N/A

-

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

Details

7000 LE

97 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

892.86 MHz

微芯片技术

有

160

IGLOOe

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

AGL600

活跃

1.575 V

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

AGL600V5-FGG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.4

-40 to 85 °C

Tray

AGL600V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

-

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

13824

110592

600000

STD

-

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

69 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

139 MHz

微芯片技术

有

90

Actel

5.5 V

Tray

A40MX04

活跃

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-80

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A40MX04-VQG80M

80 MHz

TQFP

SQUARE

活跃

MICROSEMI CORP

1.55

This product may require additional documentation to export from the United States.

Details

-55°C ~ 125°C (TC)

Tray

A40MX04

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

MILITARY

547 CLBS, 6000 GATES

1.2 mm

现场可编程门阵列

6000

2.7 ns

547

6000

1 mm

14 mm

14 mm

N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

+ 70 C

SMD/SMT

160 MHz

有

微芯片技术

90

Actel

5.25 V

Tray

A40MX02

活跃

TQFP,

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX02-1VQG80

92 MHz

TQFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

57 I/O

3 V

0 C

0°C ~ 70°C (TA)

Tray

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

COMMERCIAL

295 CLBS, 3000 GATES

1.2 mm

现场可编程门阵列

3000

2.3 ns

295

3000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 1 month ago)

Lead, Silver, Tin

表面贴装

表面贴装

FBGA-256

YES

256

256-FPBGA (17x17)

400.011771 mg

256

177 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

350 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3P600

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

A3P600-FG256I

350 MHz

BGA

SQUARE

活跃

FPGA - Field Programmable Gate Array ProASIC3

MICROSEMI CORP

1.48

N

-

-40 to 85 °C

Tray

A3P600

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

231 MHz

S-PBGA-B256

不合格

INDUSTRIAL

13.5 kB

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

231 MHz

STD

13824

13824

1.575 V

1.425 V

600000

1.2 mm

17 mm

17 mm

无

含铅

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

676

676-FBGA (27x27)

400.011771 mg

676

SMD/SMT

310 MHz

微芯片技术

有

40

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

A3PE1500

活跃

27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-676

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

A3PE1500-2FG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

444 I/O

1.425 V

0 C

+ 70 C

0 to 70 °C

Tray

A3PE1500

e0

锡铅

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B676

不合格

COMMERCIAL

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

310 MHz

2

38400

38400

1.575 V

1.425 V

1500000

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

0 C

+ 70 C

SMD/SMT

188 MHz

有

微芯片技术

27

Actel

0.084185 oz

5.25 V

Tray

A40MX04

活跃

ROHS COMPLIANT, PLASTIC, LCC-44

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX04-3PLG44

109 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

34 I/O

3 V

0°C ~ 70°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

COMMERCIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

1.7 ns

547

6000

3.68 mm

16.59 mm

16.59 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

Details

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3P1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1A3P1000-FGG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M1A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

N

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3P1000

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P1000-1FG256I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M1A3P1000

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

- 40 C

+ 125 C

SMD/SMT

153 MHz

有

微芯片技术

24

Actel

Tray

A42MX16

活跃

5.25 V

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A42MX16-PQG208A

139 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.59

Details

140 I/O

4.75 V

-40°C ~ 125°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5.0V SUPPLY

8542.39.00.01

CMOS

5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

AUTOMOTIVE

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

STD

2.2 ns

1232

24000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

4.75 V

- 40 C

+ 125 C

SMD/SMT

192 MHz

有

微芯片技术

66

Actel

0.062040 oz

5.25 V

Tray

A42MX09

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A42MX09-PQG100A

174 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.6

Details

83 I/O

-40°C ~ 125°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5.0V SUPPLY

8542.39.00.01

CMOS

5 V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

AUTOMOTIVE

684 CLBS, 14000 GATES

3.4 mm

现场可编程门阵列

14000

STD

2 ns

684

14000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

Details

69 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

160 MHz

微芯片技术

有

16

Actel

0.239083 oz

5.5 V

Tray

A40MX04

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A40MX04-1PLG84M

48 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TC)

Tube

A40MX04

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

MILITARY

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2.3 ns

547

6000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

1.5000 V

1.575 V

Tray

A3P400

活跃

This product may require additional documentation to export from the United States.

