N/A

-

表面贴装

100-LQFP

100-TQFP (14x14)

Molex

Bulk

093608

活跃

81

0°C ~ 70°C (TA)

*

2.25V ~ 5.25V

24000

1452

N/A

-

Free Hanging (In-Line)

YES

-

铝合金

Neoprene

208

Aluminum Alloy, Olive Drab Cadmium

Copper Alloy

Silver

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

ITT Cannon, LLC

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.2 V

40

1.14 V

85 °C

有

A3P250L-1PQG208I

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.25

200VAC, 250VDC

Bulk

Metal

CIR01

活跃

-55°C ~ 125°C

CIR

e3

焊杯

Receptacle, Male Pins

6

哑光锡

橄榄色

-

8542.39.00.01

卡口锁

现场可编程门阵列

13A

CMOS

QUAD

N (Normal)

鸥翼

-

245

环境防护

0.5 mm

compliant

橄榄色镉

14S-6

S-PQFP-G208

151

不合格

1.5/3.3 V

INDUSTRIAL

-

0.669 (17.00mm)

151

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

6144

6144

250000

Backshell, Heat Shrink Adapter

28 mm

28 mm

-

-

N/A

-

YES

208

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

30

Molex

1.425 V

70 °C

无

A3PE600-2PQ208

350 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.85

Bulk

068800

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

*

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

COMMERCIAL

147

13824 CLBS, 600000 GATES

4.1 mm

现场可编程门阵列

13824

13824

600000

28 mm

28 mm

N/A

-

YES

100

PLASTIC/EPOXY

5 V

30

4.75 V

Molex

70 °C

无

A1425A-PQ100C

125 MHz

QFP

RECTANGULAR

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.25 V

8.8

Bulk

120065

活跃

PLASTIC, QFP-100

FLATPACK

3

*

e0

锡铅

MAX 80 I/OS

CMOS

QUAD

鸥翼

225

0.65 mm

compliant

R-PQFP-G100

不合格

COMMERCIAL

310 CLBS, 2500 GATES

3.4 mm

现场可编程门阵列

3 ns

310

2500

20 mm

14 mm

N/A

-

Axial

YES

Axial

68

5 V

40

Vishay Dale

4.5 V

85 °C

有

A1010B-PLG68I

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.5 V

8.59

Tape & Reel (TR)

ERC55

活跃

PLASTIC, MS-007-AD, LCC-68

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

-65°C ~ 175°C

ERC

0.094 Dia x 0.250 L (2.39mm x 6.35mm)

±0.1%

e3

2

±50ppm/°C

56.9 kOhms

Matte Tin (Sn)

Metal Film

0.125W, 1/8W

MAX 57 I/OS

8542.39.00.01

CMOS

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

-

INDUSTRIAL

295 CLBS, 1200 GATES

4.445 mm

现场可编程门阵列

4.5 ns

295

1200

Moisture Resistant

-

24.13 mm

24.13 mm

N/A

-

N/A

-

N/A

-

N/A

-

表面贴装

208-BFCQFP with Tie Bar

208-CQFP (75x75)

微芯片技术

Non-Compliant

115

Tray

AX500

活跃

-55°C ~ 125°C (TA)

Axcelerator

1.425V ~ 1.575V

73728

500000

8064

N/A

-

面板安装

100-BQFP

Bulkhead - Front Side Nut

Circular

铝合金

100-PQFP (20x14)

Plastic

ITT Cannon, LLC

活跃

83

Bulk

KJB7T

20

-65°C ~ 175°C

KJB

插座外壳

用于公引脚

53

Threaded

Crimp

3V ~ 3.6V, 4.75V ~ 5.25V

B

Unshielded

抗环境干扰

Cadmium over Electroless Nickel

23-53

橄榄色

不包括触点

-

-

24000

-

-

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

PLASTIC/EPOXY

BGA1152,34X34,40

微芯片技术

-55 °C

1.2 V

1.14 V

125 °C

有

M2GL150TS-1FCG1152M

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.27

Compliant

574

Tray

M2GL150

活跃

35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152

网格排列

4

-55°C ~ 125°C (TJ)

IGLOO2

3A001.A.2.C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B1152

574

不合格

1.2 V

MILITARY

574

2.9 mm

现场可编程门阵列

146124

5120000

146124

35 mm

35 mm

N/A

-

表面贴装

144

97

Compliant

3

30

有

AGL125V2-FGG144T

Microsemi Corporation

活跃

MICROSEMI CORP

5.76

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

260

compliant

4.5 kB

现场可编程门阵列

3072

125000

N/A

-

表面贴装

48-VFQFN Exposed Pad

YES

48-QFN (6x6)

