N/A

-

表面贴装

784-FBGA

784-VFBGA (23x23)

微芯片技术

56500 LE

+ 85 C

0 C

SMD/SMT

395

Tray

活跃

0°C ~ 85°C (TJ)

IGLOO2

1.14V ~ 1.26V

56520

1869824

N/A

-

表面贴装

1657-BCLGA

1657-CLGA (42.5x42.5)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

表面贴装

352-BFCQFP Exposed Pad

352-QFP (48x48)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

表面贴装

100-LQFP

100-TQFP (14x14)

微芯片技术

81

Tray

A54SX16A

Obsolete

-40°C ~ 85°C (TA)

SX-A

2.25V ~ 5.25V

24000

1452

N/A

-

N/A

-

表面贴装

100-TQFP

100-VQFP (14x14)

微芯片技术

77

Tray

A3PN030

Obsolete

-40°C ~ 100°C (TJ)

ProASIC3 nano

1.425V ~ 1.575V

30000

N/A

-

表面贴装

1657-BCLGA

1657-CLGA (42.5x42.5)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

表面贴装

352-BFCQFP Exposed Pad

352-QFP (48x48)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

Non-Compliant

N/A

-

YES

208

1.2 V

40

1.14 V

85 °C

有

M1A3P1000L-PQG208I

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.27

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

e3

哑光锡

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5/3.3 V

INDUSTRIAL

154

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

24576

24576

1000000

28 mm

28 mm

N/A

-

YES

84

Microsemi Corporation

活跃

MICROSEMI CORP

5.84

QCCJ, LDCC84,1.2SQ

CHIP CARRIER

PLASTIC/EPOXY

LDCC84,1.2SQ

-40 °C

85 °C

无

A54SX08-PL84I

230 MHz

QCCJ

SQUARE

现场可编程门阵列

CMOS

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J84

69

不合格

3.3,5 V

INDUSTRIAL

69

现场可编程门阵列

768

N/A

-

YES

44

有

A1010B-PLG44C

45 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.25 V

5.8

PLASTIC, MS-007-AB, LCC-44

CHIP CARRIER

3

PLASTIC/EPOXY

5 V

40

4.75 V

70 °C

e3

Matte Tin (Sn)

MAX 34 I/OS

8542.39.00.01

CMOS

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

COMMERCIAL

295 CLBS, 1200 GATES

4.445 mm

现场可编程门阵列

4.5 ns

295

1200

16.51 mm

16.51 mm

N/A

-

YES

456

2.3 V

70 °C

无

APA150-BG456

180 MHz

BGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.7 V

5.86

1.27 MM PITCH, PLASTIC, BGA-456

网格排列

3

PLASTIC/EPOXY

BGA456,26X26,50

2.5 V

30

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B456

242

不合格

2.5,2.5/3.3 V

COMMERCIAL

242

150000 GATES

2.54 mm

现场可编程门阵列

6144

150000

35 mm

35 mm

N/A

-

YES

121

Obsolete

MICROSEMI CORP

1.575 V

5.25

VFBGA,

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

1.5 V

1.425 V

85 °C

无

A3P060-CS121

VFBGA

SQUARE

Microsemi Corporation

8542.39.00.01

CMOS

BOTTOM

BALL

0.5 mm

compliant

S-PBGA-B121

不合格

COMMERCIAL

1536 CLBS, 60000 GATES

0.99 mm

现场可编程门阵列

1536

60000

6 mm

6 mm

N/A

-

YES

208

1.425 V

70 °C

无

AX250-2PQ208

870 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.88

0.50 MM PITCH, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

30

e0

Tin/Lead (Sn/Pb)

250000 SYSTEM GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G208

248

不合格

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

248

2816 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

0.74 ns

2816

4224

250000

28 mm

28 mm

N/A

-

NO

84

30

4.5 V

125 °C

无

A1010B-PG84B

37 MHz

PGA

SQUARE

Actel Corporation

Obsolete

ACTEL CORP

5.5 V

5.84

Military grade

CERAMIC, PGA-84

网格排列

CERAMIC, METAL-SEALED COFIRED

PGA84M,11X11

-55 °C

5 V

e0

Tin/Lead (Sn/Pb)

MAX 57 I/OS

现场可编程门阵列

CMOS

PERPENDICULAR

PIN/PEG

225

2.54 mm

compliant

S-CPGA-P84

57

不合格

5 V

MILITARY

57

295 CLBS, 1200 GATES

4.318 mm

现场可编程门阵列

MIL-STD-883 Class B

5.5 ns

295

295

1200

27.94 mm

27.94 mm

N/A

-

N/A

-

N/A

-

YES

68

8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, QFN-68

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Obsolete

未说明

5.25

有

1.575 V

1.14 V

1.2 V

MICROSEMI CORP

Microsemi Corporation

AGL015V2-QNG68I

3

100 °C

-40 °C

UNSPECIFIED

HVQCCN

8542.39.00.01

CMOS

QUAD

无铅

未说明

0.4 mm

compliant

S-XQCC-N68

不合格

INDUSTRIAL

384 CLBS, 15000 GATES

1 mm

现场可编程门阵列

384

15000

8 mm

8 mm

N/A

-

784-FBGA

784-VFBGA (23x23)

微芯片技术

56500 LE

Tray

活跃

+ 100 C

- 40 C

SMD/SMT

-40°C ~ 100°C (TJ)

SmartFusion®2

166MHz

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

N/A

-

通孔

1657-BFCPGA

1657-CCGA (42.5x42.5)

微芯片技术

Bulk

活跃

-55°C ~ 125°C (TJ)

RTG4™

1.14V ~ 1.26V

151824

5325

N/A

-

N/A

-

N/A

-

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

3

PLASTIC/EPOXY

QFP144,.87SQ,20

-55 °C

2.5 V

30

2.25 V

125 °C

无

A54SX16A-1TQ144M

263 MHz

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.75 V

5.25

113

Tray

A54SX16A

Obsolete

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

-55°C ~ 125°C (TC)

SX-A

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5,3.3/5 V

MILITARY

113

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1.2 ns

1452

1452

24000

20 mm

20 mm