N/A

-

YES

208

5.31

313 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

2.75 V

2.5 V

30

2.25 V

A54SX08A-2PQ208

无

Obsolete

MICROSEMI CORP

FQFP, QFP208,1.2SQ,20

e0

Tin/Lead (Sn/Pb)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

130

不合格

2.5,3.3/5 V

COMMERCIAL

130

768 CLBS, 12000 GATES

4.1 mm

现场可编程门阵列

0.9 ns

768

768

12000

28 mm

28 mm

N/A

-

YES

176

LFQFP,

5.59

280 MHz

3

70 °C

PLASTIC/EPOXY

LFQFP

A54SX32-1TQG176

有

Obsolete

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.6 V

3 V

3.3 V

40

MICROSEMI CORP

e3

哑光锡

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

COMMERCIAL

2880 CLBS, 32000 GATES

1.6 mm

现场可编程门阵列

0.8 ns

2880

32000

24 mm

24 mm

N/A

-

YES

68

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.575 V

1.5 V

未说明

1.425 V

AGL015V5-QNG68I

有

Obsolete

MICROSEMI CORP

HVQCCN,

5.31

100 °C

-40 °C

UNSPECIFIED

8542.39.00.01

QUAD

无铅

未说明

0.4 mm

compliant

S-XQCC-N68

不合格

INDUSTRIAL

384 CLBS, 15000 GATES

1 mm

现场可编程门阵列

384

15000

8 mm

8 mm

233 In Stock

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

微芯片技术

FLATPACK, LOW PROFILE, FINE PITCH

2.75 V

2.5 V

30

SX-A

85C

INDUSTRIALC

TQFP

48000

-40C to 85C

113

32000

2880

0.25um

2.75(V)

2.5(V)

无

2.25(V)

-40C

有

1800

1980

表面贴装

113

Tray

A54SX32A

Obsolete

2.25 V

A54SX32A-TQ144I

无

Obsolete

MICROSEMI CORP

1.40 MM, TQFP-144

5.18

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

SQUARE

-40°C ~ 85°C (TA)

Tray

SX-A

e0

Tin/Lead (Sn/Pb)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

unknown

238(MHz)

144

S-PQFP-G144

不合格

INDUSTRIAL

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

48000

2880

1.2 ns

2880

48000

20 mm

20 mm

N/A

-

Obsolete (Last Updated: 1 month ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

