2162 In Stock

• 1: ¥1,103.337279
• 10: ¥1,040.884226
• 100: ¥981.966246
• 500: ¥926.383251
查看所有的价格

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

有

M2GL050-FCSG325I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

1.53

This product may require additional documentation to export from the United States.

Details

有

176

IGLOO2

200

Tray

M2GL050

活跃

BGA, BGA325,21X21,20

网格排列

-40°C ~ 100°C (TJ)

Tray

M2GL050

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B325

200

不合格

1.2 V

200

现场可编程门阵列

56340

1869824

STD

56340

49 In Stock

• 1: ¥656.852292
• 10: ¥619.671976
• 100: ¥584.596200
• 500: ¥551.505854
查看所有的价格

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

+ 85 C

SMD/SMT

有

微芯片技术

176

IGLOO2

1.2 V

Tray

M2GL025

活跃

BGA, BGA325,21X21,20

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

85 °C

有

M2GL025T-FCSG325

BGA

SQUARE

活跃

MICROSEMI CORP

5.2

This product may require additional documentation to export from the United States.

Details

27696 LE

180 I/O

1.2 V

0 C

0°C ~ 85°C (TJ)

Tray

M2GL025T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B325

180

不合格

1.2 V

1.2 V

OTHER

180

现场可编程门阵列

27696

1130496

STD

2 Transceiver

27696

73 In Stock

• 1: ¥142.126700
• 10: ¥134.081790
• 100: ¥126.492258
• 500: ¥119.332315
查看所有的价格

-

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

60

微芯片技术

IGLOO2

0.035380 oz

1.26 V

Tray

M2GL005

活跃

20 X 20 MM, 0.50 MM PITCH, ROHS COMPLIANT, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL005-1TQG144I

LFQFP

SQUARE

活跃

MICROSEMI CORP

2.03

Details

6060 LE

84 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

有

-40°C ~ 100°C (TJ)

Tray

M2GL005

8542.39.00.01

1.14V ~ 2.625V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

1.2 V

667 Mb/s

1.6 mm

现场可编程门阵列

6060

719872

1

20 mm

20 mm

2325 In Stock

• 1: ¥1,003.729469
• 10: ¥946.914591
• 100: ¥893.315652
• 500: ¥842.750615
查看所有的价格

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

SMD/SMT

有

微芯片技术

119

IGLOO2

Tray

M2GL025

活跃

1.2 V

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL025TS-1VFG256

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

27696 LE

138 I/O

1.2 V

0 C

+ 85 C

0°C ~ 85°C (TJ)

Tray

M2GL025TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

1.2 V

OTHER

1.56 mm

现场可编程门阵列

27696

1130496

2 Transceiver

14 mm

14 mm

2269 In Stock

• 1: ¥1,350.663103
• 10: ¥1,274.210472
• 100: ¥1,202.085352
• 500: ¥1,134.042787
查看所有的价格

-

Production (Last Updated: 1 month ago)

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

N

56340 LE

267 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

1.26 V

Tray

M2GL050

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL050

1.14V ~ 2.625V

667 Mb/s

56340

1869824

STD

4 Transceiver

含铅

2940 In Stock

• 1: ¥944.400396
• 10: ¥890.943768
• 100: ¥840.512989
• 500: ¥792.936782
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

400

400-VFBGA (17x17)

微芯片技术

27696 LE

207 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL025

活跃

This product may require additional documentation to export from the United States.

N

0°C ~ 85°C (TJ)

Tray

M2GL025T

85 °C

0 °C

1.14V ~ 2.625V

1.2 V

138 kB

27696

1130496

1

4 Transceiver

49 In Stock

• 1: ¥571.293167
• 10: ¥538.955821
• 100: ¥508.448882
• 500: ¥479.668760
查看所有的价格

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

SMD/SMT

有

微芯片技术

90

IGLOO2

1.2 V

Tray

M2GL010

活跃

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

85 °C

无

M2GL010TS-VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

12084 LE

195 I/O

1.2 V

0 C

+ 85 C

0°C ~ 85°C (TJ)

Tray

M2GL010TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

1.2 V

OTHER

195

1.51 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

17 mm

17 mm

2888 In Stock

• 1: ¥1,937.229233
• 10: ¥1,827.574751
• 100: ¥1,724.127121
• 500: ¥1,626.535021
查看所有的价格

-

表面贴装

896-BGA

896-FBGA (31x31)

微芯片技术

This product may require additional documentation to export from the United States.

