N/A

-

YES

128

160 MHz

85 °C

-40 °C

PLASTIC/EPOXY

TFQFP

TQFP128,.63SQ,16

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.575 V

1.425 V

1.5 V

未说明

AGLP030V2-VQ128I

无

Obsolete

MICROSEMI CORP

14 X 14 MM, 1 MM HEIGHT, 0.4 MM PITCH, VQFP-128

5.32

8542.39.00.01

QUAD

鸥翼

未说明

0.4 mm

unknown

S-PQFP-G128

101

不合格

1.2/1.5 V

INDUSTRIAL

101

792 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

792

792

30000

14 mm

14 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

320 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

3.6 V

3.3 V

30

175

Tray

A54SX16

Obsolete

3 V

A54SX16P-2PQ208I

无

Obsolete

MICROSEMI CORP

FQFP,

5.24

-40°C ~ 85°C (TA)

SX

e0

Tin/Lead (Sn/Pb)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

1452 CLBS, 16000 GATES

4.1 mm

现场可编程门阵列

24000

1452

0.7 ns

1452

16000

28 mm

28 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

5.24

微芯片技术

280 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3.3 V

40

113

Tray

A54SX32

活跃

3 V

A54SX32-1TQG144I

有

活跃

MICROSEMI CORP

LFQFP, QFP144,.87SQ,20

-40°C ~ 85°C (TA)

SX

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

3.3,5 V

INDUSTRIAL

113

2880 CLBS, 32000 GATES

1.6 mm

现场可编程门阵列

48000

2880

1

0.8 ns

2880

2880

32000

20 mm

20 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

MICROSEMI CORP

TFQFP, TQFP100,.63SQ

5.24

微芯片技术

320 MHz

3

70 °C

PLASTIC/EPOXY

TFQFP

TQFP100,.63SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

3.6 V

3.3 V

40

3.3, 5 V

2.97, 4.75 V

3.63, 5.25 V

81

Tray

A54SX16

活跃

3 V

A54SX16P-2VQG100

有

活跃

0 to 70 °C

SX

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

81

不合格

3.3,3.3/5 V

COMMERCIAL

81

1452 CLBS, 16000 GATES

1.2 mm

现场可编程门阵列

24000

1452

2

0.7 ns

1452

1452

16000

14 mm

14 mm

N/A

-

表面贴装

AGL030V2-VQG100T

有

活跃

MICROSEMI CORP

,

5.76

3

未说明

77

Compliant

e3

Tin (Sn)

70 °C

0 °C

8542.39.00.01

未说明

compliant

现场可编程门阵列

768

30000

N/A

-

表面贴装

100-LQFP

YES

100-TQFP (14x14)

100

5.26

微芯片技术

278 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

2.75 V

2.5 V

30

81

Tray

A54SX08A

Obsolete

2.25 V

A54SX08A-1TQ100I

无

Obsolete

MICROSEMI CORP

1.40 MM HEIGHT, TQFP-100

-40°C ~ 85°C (TA)

SX-A

e0

Tin/Lead (Sn/Pb)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

81

不合格

2.5,3.3/5 V

INDUSTRIAL

81

768 CLBS, 12000 GATES

1.6 mm

现场可编程门阵列

12000

768

1.1 ns

768

768

12000

14 mm

14 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

TFQFP,

1.39

微芯片技术

108 MHz

3

85 °C

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

1.575 V

1.2 V

未说明

1.2, 1.5 V

1.14 V

1.575 V

77

Tray

AGL030

活跃

1.14 V

AGL030V2-VQG100

有

活跃

MICROSEMI CORP

0 to 70 °C

IGLOO

e3

Tin (Sn)