Obsolete

MICROSEMI CORP

QFP

FQFP,

5.25

105 MHz

3

70 °C

PLASTIC/EPOXY

176

Compliant

Tray

A42MX24

Obsolete

3 V

FQFP

SQUARE

FLATPACK, FINE PITCH

3.6 V

3.3 V

30

A42MX24-2PQ208

无

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

208

S-PQFP-G208

不合格

5 V

COMMERCIAL

5.25 V

3 V

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

912

2

1410

1.8 ns

1890

36000

3.4 mm

28 mm

28 mm

无

N/A

-

YES

256

70 °C

CERAMIC, METAL-SEALED COFIRED

QFF

TPAK256,3SQ,20

SQUARE

FLATPACK

3.63 V

3.3 V

20

2.97 V

A54SX32-1CQ256

无

Obsolete

MICROSEMI CORP

CERAMIC, QFP-256

5.24

240 MHz

e0

锡铅

48000 SYSTEM GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

225

0.5 mm

unknown

S-CQFP-F256

246

不合格

3.3,5 V

COMMERCIAL

246

2880 CLBS, 32000 GATES

3.06 mm

现场可编程门阵列

0.9 ns

2880

2880

32000

36 mm

36 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

3

70 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

3.6 V

3.3 V

30

140

Compliant

Tray

A42MX16

Obsolete

3 V

A42MX16-3PQ208

无

Obsolete

MICROSEMI CORP

QFP

FQFP,

5.24

129 MHz

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

208

S-PQFP-G208

不合格

5 V

COMMERCIAL

5.25 V

3 V

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

608

24000

237 MHz

608

3

928

1.9 ns

1232

24000

3.4 mm

28 mm

28 mm

无

N/A

-

YES

68

100 °C

-40 °C

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.575 V

1.425 V

1.5 V

30

A3P015-QNG68I

有

Obsolete

MICROSEMI CORP

HVQCCN,

5.25

3

8542.39.00.01

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

不合格

INDUSTRIAL

384 CLBS, 15000 GATES

1 mm

现场可编程门阵列

384

15000

8 mm

8 mm

N/A

-

YES

68

3

85 °C

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.575 V

1.425 V

1.5 V

30

A3P015-2QNG68

有

Obsolete

MICROSEMI CORP

HVQCCN,

5.25

350 MHz

8542.39.00.01

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

不合格

COMMERCIAL

384 CLBS, 15000 GATES

1 mm

现场可编程门阵列

384

15000

8 mm

8 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

Obsolete

MICROSEMI CORP

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208

5.6

350 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

30

147

Tray

M1A3PE3000

Obsolete

1.425 V

M1A3PE3000-PQ208I

无

-40°C ~ 100°C (TJ)

ProASIC3E

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

INDUSTRIAL

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

28 mm

28 mm

N/A

-

YES

208

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.5 V

30

1.425 V

M7AFS600-2PQ208I

无

Transferred

ACTEL CORP

0.50 MM PITCH, PQFP-208

5.85

3

e0

锡铅

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

600000 GATES

4.1 mm

现场可编程门阵列

600000

28 mm

28 mm

N/A

-

YES

208

5.25

350 MHz

3

70 °C

PLASTIC/EPOXY

FQFP

QFP208,1.2SQ,20

SQUARE

FLATPACK, FINE PITCH

1.575 V

1.2 V

40

1.14 V

M1A3P600L-PQG208

有

Obsolete

MICROSEMI CORP

FQFP, QFP208,1.2SQ,20

e3

哑光锡

8542.39.00.01

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

154

不合格

1.5/3.3 V

COMMERCIAL

154

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

13824

13824

600000

28 mm

28 mm

N/A

-

表面贴装

100-LQFP

YES

100-TQFP (14x14)

100

微芯片技术

TQFP-100

5.32

250 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

2.7 V

2.5 V

30

70

Tray

EX128

Obsolete

2.3 V

EX128-TQ100I

无

Obsolete

MICROSEMI CORP

-40°C ~ 85°C (TA)

EX

e0

Tin/Lead (Sn/Pb)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

2.3V ~ 2.7V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G100

INDUSTRIAL

6000 GATES

1.6 mm

现场可编程门阵列

256

6000

1 ns

6000

14 mm

14 mm

2008 In Stock

• 1: ¥2,432.724480
• 10: ¥2,295.023092
• 100: ¥2,165.116126
• 500: ¥2,042.562386
查看所有的价格

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

86184 LE

+ 100 C

1.2 V

- 40 C

1.2 V

SMD/SMT

AEC-Q200

267

Tray

M2GL090

活跃

-40°C ~ 100°C (TJ)

IGLOO2

100 ppm/K

165 Ohm

0.125 W

1.14V ~ 2.625V

通用型

1.2 V

86184

2648064

STD

4 Transceiver

1

2 mm

1.25 mm

N/A

-

表面贴装

68-LCC (J-Lead)

YES

68-PLCC (24.23x24.23)

68

微芯片技术

57

Tray

A40MX02

Obsolete

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

3.3 V

30

3 V

85 °C

无

A40MX02-3PL68I

109 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.25

LCC

-40°C ~ 85°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

225

1.27 mm

compliant

68

S-PQCC-J68

不合格

INDUSTRIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

1.7 ns

295

3000

24.2316 mm

24.2316 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

Contactor

法兰安装

147

Tray

A3PE3000

Obsolete

Compliant

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.5 V

30

1.425 V

85 °C

无

A3PE3000-PQ208I

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.6

-40°C ~ 100°C (TJ)

ProASIC3E

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

231 MHz

S-PQFP-G208

147

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

63 kB

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3000000

231 MHz

75264

75264

75264

3000000

SPST-NO-DM

3.4 mm

28 mm

28 mm

无

N/A

-

Obsolete (Last Updated: 1 month ago)

Lead, Tin

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

微芯片技术

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

2.5 V

30

2.25 V

85 °C

无

A54SX72A-PQ208I

230.8 MHz

FQFP

SQUARE

Actel Corporation

Transferred

ACTEL CORP

2.75 V

5.82

171

Compliant

Tray

A54SX72A

Obsolete

PLASTIC, QFP-208

-40°C ~ 85°C (TA)

