品牌是'Microchip' (5152)
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![]() | A54SX08A-1PQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | MICROSEMI CORP | 2.75 V | 5.27 | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 2.5 V | 40 | 2.25 V | 70 °C | 有 | A54SX08A-1PQG208 | 278 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | e3 | 哑光锡 | 8000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 130 | 不合格 | 2.5,3.3/5 V | COMMERCIAL | 130 | 768 CLBS, 12000 GATES | 4.1 mm | 现场可编程门阵列 | 1.1 ns | 768 | 768 | 12000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | EX128-TQG64I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-LQFP | YES | 64-TQFP (10x10) | 64 | 微芯片技术 | LFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 2.7 V | 5.29 | 活跃 | EX128 | Tray | 46 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 2.5 V | 40 | 2.3 V | 85 °C | 有 | EX128-TQG64I | 250 MHz | -40°C ~ 85°C (TA) | EX | e3 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G64 | INDUSTRIAL | 6000 GATES | 1.6 mm | 现场可编程门阵列 | 256 | 6000 | 1 ns | 6000 | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||||
![]() | APA075-FGG144 | Microchip | 数据表 | 2367 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | 微芯片技术 | 40 | 2.3 V | 70 °C | 有 | APA075-FGG144 | 180 MHz | LBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 2.7 V | 1.45 | 2.5000 V | 2.3 V | 2.7 V | 100 | Tray | APA075 | 活跃 | LBGA, BGA144,12X12,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA144,12X12,40 | 2.5 V | 0 to 70 °C | ProASICPLUS | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 100 | 不合格 | 2.5,2.5/3.3 V | COMMERCIAL | 100 | 75000 GATES | 1.55 mm | 现场可编程门阵列 | 27648 | 75000 | STD | 3072 | 75000 | 13 mm | 13 mm | |||||||||||||||||||||||||||
![]() | AGLP060V5-VQG176 | Microchip | 数据表 | 15 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 176-TQFP | YES | 176-VQFP (20x20) | 176 | 微芯片技术 | 未说明 | 1.425 V | 70 °C | 有 | AGLP060V5-VQG176 | 250 MHz | TFQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 0.9 | 1.5000 V | 1.425 V | 1.575 V | 137 | Tray | AGLP060 | 活跃 | TFQFP, TQFP176,.87SQ,16 | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | TQFP176,.87SQ,16 | 1.5 V | 0 to 70 °C | IGLOO PLUS | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.425V ~ 1.575V | QUAD | 鸥翼 | 未说明 | 0.4 mm | compliant | S-PQFP-G176 | 137 | 不合格 | 1.5 V | COMMERCIAL | 137 | 1584 CLBS, 60000 GATES | 1.2 mm | 现场可编程门阵列 | 1584 | 18432 | 60000 | STD | 1584 | 1584 | 60000 | 20 mm | 20 mm | |||||||||||||||||||||||||||
![]() | AGLP030V2-CS289I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 289-TFBGA, CSBGA | YES | 289-CSP (14x14) | 289 | 微芯片技术 | TFBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.26 | 120 | Tray | AGLP030 | 活跃 | TFBGA, BGA289,17X17,32 | GRID ARRAY, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA289,17X17,32 | -40 °C | 1.5 V | 未说明 | 1.425 V | 85 °C | 无 | AGLP030V2-CS289I | 160 MHz | -40°C ~ 100°C (TJ) | IGLOO PLUS | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 未说明 | 0.8 mm | unknown | S-PBGA-B289 | 120 | 不合格 | 1.2/1.5 V | INDUSTRIAL | 120 | 792 CLBS, 30000 GATES | 1.2 mm | 现场可编程门阵列 | 792 | 30000 | STD | 792 | 792 | 30000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||
