对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

生命周期状态

触点镀层

底架

安装类型

包装/外壳

表面安装

引脚数

供应商器件包装

质量

终端数量

厂商

操作温度

包装

系列

JESD-609代码

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

技术

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

频率

JESD-30代码

输出的数量

资历状况

工作电源电压

电源

温度等级

最大电源电压

最小电源电压

工作电源电流

内存大小

传播延迟

接通延迟时间

数据率

输入数量

组织结构

座位高度-最大

可编程逻辑类型

逻辑元件/单元数

总 RAM 位数

阀门数量

最高频率

LABs数量/ CLBs数量

逻辑块数(LABs)

速度等级

收发器数量

寄存器数量

CLB-Max的组合延时

逻辑块数量

逻辑单元数

等效门数

高度

长度

宽度

辐射硬化

无铅

AFS600-2FG484I
AFS600-2FG484I
Microchip Technology 数据表

2826 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

SMD/SMT

微芯片技术

1470.59 MHz

60

Fusion

0.014110 oz

1.575 V

Tray

AFS600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

AFS600-2FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

7000 LE

172 I/O

1.425 V

- 40 C

+ 85 C

-40°C ~ 100°C (TJ)

Tray

AFS600

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1.47059 GHz

2

13824

13824

600000

1.73 mm

23 mm

23 mm

A54SX72A-2FGG256I
A54SX72A-2FGG256I
Microchip Technology 数据表

800 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

- 40 C

+ 85 C

SMD/SMT

294 MHz

微芯片技术

90

Actel

0.014110 oz

Tray

A54SX72

活跃

2.75 V

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

2.5 V

30

85 °C

A54SX72A-2FGG256I

294 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

203 I/O

2.25 V

-40°C ~ 85°C (TA)

Tray

A54SX72A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B256

203

不合格

2.5 V

2.5,3.3/5 V

INDUSTRIAL

203

6036 CLBS, 108000 GATES

1.97 mm

现场可编程门阵列

108000

6036

1.1 ns

6036

6036

108000

1.2 mm

17 mm

17 mm

A3P1000-1FGG144
A3P1000-1FGG144
Microchip Technology 数据表

2625 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

微芯片技术

272 MHz

160

ProASIC3

0.014110 oz

1.575 V

Tray

A3P1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

A3P1000-1FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

Details

11000 LE

0°C ~ 85°C (TJ)

Tray

A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

13 mm

13 mm

A54SX32A-2FGG256
A54SX32A-2FGG256
Microchip Technology 数据表

2472 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

+ 70 C

SMD/SMT

313 MHz

微芯片技术

90

Actel

0.014110 oz

Tray

A54SX32

活跃

2.75 V

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

40

70 °C

A54SX32A-2FGG256

313 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

203 I/O

2.25 V

0 C

0°C ~ 70°C (TA)

Tray

A54SX32A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

203

不合格

2.5 V

2.5,2.5/5 V

COMMERCIAL

203

2880 CLBS, 48000 GATES

1.97 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

2880

48000

1.2 mm

17 mm

17 mm

APA450-FGG256
APA450-FGG256
Microchip Technology 数据表

2806 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

Copper, Silver, Tin

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

0 C

+ 70 C

SMD/SMT

180 MHz

90

Actel

0.014110 oz

2.7 V

Tray

APA450

活跃

This product may require additional documentation to export from the United States.