48

-40 °C

1.2 V

微芯片技术

未说明

1.14 V

85 °C

有

AGLN010V2-QNG48I

HVQCCN

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.58

34

Tray

AGLN010

活跃

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

-40°C ~ 100°C (TJ)

Each

IGLOO nano

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

无铅

未说明

0.4 mm

compliant

S-XQCC-N48

不合格

INDUSTRIAL

260 CLBS, 10000 GATES

1 mm

现场可编程门阵列

260

10000

STD

260

10000

6 mm

6 mm

N/A

-

YES

144

70 °C

有

A54SX16A-FFGG144

167 MHz

LBGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.75 V

5.27

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

2.5 V

40

2.25 V

e1

锡银铜

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

111

不合格

2.5,3.3/5 V

COMMERCIAL

111

1452 CLBS, 24000 GATES

1.55 mm

现场可编程门阵列

1.9 ns

1452

1452

24000

13 mm

13 mm

N/A

-

Free Hanging (In-Line)

100-TQFP

-

铝合金

100-VQFP (14x14)

ITT Cannon, LLC

50V

Bulk

Metal

CA310

活跃

Gold

77

-55°C ~ 125°C

MIL-DTL-5015, CA

焊杯

Plug, Male Pins

14

Black

Threaded

22A

1.425V ~ 1.575V

N (Normal)

-

IP65 - Dust Tight, Water Resistant

黑锌钴

20-27

-

30000

Strain Relief

19.7µin (0.50µm)

N/A

-

表面贴装

100-TQFP

100-VQFP (14x14)

Glenair

零售包装

活跃

68

A3PN250

-40°C ~ 100°C (TJ)

*

1.425V ~ 1.575V

36864

250000

N/A

-

表面贴装

100-TQFP

100-VQFP (14x14)

Glenair

零售包装

活跃

71

AGLN060

-40°C ~ 100°C (TJ)

*

1.425V ~ 1.575V

1536

18432

60000

STD

N/A

-

Banner Engineering Corporation

活跃

Bulk

*

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

PLASTIC/EPOXY

1.2 V

微芯片技术

30

1.14 V

85 °C

有

M2GL005S-TQG144

LFQFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.57

Non-Compliant

84

Tray

M2GL005

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

0°C ~ 85°C (TJ)

IGLOO2

8542.39.00.01

1.14V ~ 2.625V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

OTHER

1.6 mm

现场可编程门阵列

6060

719872

20 mm

20 mm

N/A

-

Gold

表面贴装

256-LBGA

16

256-FPBGA (17x17)

微芯片技术

Compliant

165

Tray

A3PE600

活跃

-40°C ~ 100°C (TJ)

ProASIC3E

1.425V ~ 1.575V

110592

600000

2

N/A

-

Gold Over Nickel

19

Straight

850VDC/600VAC

19Signal

无

Copper Alloy

Wall

Not Required(mm)

Crimp

-65C to 175C

25-19

46.4(mm)

Circular

RCP

19(POS)

PIN

1(Port)

TVP

STD

Nickel

无

32.77(mm)

46.4(mm)

N/A

-

N/A

-

Silver

表面贴装

68-VFQFN Exposed Pad

YES

68-QFN (8x8)

5

Straight

700VDC/500VAC

18-20

-55C to 125C

Crimp

Cable

Copper Alloy

无

5Signal

49

微芯片技术

Tray

A3P030

活跃

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

1.5 V

30

1.425 V

85 °C

有

A3P030-QNG68

350 MHz

HVQCCN

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

1.33

0°C ~ 85°C (TJ)

ProASIC3

Circular

RCP

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

无铅

260

0.4 mm

compliant

S-XQCC-N68

不合格

5(POS)

PIN

COMMERCIAL

1(Port)

ACC

768 CLBS, 30000 GATES

1 mm

现场可编程门阵列

30000

STD

768

Cadmium

30000

无

8 mm

8 mm

N/A

-

N/A

-

表面贴装

100-TQFP

100-VQFP (14x14)

Glenair

零售包装

活跃

68

AGLN250

-20°C ~ 85°C (TJ)

*

1.425V ~ 1.575V

6144

36864

250000