N/A

-

YES

208

M1AFS250-1PQ208

无

Obsolete

MICROSEMI CORP

QFF,

5.88

3

85 °C

PLASTIC/EPOXY

QFF

RECTANGULAR

FLATPACK

1.575 V

1.5 V

30

1.425 V

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

QUAD

FLAT

225

0.5 mm

compliant

R-PQFP-F208

不合格

OTHER

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

6144

250000

30.6 mm

28 mm

N/A

-

YES

208

M1AFS250-PQ208I

无

Obsolete

MICROSEMI CORP

QFP-208

5.88

3

85 °C

-40 °C

1.575 V

1.5 V

30

FLATPACK

RECTANGULAR

QFF

PLASTIC/EPOXY

1.425 V

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

QUAD

FLAT

225

0.5 mm

compliant

R-PQFP-F208

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

6144

250000

30.6 mm

28 mm

N/A

-

表面贴装

176-TQFP

YES

176-VQFP (20x20)

176

微芯片技术

FLATPACK, THIN PROFILE, FINE PITCH

1.575 V

1.425 V

1.5 V

未说明

1.425 V

1.575 V

137

Tray

AGLP060

活跃

AGLP060V5-VQG176I

有

活跃

MICROSEMI CORP

TFQFP, TQFP176,.87SQ,16

0.88

250 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

TFQFP

TQFP176,.87SQ,16

SQUARE

-40°C ~ 100°C (TJ)

IGLOO PLUS

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

未说明

0.4 mm

compliant

S-PQFP-G176

137

不合格

1.5 V

INDUSTRIAL

137

1584 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

1584

18432

60000

STD

1584

1584

60000

20 mm

20 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

1.575 V

1.2 V

未说明

1.2, 1.5 V

1.14 V

1.575 V

77

Tray

AGL030

活跃

1.14 V

AGL030V2-VQG100I

有

活跃

MICROSEMI CORP

TFQFP,

1.39

108 MHz

3

100 °C

-40 °C

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

-40 to 85 °C

IGLOO

e3

Tin (Sn)

8542.39.00.01

1.14V ~ 1.575V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

768

30000

STD

768

30000

14 mm

14 mm

N/A

-

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

活跃

1.425 V

A2F200M3F-PQG208

有

活跃

MICROSEMI CORP

FQFP,

2.08

3

85 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

30

MCU - 22, FPGA - 66

Tray

A2F200

0°C ~ 85°C (TJ)

SmartFusion®

Pure Matte Tin (Sn)

8542.39.00.01

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

OTHER

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

4608 CLBS, 200000 GATES

4.1 mm

现场可编程门阵列

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

200000

256KB

28 mm

28 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

2.5 V

30

171

Tray

A54SX72A

Obsolete

2.25 V

A54SX72A-1PQ208M

无

Obsolete

MICROSEMI CORP

PLASTIC, QFP-208

5.25

250 MHz

3

125 °C

-55 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

2.75 V

-55°C ~ 125°C (TC)

SX-A

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G208

171

不合格

2.5,3.3/5 V

MILITARY

171

6036 CLBS, 108000 GATES

4.1 mm

现场可编程门阵列

108000

6036

1.3 ns

6036

6036

108000

28 mm

28 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

-55 °C

PLASTIC/EPOXY

QFP

QFP208,1.2SQ

SQUARE

FLATPACK

175

Tray

A54SX16A

Obsolete

A54SX16A-1PQ208M

无

Obsolete

MICROSEMI CORP

5.85

125 °C

-55°C ~ 125°C (TC)

SX-A

3A001.A.2.C

8542.39.00.01

2.25V ~ 5.25V

QUAD

鸥翼

0.635 mm

unknown

S-PQFP-G208

175

不合格

2.5,3.3/5 V

MILITARY

175

现场可编程门阵列

24000

1452

1452

N/A

-

YES

176

2.5 V

30

2.25 V

A54SX32A-2TQ176I

无

Obsolete

MICROSEMI CORP

1.40 MM HEIGHT, TQFP-176

5.84

313 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

QFP176,1.0SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

2.75 V

e0

锡铅

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G176

147

不合格

2.5,2.5/5 V

INDUSTRIAL

147

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

0.9 ns

2880

2880

48000

24 mm

24 mm

N/A

-

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

Tray

A2F500M3G

Obsolete

1.425 V

A2F500M3G-PQ208I

无

Obsolete

MICROSEMI CORP

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208

5.56

80 MHz

3

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

20

MCU - 22, FPGA - 66

-40°C ~ 100°C (TJ)