Details

186 I/O

2.3 V

0°C ~ 70°C (TA)

Tray

APA450

70 °C

0 °C

2.3V ~ 2.7V

180 MHz

2.5 V

2.7 V

2.3 V

13.5 kB

110592

450000

180 MHz

STD

12288

1.2 mm

17 mm

17 mm

A54SX16P-TQG176
A54SX16P-TQG176
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

SMD/SMT

240 MHz

微芯片技术

40

Actel

3.6 V

Tray

A54SX16

活跃

LFQFP, QFP176,1.0SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP176,1.0SQ,20

3.3 V

40

70 °C

A54SX16P-TQG176

240 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

147 I/O

3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A54SX16P

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

147

不合格

3.3 V, 5 V

3.3,3.3/5 V

COMMERCIAL

147

1452 CLBS, 16000 GATES

1.6 mm

现场可编程门阵列

24000

1452

0.9 ns

1452

1452

16000

1.4 mm

24 mm

24 mm

A42MX16-1PLG84
A42MX16-1PLG84
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

SMD/SMT

198 MHz

微芯片技术

16

Actel

0.239083 oz

5.25 V

Tray

A42MX16

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

A42MX16-1PLG84

108 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

Details

72 I/O

3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tube

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

COMMERCIAL

1232 CLBS, 24000 GATES

4.572 mm

现场可编程门阵列

24000

2.4 ns

1232

24000

3.68 mm

29.31 mm

29.31 mm

A3P400-PQG208
A3P400-PQG208
Microchip Technology 数据表

875 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

151 I/O

1.425 V

0 C

+ 85 C

SMD/SMT

350 MHz

微芯片技术

24

55296 bit

ProASIC3

0.183425 oz

1.5000 V

Tray

A3P400

活跃

1.575 V

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

A3P400-PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

1.34

Details

5000 LE

0 to 70 °C

Tray

A3P400

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

COMMERCIAL

3 mA

-

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

55296

400000

STD

-

9216

400000

3.4 mm

28 mm

28 mm

AFS250-1FGG256I
AFS250-1FGG256I
Microchip Technology 数据表

2365 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

SMD/SMT

微芯片技术

1282.05 MHz

90

Fusion

0.014110 oz

1.575 V

Tray

AFS250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

AFS250-1FGG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

3000 LE

114 I/O

1.425 V

- 40 C

+ 85 C

-40°C ~ 100°C (TJ)

Tray

AFS250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

4.5 kB

6144 CLBS, 250000 GATES

1.68 mm

现场可编程门阵列

36864

250000

1.28205 GHz

1

6144

6144

250000

1.2 mm

17 mm

17 mm

A54SX32-2PQG208I
A54SX32-2PQG208I
Microchip Technology 数据表

632 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

+ 85 C

SMD/SMT

320 MHz

微芯片技术

24

Actel

Tray

A54SX32

活跃

3.6 V

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

3.3 V

40

85 °C

A54SX32-2PQG208I

320 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

174 I/O

3 V

- 40 C

-40°C ~ 85°C (TA)

Tray

A54SX32

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

174

不合格

3.3 V, 5 V

3.3,5 V

INDUSTRIAL

174

2880 CLBS, 32000 GATES

4.1 mm

现场可编程门阵列

48000

2880

0.7 ns

2880

2880

32000

3.4 mm

28 mm

28 mm

A54SX32A-TQG100
A54SX32A-TQG100
Microchip Technology 数据表

2812 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

TQFP-100

100

100-TQFP (14x14)

657.000198 mg

微芯片技术

+ 70 C

SMD/SMT

238 MHz

90

Actel

0.023175 oz

2.75 V

Tray

A54SX32

活跃

Details

81 I/O

2.25 V

0 C

0°C ~ 70°C (TA)

Tray

A54SX32A

70 °C

0 °C

2.25V ~ 5.25V

238 MHz

2.5 V

2.75 V

2.25 V

1.2 ns

1.2 ns

1800

48000

238 MHz

2880

2880

1980

1.4 mm

14 mm

14 mm

无铅

A40MX02-1PLG44I
A40MX02-1PLG44I
Microchip Technology 数据表

36 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

+ 85 C

SMD/SMT

160 MHz

微芯片技术

27

Actel

0.084185 oz

5.5 V

Tray

A40MX02

活跃

ROHS COMPLIANT, PLASTIC, LCC-44

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

A40MX02-1PLG44I

92 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

Details

34 I/O

3 V

- 40 C

-40°C ~ 85°C (TA)

