300 VDC

微芯片技术

UL

Turck

1.5000 V

1.425 V

1.575 V

336

Tray

AX500

活跃

0 to 70 °C

Axcelerator

1.425V ~ 1.575V

6 A

73728

500000

8064

2

IP67

2 m

N/A

-

表面贴装

144-BQFP

144-PQFP (28x28)

300 stainless steel

微芯片技术

95

Tray

Obsolete

无

A42MX09-PQ144I

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.8

-40°C ~ 85°C (TA)

42MX

Blind Threaded Inserts - MaxTite®

3V ~ 3.6V, 4.75V ~ 5.25V

compliant

348

14000

N/A

-

Back Mount

100-TQFP

4

100-VQFP (14x14)

125 VAC, 125 VDC

微芯片技术

CSA, UL

Turck

68

Tray

A3PN250

Obsolete

-20°C ~ 85°C (TJ)

ProASIC3 nano

1.425V ~ 1.575V

4 A

36864

250000

IP67

1 m

N/A

-

表面贴装

68-VFQFN Exposed Pad

YES

6

68-QFN (8x8)

68

600 VAC/600 VDC

微芯片技术

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

-40 °C

1.2 V

未说明

1.14 V

85 °C

有

HVQCCN

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.59

7000-PS202-8211050

飞线

Female

Murrelektronik

PUR

49

Tray

AGLN020

活跃

HVQCCN,

-40°C ~ 100°C (TJ)

IGLOO nano

Female to Flying Leads, 6-pole, M23

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

无铅

未说明

0.4 mm

compliant

15 Amps

S-XQCC-N68

不合格

INDUSTRIAL

520 CLBS, 20000 GATES

1 mm

现场可编程门阵列

520

20000

STD

520

20000

IP65/IP67

10.5 Meters

8 mm

N/A

-

表面贴装

100-LQFP

100-TQFP (14x14)

微芯片技术

Tray

EX256

Obsolete

81

0°C ~ 70°C (TA)

EX

2.3V ~ 2.7V

512

12000

N/A

-

表面贴装

160-BQFP

YES

160-PQFP (28x28)

160

微芯片技术

3.3 V

30

3 V

85 °C

无

A42MX16-2PQ160I

117 MHz

QFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.24

QFP

125

Tray

A42MX16

Obsolete

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

160

S-PQFP-G160

不合格

INDUSTRIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

2.1 ns

1232

24000

28 mm

28 mm

N/A

-

YES

100

FLATPACK, LOW PROFILE, FINE PITCH

2.7 V

2.5 V

40

2.3 V

EX64-PTQG100

有

Obsolete

MICROSEMI CORP

LFQFP,

5.83

357 MHz

3

70 °C

PLASTIC/EPOXY

LFQFP

SQUARE

e3

哑光锡

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

COMMERCIAL

3000 GATES

1.6 mm

现场可编程门阵列

0.7 ns

3000

14 mm

14 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

1.26 V

1.14 V

1.2 V

30

84

Tray

M2GL005

活跃

6060 LE

+ 85 C

0 C

SMD/SMT

M2GL005-TQG144

有

活跃

MICROSEMI CORP

LFQFP,

5.54

3

85 °C

PLASTIC/EPOXY

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

1.2 V

OTHER

-

1.6 mm

现场可编程门阵列

6060

719872

STD

-

20 mm

20 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

30

154

Tray

M1A3P1000

Obsolete

1.425 V

M1A3P1000-PQ208M

无

Obsolete

MICROSEMI CORP

0.50 MM PITCH, PLASTIC, QFP-208

5.24

350 MHz

3

125 °C

-55 °C

-55°C ~ 125°C (TJ)

ProASIC3

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5,1.5/3.3 V

MILITARY

154

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

24576

24576

1000000

28 mm

28 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

30

147

Tray

M1A3PE1500

Obsolete

1.425 V

M1A3PE1500-PQ208

无

Obsolete

MICROSEMI CORP

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208

5.6

350 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

0°C ~ 85°C (TJ)