SmartFusion®

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

66

不合格

1.5,1.8,2.5,3.3 V

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

Ethernet, I²C, SPI, UART/USART

MCU, FPGA

66

11520 CLBS, 500000 GATES

4.1 mm

现场可编程门阵列

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

11520

11520

500000

512KB

28 mm

28 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

174

Tray

A54SX32A

Obsolete

2.25 V

A54SX32A-2PQ208

无

Obsolete

MICROSEMI CORP

PLASTIC, QFP-208

5.25

313 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

30

2.5 V

2.75 V

0°C ~ 70°C (TA)

SX-A

e0

Tin/Lead (Sn/Pb)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G208

174

不合格

2.5,3.3/5 V

COMMERCIAL

174

2880 CLBS, 48000 GATES

4.1 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

2880

48000

28 mm

28 mm

N/A

-

表面贴装

160-BQFP

YES

160-PQFP (28x28)

160

微芯片技术

40

3.3, 5 V

3 V

5.25 V

101

Tray

A42MX09

活跃

3 V

A42MX09-FPQG160

有

活跃

MICROSEMI CORP

ROHS COMPLIANT, PLASTIC, QFP-160

5.24

70 MHz

3

70 °C

PLASTIC/EPOXY

QFP

SQUARE

FLATPACK

3.6 V

3.3 V

0 to 70 °C

MX

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

COMMERCIAL

684 CLBS, 14000 GATES

4.1 mm

现场可编程门阵列

14000

F

3.5 ns

684

14000

28 mm

28 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

A54SX16

Obsolete

3 V

A54SX16P-2VQ100

无

Obsolete

MICROSEMI CORP

TFQFP,

5.26

320 MHz

3

70 °C

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

3.6 V

3.3 V

30

81

Tray

0°C ~ 70°C (TA)

SX

e0

Tin/Lead (Sn/Pb)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

COMMERCIAL

1452 CLBS, 16000 GATES

1.2 mm

现场可编程门阵列

24000

1452

0.7 ns

1452

16000

14 mm

14 mm

N/A

-

表面贴装

48-VFQFN Exposed Pad

YES

48-QFN (6x6)

48

微芯片技术

30

1.5000 V

1.425 V

1.575 V

34

Tray

A3PN010

活跃

1.425 V

A3PN010-2QNG48

有

活跃

MICROSEMI CORP

HQCCN,

5.26

3

70 °C

-20 °C

UNSPECIFIED

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

1.575 V

1.5 V

-20 to 70 °C

ProASIC3 nano

8542.39.00.01

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N48

不合格

OTHER

260 CLBS, 10000 GATES

现场可编程门阵列

10000

2

260

10000

6 mm

6 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

A3P1000

Obsolete

1.425 V

A3P1000-1PQ208

无

Obsolete

MICROSEMI CORP

FQFP,

5.24

350 MHz

3

85 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

30

154

Tray

0°C ~ 85°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

24576

1000000

28 mm

28 mm

N/A

-

YES

256

20

2.97 V

Military grade

A54SX16-CQ256B

无

Obsolete

MICROSEMI CORP

CERAMIC, QFP-256

5.31

205 MHz

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

QFF

TPAK256,3SQ,20

SQUARE

FLATPACK

3.63 V

3.3 V

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

24000 SYSTEM GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

225

0.5 mm

compliant

S-CQFP-F256

172

不合格

3.3,5 V

MILITARY

172

1452 CLBS, 16000 GATES

3.06 mm

现场可编程门阵列

MIL-STD-883 Class B

1 ns

1452

1452

16000

36 mm

36 mm

N/A

-

表面贴装

48-VFQFN Exposed Pad

YES

48-QFN (6x6)

48

微芯片技术

1.425 V

AGL030V5-QNG48

有

活跃

MICROSEMI CORP

HQCCN,

5.23

3

85 °C

UNSPECIFIED

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

1.575 V

1.5 V

未说明

34

Tray

AGL030

活跃

0°C ~ 70°C (TA)

IGLOO

8542.39.00.01

1.425V ~ 1.575V

QUAD

无铅

未说明

compliant

S-XQCC-N48

不合格

OTHER

768 CLBS, 30000 GATES

现场可编程门阵列

768

30000

STD

768

30000

N/A

-

表面贴装

176-LQFP

YES

176-TQFP (24x24)