Tube

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

3.3 V, 5 V

INDUSTRIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2.3 ns

295

3000

3.68 mm

16.59 mm

16.59 mm

M7A3P1000-1FGG144
M7A3P1000-1FGG144
Microchip Technology 数据表

2888 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

SMD/SMT

272 MHz

微芯片技术

160

ProASIC3

0.014110 oz

1.5000 V

Tray

M7A3P1000

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

70 °C

M7A3P1000-1FGG144

350 MHz

LBGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

0 C

+ 70 C

0 to 70 °C

Tray

M7A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

272 MHz

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

272 MHz

1

24576

24576

1000000

1.05 mm

13 mm

13 mm

A54SX32A-1FGG256I
A54SX32A-1FGG256I
Microchip Technology 数据表

2274 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

- 40 C

+ 85 C

SMD/SMT

278 MHz

微芯片技术

90

Actel

0.014110 oz

Tray

A54SX32

活跃

2.75 V

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

-40 °C

2.5 V

40

85 °C

A54SX32A-1FGG256I

278 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

203 I/O

2.25 V

-40°C ~ 85°C (TA)

Tray

A54SX32A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

203

不合格

2.5 V

2.5,2.5/5 V

INDUSTRIAL

203

2880 CLBS, 48000 GATES

1.97 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

1.2 mm

17 mm

17 mm

A54SX32A-PQG208A
A54SX32A-PQG208A
Microchip Technology 数据表

2002 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

Details

174 I/O

2.25 V

- 40 C

+ 125 C

SMD/SMT

238 MHz

24

Actel

Tray

A54SX32

活跃

2.75 V

-40°C ~ 125°C (TA)

Tray

A54SX32A

2.25V ~ 5.25V

2.5 V

48000

2880

STD

3.4 mm

28 mm

28 mm

A54SX72A-FPQG208
A54SX72A-FPQG208
Microchip Technology 数据表

2426 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

24

Actel

Tray

A54SX72

活跃

2.75 V

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

2.5 V

40

70 °C

A54SX72A-FPQG208

156 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.25

Details

171 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

156 MHz

0°C ~ 70°C (TA)

Tray

A54SX72A

e3

Matte Tin (Sn)

70 °C

0 °C

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

156 MHz

S-PQFP-G208

171

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

2.75 V

2.25 V

2 ns

2 ns

171

6036 CLBS, 108000 GATES

4.1 mm

现场可编程门阵列

6036

108000

156 MHz

6036

6036

4024

2 ns

6036

6036

108000

3.4 mm

28 mm

28 mm

A54SX16A-1TQG100I
A54SX16A-1TQG100I
Microchip Technology 数据表

2580 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

- 40 C

+ 85 C

SMD/SMT

263 MHz

微芯片技术

90

Actel

0.023175 oz

2.75 V

Tray

A54SX16

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-100

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

-40 °C

2.5 V

40

85 °C

A54SX16A-1TQG100I

263 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

81 I/O

2.25 V

-40°C ~ 85°C (TA)

Tray

A54SX16A

e3

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

172

不合格

2.5 V

2.5,3.3/5 V

INDUSTRIAL

172

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1.2 ns

1452

1452

24000

1.4 mm

14 mm

14 mm

A54SX16A-1TQG144M
A54SX16A-1TQG144M
Microchip Technology 数据表

568 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

113 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

263 MHz

微芯片技术

60

Actel

0.046530 oz

Tray

A54SX16

活跃

2.75 V

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

-55 °C

2.5 V

40

125 °C

A54SX16A-1TQG144M

263 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

1.37

This product may require additional documentation to export from the United States.