ProASIC3E

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

COMMERCIAL

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

38400

38400

1500000

28 mm

28 mm

N/A

-

YES

208

FLATPACK

1.575 V

1.5 V

30

1.425 V

M1AFS600-1PQ208I

无

Obsolete

MICROSEMI CORP

QFF,

5.88

3

85 °C

-40 °C

PLASTIC/EPOXY

QFF

RECTANGULAR

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

QUAD

FLAT

225

0.5 mm

compliant

R-PQFP-F208

不合格

INDUSTRIAL

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

13824

600000

30.6 mm

28 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

20

84

Tray

Obsolete

1.14 V

M2GL005S-TQ144

无

Obsolete

MICROSEMI CORP

20 X 20 MM, 0.50 MM PITCH, TQFP-144

5.57

3

85 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

1.26 V

1.2 V

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

QUAD

鸥翼

240

0.5 mm

compliant

S-PQFP-G144

OTHER

1.6 mm

现场可编程门阵列

6060

719872

20 mm

20 mm

N/A

-

YES

208

3

278 MHz

5.27

FQFP, QFP208,1.2SQ,20

MICROSEMI CORP

Obsolete

有

A54SX08A-1PQG208I

2.25 V

40

2.5 V

2.75 V

FLATPACK, FINE PITCH

SQUARE

QFP208,1.2SQ,20

FQFP

PLASTIC/EPOXY

-40 °C

85 °C

e3

哑光锡

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

130

不合格

2.5,3.3/5 V

INDUSTRIAL

130

768 CLBS, 12000 GATES

4.1 mm

现场可编程门阵列

1.1 ns

768

768

12000

28 mm

28 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

PLASTIC/EPOXY

LFQFP

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

2.75 V

2.5 V

30

113

Tray

A54SX32A

Obsolete

2.25 V

A54SX32A-1TQ144I

无

Obsolete

MICROSEMI CORP

1.40 MM HEIGHT, TQFP-144

5.25

278 MHz

3

85 °C

-40 °C

-40°C ~ 85°C (TA)

SX-A

e0

Tin/Lead (Sn/Pb)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G144

113

不合格

2.5,3.3/5 V

INDUSTRIAL

113

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

20 mm

20 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

85 °C

微芯片技术

-40 °C

PLASTIC/EPOXY

TFQFP

TQFP100,.63SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

3.6 V

3.3 V

40

3.3, 5 V

2.97, 4.5 V

3.63, 5.5 V

81

Tray

A54SX16

活跃

3 V

A54SX16P-VQG100I

有

活跃

MICROSEMI CORP

TFQFP, TQFP100,.63SQ

5.25

240 MHz

3

-40 to 85 °C

SX

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

81

不合格

3.3,3.3/5 V

INDUSTRIAL

81

1452 CLBS, 16000 GATES

1.2 mm

现场可编程门阵列

24000

1452

STD

0.9 ns

1452

1452

16000

14 mm

14 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

PLASTIC/EPOXY

LFQFP

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

2.75 V

2.5 V

30

113

Tray

A54SX32A

Obsolete

2.25 V

A54SX32A-1TQ144M

无

Obsolete

MICROSEMI CORP

1.40 MM HEIGHT, TQFP-144

5.25

278 MHz

3

125 °C

-55 °C

-55°C ~ 125°C (TC)

SX-A

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G144

113

不合格

2.5,3.3/5 V

MILITARY

113

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

20 mm

20 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.575 V

1.5 V

未说明

68

Tray

AGL250

活跃

1.425 V

AGL250V5-VQG100I

有

活跃

MICROSEMI CORP

TFQFP,

5.32

108 MHz

3

100 °C

-40 °C

PLASTIC/EPOXY

-40°C ~ 85°C (TA)

IGLOO

e3

Tin (Sn)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

6144

250000

14 mm

14 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.575 V

1.5 V

未说明

1.5000 V

1.425 V

1.575 V

77

Tray

AGL030

活跃

1.425 V

AGL030V5-VQG100

有

活跃

MICROSEMI CORP

TFQFP,

0.79

108 MHz

3

85 °C

0 to 70 °C

IGLOO

e3

Tin (Sn)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

OTHER

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

768

30000

STD

768

30000

14 mm

14 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

2.75 V

2.5 V

30

113

Tray

A54SX16A

Obsolete

2.25 V

A54SX16A-FTQ144

无

Obsolete

MICROSEMI CORP

LFQFP, QFP144,.87SQ,20

5.25

167 MHz

3

70 °C

PLASTIC/EPOXY

LFQFP

0°C ~ 70°C (TA)