Details

有

27

IGLOO2

377

Tray

M2GL050

活跃

0°C ~ 85°C (TJ)

Tray

M2GL050TS

1.14V ~ 2.625V

56340

1869824

2242 In Stock

• 1: ¥1,208.680691
• 10: ¥1,140.264806
• 100: ¥1,075.721512
• 500: ¥1,014.831619
查看所有的价格

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

BGA325,21X21,20

1.2 V

20

1.14 V

无

M2GL050T-FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

176

IGLOO2

200

Tray

M2GL050

活跃

11 X 11 MM, 0.50 MM PITCH, FBGA-325

网格排列

PLASTIC/EPOXY

-40°C ~ 100°C (TJ)

Tray

M2GL050T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

200

不合格

1.2 V

200

现场可编程门阵列

56340

1869824

STD

56340

2540 In Stock

• 1: ¥1,105.183106
• 10: ¥1,042.625572
• 100: ¥983.609028
• 500: ¥927.933047
查看所有的价格

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

85 °C

有

M2GL050TS-FCSG325

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

176

IGLOO2

200

Tray

M2GL050

活跃

BGA, BGA325,21X21,20

0°C ~ 85°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

200

现场可编程门阵列

56340

1869824

56340

2599 In Stock

• 1: ¥2,442.457163
• 10: ¥2,304.204867
• 100: ¥2,173.778179
• 500: ¥2,050.734132
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

SMD/SMT

有

微芯片技术

60

IGLOO2

1.2 V

Tray

M2GL090

活跃

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

85 °C

无

M2GL090T-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

86184 LE

267 I/O

1.2 V

0 C

+ 85 C

0°C ~ 85°C (TJ)

Tray

M2GL090T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

OTHER

323.3 kB

267

2.44 mm

现场可编程门阵列

86316

2648064

4 Transceiver

86316

23 mm

23 mm

19 In Stock

• 1: ¥453.161903
• 10: ¥427.511228
• 100: ¥403.312478
• 500: ¥380.483471
查看所有的价格

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

SMD/SMT

有

微芯片技术

176

IGLOO2

1.2 V

Tray

M2GL025

活跃

BGA, BGA325,21X21,20

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

无

M2GL025-FCS325I

BGA

SQUARE

活跃

FPGA IGLOOu00ae2 Family 27696 Cells 1.2V 325-Pin FCBGA Tray

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

27696 LE

180 I/O

1.2 V

- 40 C

+ 100 C

-40°C ~ 100°C (TJ)

Tray

M2GL025

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

1.2 V

180

现场可编程门阵列

27696

1130496

STD

27696

49 In Stock

• 1: ¥857.308225
• 10: ¥808.781346
• 100: ¥763.001270
• 500: ¥719.812523
查看所有的价格

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

SMD/SMT

有

微芯片技术

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL060-VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

207 I/O

1.2 V

0 C

+ 85 C

0°C ~ 85°C (TJ)

Tray

M2GL060

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

1.2 V

OTHER

1.51 mm

现场可编程门阵列

56520

1869824

17 mm

17 mm

2579 In Stock

• 1: ¥894.670289
• 10: ¥844.028577
• 100: ¥796.253375
• 500: ¥751.182429
查看所有的价格

-

表面贴装

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

This product may require additional documentation to export from the United States.

Details

27696 LE

138 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

0°C ~ 85°C (TJ)

Tray

M2GL025T

1.14V ~ 2.625V

1.2 V

27696

1130496

2 Transceiver

2984 In Stock

• 1: ¥1,498.814591
• 10: ¥1,413.976026
• 100: ¥1,333.939649
• 500: ¥1,258.433632
查看所有的价格

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

1.14 V

有

M2GL050TS-1FCSG325I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

176

IGLOO2

200

Tray

M2GL050

活跃

11 X 11 MM, 0.50 MM PITCH, ROHS COMPLIANT, FBGA-325

网格排列

3

-40°C ~ 100°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

30

S-PBGA-B325

200

不合格

1.2 V

200

现场可编程门阵列

56340

1869824

56340

19 In Stock

• 1: ¥718.415029
• 10: ¥677.750027
• 100: ¥639.386821
• 500: ¥603.195109
查看所有的价格

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

+ 70 C

SMD/SMT

310 MHz

有

微芯片技术

90

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3P600

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P600-2FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

