品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 系列 | 尺寸/尺寸 | 容差 | JESD-609代码 | 终止次数 | ECCN 代码 | 温度系数 | 电阻 | 端子表面处理 | 组成 | 功率(瓦特) | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 终端样式 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 温度等级 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | LABs数量/ CLBs数量 | 电池化学 | 速度等级 | 电压 - 栅极触发 (Vgt)(最大值) | 电流-非反复浪涌 50, 60Hz (Itsm) | 最大闸极触发电流 (Igt) | 最大保持电流(Ih) | 主要属性 | 最大开态电流(It (RMS)) | CLB-Max的组合延时 | 电池尺寸 | 逻辑块数量 | 逻辑单元数 | 最大开态电流(It (AV)) | SCR类型 | 电压 - 通态 (Vtm)(最大值) | 最大断态电流 | 等效门数 | 闪光大小 | 特征 | 座位高度(最大) | 长度 | 宽度 | |||||||||||||||||||||||||||||
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![]() | A54SX16A-1FG256 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | 263 MHz | BGA | Murata Electronics | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 2.75 V | 5.32 | 无 | 70 °C | 2.25 V | 30 | 2.5 V | BGA256,16X16,40 | PLASTIC/EPOXY | 3 | 网格排列 | BGA, BGA256,16X16,40 | Strip | 活跃 | 1.55 V | A54SX16A-1FG256 | 348 | 0.19 Dia x 0.07 H (4.8mm x 2.2mm) | TIN LEAD/TIN LEAD SILVER | 16000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | 需要支架 | S-PBGA-B256 | 180 | 不合格 | 2.5,3.3/5 V | COMMERCIAL | 180 | 1452 CLBS, 24000 GATES | 1.97 mm | 现场可编程门阵列 | 氧化银 | 1.2 ns | Coin, 4.8mm | 1452 | 1452 | 24000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P250L-1PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1206 (3216 Metric) | YES | 1206 | 208 | KOA Speer Electronics, Inc. | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 1.2 V | 30 | 1.14 V | 70 °C | 无 | A3P250L-1PQ208 | 350 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.27 | Tape & Reel (TR) | RN732B | Obsolete | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | -55°C ~ 155°C | RN73 | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±0.25% | e0 | 2 | ±50ppm/°C | 5.05 kOhms | Tin/Lead (Sn/Pb) | Thin Film | 0.125W, 1/8W | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 151 | 不合格 | 1.5/3.3 V | COMMERCIAL | 151 | 6144 CLBS, 250000 GATES | 4.1 mm | 现场可编程门阵列 | 6144 | 6144 | 250000 | Moisture Resistant | 0.028 (0.70mm) | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||
![]() | A54SX16-CQ208M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Chassis, Stud Mount | TO-209AE, TO-118-4, Stud | YES | TO-209AE (TO-118) | 208 | Vishay General Semiconductor - Diodes Division | CERAMIC, METAL-SEALED COFIRED | TPAK208,2.9SQ,20 | -55 °C | 3.3 V | 20 | 2.97 V | 125 °C | 无 | A54SX16-CQ208M | 205 MHz | QFF | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.63 V | 5.26 | Bulk | ST333 | 活跃 | 800 V | CERAMIC, QFP-208 | FLATPACK | -40°C ~ 125°C | - | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 24000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | FLAT | 225 | 0.5 mm | compliant | S-CQFP-F208 | 172 | 不合格 | 3.3,5 V | MILITARY | 172 | 1452 CLBS, 16000 GATES | 3.06 mm | 现场可编程门阵列 | 3 V | 11000A, 11520A | 200 mA | 600 mA | 518 A | 1 ns | 1452 | 1452 | 330 A | 标准恢复 | 1.96 V | 50 mA | 16000 | 29.21 mm | 29.21 mm | ||||||||||||||||||||||||||||||||||
![]() | A1460A-PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | FLATPACK, FINE PITCH | 3 | Corsair | PLASTIC/EPOXY | -40 °C | 5 V | 30 | 4.5 V | 85 °C | 无 | A1460A-PQ208I | 100 MHz | FQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 5.5 V | 5.85 | Bag | D38999/26TB | 活跃 | PLASTIC, QFP-208 | * | e0 | 锡铅 | MAX 167 I/OS | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | INDUSTRIAL | 848 CLBS, 6000 GATES | 4.1 mm | 现场可编程门阵列 | 3 ns | 848 | 6000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3PE3000-1PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | 350 MHz | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | FQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | 1.575 V | 1.5 V | 30 | 147 | Tray | M1A3PE3000 | Obsolete | 1.425 V | M1A3PE3000-1PQ208I | 无 | Obsolete | MICROSEMI CORP | FQFP, QFP208,1.2SQ,20 | 5.61 | -40°C ~ 100°C (TJ) | ProASIC3E | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 147 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | 现场可编程门阵列 | 516096 | 3000000 | 75264 | 75264 | 3000000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3PE1500-2PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | 350 MHz | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | FQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | 1.575 V | 1.5 V | 30 | 147 | Tray | M1A3PE1500 | Obsolete | 1.425 V | M1A3PE1500-2PQ208I | 无 | Obsolete | MICROSEMI CORP | FQFP, QFP208,1.2SQ,20 | 5.6 | -40°C ~ 100°C (TJ) | ProASIC3E | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 147 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 147 | 38400 CLBS, 1500000 GATES | 4.1 mm | 现场可编程门阵列 | 276480 | 1500000 | 38400 | 38400 | 1500000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P1000L-1PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 350 MHz | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | FQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | 1.575 V | 1.2 V | 30 | 1.14 V | M1A3P1000L-1PQ208I | 无 | Obsolete | MICROSEMI CORP | FQFP, QFP208,1.2SQ,20 | 5.27 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 154 | 不合格 | 1.5/3.3 V | INDUSTRIAL | 154 | 24576 CLBS, 1000000 GATES | 4.1 mm | 现场可编程门阵列 | 24576 | 24576 | 1000000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010-TQ144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 微芯片技术 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 1.26 V | 1.2 V | 20 | 84 | Tray | Obsolete | 1.14 V | M2GL010-TQ144 | 无 | Obsolete | MICROSEMI CORP | 20 X 20 MM, 0.50 MM PITCH, TQFP-144 | 5.57 | 3 | 85 °C | PLASTIC/EPOXY | LFQFP | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | QUAD | 鸥翼 | 240 | 0.5 mm | compliant | S-PQFP-G144 | OTHER | 1.6 mm | 现场可编程门阵列 | 12084 | 933888 | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P1000L-1PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 3 | 70 °C | PLASTIC/EPOXY | FQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | 1.575 V | 1.14 V | 1.2 V | 30 | M1A3P1000L-1PQ208 | 无 | Obsolete | MICROSEMI CORP | FQFP, QFP208,1.2SQ,20 | 5.27 | 350 MHz | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 154 | 不合格 | 1.5/3.3 V | COMMERCIAL | 154 | 24576 CLBS, 1000000 GATES | 4.1 mm | 现场可编程门阵列 | 24576 | 24576 | 1000000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M7AFS600-2PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | MICROSEMI CORP | Obsolete | 有 | M7AFS600-2PQG208I | FLATPACK, FINE PITCH | 1.575 V | 1.5 V | 40 | 1.425 V | SQUARE | FQFP | PLASTIC/EPOXY | -40 °C | 85 °C | 3 | 5.8 | FQFP, | e3 | 哑光锡 | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | INDUSTRIAL | 600000 GATES | 4.1 mm | 现场可编程门阵列 | 600000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010-TQ144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 微芯片技术 | PLASTIC/EPOXY | LFQFP | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 1.26 V | 1.2 V | 30 | 84 | Tray | Obsolete | 1.14 V | M2S010-TQ144 | 无 | Obsolete | MICROSEMI CORP | TQFP-144 | 5.88 | 3 | 85 °C | 0°C ~ 85°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 240 | 0.5 mm | not_compliant | S-PQFP-G144 | 84 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 84 | 1.6 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 256KB | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P400-2PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | -40 °C | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 1.575 V | 1.5 V | 30 | 151 | Tray | M1A3P400 | Obsolete | 1.425 V | M1A3P400-2PQ208I | 无 | Obsolete | MICROSEMI CORP | FQFP, | 5.25 | 3 | 100 °C | -40°C ~ 100°C (TJ) | ProASIC3 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | INDUSTRIAL | 9216 CLBS, 400000 GATES | 4.1 mm | 现场可编程门阵列 | 55296 | 400000 | 9216 | 400000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P600-1PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | 85 °C | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 