![]() | AGLN125V2-ZVQ100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.87 | 71 | Tray | AGLN125 | Obsolete | 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100 | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -20 °C | 1.2 V | 30 | 1.14 V | 70 °C | 无 | AGLN125V2-ZVQ100 | TFQFP | SQUARE | -20°C ~ 85°C (TJ) | IGLOO nano | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | 鸥翼 | 230 | 0.5 mm | unknown | S-PQFP-G100 | 不合格 | OTHER | 3072 CLBS, 125000 GATES | 1.2 mm | 现场可编程门阵列 | 3072 | 36864 | 125000 | 3072 | 125000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||
![]() | A54SX08A-2FG144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 5.32 | LBGA, BGA144,12X12,40 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA144,12X12,40 | -40 °C | 2.5 V | 30 | 2.25 V | 85 °C | 无 | A54SX08A-2FG144I | 313 MHz | LBGA | SQUARE | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | 111 | 不合格 | 2.5,3.3/5 V | INDUSTRIAL | 111 | 768 CLBS, 12000 GATES | 1.55 mm | 现场可编程门阵列 | 0.9 ns | 768 | 768 | 12000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | AGLP030V2-CS201 | Microchip | 数据表 | 40 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 201-VFBGA, CSBGA | YES | 201-CSP (8x8) | 201 | 微芯片技术 | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.26 | 120 | Tray | AGLP030 | 活跃 | VFBGA, BGA201,15X15,20 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA201,15X15,20 | 1.5 V | 未说明 | 1.425 V | 70 °C | 无 | AGLP030V2-CS201 | 160 MHz | VFBGA | SQUARE | 0°C ~ 85°C (TJ) | IGLOO PLUS | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 未说明 | 0.5 mm | unknown | S-PBGA-B201 | 120 | 不合格 | 1.2/1.5 V | COMMERCIAL | 120 | 792 CLBS, 30000 GATES | 0.99 mm | 现场可编程门阵列 | 792 | 30000 | STD | 792 | 792 | 30000 | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||
![]() | M2GL010T-FGG484I | Microchip | 数据表 | 51 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | SMD/SMT | Microchip | Microchip Technology / Atmel | IGLOO2 | Details | Tray | M2GL010 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 有 | M2GL010T-FGG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.27 | 有 | 12084 LE | 233 I/O | + 100 C | 1.26 V | 1.388030 oz | - 40 C | 60 | 1.14 V | -40°C ~ 100°C (TJ) | Tray | M2GL010T | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | 30 | S-PBGA-B484 | 233 | 不合格 | 1.2 V | 1.2 V | 667 Mb/s | 233 | 2.44 mm | 现场可编程门阵列 | 12084 | SoC FPGA | 933888 | STD | 4 Transceiver | 12084 | FPGA - Field Programmable Gate Array | 23 mm | 23 mm | |||||||||||||||||||||
![]() | M2GL050TS-1FCS325I | Microchip | 数据表 | 2141 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | 微芯片技术 | Tray | M2GL050 | BGA, BGA325,21X21,20 | 网格排列 | PLASTIC/EPOXY | BGA325,21X21,20 | M2GL050TS-1FCS325I | BGA | SQUARE | 活跃 | MICROSEMI CORP | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | IGLOO2 | N | 活跃 | 1.2 V | 20 | 无 | 5.27 | 有 | 56340 LE | 200 I/O | + 100 C | - 40 C | 176 | SMD/SMT | Microchip | Microchip Technology / Atmel | -40°C ~ 100°C (TJ) | Tray | M2GL050TS | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 200 | 不合格 | 1.2 V | 667 Mb/s | 200 | 现场可编程门阵列 | 56340 | FPGA - Field Programmable Gate Array | 1869824 | 2 Transceiver | 56340 | FPGA - Field Programmable Gate Array | ||||||||||||||||||||||||||||
![]() | A3PN030-ZQNG48 | Microchip | 数据表 | 530 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 48-VFQFN Exposed Pad | YES | 48-QFN (6x6) | 48 | 微芯片技术 | SQUARE | Microsemi Corporation | 不推荐 | FPGA | MICROSEMI CORP | 1.575 V | 7.65 | 34 | Tray | A3PN030 | 活跃 | HQCCN, | CHIP CARRIER, HEAT SINK/SLUG | 3 | UNSPECIFIED | -20 °C | 1.5 V | 30 | 1.425 V | 70 °C | 有 | A3PN030-ZQNG48 | HQCCN | -20°C ~ 85°C (TJ) | ProASIC3 nano | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 无铅 | 260 | 0.4 mm | compliant | S-XQCC-N48 | 不合格 | OTHER | 768 CLBS, 30000 GATES | 现场可编程门阵列 | 30000 | STD | 768 | 30000 | 6 mm | 6 mm | ||||||||||||||||||||||||||||||||||||||