177 I/O

1.425 V

0 C

0°C ~ 85°C (TJ)

Tray

M1A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.2 mm

17 mm

17 mm

2724 In Stock

• 1: ¥3,588.172242
• 10: ¥3,385.068155
• 100: ¥3,193.460523
• 500: ¥3,012.698610
查看所有的价格

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

147 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

微芯片技术

24

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE3000

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

40

70 °C

有

M1A3PE3000-PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.61

This product may require additional documentation to export from the United States.

Details

0 to 70 °C

Tray

M1A3PE3000

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA-484

YES

484

484-FPBGA (23x23)

484

341 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

504 kbit

微芯片技术

250 MHz

3500 LAB

60

IGLOOe

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1AGLE3000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

有

M1AGLE3000V5-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

35000 LE

-40 to 85 °C

Tray

M1AGLE3000V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

63 kB

700 Mb/s

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

516096

3000000

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

无

2210 In Stock

• 1: ¥1,060.342083
• 10: ¥1,000.322720
• 100: ¥943.700675
• 500: ¥890.283658
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

有

90

微芯片技术

IGLOOe

0.014110 oz

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

M1AGL600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AGL600V5-FG256

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0 to 70 °C

Tray

M1AGL600V5

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

OTHER

1.575 V

1.425 V

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.2 mm

17 mm

17 mm

876 In Stock

• 1: ¥4,479.871319
• 10: ¥4,226.293700
• 100: ¥3,987.069526
• 500: ¥3,761.386345
查看所有的价格

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

N

620 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

微芯片技术

27

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE3000

活跃

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.5 V

30

70 °C

无

M1A3PE3000-FG896

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

M1A3PE3000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

31 mm

31 mm

564 In Stock

• 1: ¥8,255.108250
• 10: ¥7,787.837970
• 100: ¥7,347.016956
• 500: ¥6,931.148070
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA-484

YES

484

484-FPBGA (23x23)

484

341 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

504 kbit

微芯片技术

250 MHz

3500 LAB

60

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

M1AGLE3000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

有

M1AGLE3000V2-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

35000 LE

-40 to 85 °C

Tray

M1AGLE3000V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.2 V to 1.5 V

INDUSTRIAL

1.575 V

1.14 V

63 kB

700 Mb/s

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

516096

3000000

STD

75264

3000000

1.73 mm

23 mm

23 mm

2351 In Stock

• 1: ¥4,077.405049
• 10: ¥3,846.608537
• 100: ¥3,628.875979
• 500: ¥3,423.467906
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

微芯片技术

60

ProASIC3

0.014110 oz

1.5000 V

Tray

M1A3PE3000

活跃

1.575 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

40

70 °C

有

M1A3PE3000-1FGG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

341 I/O

0 to 70 °C

Tray

M1A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

Details

620 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

微芯片技术

27

ProASIC3

0.014110 oz

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

M1A3PE3000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.5 V

40

70 °C

有

M1A3PE3000-1FGG896

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

M1A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

75264

75264

3000000

1.73 mm

31 mm

31 mm

2409 In Stock

• 1: ¥4,069.565541
• 10: ¥3,839.212777
• 100: ¥3,621.898848
• 500: ¥3,416.885701
查看所有的价格

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

N

341 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

微芯片技术

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

M1A3PE3000

活跃

1.575 V

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

30

70 °C

无

M1A3PE3000-1FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

M1A3PE3000

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

75264

75264

3000000

1.73 mm

23 mm

23 mm

19 In Stock

• 1: ¥250.253604
• 10: ¥236.088306
• 100: ¥222.724820
• 500: ¥210.117756
查看所有的价格

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

0 C

+ 70 C

SMD/SMT

272 MHz

有

160

微芯片技术

ProASIC3

0.014110 oz

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

M1A3P250

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P250-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

97 I/O

1.425 V

0 to 70 °C

Tray

M1A3P250

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

1

6144

250000

1.05 mm

13 mm

13 mm