N/A

-

Production (Last Updated: 2 months ago)

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

微芯片技术

M2GL050

活跃

31 X 31 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

1.14 V

85 °C

有

M2GL050-1FGG896

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

Details

有

27

IGLOO2

377

Tray

0°C ~ 85°C (TJ)

Tray

M2GL050

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B896

377

不合格

1.2 V

OTHER

228.3 kB

377

2.44 mm

现场可编程门阵列

56340

1869824

56340

31 mm

31 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

YES

400

400-VFBGA (17x17)

400

微芯片技术

Tray

M2GL005

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

85 °C

无

M2GL005-1VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

1.14 V

有

90

IGLOO2

169

1.26 V

0°C ~ 85°C (TJ)

Tray

M2GL005

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

171

不合格

1.2 V

OTHER

87.9 kB

171

1.51 mm

现场可编程门阵列

6060

719872

6060

17 mm

17 mm

N/A

-

表面贴装

484-BFBGA

YES

484-BGA

484

微芯片技术

M2GL150

活跃

FBGA,

GRID ARRAY, FINE PITCH

4

PLASTIC/EPOXY

1.2 V

30

1.14 V

有

M2GL150-1FCVG484I

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

84

IGLOO2

248

Tray

-40°C ~ 100°C (TJ)

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B484

3.15 mm

现场可编程门阵列

146124

5120000

1

19 mm

19 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

活跃

IGLOO2

60

有

N

This product may require additional documentation to export from the United States.

267

Tray

M2GL050

0°C ~ 85°C (TJ)

Tray

M2GL050

85 °C

0 °C

1.14V ~ 2.625V

228.3 kB

56340

1869824

N/A

-

表面贴装

484-BFBGA

YES

484-BGA

484

微芯片技术

M2GL150

活跃

FBGA,

GRID ARRAY, FINE PITCH

4

PLASTIC/EPOXY

1.2 V

1.14 V

85 °C

有

M2GL150-1FCVG484

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

84

IGLOO2

248

Tray

0°C ~ 85°C (TJ)

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B484

OTHER

3.15 mm

现场可编程门阵列

146124

5120000

19 mm

19 mm

N/A

-

表面贴装

484-BFBGA

YES

484-FBGA (19x19)

484

微芯片技术

活跃

1.26 V

1.71

MICROSEMI CORP

活跃

SQUARE

FBGA

M2GL150T-FCV484I

无

1.14 V

20

1.2 V

PLASTIC/EPOXY

GRID ARRAY, FINE PITCH

FBGA,

This product may require additional documentation to export from the United States.

N

有

84

IGLOO2

248

Tray

M2GL150

-40°C ~ 100°C (TJ)

Tray

M2GL150T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B484

3.15 mm

现场可编程门阵列

146124

5120000

19 mm

19 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

YES

400

400-VFBGA (17x17)

400

微芯片技术

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

1.14 V

无

M2GL050T-1VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

90

IGLOO2

207

Tray

M2GL050

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL050T

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

228.3 kB

207

1.51 mm

现场可编程门阵列

56340

1869824

56340

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

微芯片技术

8542310000, 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000

68

Tray

A3P250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

1.5 V

1.425 V

125 °C

有

A3P250-VQG100M

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.18

This product may require additional documentation to export from the United States.

Details

SMD/SMT

有

90

ProASIC3

-55°C ~ 125°C (TJ)

Tray

A3P250

125 °C

-55 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

0.5 mm

compliant

S-PQFP-G100

MILITARY

4.5 kB

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

6144

250000

14 mm

14 mm

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

109000 LE

970 mV/1.02 V

SMD/SMT

7.6 Mbit

有

1

PolarFire

1.03 V/1.08 V

284

Tray

MPF100

活跃

-40°C ~ 100°C (TJ)

Tray

MPF100TS

0.97V ~ 1.08V

109000

7782400

N/A

-

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

Details

109000 LE

970 mV/1.02 V

SMD/SMT

7.6 Mbit

有

1

PolarFire

1.03 V/1.08 V

284

Tray

MPF100

活跃

-40°C ~ 100°C (TJ)

Tray

MPF100TLS

0.97V ~ 1.08V

109000

7782400

N/A

-

表面贴装

BGA-325

325-FCBGA (11x11)

微芯片技术

This product may require additional documentation to export from the United States.