![]() | AGLN060V5-ZCSG81 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 81-WFBGA, CSBGA | YES | 81-CSP (5x5) | 81 | 微芯片技术 | MICROSEMI CORP | 1.575 V | 5.81 | 60 | Tray | AGLN060 | Obsolete | 5 X 5 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, CSP-81 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | -20 °C | 1.5 V | 未说明 | 1.425 V | 70 °C | 有 | AGLN060V5-ZCSG81 | VFBGA | SQUARE | Microsemi Corporation | Obsolete | -20°C ~ 85°C (TJ) | IGLOO nano | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 未说明 | 0.5 mm | compliant | S-PBGA-B81 | 不合格 | OTHER | 1536 CLBS, 60000 GATES | 0.8 mm | 现场可编程门阵列 | 1536 | 18432 | 60000 | 1536 | 60000 | 5 mm | 5 mm | ||||||||||||||||||||||||||||||||||||||
![]() | A54SX16A-FG256 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL125V2-FGG144I | Microchip | 数据表 | 24 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | 微芯片技术 | LBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.28 | 97 | Tray | AGL125 | 活跃 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | -40 °C | 1.2 V | 40 | 1.14 V | 100 °C | 有 | AGL125V2-FGG144I | 108 MHz | -40°C ~ 85°C (TA) | IGLOO | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 不合格 | INDUSTRIAL | 3072 CLBS, 125000 GATES | 1.55 mm | 现场可编程门阵列 | 3072 | 36864 | 125000 | STD | 3072 | 125000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||
![]() | AGL125V2-VQG100I | Microchip | 数据表 | 5000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | 100 °C | 1.14 V | 未说明 | 1.2 V | -40 °C | PLASTIC/EPOXY | 3 | 71 | Tray | AGL125 | 活跃 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 5.29 | 1.575 V | MICROSEMI CORP | 活跃 | Microsemi Corporation | SQUARE | TFQFP | 108 MHz | AGL125V2-VQG100I | 有 | -40°C ~ 85°C (TA) | IGLOO | e3 | Tin (Sn) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | 鸥翼 | 未说明 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | INDUSTRIAL | 3072 CLBS, 125000 GATES | 1.2 mm | 现场可编程门阵列 | 3072 | 36864 | 125000 | STD | 3072 | 125000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||
![]() | AGL125V2-CS196 | Microchip | 数据表 | 40 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 196-TFBGA, CSBGA | YES | 196-CSP (8x8) | 196 | 微芯片技术 | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.3 | 1.2, 1.5 V | 133 | Tray | AGL125 | 活跃 | TFBGA, | GRID ARRAY, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | 1.2 V | 未说明 | 1.14 V | 85 °C | 无 | AGL125V2-CS196 | 108 MHz | TFBGA | SQUARE | 0 to 70 °C | IGLOO | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 未说明 | 0.5 mm | unknown | S-PBGA-B196 | 不合格 | OTHER | 3072 CLBS, 125000 GATES | 1.2 mm | 现场可编程门阵列 | 3072 | 36864 | 125000 | STD | 3072 | 125000 | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||
![]() | M2GL090-FCS325 | Microchip | 数据表 | 2538 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | 微芯片技术 | 1.2 V | 20 | 85 °C | 无 | M2GL090-FCS325 | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.81 | 180 | Tray | M2GL090 | 活跃 | 86184 LE | + 85 C | 1.2 V | 0 C | 1.2 V | SMD/SMT | BGA, BGA325,21X21,20 | 网格排列 | PLASTIC/EPOXY | BGA325,21X21,20 | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 180 | 不合格 | 1.2 V | 1.2 V | OTHER | 180 | 现场可编程门阵列 | 86184 | 2648064 | STD | 86316 | |||||||||||||||||||||||||||||||||||