Details

151 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

24

ProASIC3

1.575 V

1.425 V

0 to 70 °C

Tray

A3P400

1.5 V

55296

400000

2

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

135 MHz

有

微芯片技术

24

Actel

Tray

A42MX24

活跃

5.25 V

QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A42MX24-PQG208A

124 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.6

Details

176 I/O

4.75 V

- 40 C

+ 125 C

SMD/SMT

-40°C ~ 125°C (TA)

Tray

A42MX24

e3

Matte Tin (Sn)

125 °C

-40 °C

CAN ALSO BE OPERATED AT 5.0V SUPPLY

8542.39.00.01

CMOS

5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

AUTOMOTIVE

2 ns

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

36000

135 MHz

STD

1410

2 ns

1890

5.25 V

4.75 V

36000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

83 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

198 MHz

微芯片技术

有

90

Actel

5.5 V

Tray

A42MX16

活跃

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX16-1VQG100M

108 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

-55°C ~ 125°C (TC)

Tray

A42MX16

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

MILITARY

1232 CLBS, 24000 GATES

1.2 mm

现场可编程门阵列

24000

2.4 ns

1232

24000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

0 C

+ 70 C

SMD/SMT

310 MHz

有

微芯片技术

160

ProASIC3

0.014110 oz

1.575 V

Tray

A3P060

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P060-2FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

96 I/O

1.425 V

0°C ~ 85°C (TJ)

Tray

A3P060

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

1536 CLBS, 60000 GATES

1.55 mm

现场可编程门阵列

18432

60000

2

1536

60000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

Details

341 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

微芯片技术

有

60

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGLE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.2 V

40

85 °C

有

AGLE3000V2-FGG484I

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

AGLE3000V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.2/1.5 V

INDUSTRIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

516096

3000000

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE3000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

A3PE3000-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

341 I/O

-40 to 85 °C

Tray

A3PE3000

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

272 MHz

1

75264

75264

75264

1.575 V

1.425 V

3000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

+ 70 C

SMD/SMT

175 MHz

有

微芯片技术

90

Actel

5.25 V

Tray

A40MX02

活跃

TQFP,

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX02-2VQG80

101 MHz

TQFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

57 I/O

3 V

0 C

0°C ~ 70°C (TA)

Tray

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

COMMERCIAL

295 CLBS, 3000 GATES

1.2 mm

现场可编程门阵列

3000

2 ns

295

3000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

- 40 C

+ 85 C

SMD/SMT

870 MHz

微芯片技术

有

60

Actel

0.014110 oz

Tray

AX1000

活跃

1.575 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

40

85 °C

有

AX1000-2FGG484I

870 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

317 I/O

1.425 V

-40°C ~ 85°C (TA)

Tray

AX1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

870 MHz

S-PBGA-B484

516

不合格

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

20.3 kB

740 ps

740 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

870 MHz

18144

12096

2

12096

0.74 ns

12096

18144

1.575 V

1.425 V

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

0 C

+ 70 C

SMD/SMT

83 MHz

有

微芯片技术

27

Actel

0.084185 oz

5.25 V

Tray

A40MX02

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX02-FPLG44

48 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

1.36

Details

34 I/O

3 V

0°C ~ 70°C (TA)

Tube

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

COMMERCIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

3.7 ns

295

3000

3.68 mm

16.59 mm

16.59 mm

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

3 V

- 40 C

+ 85 C

SMD/SMT

175 MHz

有

微芯片技术

19

Actel

0.171777 oz

5.5 V

Tray

A40MX02

活跃

ROHS COMPLIANT, PLASTIC, LCC-68

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A40MX02-2PLG68I

101 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

57 I/O

-40°C ~ 85°C (TA)

Tube

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

INDUSTRIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2 ns

295

3000

3.68 mm

24.23 mm

24.23 mm

N/A

-

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

104 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

215 MHz

微芯片技术

有

40

Actel

5.5 V

Tray

A42MX09

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX09-TQG176M

117 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

-55°C ~ 125°C (TC)

Tray

A42MX09

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

MILITARY

684 CLBS, 14000 GATES

1.6 mm

现场可编程门阵列

14000

2.5 ns

684

14000

1.4 mm

24 mm

24 mm

N/A

-

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

104 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

247 MHz

微芯片技术

有

40

Actel

5.5 V

Tray

A42MX09

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX09-1TQG176M

135 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

-55°C ~ 125°C (TC)

Tray

A42MX09

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

MILITARY

684 CLBS, 14000 GATES

1.6 mm

现场可编程门阵列

14000

2.1 ns

684

14000

1.4 mm

24 mm

24 mm

N/A

-

表面贴装

VQFP-100

100-VQFP (14x14)

微芯片技术

1.575 V

1.575 V

Tray

A3P250

活跃

This product may require additional documentation to export from the United States.

N

68 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

90

ProASIC3

1.5000 V

1.425 V

0 to 70 °C

Tray

A3P250

1.5 V

36864

250000

1

1 mm

14 mm

14 mm

N/A

-

表面贴装

CSP-196

YES

196-CSP (8x8)

196

Details

1500 LE

133 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

526.32 MHz, 892.86 MHz

微芯片技术

有

348

IGLOOe

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGL125

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.2 V

未说明

100 °C

有

AGL125V2-CSG196I

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

AGL125V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B196

不合格

INDUSTRIAL

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

0.7 mm

8 mm

8 mm