Details

-55°C ~ 125°C (TC)

Tray

A54SX16A

e3

3A001.A.2.C

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5 V

2.5,3.3/5 V

MILITARY

113

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1.2 ns

1452

1452

24000

1.4 mm

20 mm

20 mm

APA075-TQG100
APA075-TQG100
Microchip Technology 数据表

19 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

-

66 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

微芯片技术

-

90

27648 bit

ProASICPLUS

0.023175 oz

2.7 V

Tray

APA075

活跃

LFQFP, QFP100,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

2.5 V

40

70 °C

APA075-TQG100

180 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

1.57

Details

0°C ~ 70°C (TA)

Tray

APA075

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

66

不合格

2.5 V

2.5,2.5/3.3 V

COMMERCIAL

5 mA

66

75000 GATES

1.6 mm

现场可编程门阵列

27648

75000

STD

3072

75000

1.4 mm

14 mm

14 mm

A3P125-1VQG100I
A3P125-1VQG100I
Microchip Technology 数据表

36 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

VQFP

YES

100-VQFP (14x14)

100

SMD/SMT

272 MHz

微芯片技术

90

ProASIC3

Tray

A3P125

活跃

1.575 V

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

A3P125-1VQG100I

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.23

Details

71 I/O

1.425 V

- 40 C

+ 85 C

-40°C ~ 100°C (TJ)

Tray

A3P125

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.5 V

INDUSTRIAL

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

1

3072

125000

1 mm

14 mm

14 mm

A3P1000-FGG256
A3P1000-FGG256
Microchip Technology 数据表

1200 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA-256

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

Details

11000 LE

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

微芯片技术

231 MHz

-

90

147456 bit

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

A3P1000-FGG256

350 MHz

BGA

SQUARE

活跃

FPGA ProASICu00ae3 Family 1M Gates 231MHz 130nm Technology 1.5V Automotive 256-Pin FBGA

MICROSEMI CORP

1.33

0 to 70 °C

Tray

A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

8 mA

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

1.6 mm

17 mm

17 mm

A54SX72A-FFGG256
A54SX72A-FFGG256
Microchip Technology 数据表

2206 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

+ 70 C

SMD/SMT

156 MHz

微芯片技术

90

Actel

0.014110 oz

2.75 V

Tray

A54SX72

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

40

70 °C

A54SX72A-FFGG256

156 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Details

203 I/O

2.25 V

0 C

0°C ~ 70°C (TA)

Tray

A54SX72A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

203

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

203

6036 CLBS, 108000 GATES

1.97 mm

现场可编程门阵列

108000

6036

2 ns

6036

6036

108000

1.2 mm

17 mm

17 mm

M7A3P1000-1FGG484I
M7A3P1000-1FGG484I
Microchip Technology 数据表

2482 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M7A3P1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

M7A3P1000-1FGG484I

350 MHz

BGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

300 I/O

-40 to 85 °C

Tray

M7A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

272 MHz

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

272 MHz

1

24576

24576

1000000

1.73 mm

23 mm

23 mm

A42MX09-1VQG100
A42MX09-1VQG100
Microchip Technology 数据表

2250 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

VQFP

YES

100-VQFP (14x14)

100

247 MHz

微芯片技术

90

Actel

5.25 V

Tray

A42MX09

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

A42MX09-1VQG100

135 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

83 I/O

3 V

0 C

+ 70 C

SMD/SMT

0°C ~ 70°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

3.3 V, 5 V

COMMERCIAL

684 CLBS, 14000 GATES

1.2 mm

现场可编程门阵列

14000

2.1 ns

684

14000

1 mm

14 mm

14 mm

AFS1500-1FGG484I
AFS1500-1FGG484I
Microchip Technology 数据表

2517 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

60

Fusion

0.014110 oz

1.575 V

Tray

AFS1500

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

AFS1500-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

223 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

-40°C ~ 100°C (TJ)

Tray

AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.28205 GHz

1

38400

38400

1500000

1.73 mm

23 mm

23 mm