Details

109000 LE

970 mV/1.02 V

SMD/SMT

7.6 Mbit

有

1

PolarFire

1.03 V/1.08 V

170

Tray

MPF100

活跃

-40°C ~ 100°C (TJ)

Tray

MPF100TS

0.97V ~ 1.08V

109000

7782400

N/A

-

表面贴装

BGA-325

325-FCBGA (11x11)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

109000 LE

970 mV/1.02 V

SMD/SMT

7.6 Mbit

有

1

PolarFire

MSL 3 - 168 hours

1.03 V/1.08 V

170

Tray

MPF100

-40°C ~ 100°C (TJ)

Tray

MPF100T

0.97V ~ 1.08V

109000

7782.4Kbit

N/A

-

表面贴装

BGA-484

484-FCBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

109000 LE

970 mV/1.02 V

SMD/SMT

7.6 Mbit

有

1

PolarFire

1.03 V/1.08 V

244

Tray

MPF100

活跃

-40°C ~ 100°C (TJ)

Tray

MPF100TS

0.97V ~ 1.08V

109000

7782400

N/A

-

表面贴装

BGA-325

325-FCBGA (11x11)

微芯片技术

This product may require additional documentation to export from the United States.

Details

109000 LE

970 mV/1.02 V

SMD/SMT

7.6 Mbit

有

1

PolarFire

1.03 V/1.08 V

170

Tray

MPF100

活跃

-40°C ~ 100°C (TJ)

Tray

MPF100TLS

0.97V ~ 1.08V

109000

7782400

N/A

-

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

Details

109000 LE

970 mV/1.02 V

SMD/SMT

7.6 Mbit

有

1

PolarFire

1.03 V/1.08 V

244

Tray

MPF100

活跃

-40°C ~ 100°C (TJ)

Tray

MPF100TLS

0.97V ~ 1.08V

109000

7782400

N/A

-

YES

144

-55 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3.3 V

40

3 V

A54SX16P-1TQG144M

有

Obsolete

MICROSEMI CORP

LFQFP,

5.81

280 MHz

3

125 °C

e3

3A001.A.2.C

哑光锡

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

不合格

MILITARY

1452 CLBS, 16000 GATES

1.6 mm

现场可编程门阵列

0.8 ns

1452

16000

20 mm

20 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.575 V

1.5 V

未说明

68

Tray

AGLN250

活跃

1.425 V

AGLN250V5-VQG100I

有

活跃

MICROSEMI CORP

TFQFP,

5.6

3

85 °C

-40 °C

PLASTIC/EPOXY

-40°C ~ 100°C (TJ)

IGLOO nano

e3

Tin (Sn)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

14 mm

14 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

40

-55 °C

125 °C

PLASTIC/EPOXY

LFQFP

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3.3 V

113

Tray

A54SX32

活跃

3 V

5.24

280 MHz

3

LFQFP, QFP144,.87SQ,20

MICROSEMI CORP

活跃

有

A54SX32-1TQG144M

-55°C ~ 125°C (TC)

