N/A

-

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

+ 85 C

微芯片技术

SMD/SMT

有

40

IGLOO2

1.2 V

活跃

M2GL060

Tray

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL060TS-1FG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

56520 LE

387 I/O

1.2 V

0 C

0°C ~ 85°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

1.2 V

OTHER

2.44 mm

现场可编程门阵列

56520

1869824

4 Transceiver

27 mm

27 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

YES

400

400-VFBGA (17x17)

400

微芯片技术

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

85 °C

有

M2GL050T-VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.29

This product may require additional documentation to export from the United States.

Details

有

90

IGLOO2

207

Tray

M2GL050

活跃

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

0°C ~ 85°C (TJ)

Tray

M2GL050T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

228.3 kB

207

1.51 mm

现场可编程门阵列

56340

1869824

STD

56340

17 mm

17 mm

N/A

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

350 MHz

有

- 55 C

1.425 V

微芯片技术

68 I/O

3000 LE

N

This product may require additional documentation to export from the United States.

ProASIC3

90

1.575 V

Tray

A3P250

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

1.5 V

未说明

125 °C

无

A3P250-VQ100M

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.16

+ 125 C

SMD/SMT

36 kbit

-55°C ~ 125°C (TJ)

Tray

A3P250

e0

Tin/Lead (Sn85Pb15)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

1.5 V

MILITARY

3 mA

-

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

-

6144

250000

14 mm

14 mm

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

0 C

+ 85 C

微芯片技术

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL025

活跃

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

85 °C

有

M2GL025TS-VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

27696 LE

207 I/O

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL025TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

1.2 V

OTHER

207

1.51 mm

现场可编程门阵列

27696

1130496

STD

4 Transceiver

27696

17 mm

17 mm

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

+ 85 C

微芯片技术

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL010

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

85 °C

无

M2GL010TS-1VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

12084 LE

195 I/O

1.2 V

0 C

0°C ~ 85°C (TJ)

Tray

M2GL010TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

1.2 V

OTHER

195

1.51 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

17 mm

17 mm

N/A

-

表面贴装

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

This product may require additional documentation to export from the United States.

Details

27696 LE

138 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

0°C ~ 85°C (TJ)

Tray

M2GL025T

1.14V ~ 2.625V

1.2 V

27696

1130496

2 Transceiver

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

Tray

M2GL005

活跃

1.26 V

This product may require additional documentation to export from the United States.

Details

1.14 V

有

60

IGLOO2

209

-40°C ~ 100°C (TJ)

Tray

M2GL005S

1.14V ~ 2.625V

6060

719872

N/A

-

表面贴装

FCBGA-325

325-FCBGA (11x11)

微芯片技术

This product may require additional documentation to export from the United States.

Details

27696 LE

180 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL025

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL025TS

1.14V ~ 2.625V

1.2 V

27696

1130496

2 Transceiver

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

YES

400

400-VFBGA (17x17)

400

微芯片技术

有

90

IGLOO2

1.2 V

Tray

M2GL010

活跃

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

有

M2GL010T-1VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

12084 LE

195 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

M2GL010T

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

1.2 V

114 kB

195

1.51 mm

现场可编程门阵列

12084

933888

1

4 Transceiver

12084

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

896-BGA

896-FBGA (31x31)

微芯片技术

This product may require additional documentation to export from the United States.

N

有

27

IGLOO2

1.2000 V

377

Tray

M2GL050

活跃

-40 to 100 °C

Tray

M2GL050T

100 °C

-40 °C

1.14V ~ 2.625V

228.3 kB

56340

1869824

1

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

SMD/SMT

有

119

IGLOO2

1.2 V

活跃

M2GL010

Tray

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL010TS-1VF256

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

12084 LE

138 I/O

1.2 V

0 C

+ 85 C

0°C ~ 85°C (TJ)

Tray

M2GL010TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.2 V

OTHER

1.56 mm

现场可编程门阵列

12084

933888

2 Transceiver

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

有

119

IGLOO2

Tray

M2GL010

活跃

1.2 V

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL010T-1VF256

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

12084 LE

138 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

0°C ~ 85°C (TJ)