8542.39.00.01

1.14V ~ 1.575V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

OTHER

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

768

30000

STD

768

30000

14 mm

14 mm

N/A

-

YES

208

313 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

2.75 V

2.5 V

30

2.25 V

A54SX08A-2PQ208

无

Obsolete

MICROSEMI CORP

FQFP, QFP208,1.2SQ,20

5.31

e0

Tin/Lead (Sn/Pb)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

130

不合格

2.5,3.3/5 V

COMMERCIAL

130

768 CLBS, 12000 GATES

4.1 mm

现场可编程门阵列

0.9 ns

768

768

12000

28 mm

28 mm

N/A

-

YES

176

LFQFP,

5.59

280 MHz

3

70 °C

PLASTIC/EPOXY

LFQFP

A54SX32-1TQG176

有

Obsolete

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3 V

3.3 V

40

MICROSEMI CORP

e3

哑光锡

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

COMMERCIAL

2880 CLBS, 32000 GATES

1.6 mm

现场可编程门阵列

0.8 ns

2880

32000

24 mm

24 mm

N/A

-

YES

68

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.575 V

1.5 V

未说明

1.425 V

AGL015V5-QNG68I

有

Obsolete

MICROSEMI CORP

HVQCCN,

5.31

100 °C

-40 °C

8542.39.00.01

QUAD

无铅

未说明

0.4 mm

compliant

S-XQCC-N68

不合格

INDUSTRIAL

384 CLBS, 15000 GATES

1 mm

现场可编程门阵列

384

15000

8 mm

8 mm

N/A

-

YES

256

70 °C

CERAMIC, METAL-SEALED COFIRED

QFF

TPAK256,3SQ,20

SQUARE

FLATPACK

3.63 V

3.3 V

20

2.97 V

A54SX32-1CQ256

无

Obsolete

MICROSEMI CORP

CERAMIC, QFP-256

5.24

240 MHz

e0

锡铅

48000 SYSTEM GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F256

246

不合格

3.3,5 V

COMMERCIAL

246

2880 CLBS, 32000 GATES

3.06 mm

现场可编程门阵列

0.9 ns

2880

2880

32000

36 mm

36 mm

N/A

-

YES

68

100 °C

-40 °C

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.575 V

1.425 V

1.5 V

30

A3P015-QNG68I

有

Obsolete

MICROSEMI CORP

HVQCCN,

5.25

3

8542.39.00.01

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

不合格

INDUSTRIAL

384 CLBS, 15000 GATES

1 mm

现场可编程门阵列

384

15000

8 mm

8 mm

N/A

-

YES

68

3

85 °C

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.575 V

1.425 V

1.5 V

30

A3P015-2QNG68

有

Obsolete

MICROSEMI CORP

HVQCCN,

5.25

350 MHz

8542.39.00.01

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

不合格

COMMERCIAL

384 CLBS, 15000 GATES

1 mm

现场可编程门阵列

384

15000

8 mm

8 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

5.6

微芯片技术

350 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

30

147

Tray

M1A3PE3000

Obsolete

1.425 V

M1A3PE3000-PQ208I

无

Obsolete

MICROSEMI CORP

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208

-40°C ~ 100°C (TJ)

ProASIC3E

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

INDUSTRIAL

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

28 mm

28 mm

N/A

-

YES

208

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

30

1.425 V

M7AFS600-2PQ208I

无

Transferred

ACTEL CORP

0.50 MM PITCH, PQFP-208

5.85

3

e0

锡铅

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

600000 GATES

4.1 mm

现场可编程门阵列

600000

28 mm

28 mm

N/A

-

YES

208

350 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.2 V

40

1.14 V

M1A3P600L-PQG208

有

Obsolete

MICROSEMI CORP

FQFP, QFP208,1.2SQ,20

5.25

e3

哑光锡

8542.39.00.01

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5/3.3 V

COMMERCIAL

154

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

13824

13824

600000

28 mm

28 mm

N/A

-

表面贴装

100-LQFP

YES

100-TQFP (14x14)

100

微芯片技术

250 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

2.7 V

2.5 V

30

70

Tray

EX128

Obsolete

2.3 V

EX128-TQ100I

无

Obsolete

MICROSEMI CORP

TQFP-100

5.32

-40°C ~ 85°C (TA)

EX

e0

Tin/Lead (Sn/Pb)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

2.3V ~ 2.7V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G100

INDUSTRIAL

6000 GATES

1.6 mm

现场可编程门阵列

256

6000

1 ns

6000

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

60

IGLOO2

267

微芯片技术

Tray

M2GL050

活跃

5.3

1.26 V

MICROSEMI CORP

活跃

SQUARE

BGA

M2GL050T-1FG484

无

85 °C

1.14 V

20

1.2 V

BGA484,22X22,40

PLASTIC/EPOXY

3

网格排列

BGA, BGA484,22X22,40

This product may require additional documentation to export from the United States.

N

有

0°C ~ 85°C (TJ)

Tray

M2GL050T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

228.3 kB

267

2.44 mm

现场可编程门阵列

56340

1869824

56340

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

IGLOO2

377

微芯片技术

Tray

M2GL050

活跃

31 X 31 MM, 1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

20

1.14 V

无

M2GL050TS-1FG896I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

27

-40°C ~ 100°C (TJ)

Tray

M2GL050TS

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

228.3 kB

377

2.44 mm

现场可编程门阵列

56340

1869824

56340

31 mm

31 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

YES

400

400-VFBGA (17x17)

400

IGLOO2

207

微芯片技术

Tray

M2GL050

活跃

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

85 °C

有

M2GL050T-VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.29

This product may require additional documentation to export from the United States.

Details

有

90

0°C ~ 85°C (TJ)

Tray

M2GL050T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

228.3 kB

207

1.51 mm

现场可编程门阵列

56340

1869824

STD

56340

17 mm

17 mm

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

1.14 V

有

60

IGLOO2

209

Tray

M2GL005

活跃

1.26 V

-40°C ~ 100°C (TJ)

Tray

M2GL005S

1.14V ~ 2.625V

6060

719872

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

896-BGA

896-FBGA (31x31)

微芯片技术

27

IGLOO2

1.2000 V

377

Tray

M2GL050

活跃

This product may require additional documentation to export from the United States.

N

有

-40 to 100 °C

Tray

M2GL050T

100 °C

-40 °C

1.14V ~ 2.625V

228.3 kB

56340

1869824

1

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

400

400-VFBGA (17x17)

微芯片技术

有

90

IGLOO2

169

1.26 V

Tray

M2GL005

活跃

This product may require additional documentation to export from the United States.

N

1.14 V

-40°C ~ 100°C (TJ)

Tray

M2GL005S

100 °C

-40 °C

1.14V ~ 2.625V

87.9 kB

6060

719872

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

176

IGLOO2

200

微芯片技术

Tray

M2GL050

活跃

BGA, BGA325,21X21,20

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

有

MICROSEMI CORP

1.26 V

5.27

活跃

SQUARE

BGA

M2GL050-1FCSG325I

This product may require additional documentation to export from the United States.

Details

有

-40°C ~ 100°C (TJ)

Tray

M2GL050

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B325

200

不合格

1.2 V

200

现场可编程门阵列

56340

1869824

56340

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

400

400-VFBGA (17x17)

微芯片技术

有

90

IGLOO2

169

1.26 V

Tray

M2GL005

活跃

This product may require additional documentation to export from the United States.

N

1.14 V

-40°C ~ 100°C (TJ)

Tray

M2GL005

100 °C

-40 °C

1.14V ~ 2.625V

87.9 kB

6060

719872