SX-A

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

72000 TYPICAL GATES AVAILABLE

现场可编程门阵列

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

217 MHz

S-PQFP-G208

171

不合格

2.5 V

2.5,3.3/5 V

INDUSTRIAL

2.75 V

2.25 V

1.5 ns

1.5 ns

171

6036 CLBS, 108000 GATES

4.1 mm

现场可编程门阵列

6036

108000

217 MHz

6036

6036

4024

1.3 ns

6036

6036

108000

3.4 mm

28 mm

28 mm

无

含铅

N/A

-

Obsolete (Last Updated: 2 months ago)

通孔

624

418

Compliant

125 °C

-55 °C

1.5 V

20.3 kB

990 ps

12096

1e+06

12096

无

N/A

-

表面贴装

YES

240

240

202

FQFP, QFP240,1.3SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP240,1.3SQ,20

3.3 V

30

3 V

70 °C

无

A42MX36-3PQ240

100 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.79

QFP

Compliant

e0

锡铅

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

225

0.5 mm

compliant

240

S-PQFP-G240

202

不合格

5 V

3.3,3.3/5,5 V

COMMERCIAL

5.25 V

3 V

320 B

202

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

54000

180 MHz

1184

3

1822

1.9 ns

2438

2414

54000

3.4 mm

32 mm

32 mm

无

49 In Stock

• 1: ¥713.699982
• 10: ¥673.301872
• 100: ¥635.190439
• 500: ¥599.236269
查看所有的价格

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

85 °C

无

M2GL010TS-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

12084 LE

233 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

0°C ~ 85°C (TJ)

Tray

M2GL010TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

OTHER

233

2.44 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

23 mm

23 mm

83 In Stock

• 1: ¥232.634618
• 10: ¥219.466622
• 100: ¥207.043985
• 500: ¥195.324510
查看所有的价格

-

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

微芯片技术

M2GL010-1TQG144I

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.57

This product may require additional documentation to export from the United States.

Details

12084 LE

84 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

0.711955 oz

1.26 V

Tray

M2GL010

活跃

20 X 20 MM, 0.50 MM PITCH, ROHS COMPLIANT, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

-40°C ~ 100°C (TJ)

Tray

M2GL010

8542.39.00.01

1.14V ~ 2.625V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

1.2 V

-

1.6 mm

现场可编程门阵列

12084

933888

-

20 mm

20 mm

2404 In Stock

• 1: ¥1,851.390897
• 10: ¥1,746.595186
• 100: ¥1,647.731309
• 500: ¥1,554.463498
查看所有的价格

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

Details

86184 LE

180 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL090

活跃

3

PLASTIC

BGA325,21X21,20

1.2 V

有

M2GL090T-1FCSG325I

活跃

MICROSEMI CORP

5.8

-40°C ~ 100°C (TJ)

Tray

M2GL090T

8542.39.00.01

CMOS

1.14V ~ 2.625V

compliant

180

不合格

1.2 V

1.2 V

180

现场可编程门阵列

86184

2648064

4 Transceiver

86316

2342 In Stock

• 1: ¥1,474.062025
• 10: ¥1,390.624555
• 100: ¥1,311.909958
• 500: ¥1,237.650898
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

N

有

60

IGLOO2

267

Tray

M2GL050

活跃

5.3

1.26 V

MICROSEMI CORP

活跃

SQUARE

BGA

M2GL050T-1FG484

无

85 °C

1.14 V

20

1.2 V

BGA484,22X22,40

PLASTIC/EPOXY

3

网格排列

BGA, BGA484,22X22,40

0°C ~ 85°C (TJ)

Tray

M2GL050T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

228.3 kB

267

2.44 mm

现场可编程门阵列

56340

1869824

56340

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

微芯片技术

This product may require additional documentation to export from the United States.

N

有

27

IGLOO2

377

Tray

M2GL050

活跃

31 X 31 MM, 1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

20

1.14 V

无

M2GL050TS-1FG896I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

-40°C ~ 100°C (TJ)

Tray

M2GL050TS

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

228.3 kB

377

2.44 mm

现场可编程门阵列

56340

1869824

56340

31 mm

31 mm

19 In Stock

• 1: ¥529.230710
• 10: ¥499.274254
• 100: ¥471.013444
• 500: ¥444.352307
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表面贴装

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

12084 LE

138 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL010

-40°C ~ 100°C (TJ)

Tray

M2GL010TS

1.14V ~ 2.625V

1.2 V

12084

933888

2 Transceiver