1.575 V | 1.5 V | 30 | 154 | Tray | M1A3P600 | Obsolete | 1.425 V | M1A3P600-1PQ208 | 无 | Obsolete | MICROSEMI CORP | FQFP, | 5.25 | 350 MHz | 3 | 0°C ~ 85°C (TJ) | ProASIC3 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V ~ 1.575V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G208 | 不合格 | COMMERCIAL | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 110592 | 600000 | 13824 | 600000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EX256-PTQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-LQFP | YES | 100-TQFP (14x14) | 100 | 微芯片技术 | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 2.7 V | 2.5 V | 30 | 81 | Tray | EX256 | Obsolete | 2.3 V | EX256-PTQ100I | 无 | Obsolete | MICROSEMI CORP | TQFP-100 | 5.61 | 357 MHz | -40°C ~ 85°C (TA) | EX | e0 | Tin/Lead (Sn/Pb) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | 2.3V ~ 2.7V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | S-PQFP-G100 | INDUSTRIAL | 12000 GATES | 1.6 mm | 现场可编程门阵列 | 512 | 12000 | 0.7 ns | 12000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EX128-TQ64 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-LQFP | YES | 64-TQFP (10x10) | 64 | 微芯片技术 | 3 | 70 °C | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 2.7 V | 2.5 V | 46 | Tray | EX128 | Obsolete | 2.3 V | 无 | 30 | EX128-TQ64 | Obsolete | MICROSEMI CORP | TQFP-64 | 5.32 | 250 MHz | 0°C ~ 70°C (TA) | EX | e0 | Tin/Lead (Sn/Pb) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | 2.3V ~ 2.7V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | S-PQFP-G64 | COMMERCIAL | 6000 GATES | 1.6 mm | 现场可编程门阵列 | 256 | 6000 | 1 ns | 6000 | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX08A-1PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | FQFP | PLASTIC/EPOXY | -40 °C | 85 °C | 3 | 278 MHz | 5.27 | FQFP, QFP208,1.2SQ,20 | MICROSEMI CORP | Obsolete | 有 | A54SX08A-1PQG208I | 2.25 V | 40 | 2.5 V | 2.75 V | FLATPACK, FINE PITCH | SQUARE | QFP208,1.2SQ,20 | e3 | 哑光锡 | 8000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 130 | 不合格 | 2.5,3.3/5 V | INDUSTRIAL | 130 | 768 CLBS, 12000 GATES | 4.1 mm | 现场可编程门阵列 | 1.1 ns | 768 | 768 | 12000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-1TQ144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 微芯片技术 | 278 MHz | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 2.75 V | 2.5 V | 30 | 113 | Tray | A54SX32A | Obsolete | 2.25 V | A54SX32A-1TQ144I | 无 | Obsolete | MICROSEMI CORP | 1.40 MM HEIGHT, TQFP-144 | 5.25 | -40°C ~ 85°C (TA) | SX-A | e0 | Tin/Lead (Sn/Pb) | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 2.25V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | S-PQFP-G144 | 113 | 不合格 | 2.5,3.3/5 V | INDUSTRIAL | 113 | 2880 CLBS, 48000 GATES | 1.6 mm | 现场可编程门阵列 | 48000 | 2880 | 1.1 ns | 2880 | 2880 | 48000 | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16P-VQG100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | MICROSEMI CORP | TFQFP, TQFP100,.63SQ | 5.25 | 微芯片技术 | 240 MHz | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | TFQFP | TQFP100,.63SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 3.6 V | 3.3 V | 40 | 3.3, 5 V | 2.97, 4.5 V | 3.63, 5.5 V | 81 | Tray | A54SX16 | 活跃 | 3 V | A54SX16P-VQG100I | 有 | 活跃 | -40 to 85 °C | SX | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | S-PQFP-G100 | 81 | 不合格 | 3.3,3.3/5 V | INDUSTRIAL | 81 | 1452 CLBS, 16000 GATES | 1.2 mm | 现场可编程门阵列 | 24000 | 1452 | STD | 0.9 ns | 1452 | 1452 | 16000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||
