N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

Amphenol Piher

147

Tray

M1A3PE1500

Obsolete

FQFP, QFP208,1.2SQ,20

微芯片技术

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

30

1.425 V

70 °C

无

M1A3PE1500-2PQ208

350 MHz

FQFP

SQUARE

Obsolete

MICROSEMI CORP

1.575 V

5.6

7500

Amphenol

0°C ~ 85°C (TJ)

N-6

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

Potentiometers, Trimmers & Rheostats

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

COMMERCIAL

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

微调电阻器

276480

1500000

38400

38400

1500000

Trimmer Resistors - Through Hole

28 mm

28 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

TE Connectivity / DEUTSCH

Details

151

Tray

M1A3P400

Obsolete

微芯片技术

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

无

M1A3P400-PQ208I

FQFP

SQUARE

Obsolete

MICROSEMI CORP

1.575 V

5.25

1

TE Connectivity

-40°C ~ 100°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

MIL-Spec / MIL-Type

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

矩形MIL规格连接器

55296

400000

9216

400000

矩形MIL规格连接器

28 mm

28 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

151

Tray

M1A3P250

Obsolete

FQFP,

微芯片技术

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

无

M1A3P250-1PQ208I

FQFP

SQUARE

Obsolete

MICROSEMI CORP

1.575 V

5.25

2000

Amphenol

Amphenol Piher

-40°C ~ 100°C (TJ)

PT-10

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

Potentiometers, Trimmers & Rheostats

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

微调电阻器

36864

250000

6144

250000

Trimmer Resistors - Through Hole

28 mm

28 mm

N/A

-

Gold

表面贴装

208-BFQFP

208-PQFP (28x28)

Polybutylene Terephthalate (PBT)

微芯片技术

有

330

通孔

Brass

TE Connectivity

TE Connectivity

Details

151

Tray

Obsolete

M1A3P250

-40°C ~ 100°C (TJ)

切割胶带

ProASIC3

2 Position

Blue

1 Row

Plug (Male)

汽车连接器

-

1.425V ~ 1.575V

焊针

Pin (Male)

-

汽车连接器

36864

250000

Headers

直角

汽车连接器

UL 94 V-0

N/A

-

表面贴装

536-LFBGA

536-BGA (16x16)

微芯片技术

500

Amphenol

Amphenol Commercial Products

300

Tray

活跃

-40°C ~ 125°C (TJ)

PolarFire™

I/O Connectors

0.97V ~ 1.08V

300000

I/O Connectors

21600666

I/O Connectors

N/A

-

表面贴装

484-BFBGA

484-FBGA (19x19)

微芯片技术

CTS

CTS电子元件

Details

284

Tray

活跃

AEC-Q200

3000

-40°C ~ 125°C (TJ)

Reel

PolarFire™

Crystals

0.97V ~ 1.08V

192000

Crystals

13946061

Crystals

N/A

-

通孔

1657-BFCPGA

1657-CCGA (42.5x42.5)

微芯片技术

1

Advanced Energy

Advanced Energy

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

DC-DC Converter

1.14V ~ 1.26V

151824

Non-Isolated DC-DC Converters

5325

Non-Isolated DC/DC Converters

N/A

-

Cable

Compliant

81

Bulk

Crimp

70 °C

0 °C

Female

Straight

4

768

30000

无

N/A

-

表面贴装

352-BFCQFP Exposed Pad

352-QFP (48x48)

微芯片技术

活跃

Non-Compliant

Bulk

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

Tin

通孔

YES

144

BGA144,12X12,40

-40 °C

2.5 V

30

2.25 V

85 °C

无

A54SX32A-2FG144I

313 MHz

LBGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.75 V

5.32

Non-Compliant

1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1 %

e0

25 ppm/°C

4.22 kΩ

Tin/Lead/Silver (Sn/Pb/Ag)

Metal Film

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B144

111

不合格

2.5,2.5/5 V

INDUSTRIAL

111

2880 CLBS, 48000 GATES

1.55 mm

现场可编程门阵列

0.9 ns

2880

2880

48000

2.5 mm

6.7 mm

13 mm

N/A

-

YES

84

5 V

未说明

4.5 V

125 °C

有

A1415A-1PLG84M

150 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.5 V

5.79

Non-Compliant

QCCJ,

CHIP CARRIER

PLASTIC/EPOXY

-55 °C

3A001.A.2.C

8542.39.00.01

CMOS

QUAD

J BEND

未说明

1.27 mm

compliant

S-PQCC-J84

MILITARY

200 CLBS, 1500 GATES

4.572 mm

现场可编程门阵列

2.6 ns

200

1500

29.3116 mm

29.3116 mm

N/A

-

YES

144

2.5 V

30

2.25 V

70 °C

无

A54SX32A-FFG144

172 MHz

LBGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.75 V

5.27

1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

e0

Tin/Lead/Silver (Sn/Pb/Ag)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B144

111

不合格

2.5,2.5/5 V

COMMERCIAL

111

2880 CLBS, 48000 GATES

1.55 mm

现场可编程门阵列

1.7 ns

2880

2880

48000

13 mm

13 mm

N/A

-

Compliant

N/A

-

N/A

-

Non-Compliant

N/A

-

Production (Last Updated: 2 years ago)

Circular

Compliant

10 %

Pin

200 kΩ

70 °C

-25 °C

70 mW

Not

10.3 mm

N/A

-

表面贴装

256-LBGA

YES

256-FPBGA (17x17)

256

A3P250

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

微芯片技术

BGA256,16X16,40

-40 °C

1.5 V

30

1.425 V

125 °C

有

A3P250-1FGG256T

350 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.23

Automotive grade

157

Tray

-40°C ~ 125°C (TA)

Automotive, AEC-Q100, ProASIC3

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B256

157

不合格

1.5/3.3 V

AUTOMOTIVE

157

6144 CLBS, 250000 GATES

1.8 mm

现场可编程门阵列

36864

250000

AEC-Q100

6144

6144

250000

17 mm

17 mm

N/A

-

表面贴装

352-BFCQFP Exposed Pad

352-QFP (48x48)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

表面贴装

1657-BCLGA

1657-CLGA (42.5x42.5)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

表面贴装

1657-BCLGA

1657-CLGA (42.5x42.5)

微芯片技术

活跃

Bulk

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

YES

208

QFP208,1.2SQ,20

-40 °C

1.2 V

30

1.14 V

85 °C

无

M1A3P600L-1PQ208I

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.25

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5/3.3 V

INDUSTRIAL

154

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

13824

13824

600000

28 mm

28 mm

N/A

-

YES

208

1.2 V

40

1.14 V

70 °C

有

M1A3P1000L-PQG208

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.27

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

e3

哑光锡

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5/3.3 V

COMMERCIAL

154

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

24576

24576

1000000

28 mm

28 mm

N/A

-

YES

484

1.425 V

85 °C

有

M1A3P400-2FGG484

350 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.25

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

2.44 mm

现场可编程门阵列

9216

400000

23 mm

23 mm

N/A

-

YES

256

BGA256,16X16,40

-40 °C

1.2 V

30

1.14 V

85 °C

无

M1A3P600L-FG256I

350 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.25

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

177

不合格

1.5/3.3 V

INDUSTRIAL

177

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

13824

600000

17 mm

17 mm

N/A

-

YES

208

85 °C

有

M1AFS250-1PQG208

QFF

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.82

QFF,

FLATPACK

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

e3

哑光锡

8542.39.00.01

CMOS

QUAD

FLAT

245

0.5 mm

compliant

R-PQFP-F208

不合格

OTHER

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

6144

250000

30.6 mm

28 mm