176

微芯片技术

104

Tray

A42MX09

活跃

3 V

A42MX09-TQG176

有

活跃

MICROSEMI CORP

1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-176

1.57

117 MHz

3

70 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3.3 V

40

3.3, 5 V

0 to 70 °C

MX

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

COMMERCIAL

684 CLBS, 14000 GATES

1.6 mm

现场可编程门阵列

14000

STD

2.5 ns

684

14000

24 mm

24 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

A42MX16

活跃

3 V

A42MX16-PQG208

有

活跃

MICROSEMI CORP

FQFP,

5.29

94 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

3.6 V

3.3 V

40

140

Tray

0°C ~ 70°C (TA)

MX

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

STD

2.8 ns

1232

24000

28 mm

28 mm

N/A

-

YES

144

40

3.3 V

3.6 V

FLATPACK, LOW PROFILE, FINE PITCH

SQUARE

LFQFP

PLASTIC/EPOXY

70 °C

3

240 MHz

5.3

LFQFP,

MICROSEMI CORP

Obsolete

有

A54SX08-TQG144

3 V

e3

哑光锡

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

不合格

COMMERCIAL

768 CLBS, 8000 GATES

1.6 mm

现场可编程门阵列

0.9 ns

768

8000

20 mm

20 mm

N/A

-

表面贴装

100-LQFP

YES

100-TQFP (14x14)

100

微芯片技术

无

APA075-TQ100I

66

Tray

APA075

Obsolete

2.3 V

2.7 V

2.5 V

未说明

FLATPACK, LOW PROFILE, FINE PITCH

SQUARE

QFP100,.63SQ,20

LFQFP

PLASTIC/EPOXY

-40 °C

85 °C

3

180 MHz

5.31

0.50 MM PITCH, TQFP-100

MICROSEMI CORP

Obsolete

-40°C ~ 85°C (TA)

ProASICPLUS

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

2.3V ~ 2.7V

QUAD

鸥翼

未说明

0.5 mm

unknown

S-PQFP-G100

66

不合格

2.5,2.5/3.3 V

INDUSTRIAL

66

75000 GATES

1.6 mm

现场可编程门阵列

27648

75000

3072

75000

14 mm

14 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

151

Tray

A3P400

Obsolete

1.425 V

A3P400-PQ208I

无

Obsolete

MICROSEMI CORP

FQFP,

5.23

350 MHz

3

100 °C

-40 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

30

-40°C ~ 100°C (TJ)

ProASIC3

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

55296

400000

9216

400000

28 mm

28 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

158

Tray

APA300

Obsolete

2.3 V

APA300-PQ208

无

Obsolete

MICROSEMI CORP

0.50 MM PITCH, PLASTIC, QFP-208

5.3

180 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

2.7 V

2.5 V

30

0°C ~ 70°C (TA)

ProASICPLUS

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

2.3V ~ 2.7V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G208

158

不合格

2.5,2.5/3.3 V

COMMERCIAL

158

300000 GATES

4.1 mm

现场可编程门阵列

73728

300000

8192

300000

28 mm

28 mm

N/A

-

YES

256

3.63 V

FLATPACK, GUARD RING

SQUARE

GQFF

CERAMIC, METAL-SEALED COFIRED

-55 °C

125 °C

5.26

GQFF,

MICROSEMI CORP

Obsolete

5962-9956904QXC

2.97 V

Military grade

3.3 V

e4

3A001.A.2.C

GOLD

ALSO REQUIRES 5V SUPPLY

8542.39.00.01

QUAD

FLAT

0.5 mm

unknown

S-CQFP-F256

Qualified

MILITARY

1452 CLBS, 16000 GATES

3.81 mm

现场可编程门阵列

MIL-PRF-38535 Class Q

1452

16000

36 mm

36 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

AWG27

Networks

RJ45 plug

Cable

RJ45 plug

1x

Yellow,Green

267

Compliant

Tray

M2GL050

活跃

Round

有

1x

straight

-40°C ~ 100°C (TJ)

IGLOO2

100 °C

-40 °C

1.14V ~ 2.625V

S/FTP

228.3 kB

56340

1869824

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

10250T434H620

Cutler Hammer, Div of Eaton Co

267

Tray

M2GL050

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

1.14 V

125 °C

有

BGA

-55°C ~ 125°C (TJ)

IGLOO2

3A001.A.2.C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B484

267

不合格

1.2 V

MILITARY

267

2.44 mm

现场可编程门阵列

56340

1869824

56340

23 mm

23 mm