![]() | A54SX32A-1TQ144M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 微芯片技术 | 278 MHz | 3 | 125 °C | -55 °C | PLASTIC/EPOXY | LFQFP | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 2.75 V | 2.5 V | 30 | 113 | Tray | A54SX32A | Obsolete | 2.25 V | A54SX32A-1TQ144M | 无 | Obsolete | MICROSEMI CORP | 1.40 MM HEIGHT, TQFP-144 | 5.25 | -55°C ~ 125°C (TC) | SX-A | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 2.25V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | S-PQFP-G144 | 113 | 不合格 | 2.5,3.3/5 V | MILITARY | 113 | 2880 CLBS, 48000 GATES | 1.6 mm | 现场可编程门阵列 | 48000 | 2880 | 1.1 ns | 2880 | 2880 | 48000 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | AGL250V5-VQG100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | 3 | 100 °C | -40 °C | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 1.575 V | 1.5 V | 未说明 | 68 | Tray | AGL250 | 活跃 | 1.425 V | AGL250V5-VQG100I | 有 | 活跃 | MICROSEMI CORP | TFQFP, | 5.32 | 108 MHz | -40°C ~ 85°C (TA) | IGLOO | e3 | Tin (Sn) | 8542.39.00.01 | 1.425V ~ 1.575V | QUAD | 鸥翼 | 未说明 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | INDUSTRIAL | 6144 CLBS, 250000 GATES | 1.2 mm | 现场可编程门阵列 | 6144 | 36864 | 250000 | 6144 | 250000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL030V5-VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 0.79 | 微芯片技术 | 108 MHz | 3 | 85 °C | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 1.575 V | 1.5 V | 未说明 | 1.5000 V | 1.425 V | 1.575 V | 77 | Tray | AGL030 | 活跃 | 1.425 V | AGL030V5-VQG100 | 有 | 活跃 | MICROSEMI CORP | TFQFP, | 0 to 70 °C | IGLOO | e3 | Tin (Sn) | 8542.39.00.01 | 1.425V ~ 1.575V | QUAD | 鸥翼 | 未说明 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | OTHER | 768 CLBS, 30000 GATES | 1.2 mm | 现场可编程门阵列 | 768 | 30000 | STD | 768 | 30000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16A-FTQ144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 微芯片技术 | 3 | 70 °C | PLASTIC/EPOXY | LFQFP | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 2.75 V | 2.5 V | 30 | 113 | Tray | A54SX16A | Obsolete | 2.25 V | A54SX16A-FTQ144 | 无 | Obsolete | MICROSEMI CORP | LFQFP, QFP144,.87SQ,20 | 5.25 | 167 MHz | 0°C ~ 70°C (TA) | SX-A | e0 | Tin/Lead (Sn/Pb) | 16000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 2.25V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.5 mm | compliant | S-PQFP-G144 | 113 | 不合格 | 2.5,3.3/5 V | COMMERCIAL | 113 | 1452 CLBS, 24000 GATES | 1.6 mm | 现场可编程门阵列 | 24000 | 1452 | 1.9 ns | 1452 | 1452 | 24000 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | AGL250V2-VQG100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100-VQFP (14x14) | 100 | 微芯片技术 | 85 °C | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 1.575 V | 1.14 V | 1.2 V | 未说明 | 68 | Tray | AGL250 | 活跃 | AGL250V2-VQG100 | 有 | 活跃 | MICROSEMI CORP | TFQFP, | 1.6 | 108 MHz | 3 | 0°C ~ 70°C (TA) | IGLOO | e3 | Tin (Sn) | 8542.39.00.01 | 1.14V ~ 1.575V | QUAD | 鸥翼 | 未说明 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | OTHER | 6144 CLBS, 250000 GATES | 1.2 mm | 现场可编程门阵列 | 6144 | 36864 | 250000 | STD | 6144 | 250000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLN010V2-QNG48 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 48-VFQFN Exposed Pad | YES | 48-QFN (6x6) | 48 | 微芯片技术 | -20 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 1.575 V | 1.2 V | 未说明 | 34 | Tray | AGLN010 | 活跃 | 1.14 V | AGLN010V2-QNG48 | 有 | 活跃 | MICROSEMI CORP | HVQCCN, | 1.49 | 3 | 70 °C | -20°C ~ 85°C (TJ) | IGLOO nano | e3 | Matte Tin (Sn) | 8542.39.00.01 | 1.14V ~ 1.575V | QUAD | 无铅 | 未说明 | 0.4 mm | compliant | S-XQCC-N48 | 不合格 | OTHER | 260 CLBS, 10000 GATES | 1 mm | 现场可编程门阵列 | 260 | 10000 | STD | 260 | 10000 | 6 mm | 6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX16P-TQ144M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 3 | 125 °C | -55 °C | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 3.6 V | 3.3 V | 30 | 3 V | A54SX16P-TQ144M | 无 | Obsolete | MICROSEMI CORP | 1.40 MM HEIGHT, MO-136, TQFP-144 | 5.6 | 240 MHz | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | S-PQFP-G144 | 不合格 | MILITARY | 1452 CLBS, 16000 GATES | 1.6 mm | 现场可编程门阵列 | 0.9 ns | 1452 | 16000 | 20 mm | 20 mm |
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
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分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX16P-TQ144M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