SX

e3

3A001.A.2.C

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

3.3,5 V

MILITARY

113

2880 CLBS, 32000 GATES

1.6 mm

现场可编程门阵列

48000

2880

0.8 ns

2880

2880

32000

20 mm

20 mm

N/A

-

YES

256

-55 °C

CERAMIC, METAL-SEALED COFIRED

QFF

TPAK256,3SQ,20

SQUARE

FLATPACK

3.63 V

3.3 V

20

2.97 V

Military grade

A54SX16-1CQ256B

无

Obsolete

MICROSEMI CORP

QFF, TPAK256,3SQ,20

5.27

240 MHz

125 °C

e0

3A001.A.2.C

锡铅

24000 SYSTEM GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

225

0.5 mm

compliant

S-CQFP-F256

172

不合格

3.3,5 V

MILITARY

172

1452 CLBS, 16000 GATES

3.06 mm

现场可编程门阵列

MIL-STD-883 Class B

0.9 ns

1452

1452

16000

36 mm

36 mm

N/A

-

YES

208

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

2.75 V

2.5 V

30

2.25 V

A54SX08A-1PQ208

无

Obsolete

MICROSEMI CORP

FQFP, QFP208,1.2SQ,20

5.27

278 MHz

3

70 °C

e0

Tin/Lead (Sn/Pb)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

130

不合格

2.5,3.3/5 V

COMMERCIAL

130

768 CLBS, 12000 GATES

4.1 mm

现场可编程门阵列

1.1 ns

768

768

12000

28 mm

28 mm

N/A

-

表面贴装

100-LQFP

YES

100-TQFP (14x14)

100

微芯片技术

1.40 MM HEIGHT, TQFP-100

MICROSEMI CORP

Obsolete

无

A54SX32A-2TQ100

2.75 V

2.5 V

30

81

Tray

A54SX32A

Obsolete

2.25 V

5.25

313 MHz

3

70 °C

PLASTIC/EPOXY

LFQFP

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

0°C ~ 70°C (TA)

SX-A

e0

Tin/Lead (Sn/Pb)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G100

81

不合格

2.5,2.5/5 V

COMMERCIAL

81

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

2880

48000

14 mm

14 mm

N/A

-

YES

208

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

40

1.425 V

A3PE600-1PQG208

有

Obsolete

MICROSEMI CORP

FQFP, QFP208,1.2SQ,20

5.82

350 MHz

3

70 °C

e3

哑光锡

8542.39.00.01

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

COMMERCIAL

147

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

13824

13824

600000

28 mm

28 mm

N/A

-

YES

208

CERAMIC, METAL-SEALED COFIRED

-55 °C

125 °C

205 MHz

7.84

CERAMIC, QFP-208

MICROSEMI CORP

Obsolete

无

A54SX16-CQ208B

Military grade

SQUARE

FLATPACK

3.63 V

2.97 V

3.3 V

20

TPAK208,2.9SQ,20

QFF

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

24000 SYSTEM GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

225

0.5 mm

compliant

S-CQFP-F208

172

不合格

3.3,5 V

MILITARY

172

1452 CLBS, 16000 GATES

3.06 mm

现场可编程门阵列

MIL-STD-883 Class B

1 ns

1452

1452

16000

29.21 mm

29.21 mm

N/A

-

YES

144

5.84

FLATPACK

SQUARE

QFP144,.87SQ,20

QFP

PLASTIC/EPOXY

-40 °C

85 °C

230 MHz

QFP, QFP144,.87SQ,20

MICROSEMI CORP

活跃

A54SX08-TQ144I

无

QUAD

鸥翼

0.5 mm

unknown

S-PQFP-G144

113

不合格

3.3,5 V

INDUSTRIAL

113

现场可编程门阵列

768

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

2.7 V

2.5 V

30

107

Tray

APA075

Obsolete

2.3 V

APA075-TQ144I

无

Obsolete

MICROSEMI CORP

0.50 MM PITCH, TQFP-144

5.3

180 MHz

3

-40°C ~ 85°C (TA)

ProASICPLUS

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

2.3V ~ 2.7V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G144

107

不合格

2.5,2.5/3.3 V

INDUSTRIAL

107

75000 GATES

1.6 mm

现场可编程门阵列

27648

75000

3072

75000

20 mm

20 mm