SX-A

e0

Tin/Lead (Sn/Pb)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5,3.3/5 V

COMMERCIAL

113

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1.9 ns

1452

1452

24000

20 mm

20 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

FLATPACK, THIN PROFILE, FINE PITCH

1.575 V

1.14 V

1.2 V

未说明

68

Tray

AGL250

活跃

AGL250V2-VQG100

有

活跃

MICROSEMI CORP

TFQFP,

1.6

108 MHz

3

85 °C

PLASTIC/EPOXY

TFQFP

SQUARE

0°C ~ 70°C (TA)

IGLOO

e3

Tin (Sn)

8542.39.00.01

1.14V ~ 1.575V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

OTHER

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

14 mm

14 mm

N/A

-

表面贴装

48-VFQFN Exposed Pad

YES

48-QFN (6x6)

48

微芯片技术

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.575 V

1.2 V

未说明

34

Tray

AGLN010

活跃

1.14 V

AGLN010V2-QNG48

有

活跃

MICROSEMI CORP

HVQCCN,

1.49

3

70 °C

-20 °C

UNSPECIFIED

HVQCCN

SQUARE

-20°C ~ 85°C (TJ)

IGLOO nano

e3

Matte Tin (Sn)

8542.39.00.01

1.14V ~ 1.575V

QUAD

无铅

未说明

0.4 mm

compliant

S-XQCC-N48

不合格

OTHER

260 CLBS, 10000 GATES

1 mm

现场可编程门阵列

260

10000

STD

260

10000

6 mm

6 mm

N/A

-

表面贴装

100-BQFP

YES

100-PQFP (20x14)

100

微芯片技术

-40 °C

PLASTIC/EPOXY

QFP

RECTANGULAR

FLATPACK

3.6 V

3.3 V

30

83

Tray

A42MX09

Obsolete

3 V

A42MX09-1PQ100I

无

Obsolete

MICROSEMI CORP

QFP

PLASTIC, QFP-100

5.23

135 MHz

3

85 °C

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

100

R-PQFP-G100

不合格

INDUSTRIAL

684 CLBS, 14000 GATES

3.4 mm

现场可编程门阵列

14000

2.1 ns

684

14000

20 mm

14 mm

N/A

-

YES

144

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3.3 V

30

3 V

A54SX16P-TQ144M

无

Obsolete

MICROSEMI CORP

1.40 MM HEIGHT, MO-136, TQFP-144

5.6

240 MHz

3

125 °C

-55 °C

PLASTIC/EPOXY

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G144

不合格

MILITARY

1452 CLBS, 16000 GATES

1.6 mm

现场可编程门阵列

0.9 ns

1452

16000

20 mm

20 mm

N/A

-

表面贴装

100-BQFP

YES

100-PQFP (20x14)

100

微芯片技术

48 MHz

3

125 °C

-55 °C

PLASTIC/EPOXY

QFP

RECTANGULAR

FLATPACK

69

Tray

A40MX04

Obsolete

3 V

3.6 V

3.3 V

30

A40MX04-1PQ100M

无

Obsolete

MICROSEMI CORP

QFP

QFP,

5.23

-55°C ~ 125°C (TC)

MX

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

225

0.65 mm

compliant

100

R-PQFP-G100

不合格

MILITARY

547 CLBS, 6000 GATES

3.4 mm

现场可编程门阵列

6000

2.3 ns

547

6000

20 mm

14 mm

N/A

-

YES

68

1.575 V

1.2 V

1.14 V

AGL030V2-QNG68I

有

Obsolete

MICROSEMI CORP

8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68

8.62

3

100 °C

-40 °C

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

8542.39.00.01

QUAD

无铅

0.4 mm

compliant

S-XQCC-N68

INDUSTRIAL

768 CLBS, 30000 GATES

1 mm

现场可编程门阵列

768

30000

8 mm

8 mm