![]() | M2GL025-VFG256I | Microchip | 数据表 | 2180 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LFBGA | 256-FPBGA (14x14) | 微芯片技术 | 活跃 | 27696 LE | + 100 C | 1.26 V | - 40 C | 1.14 V | SMD/SMT | 138 | Tray | M2GL025 | -40°C ~ 100°C (TJ) | IGLOO2 | 1.14V ~ 2.625V | 1.2 V | 667 Mb/s | 27696 | 1130496 | STD | 2 Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16A-1FG256M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | BGA256,16X16,40 | PLASTIC/EPOXY | 3 | 网格排列 | BGA, BGA256,16X16,40 | 5.31 | 2.75 V | MICROSEMI CORP | Obsolete | Microsemi Corporation | SQUARE | BGA | 263 MHz | A54SX16A-1FG256M | 无 | 125 °C | 2.25 V | 30 | 2.5 V | -55 °C | 3A001.A.2.C | TIN LEAD/TIN LEAD SILVER | 16000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 180 | 不合格 | 2.5,2.5/5 V | MILITARY | 180 | 1452 CLBS, 24000 GATES | 1.97 mm | 现场可编程门阵列 | 1.2 ns | 1452 | 1452 | 24000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | A3PN125-Z1VQG100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | 100-VQFP (14x14) | 微芯片技术 | Obsolete | 71 | Tray | A3PN125 | -40°C ~ 100°C (TJ) | ProASIC3 nano | 1.425V ~ 1.575V | 36864 | 125000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PN030-Z1QNG68 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 68-VFQFN Exposed Pad | YES | 68-QFN (8x8) | 68 | 微芯片技术 | SQUARE | Microsemi Corporation | 不推荐 | FPGA - Field Programmable Gate Array 30K System Gates ProASIC3 nano | MICROSEMI CORP | 1.575 V | 5.26 | 49 | Tray | A3PN030 | 活跃 | HVQCCN, | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3 | UNSPECIFIED | -20 °C | 1.5 V | 30 | 1.425 V | 70 °C | 有 | A3PN030-Z1QNG68 | HVQCCN | -20°C ~ 85°C (TJ) | ProASIC3 nano | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | 无铅 | 260 | 0.4 mm | compliant | S-XQCC-N68 | 不合格 | OTHER | 768 CLBS, 30000 GATES | 1 mm | 现场可编程门阵列 | 30000 | 768 | 30000 | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||
![]() | A54SX16A-FGG144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL030V2-QNG48I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 48-VFQFN Exposed Pad | YES | 48-QFN (6x6) | 48 | 微芯片技术 | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.24 | 34 | Tray | AGL030 | 活跃 | HQCCN, | CHIP CARRIER, HEAT SINK/SLUG | 3 | UNSPECIFIED | -40 °C | 1.2 V | 未说明 | 1.14 V | 100 °C | 有 | AGL030V2-QNG48I | HQCCN | SQUARE | -40°C ~ 85°C (TA) | IGLOO | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | 无铅 | 未说明 | compliant | S-XQCC-N48 | 不合格 | INDUSTRIAL | 768 CLBS, 30000 GATES | 现场可编程门阵列 | 768 | 30000 | STD | 768 | 30000 | |||||||||||||||||||||||||||||||||||||||||
![]() | M2GL090TS-1FCSG325I | Microchip | 数据表 | 2965 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | 微芯片技术 | 活跃 | MICROSEMI CORP | 5.8 | 180 | Tray | M2GL090 | 活跃 | 86184 LE | + 100 C | 1.2 V | - 40 C | 1.2 V | SMD/SMT | , BGA325,21X21,20 | 3 | PLASTIC | BGA325,21X21,20 | 1.2 V | 有 | M2GL090TS-1FCSG325I | Microsemi Corporation | -40°C ~ 100°C (TJ) | IGLOO2 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.14V ~ 2.625V | compliant | 180 | 不合格 | 1.2 V | 1.2 V | 180 | 现场可编程门阵列 | 86184 | 2648064 | 1 | 4 Transceiver | 86316 | |||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16-2PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | MICROSEMI CORP | 3.6 V | 5.24 | FQFP, | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A54SX16-2PQ208I | 320 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | e0 | Tin/Lead (Sn/Pb) | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | INDUSTRIAL | 1452 CLBS, 16000 GATES | 4.1 mm | 现场可编程门阵列 | 0.7 ns | 1452 | 16000 | 28 mm | 28 mm |
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