Tray

M2GL010T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.2 V

OTHER

1.56 mm

现场可编程门阵列

12084

933888

2 Transceiver

14 mm

14 mm

N/A

-

表面贴装

VFBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

SMD/SMT

有

119

IGLOO2

0.288117 oz

Tray

M2GL010

活跃

14 X 14 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

有

M2GL010-VFG256I

LFBGA

SQUARE

活跃

FPGA - Field Programmable Gate Array M2GL010-VFG256I

MICROSEMI CORP

1.56

Details

12084 LE

138 I/O

1.14 V

1.26 V

- 40 C

+ 100 C

-40°C ~ 100°C (TJ)

Tray

M2GL010

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B256

1.2 V

667 Mb/s

1.56 mm

现场可编程门阵列

12084

933888

STD

2 Transceiver

12084

14 mm

14 mm

N/A

-

表面贴装

FPBGA-676

676-FBGA (27x27)

微芯片技术

This product may require additional documentation to export from the United States.

Details

56520 LE

387 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

40

IGLOO2

1.2 V

Tray

M2GL060

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL060

1.14V ~ 2.625V

1.2 V

56520

1869824

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

400

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

N

1.14 V

有

90

IGLOO2

169

1.26 V

Tray

M2GL005

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL005S

100 °C

-40 °C

1.14V ~ 2.625V

87.9 kB

6060

719872

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484

484-FPBGA (23x23)

484

0 C

+ 85 C

微芯片技术

SMD/SMT

有

60

IGLOO2

1.296201 oz

1.26 V

Tray

M2GL025

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

85 °C

有

M2GL025T-FGG484

BGA

SQUARE

活跃

FPGA - Field Programmable Gate Array IGLOO 2

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

27696 LE

267 I/O

1.14 V

0°C ~ 85°C (TJ)

Tray

M2GL025T

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

OTHER

138 kB

667 Mb/s

267

2.44 mm

现场可编程门阵列

27696

1130496

STD

4 Transceiver

27696

23 mm

23 mm

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

86184 LE

267 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL090

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL090TS

1.14V ~ 2.625V

1.2 V

86184

2648064

4 Transceiver

N/A

-

表面贴装

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

This product may require additional documentation to export from the United States.

N

27696 LE

138 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL025TS

1.14V ~ 2.625V

1.2 V

27696

1130496

2 Transceiver

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

有

MICROSEMI CORP

1.26 V

5.27

活跃

SQUARE

BGA

M2GL050-1FCSG325I

This product may require additional documentation to export from the United States.

Details

有

176

IGLOO2

200

Tray

M2GL050

活跃

BGA, BGA325,21X21,20

-40°C ~ 100°C (TJ)

Tray

M2GL050

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B325

200

不合格

1.2 V

200

现场可编程门阵列

56340

1869824

56340

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

N

12084 LE

233 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000

1.2 V

Tray

M2GL010

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL010

100 °C

-40 °C

1.14V ~ 2.625V

1.2 V

114 kB

12084

933888

1

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

+ 100 C

微芯片技术

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

23 X 23 MM, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

无

M2GL010TS-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

12084 LE

233 I/O

1.2 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

M2GL010TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

1.2 V

233

2.44 mm

现场可编程门阵列

12084

933888

4 Transceiver

12084

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

400

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

N

1.14 V

有

90

IGLOO2

169

1.26 V

Tray

M2GL005

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL005

100 °C

-40 °C

1.14V ~ 2.625V

87.9 kB

6060

719872

N/A

-

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

+ 100 C

SMD/SMT

微芯片技术

有

60

IGLOO2

0.415307 oz

Tray

M2GL090

活跃

1.26 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

无

M2GL090-FG484I

BGA

SQUARE

活跃

FPGA IGLOOu00ae2 Family 86316 Cells 1.2V 484-Pin FBGA Tray

MICROSEMI CORP

5.25

N

86316

267 I/O

1.14 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

M2GL090

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

667 Mb/s

267

2.44 mm

现场可编程门阵列

86184

2648064

4 Transceiver

86316

23 mm

23 mm

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

N

56520 LE

267 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL060

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL060TS

1.14V ~ 2.625V

1.2 V

56520

1869824

4 Transceiver

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

20

1.14 V

85 °C

无

M2GL150-FC1152

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

有

24

IGLOO2

574

Tray

M2GL150

活跃

BGA, BGA1152,34X34,40

0°C ~ 85°C (TJ)

Tray

M2GL150

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

OTHER

574

2.9 mm

现场可编程门阵列

146124

5120000

STD

146124

35 mm

35 mm